CN201845844U - Double-transmission zero-point laminated band-pass filter - Google Patents
Double-transmission zero-point laminated band-pass filter Download PDFInfo
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- CN201845844U CN201845844U CN2010205422187U CN201020542218U CN201845844U CN 201845844 U CN201845844 U CN 201845844U CN 2010205422187 U CN2010205422187 U CN 2010205422187U CN 201020542218 U CN201020542218 U CN 201020542218U CN 201845844 U CN201845844 U CN 201845844U
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Abstract
The utility model relates to a double-transmission zero-point laminated band-pass filter, comprising a base body, two input and output ports arranged outside the base body, a grounding port and a circuit layer arranged in the base body, wherein the circuit layer comprises an upper grounding shielding layer and a lower grounding shielding layer which are respectively and electrically connected with the grounding port; a tapping microstrip line layer is arranged between the two grounding shielding layers and is internally provided with two tapping microstrip lines, of which the directions are opposite; each tapping microstrip line is electrically connected with one input and output port by a tapping line; more than one coupled microstrip line layers are respectively arranged on and below the tapping microstrip line layer; each coupled microstrip line layer is internally provided with two coupled microstrip lines, of which the directions are opposite; all the coupled microstrip line layers and the microstrip line layers in the tapping microstrip line layer are arranged in a laminating manner; and the directions of the microstrip lines of the adjacent microstrip line layers are opposite. Due to adoption of the double-transmission zero-point laminated band-pass filter, the technological difficulty is effectively reduced, the production efficiency is improved, and the reliability and the qualification rate of products are improved.
Description
Technical field
The utility model discloses a kind of band pass filter, relates in particular to the dual transfer zero laminated tape bandpass filter that adopts low-temp ceramics to be total to burning technology (be LowTemperature Co-fired Ceramic, be called for short LTCC) design and to make.
Background technology
In recent years, because the market demand of mobile communication product heightens, make that the development of radio communication is more rapid.In numerous wireless communication standards, the most noticeable is IEEE 802.11 wireless lan (wlan) agreements.This agreement was formulated in 1997, and it not only provides many unprecedented functions on the radio communication, and the solution that provides the wireless communications products that can make various different brands to be communicated with each other.The formulation of this agreement has been opened a new milestone for the radio communication development undoubtedly.IEEE 802.11b/g is current standard commonly used, and its operating frequency is 2.45GHz.
Simultaneously, band pass filter is an element indispensable in the mobile communication product.The band pass filter that performance is good has low Insertion Loss in the passband, the outer high characteristics that suppress of passband, and the saltus step of passband and cut-off frequency should be precipitous as far as possible.In the radio-frequency module of IEEE 802.11b/g product, the part assembly still has the ability that produces or receive unnecessary signal (noise) in the both sides of nearby pass (2.45GHz).This noise produces many negative influences to communication products easily.Outside to product can produce electromagnetic interference, then can cause the signal quality of reception/emission not good to the inside of product, and therefore the performance of product is greatly affected.
In addition, along with the fast development of communication system, radio-frequency devices is more and more to miniaturization, high-performance, and low cost, the direction of integrated multi-layer circuit develops.The volume of band pass filter of the prior art is bigger, more and more can not satisfy the demand that people pursue miniaturization day by day.
Summary of the invention
At the bigger shortcoming of radio-frequency devices build in the above-mentioned prior art of mentioning of the prior art, the utility model proposes a kind of dual transfer zero laminated tape bandpass filter, produce two transmission zeros with the outer noise of effective inhibition passband, and have smaller volume.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of dual transfer zero laminated tape bandpass filter, filter comprises matrix, be arranged on two outer input/output ports of matrix, grounding ports and the circuit layer that is arranged in the matrix, described circuit layer comprises two ground shield up and down, two ground shield are electrically connected with grounding ports respectively, be provided with one deck tap microstrip line layer between two ground shield, be provided with two tap microstrip lines in the tap microstrip line layer, article two, the direction of tap microstrip line is opposite, and every the tap microstrip line is electrically connected with an input/output port by a tap line, tap microstrip line layer is respectively equipped with the above coupled microstrip line layer of one deck up and down, be provided with two coupled microstrip lines in each coupled microstrip line layer, article two, the direction of coupled microstrip line is opposite, the stacked setting of microstrip line in each layer coupled microstrip line layer and the tap microstrip line layer, the microstrip line direction between the adjacent layer is opposite.
The technical scheme that its technical problem that solves the utility model adopts further comprises:
Described coupled microstrip line layer is identical in the number of plies of tap microstrip line layer upper and lower settings.
Described coupled microstrip line layer respectively is provided with two-layer up and down at tap microstrip line layer.
Have the slit of two " worker " fonts on described each ground shield, the slit of two " worker " fonts is symmetrically distributed.
Described grounding ports is provided with two, and two grounding ports are symmetrically distributed in the matrix outside.
The described matrix outside is provided with the sign point.
The beneficial effects of the utility model are: the utility model adopts planar design, utilize the multilayer coupled microstrip line to constitute the resonant body of filter, each resonant body is positioned at same plane, need not through hole, adopt the multilayer build-up technology, design and produce high performance band pass filter, reduced technology difficulty effectively, improve production efficiency, improved product reliability and qualification rate.There is very strong capacitive coupling in microstrip line between the different microstrip line layers of the utility model, has reduced the volume of resonant body effectively.The utility model has been broken the conventional thought that the resonant body cocurrent and parallel is placed, and produces two transmission zeros by adopting asymmetrical feed-in mode, effectively suppresses the passband external noise.In addition, can regulate the frequency response of filter by regulating tapped input and output end position.
Below in conjunction with the drawings and specific embodiments the utility model is described further.
Description of drawings
Fig. 1 is the utility model surface structure schematic diagram.
Fig. 2 is the utility model internal structure schematic perspective view.
Fig. 3 is the ground shield of the utility model ground floor and layer 7.
Fig. 4 is the planar structure schematic diagram of the utility model second layer and layer 6.
Fig. 5 is the planar structure schematic diagram of the 3rd layer of the utility model and layer 5.
Fig. 6 is the planar structure schematic diagram of the 4th layer of the utility model.
Fig. 7 is a frequency characteristic curve diagram of the present utility model.
Fig. 8 is an equivalent circuit diagram of the present utility model.
Among the figure, the last ground shield of 1-, 2-first coupled microstrip line, 3-second coupled microstrip line, the 4-first tap microstrip line, 5-the 3rd coupled microstrip line, 6-the 4th coupled microstrip line, ground shield under the 7-, 8-the 5th coupled microstrip line, 9-the 6th coupled microstrip line, the 10-second tap microstrip line, 11-the 7th coupled microstrip line, 12-the 8th coupled microstrip line, 13-first input/output port, 14-second input/output port, 15-first grounding ports, 16-second grounding ports, 17-indicates point, 18-matrix.
Embodiment
Present embodiment is the utility model preferred implementation, and other all its principles are identical with present embodiment or approximate with basic structure, all within the utility model protection range.
The common burning technology (being LTCC) of low-temp ceramics is meant in temperature and is lower than 1000 ℃; the metal such as gold, silver, copper that can adopt high conductivity is as conducting medium; all circuit are laminated in and carry out disposable sintering together; do not only like this and saved the time; reduced cost; and dielectric is difficult for oxidation, do not need to electroplate protection, significantly reduced the size of circuit.
Please referring to accompanying drawing 1, the utility model mainly comprises matrix 18, two ends, matrix 18 left and right sides are respectively first input/output port 13 and second input/output port 14, both sides, matrix 18 front and back are respectively first grounding ports 15 and second grounding ports 16, in the present embodiment, first input/output port 13, second input/output port 14 and first grounding ports 15 and second grounding ports 16 adopt the electrocondution slurry printing and electroplate tin.In order to guarantee that product has good weldability, electrode needs flange, and promptly first input/output port 13, second input/output port 14 and first grounding ports 15 and second grounding ports 16 exceed the upper surface and the lower surface of matrix 18.In the present embodiment, matrix 18 outsides also are provided with and indicate point 17, are used to discern positive and negative and front and back of the present utility model, in the present embodiment, indicate point 17 and adopt the glaze printing of special color and burn till type altogether with matrix 18.
Be provided with circuit layer in the matrix 18, please referring to accompanying drawing 2, be provided with ground shield 1 and following ground shield 7 in the utility model, last ground shield 1 and following ground shield 7 are the metal plate conductor, and all be electrically connected with first grounding ports 15 of the present utility model and second grounding ports 16 by two rectangle jags, form systematically, and provide a kind of reference planes to the utility model.In the present embodiment, last ground shield 1 and following ground shield 7 utilize screen printing technique to be printed on the ceramic dielectric matrix 18.In the present embodiment, have the slit of two " worker " fonts on last ground shield 1 and the following ground shield 7, constitute the ground of disappearance.By regulating the size in " worker " font slit, can improve characteristics such as insertion loss of the present utility model, the outer inhibition of band effectively.
In the present embodiment, be provided with the resonant body that the microstrip line layer forms between last ground shield 1 and the following ground shield 7.In the present embodiment, be provided with five layers of microstrip line layer altogether between last ground shield 1 and the following ground shield 7, wherein, the microstrip line layer comprises tap microstrip line and coupled microstrip line, and the two is referred to as microstrip line.Middle one deck in five layers of microstrip line layer is a tap microstrip line layer, please referring to accompanying drawing 6, be provided with two tap microstrip lines in the tap microstrip line layer, be respectively the first tap microstrip line 4 and the second tap microstrip line 10, the first tap microstrip line 4 and the second tap microstrip line 10 are positioned at same plane, and be parallel to each other, the first tap microstrip line 4 is electrically connected with second input/output port 14 by tap line, the second tap microstrip line 10 is electrically connected with first input/output port 13 by tap line, two tap lines have adopted asymmetric feed-in mode in the present embodiment, have introduced two transmission zeros.In the present embodiment, the first tap microstrip line 4 and the second tap microstrip line 10 comprise all that one is long and the other is short two sheet metals, arragement direction with two sheet metals showing in scheming is a direction, and in the present embodiment, the direction of the first tap microstrip line 4 and the second tap microstrip line 10 is opposite.In the present embodiment, tap microstrip line layer is respectively equipped with one deck coupled microstrip line layer up and down, please referring to accompanying drawing 5, in the present embodiment, tap microstrip line layer coupled microstrip line layer structure up and down is identical, and it is two coupled microstrip lines all, each coupled microstrip line comprises all that one is long and the other is short two sheet metals, arragement direction with two sheet metals showing in scheming is a direction, and in the present embodiment, the direction of two coupled microstrip lines in every layer of coupled microstrip line layer is opposite.Wherein, two coupled microstrip lines above the tap microstrip line layer in the coupled microstrip line layer of one deck are respectively second coupled microstrip line 3 and the 7th coupled microstrip line 11, the second coupled microstrip lines 3 and the 7th coupled microstrip line 11 and are positioned at same plane, and are parallel to each other.Two coupled microstrip lines below the tap microstrip line layer in the coupled microstrip line layer of one deck are respectively the 3rd coupled microstrip line 5 and the 6th coupled microstrip line 9, the three coupled microstrip lines 5 and the 6th coupled microstrip line 9 and are positioned at same plane, and are parallel to each other.Also be provided with one deck coupled microstrip line layer above the coupled microstrip line layer of tap microstrip line layer upper strata, be the superiors' coupled microstrip line layer; Also be provided with one deck coupled microstrip line layer below the tap microstrip line layer lower floor coupled microstrip line layer, be orlop coupled microstrip line layer.Please referring to accompanying drawing 4, in the present embodiment, the superiors' coupled microstrip line layer is identical with orlop coupled microstrip line layer structure, it is two coupled microstrip lines all, each coupled microstrip line comprises all that one is long and the other is short two sheet metals, arragement direction with two sheet metals showing in scheming is a direction, and in the present embodiment, the direction of two coupled microstrip lines in every layer of coupled microstrip line layer is opposite.Wherein, two coupled microstrip lines in the superiors' coupled microstrip line layer are respectively first coupled microstrip line 2 and the 8th coupled microstrip line 12, the first coupled microstrip lines 2 and the 8th coupled microstrip line 12 and are positioned at same plane, and are parallel to each other.Two coupled microstrip lines in the orlop coupled microstrip line layer are respectively the 4th coupled microstrip line 6 and the 5th coupled microstrip line 8, the four coupled microstrip lines 6 and the 5th coupled microstrip line 8 and are positioned at same plane, and are parallel to each other.In the present embodiment, the stacked placement of microstrip line between each layer microstrip line layer, the microstrip line direction between the adjacent layer is opposite.Wherein, first coupled microstrip line 2, second coupled microstrip line 3, the first tap microstrip line 4, the 3rd coupled microstrip line 5 and the 4th coupled microstrip line 6 constitute first resonant body together, and the 5th coupled microstrip line 8, the 6th coupled microstrip line 9, the second tap microstrip line 10, the 7th coupled microstrip line 11 and the 8th coupled microstrip line 12 constitute second resonant body together.In the utility model, the live width Ws of microstrip line, line length Ls, the vertical range ds of the microstrip line between the different layers, and the length of different layers microstrip line lap have determined the resonance frequency of resonant body together.
Please referring to accompanying drawing 7, scattering parameter of the present utility model (S-Parameters) curve comprises return loss plot (S11) and inserts damage curve (S12).As can be seen from the figure, passband has two transmission zeros outward, and the band that has increased filter suppresses outward, has improved the performance of filter.
Fig. 8 is an equivalent circuit diagram of the present utility model, comprises two coupled microstrip line resonant bodies, and is connected to input/output port via tap line.
The utility model adopts planar design, utilize the multilayer coupled microstrip line to constitute the resonant body of filter, each resonant body is positioned at same plane, need not through hole, adopt the multilayer build-up technology, design and produce high performance band pass filter, reduced technology difficulty effectively, improve production efficiency, improved product reliability and qualification rate.There is very strong capacitive coupling in microstrip line between the different microstrip line layers of the utility model, has reduced the volume of resonant body effectively.The utility model has been broken the conventional thought that the resonant body cocurrent and parallel is placed, and produces two transmission zeros by adopting asymmetrical feed-in mode, effectively suppresses the passband external noise.In addition, can regulate the frequency response of filter by regulating tapped input and output end position.
Claims (6)
1. dual transfer zero laminated tape bandpass filter, it is characterized in that: described filter comprises matrix, be arranged on two outer input/output ports of matrix, grounding ports and the circuit layer that is arranged in the matrix, described circuit layer comprises two ground shield up and down, two ground shield are electrically connected with grounding ports respectively, be provided with one deck tap microstrip line layer between two ground shield, be provided with two tap microstrip lines in the tap microstrip line layer, article two, the direction of tap microstrip line is opposite, and every the tap microstrip line is electrically connected with an input/output port by a tap line, tap microstrip line layer is respectively equipped with the above coupled microstrip line layer of one deck up and down, be provided with two coupled microstrip lines in each coupled microstrip line layer, article two, the direction of coupled microstrip line is opposite, the stacked setting of microstrip line in each layer coupled microstrip line layer and the tap microstrip line layer, the microstrip line direction between the adjacent layer is opposite.
2. dual transfer zero laminated tape bandpass filter according to claim 1 is characterized in that: described coupled microstrip line layer is identical in the number of plies of tap microstrip line layer upper and lower settings.
3. dual transfer zero laminated tape bandpass filter according to claim 2 is characterized in that: described coupled microstrip line layer respectively is provided with two-layer up and down at tap microstrip line layer.
4. dual transfer zero laminated tape bandpass filter according to claim 1 is characterized in that: have the slit of two " worker " fonts on described each ground shield, the slit of two " worker " fonts is symmetrically distributed.
5. according to any described dual transfer zero laminated tape bandpass filter in the claim 1 to 4, it is characterized in that: described grounding ports is provided with two, and two grounding ports are symmetrically distributed in the matrix outside.
6. according to any described dual transfer zero laminated tape bandpass filter in the claim 1 to 4, it is characterized in that: the described matrix outside is provided with the sign point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205422187U CN201845844U (en) | 2010-09-26 | 2010-09-26 | Double-transmission zero-point laminated band-pass filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205422187U CN201845844U (en) | 2010-09-26 | 2010-09-26 | Double-transmission zero-point laminated band-pass filter |
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| Publication Number | Publication Date |
|---|---|
| CN201845844U true CN201845844U (en) | 2011-05-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010205422187U Expired - Fee Related CN201845844U (en) | 2010-09-26 | 2010-09-26 | Double-transmission zero-point laminated band-pass filter |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103066347A (en) * | 2013-01-15 | 2013-04-24 | 深圳市麦捷微电子科技股份有限公司 | Novel low temperature co-fired ceramic (LTCC) laminated slice-type duplexer |
| CN109687065A (en) * | 2018-12-24 | 2019-04-26 | 瑞声精密制造科技(常州)有限公司 | LTCC filter |
-
2010
- 2010-09-26 CN CN2010205422187U patent/CN201845844U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103066347A (en) * | 2013-01-15 | 2013-04-24 | 深圳市麦捷微电子科技股份有限公司 | Novel low temperature co-fired ceramic (LTCC) laminated slice-type duplexer |
| CN103066347B (en) * | 2013-01-15 | 2015-07-01 | 深圳市麦捷微电子科技股份有限公司 | Novel low temperature co-fired ceramic (LTCC) laminated slice-type duplexer |
| CN109687065A (en) * | 2018-12-24 | 2019-04-26 | 瑞声精密制造科技(常州)有限公司 | LTCC filter |
| WO2020134348A1 (en) * | 2018-12-24 | 2020-07-02 | 瑞声声学科技(深圳)有限公司 | Ltcc filter |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110525 Termination date: 20190926 |