CN201559027U - High-efficiency ultrasonic welding machine - Google Patents
High-efficiency ultrasonic welding machine Download PDFInfo
- Publication number
- CN201559027U CN201559027U CN2009202046269U CN200920204626U CN201559027U CN 201559027 U CN201559027 U CN 201559027U CN 2009202046269 U CN2009202046269 U CN 2009202046269U CN 200920204626 U CN200920204626 U CN 200920204626U CN 201559027 U CN201559027 U CN 201559027U
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- CN
- China
- Prior art keywords
- welding
- chopper
- bonding machine
- ultrasonic bonding
- welded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The utility model relates to a high-efficiency ultrasonic welding machine, which comprises a welding head of which the front end is provided with a riving knife and a press block and a press claw which are matched with the position of the riving knife. A bracket to be welded is arranged between the press block and the press claw. The utility model is characterized in that the high-efficiency ultrasonic welding machine also comprises a metal block which is arranged in the motion range of the riving knife and is staggered with the bracket to be welded. By the increased metal block, when the riving knife is blocked up, the welding head drives the riving knife to reach the position of the metal block to carry out repeated welding operation so as to tear out the welding stick, then the welding head drives the riving knife to return to the position of the bracket to carry out normal welding, thus, the utility model avoids the trouble that the bracket needs to be replaced in the prior art, improves the efficiency and can guarantee the welding continuity.
Description
Technical field
The utility model relates to welder, more particularly, relates to a kind of high efficiency ultrasonic welding machine.
Background technology
At present, the ultrasonic wire bonding machine is widely used in the lead welding of electronic devices and components, integrated circuit etc., welds as the lead of above device such as big or middle pliotron, FET, various power model, big electric current fast recovery diode, Schottky triode, controllable silicon, IGBT and particular semiconductor power device.Its operation principle is: from ultrasonic wave (the being generally 40-140KHz) signal of supersonic generator, produce dither through transducer, be sent to chopper by the luffing bar, when chopper contacts with lead-in wire and welded part, under the effect of pressure and vibration, metal surface to be welded phase mutual friction, oxide-film is destroyed, and plastic deformation takes place, and causes two pure metal coverings closely to contact, reach the combination of atomic distance, finally form firm mechanical connection.
As shown in Figure 1, existing ultrasonic wire bonding machine comprises that front end is provided with the soldering tip 11 of chopper 15, heat block 12, paw 13, wire clamp (figure does not show), driving mechanism etc.Welding wire 16 passes hollow chopper 15, passes from chopper 15 lower ends, burns ball bonding and connects.During work, support 17 is pressed between paw 13 and the heat block 12; The ultrasonic signal of supersonic generator, produce dither through transducer, be sent to chopper 15 by the luffing bar, when chopper 15 when welded part on welding wire 16 and the support 17 contacts, under the effect of pressure and vibration, weld, welding wire 16 is welded on the welded part.
Under the effect of ultrasonic wave and surface friction, be in state of plastic deformation owing to pass the welding wire 16 of chopper 15 lower ends, soldering tip 11 frequently up and down the welding in, welding wire 16 for state of plastic deformation is easy to cling on chopper 15, and the hollow hole of chopper 15 is blocked, make welding wire 16 from the hole of chopper 15, to pass again.
Therefore, when chopper 15 obstructions take place, support 17 need be taken off, change the support 17 scrapping support 17 or be welded with Jin Dui, carry out once more or repeatedly routing welding, the welding wire Final 16 row that stops up is pulled out again.Then, will scrap support 17 again and take off, replace with the support 17 that needs welding.Like this, need the frequent support 17 of changing, influence welding efficiency; And when loading onto the support 17 that needs welding more again, problems such as welding, reweld may take place to leak in the location that is difficult to continue.
The utility model content
The technical problems to be solved in the utility model is, at the inefficient defective of the ultrasonic welding machine of prior art, provides a kind of efficient height, ultrasonic welding machine that continuity is good.
The technical scheme that its technical problem that solves the utility model adopts is: construct a kind of efficient ultrasonic bonding machine, comprise briquetting and paw that front end is equipped with the soldering tip of chopper, cooperates with described chopper position; Support to be welded is installed between described briquetting and paw; The metal derby that described efficient ultrasonic bonding machine also is included in the range of movement of described chopper and is provided with, stagger and be provided with described support to be welded.
In efficient ultrasonic bonding machine of the present utility model, described briquetting is a heat block.
In efficient ultrasonic bonding machine of the present utility model, described metal derby is arranged on the top of described heat block.
In efficient ultrasonic bonding machine of the present utility model, the end face of described metal derby is provided with Jin Dui or silver heap.
In efficient ultrasonic bonding machine of the present utility model, described metal derby is gold bullion or silver bullion.
In efficient ultrasonic bonding machine of the present utility model, there are Gold plated Layer or silver coating in described metal derby surface.
Enforcement the utlity model has following beneficial effect: by the metal derby that increases, when chopper takes place to stop up, drive the position that chopper arrives metal derby by soldering tip, carry out the welding operation of repetition, and then welding wire is pulled, and then drive the position that chopper is returned to support by soldering tip, then normally weld, avoid prior art need change the trouble of support, improved efficient, and can guarantee the continuity of welding.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 is the schematic side view of the ultrasonic welding machine of prior art;
Fig. 2 is the front schematic view of the utility model efficient ultrasonic bonding machine;
Fig. 3 is the schematic top plan view of the utility model efficient ultrasonic bonding machine;
Fig. 4 is the schematic side view of the utility model efficient ultrasonic bonding machine.
The specific embodiment
Shown in Fig. 2-4, be first embodiment of efficient ultrasonic bonding machine of the present utility model, comprise soldering tip 11, briquetting 12, paw 13, metal derby 14 etc.Certainly, this bonding machine also comprises control system, workbench, material toggling mechanism etc., soldering tip 11 comprises ultrasonic generator, transducer, luffing bar etc., these structures can adopt the various structures of existing ultrasonic welding machine, and improvement of the present utility model is not at these parts, therefore, do not give unnecessary details.
As shown in the figure, at the front end of soldering tip 11 chopper 15 is installed, chopper 15 is the hollow bore structure, passes from chopper 15 lower ends for welding wire 16 and welds.Welding wire 16 can be selected various welding wires 16 such as gold solder silk 16, silver wire 16, aluminium welding wire 16 for use.Briquetting 12 and paw 13 are arranged on the position that cooperates with chopper 15, are used for support 17 to be welded is clamped, and are welded by chopper 15 again.In the present embodiment, this briquetting 12 is a heat block, heats thereby can treat welding support 17, so that better weld.Understandable, briquetting 12 also can adopt other version, as long as seal face is provided, voltage supply pawl 13 compresses support 17 to be welded and gets final product.
As shown in the figure, this metal derby 14 is arranged on the end face of briquetting 12, with the support 17 to be welded setting of staggering.This metal derby 14 can select for use any metal to make, for example gold bullion, silver bullion, copper billet or the like.Further, corresponding with the material of welding wire 16, can be provided with Jin Dui, Yin Dui, aluminium heap etc. at the end face of metal derby 14, utilize metal of the same race to be easier to the characteristic of combination, conveniently cling welding wire 16, and welding wire 16 is pulled out chopper 15.Certainly can understand, it also is to utilize metal of the same race to be easier to the characteristic of combination that there are Gold plated Layer or silver coating in described metal derby surface, conveniently clings welding wire 16, and welding wire 16 is pulled out chopper 15.
When operate as normal, chopper 15 is under the drive of soldering tip 11, and the workpiece on welding wire 16 and the support 17 to be welded is welded in the welding that moves up and down.And when chopper 15 takes place to stop up, drive the position that chopper 15 moves to metal derby 14 places by soldering tip 11, driving chopper 15 by soldering tip 11 again moves up and down, weld, welding wire 16 is welded on the metal derby 14, through after the welding of one or many, make welding wire 16 successfully from the hole of chopper 15, to pull out, eliminated the blockage of chopper 15.Then, under the drive of soldering tip 11, chopper 15 is returned to the welding position of support 17 to be welded, and the workpiece for the treatment of welding support 17 continues welding.Whole process need not support 17 to be welded is taken off, and has improved operating efficiency greatly; Guaranteed to treat the continuity of welding support 17 welding, avoided wrong weldering, leaked weldering etc.
Claims (6)
1. an efficient ultrasonic bonding machine comprises briquetting and paw that front end is equipped with the soldering tip of chopper, cooperates with described chopper position; Support to be welded is installed between described briquetting and paw; It is characterized in that the metal derby that described efficient ultrasonic bonding machine also is included in the range of movement of described chopper and is provided with, stagger and be provided with described support to be welded.
2. efficient ultrasonic bonding machine according to claim 1 is characterized in that, described briquetting is a heat block.
3. efficient ultrasonic bonding machine according to claim 2 is characterized in that described metal derby is arranged on the top of described heat block.
4. according to each described efficient ultrasonic bonding machine of claim 1-3, it is characterized in that the end face of described metal derby is provided with Jin Dui or silver heap.
5. according to each described efficient ultrasonic bonding machine of claim 1-3, it is characterized in that described metal derby is gold bullion or silver bullion.
6. according to each described efficient ultrasonic bonding machine of claim 1-3, it is characterized in that there are Gold plated Layer or silver coating in described metal derby surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202046269U CN201559027U (en) | 2009-09-11 | 2009-09-11 | High-efficiency ultrasonic welding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202046269U CN201559027U (en) | 2009-09-11 | 2009-09-11 | High-efficiency ultrasonic welding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201559027U true CN201559027U (en) | 2010-08-25 |
Family
ID=42624174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202046269U Expired - Fee Related CN201559027U (en) | 2009-09-11 | 2009-09-11 | High-efficiency ultrasonic welding machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201559027U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569111A (en) * | 2011-12-27 | 2012-07-11 | 三星半导体(中国)研究开发有限公司 | Pressure plate for wire bonding |
-
2009
- 2009-09-11 CN CN2009202046269U patent/CN201559027U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569111A (en) * | 2011-12-27 | 2012-07-11 | 三星半导体(中国)研究开发有限公司 | Pressure plate for wire bonding |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100825 Termination date: 20160911 |