CN201545936U - Groove-type crystalline silicon wet-method velvet manufacturing equipment - Google Patents
Groove-type crystalline silicon wet-method velvet manufacturing equipment Download PDFInfo
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- CN201545936U CN201545936U CN2009202175128U CN200920217512U CN201545936U CN 201545936 U CN201545936 U CN 201545936U CN 2009202175128 U CN2009202175128 U CN 2009202175128U CN 200920217512 U CN200920217512 U CN 200920217512U CN 201545936 U CN201545936 U CN 201545936U
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Abstract
The utility model discloses groove-type crystalline silicon wet-method velvet manufacturing equipment comprising a liquid medicine circulating system, a liquid medicine concentration management system and a liquid medicine temperature control system which are connected in sequence by water return pipes, wherein the liquid medicine circulating system comprises a technique groove which consists of an inner groove and an outer groove; the inner groove is arranged in the outer groove; a through hole plate is arranged above the inner groove; the bottom part of the inner groove is provided with an injection port, a circulating port and a liquid discharging port; the four surfaces of the top part of the inner groove are provided with overflowing U-shaped holes; the inner wall of the inner groove is provided with a plurality of through holes; and the outer wall of the inner groove is provided with a flow adjusting plate (manual or automatic). The hole diameter size of the through hole changes in direct proportion to the height of the liquid level of the technique groove, and changes with the height of the liquid level, and the diameter of the upper through hole is larger than that of the lower through hole. The groove-type crystalline silicon wet-method velvet manufacturing equipment has the advantages of having low chip crushing rate, high conversion rate, and high safety performance, and saving liquid medicine cost.
Description
Technical field
The utility model relates to a kind of tank-type crystalline silicon wet-method etching equipment, and specifically, what relate to is crystalline silicon slot type wet-method etching treatment facility in a kind of semiconductor crystal silicon and the technical field of solar cell manufacturing.
Background technology
In semiconductor silicon and solar cell manufacturing, the slot type wet-method texturing manufacturing process is that wet etching is carried out on the crystal silicon chip surface, forms little ditch, reduces the reflectivity of silicon chip surface, impels sunlight to carry out multiple reflection at silicon chip surface, to reach the utilization ratio that promotes light.In the preparation technology of sun power crystal silicon cell, the slot type wet-method texturing manufacturing process is the integral part that is related to the photoabsorption of silicon solar energy battery surface, also is one of important channel of improving conversion efficiency of solar cell.In crystalline silicon slot type wet-method texturing manufacturing process, slot type wet-method etching treatment facility is very important some, there is following problem in usually existing crystalline silicon slot type wet-method etching treatment facility: 1) when handling a large amount of object being treateds, be difficult to accomplish to make temperature, the liquor strength on all object being treated surfaces to reach even; 2) be difficult to guarantee the dispose homogeneity of rear surface of object being treated, be difficult to ensure the surface quality after the etching; 3) not only brought obstacle, do not reached fully problems such as spray below also existing in the spray process to device miniaturization; 4) the difficult homogeneous layer fluidisation that realizes from top to bottom also can be in the groove bottom, middle part and silicon chip surface forms sinuous flow or the zone that remains in a standstill; 5) foreign matter of removing by chemical treatment according to it disengages the proportion and the shape difference of thing after the chemical reaction, is difficult to high efficiency discharging.
The utility model content
The technical problems to be solved in the utility model is to provide a kind of and can guarantee crystal silicon chip surface temperature and the uniform crystalline silicon slot type of liquor strength wet-method etching machine in the slot type wet-method etching process.
For realizing above purpose, the utility model provides a kind of tank-type crystalline silicon wet-method etching equipment, comprises medicine liquid circulation, liquor strength management system, fluid temperature Controlling System, and the three is linked in sequence by water return pipeline.
In the such scheme, described medicine liquid circulation comprises technology groove, and described technology groove is made up of inside groove and water jacket, and described inside groove is arranged in the water jacket.
In the such scheme, described inside groove top is provided with orifice plate, and described interior trench bottom is provided with inlet, circulation port and leakage fluid dram, and described inside groove top is provided with overflow U type groove on four sides, described inside groove inwall is provided with most through holes, and described inside groove outer wall is provided with flow control board (manual or automatic).
In the such scheme, the height variation in direct ratio of the pore size of described through hole and technology groove liquid level, along with the variation of liquid level, last through-hole diameter is greater than the lower through-hole diameter.
Owing to adopted technique scheme, the utility model can guarantee that temperature, the liquor strength of all crystals silicon chip surface integral body reaches even when handling a large amount of crystal silicon chips; Guarantee the dispose homogeneity of rear surface of crystal silicon chip, and improve the surface quality after the etching; Improve concentration and uneven temperature problem, and reach spray fully in the spray process; Can avoid causing temperature, the density unevenness of viscous flow part even, thereby reduce of the pollution of viscous flow part particle object being treated; Guarantee the degree of cleaning of crystal silicon chip in the groove.
Description of drawings
Fig. 1 is the main sectional view of technology groove of the present utility model;
Fig. 2 is the upward view of technology groove of the present utility model;
Fig. 3 is the vertical view of technology groove of the present utility model;
Fig. 4 is the sectional view of technology groove of the present utility model;
Fig. 5 is general principles figure of the present utility model.
Among the figure: technology groove 1, ventilating hole plate 2, circulation port 3, flow control board 5, inside groove 4, water jacket 6, inlet 7, leakage fluid dram 8, through hole 9.
Embodiment
The utility model is described in further detail below in conjunction with drawings and Examples, and following description only is used to understand the usefulness of technical solutions of the utility model, is not used in the scope of the present utility model that limits.
Shown in Fig. 1-4, a kind of tank-type crystalline silicon wet-method etching equipment, comprise medicine liquid circulation, liquor strength management system, fluid temperature Controlling System, the three is linked in sequence by water return pipeline, above-mentioned wet etching etching device will possess temperature controlling system, liquor strength management system at least, and possesses the automated closed-loop controlled function of whole systems.Described medicine liquid circulation comprises technology groove 1, and described technology groove 1 is made up of inside groove 4 and water jacket 6, and described inside groove 4 is arranged in the water jacket 6.The integrated etching solution recycle system that the technology groove 1 that above-mentioned inside groove 4 and water jacket 6 are constituted and the hold-up vessel of etching solution circulation usefulness constitute, i.e. medicine liquid circulation.Inside groove 4 bottoms are provided with inlet 7, circulation port 3 and the leakage fluid dram 8 of liquid, described inside groove 4 tops are provided with ventilating hole plate 2, described inside groove 4 end faces are provided with overflow U type groove, and inside groove 2 wall sides open the through hole 9 of some amount, discharge soup continuously and can reach circulation from through hole 9.
The flow control board of using in the arranged outside may command of described inside groove 4 walls with holes (manually or automatically) 5.Structure based on above-mentioned slot type wet-method texturing manufacturing process groove, when carrying out the leather producing process processing in the groove, because changing by direct ratio up and down, side-wall hole also externally has been equipped with flow control board (manual or automatic) 5, and inside groove 4 bottoms possess leakage fluid dram 8, so it is controlled to reach stagger to top from inside groove 4 bottoms time discharge opeing and sidewall lifting rate.
As shown in Figure 4, the height of the aperture of described inside groove 4 wall through holes 9 and technology groove 1 is the formation ratio.Along with liquid level changes, last opening diameter is greater than following opening diameter.Be the liquid measure that control is discharged, reduce the crushing that taken place in the arranged outside of the technology inside groove 4 of through hole 9 manually or the flow control board 5 of automatic and adjustable joint.The size of technology groove 1 wall through hole 9 and the height of technology groove 1 form ratio, and last bore dia is greater than neighbour's following bore dia, make the amount of height discharge in each hole and the flow velocity of substrate surface horizontal direction reach even with this ratio.When a large amount of crystal silicon chips was put into technology groove and done wet-method texturing manufacturing process, for solving an above-mentioned difficult problem on the wall parallel with crystal silicon chip, by certain distance and quantity perforate, the requirement for height of perforate was the same with the height of crystal silicon chip.
Shown in Fig. 1-4, medicine liquid circulation reaches best wet-method etching effect by the temperature homogeneity of circulation increase inside groove 4.When inside groove 4 top overflows during liquid circulation, inside groove 4 wall through holes 9 liquid are discharged, inside groove 4 continuously or discontinuous from groove bottom leakage fluid dram 8 automatic drains.Can be during liquid circulation in inside groove 4 top overflows, liquid also can be discharged from inside groove 4 wall through holes 9 simultaneously, and this structure both can reach control soup round-robin continuity, also can discharge soup automatically from treatment trough 1 bottom.The four sides overflow is formed on the top of the utility model crystalline silicon slot type wet-method etching equipment from the bottom of groove to groove, the liquid state form layers fluidisation that makes progress, be arranged on basal area that inside groove 4 lateral cowling panels make technology groove 1 top greater than the bottom basal area with this viscous flow that reduces liquid, make it to form the mode of convection current.The liquid that the overflow at inside groove 4 tops and through hole 9 are discharged is the mode that all flows to water jacket 6, being provided with in the bottom of inside groove 4 when outside hold-up vessel is supplied with inlet 7 inside groove 4 and fluid exchange is the leakage fluid dram 8 that removal waste fluid is used, and is made liquid form continuous circulation in processing by crystal silicon chip like this and reaches desired equalizing temperature.
As shown in Figure 5, the utility model embodiment general principles figure.The liquor strength management system divides four the road to supply with inside groove 4, and wherein two route soup original fluid containers are directly supplied with by pump, under meter, magnetic valve, Pneumatic valve, and two-way is supplied with by soup weigh tank under meter, magnetic valve, Pneumatic valve in addition; The each add-on of accurately controlling medicinal liquid like this, thus the homoeostasis of inside groove 4 inner liquor strengths guaranteed, guarantee that further the wet-method etching effect is the consistence under the interferential situation unmanned.At least place more than one on-line temperature monitoring device, online concentration monitor device in this technology groove 1 and monitor temperature variation in the technology groove, also can be according to the magnitude of recruitment of new etching liquid in feed rate, output and the technological process of the variation of concentration in technology groove control etching liquid, these functions all can reach by automaticmanual control.
It should be noted that at last: above embodiment only in order to the explanation the utility model and and the described technical scheme of unrestricted the utility model; Therefore, although this specification sheets has been described in detail the utility model with reference to each above-mentioned embodiment,, those of ordinary skill in the art should be appreciated that still and can make amendment or be equal to replacement the utility model; And all do not break away from the technical scheme and the improvement thereof of spirit and scope of the present utility model, and it all should be encompassed in the claim scope of the present utility model.
Claims (8)
1. tank-type crystalline silicon wet-method etching equipment is characterized in that, comprises medicine liquid circulation, liquor strength management system, fluid temperature Controlling System, and the three is linked in sequence by water return pipeline.
2. tank-type crystalline silicon wet-method etching equipment according to claim 1 is characterized in that described medicine liquid circulation comprises technology groove, and described technology groove is made up of inside groove and water jacket, and described inside groove is arranged in the water jacket.
3. tank-type crystalline silicon wet-method etching equipment according to claim 2 is characterized in that, described inside groove top is provided with ventilating hole plate.
4. tank-type crystalline silicon wet-method etching equipment according to claim 2 is characterized in that, described interior trench bottom is provided with inlet, circulation port and leakage fluid dram.
5. tank-type crystalline silicon wet-method etching equipment according to claim 2 is characterized in that, described inside groove top is provided with overflow U type groove on four sides.
6. tank-type crystalline silicon wet-method etching equipment according to claim 2 is characterized in that, described inside groove inwall is provided with most through holes.
7. tank-type crystalline silicon wet-method etching equipment according to claim 2 is characterized in that: described inside groove outer wall is provided with flow control board.
8. tank-type crystalline silicon wet-method etching equipment according to claim 6 is characterized in that: the height variation in direct ratio of the pore size of described through hole and technology groove liquid level, along with the variation of liquid level, last through-hole diameter is greater than the lower through-hole diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202175128U CN201545936U (en) | 2009-09-25 | 2009-09-25 | Groove-type crystalline silicon wet-method velvet manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202175128U CN201545936U (en) | 2009-09-25 | 2009-09-25 | Groove-type crystalline silicon wet-method velvet manufacturing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201545936U true CN201545936U (en) | 2010-08-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202175128U Expired - Fee Related CN201545936U (en) | 2009-09-25 | 2009-09-25 | Groove-type crystalline silicon wet-method velvet manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201545936U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101654809B (en) * | 2009-09-25 | 2011-12-21 | 耿彪 | Tank-type crystalline silicon wet-method etching equipment |
| CN105200527A (en) * | 2015-09-16 | 2015-12-30 | 国网天津市电力公司 | Texturing equipment and cleaning method thereof |
| WO2024021996A1 (en) * | 2022-07-28 | 2024-02-01 | 常州捷佳创精密机械有限公司 | Compatible tank structure and cleaning apparatus |
-
2009
- 2009-09-25 CN CN2009202175128U patent/CN201545936U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101654809B (en) * | 2009-09-25 | 2011-12-21 | 耿彪 | Tank-type crystalline silicon wet-method etching equipment |
| CN105200527A (en) * | 2015-09-16 | 2015-12-30 | 国网天津市电力公司 | Texturing equipment and cleaning method thereof |
| WO2024021996A1 (en) * | 2022-07-28 | 2024-02-01 | 常州捷佳创精密机械有限公司 | Compatible tank structure and cleaning apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100811 Termination date: 20170925 |