CN201535493U - LED radiating device - Google Patents
LED radiating device Download PDFInfo
- Publication number
- CN201535493U CN201535493U CN2009201098800U CN200920109880U CN201535493U CN 201535493 U CN201535493 U CN 201535493U CN 2009201098800 U CN2009201098800 U CN 2009201098800U CN 200920109880 U CN200920109880 U CN 200920109880U CN 201535493 U CN201535493 U CN 201535493U
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- Prior art keywords
- heat pipe
- heat
- led
- radiating
- substrate
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- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model relates to an LED radiating device, which belongs to the technical field of LED illumination. The radiating device comprises a substrate encapsulating the LED light source, heat pipes connected with the substrate and radiating fins connected with the heat pipes, wherein the heat absorbing ends of the heat pipes are connected with the substrate, and the radiating fins are arranged at the heat radiating ends of the heat pipes. The utility model has the advantages of excellent radiating effect, small volume, convenient maintaining and mounting, and long service life.
Description
Technical field
The utility model relates to the led lighting technical field, relates in particular to a kind of LED heat abstractor.
Background technology
Light emitting diode (Light Emitting Diode is called for short LED) is a kind of solid-state semiconductor devices that electric energy can be converted into visible light, and it can directly be converted into light to electricity.The heart of LED is a semi-conductive wafer, and an end of wafer is attached on the support, and an end is a negative pole, and the positive pole that the other end connects power supply makes entire wafer by epoxy encapsulation.Semiconductor wafer is made up of two parts, and a part is a P-type semiconductor, occupies an leading position in its hole, the inside, and the other end is a N-type semiconductor, mainly is electronics here.But when these two kinds of semiconductors couple together, just form one " P-N knot " between them.When electric current acted on this wafer by lead, electronics will be pushed to the P district, and electronics will send energy with the form of photon, the luminous principle of LED that Here it is then with hole-recombination in the P district.Illuminating lamp is the important component part of city illumination, especially, traditional street lamp often adopts high-pressure mercury lamp, the high-pressure mercury lamp shortcoming that light efficiency is low has on the whole caused the huge waste of the energy, therefore, development of new is efficient, energy-conservation, the life-span is long, colour rendering index is high, the illuminating lamp of environmental protection has a crucial meaning to city illumination is energy-conservation.And the needs for above-mentioned novel illumination lamp have exactly been satisfied in the appearance of LED illuminating lamp.
The LED illuminating lamp mainly is made up of led light source, and common integrated being encapsulated on the led light source substrate of led light source.Because led light source work the time has only 20% electric energy to change luminous energy into, all the other electric energy of 80% change heat energy into, too high temperature can make accelerated ageing of LED own and damage, thereby do not reach led light source desirable service life, so research and development and seek the significant concern point that suitable cooling system is a LED illuminating lamp industry always.
The heat that produces during led light source work mainly concentrates on the LED substrate, because integrated encapsulated LED light source substrate area only has about 46mm * 40mm, and the coefficient of heat conduction of the Aluminium Radiator that uses now has only between 155W/Mk～209W/Mk, can't satisfy the heat conduction and the heat dispersion requirement of the high heat density occasion of LED.Simultaneously, existing LED illuminating lamp cooling system is short service life, and has increased whole illuminating lamp weight.And owing to use the 220V alternating current of family expenses, the safe handling coefficient of light fixture is relatively low.
Summary of the invention
In view of above-mentioned existing in prior technology problem, heat conduction and the heat dispersion that the purpose of this utility model provides a kind of pyroconductivity height, can fully satisfy the high heat density occasion of LED illuminating lamp require, the large-power light-emitting diodes light source radiating device of safe and reliable, long service life and novel environment friendly.
The purpose of this utility model is achieved through the following technical solutions:
A kind of LED heat abstractor comprises the substrate of encapsulation LED light source, heat pipe that is connected with aforesaid substrate and the radiating fin that is connected with thermal conducting tube phase.
Described heat pipe comprises 1 or a plurality of.Described heat pipe comprises 4, and is divided into two groups, and two every group, two groups of heat pipe symmetries are connected with substrate.
The heat absorbing end of described heat pipe is connected with described substrate, and described radiating fin is located at the radiating end of heat pipe.The heat absorbing end of described heat pipe is connected with described substrate, and the heat absorbing end that comprises heat pipe is interted at an end of LED substrate.
When being provided with, the radiating end of described heat pipe is higher than the heat absorbing end of heat pipe on a vertical plane.
When being provided with, the radiating end of described heat pipe upwards bends 90 degree or 180 degree.The radiating end of described heat pipe upwards bends 90 degree, refers to heat pipe and curves the L type.The radiating end of the described heat pipe double flat that makes progress refers to heat pipe and curve the U type, thereby the radiating end of heat pipe becomes parastate with heat absorbing end.
When being provided with, the radiating end of the described heat pipe upwards angle of bending is spent greater than 1 degree and less than 90.The radiating end of described heat pipe upwards the angle of bending greater than 1 degree and less than 90 degree, upwards bending and of the radiating end that refers to heat pipe from the horizontal by a acute angle greater than 1 degree.
Described heat pipe comprises capillary formula heat pipe.Heat pipe can be divided into thermal siphon formula heat pipe and capillary formula heat pipe etc. according to the mode difference of liquid-phase reflux.Capillary formula heat pipe is meant mainly the heat pipe of finishing the liquid-phase reflux mode by the imbibition core of being made up of the capillary porous material that is located at inner wall of heat pipe.
Described radiating fin comprises 1 or multi-disc.
Described radiating fin comprises that thickness is 0.2 millimeter to 0.5 millimeter heat conductor thin slice.The heat conductor thin slice mainly comprises the heat conductor thin slice that metal materials such as aluminium, copper are formed.
Heat pipe (or claiming heat pipe) is a kind of all special materials of temperature characteristics that has fast, and the metal body of its hollow make its characteristics with light weight, and the characteristic of its quick samming makes then it have the superior function of hot superconduction.Heat pipe is the closed cavity that a Inner contains the fluid that can flow basically, the fluid that relies on cavity Inner to flow continues liquid vapour two phase change of circulation, and vapour and liquid fluid vapour between heat absorbing end and radiating end makes housing surface present the characteristic of quick samming and reaches the purpose of heat transfer toward the convection current that liquid returns.
The operation principle of heat pipe is: the fluid that its liquid phase of heat pipe heat absorption back can flow flashes to vapour phase in heat absorbing end, this produces partial high pressure at cavity Inner in a flash, order about the fluid high-speed that vapour phase can flow and flow to radiating end, the fluid that vapour phase can flow is after radiating end Ning Knot becomes liquid phase, rely on gravity, capillary force or centrifugal force etc. to be back to heat absorbing end, circulate, thereby reach the purpose of heat conduction and heat radiation.Hence one can see that, and during heat pipe work, air-flow is by the driving of atmospheric pressure difference, and liquid stream then must be complied with the duty when using, and adopts or design the backflow driving force that is fit to.
Because in the diabatic process of evaporation-condensation, working fluid is in saturation state in the pipe, so heat pipe almost transmits heat under isothermal.
A kind of LED heat abstractor of the present utility model has good heat dissipation effect by above-mentioned design, and then has guaranteed the work of led light source long-term stability, has reached led light source desirable service life.Simultaneously, design of the present utility model makes the LED illuminating lamp overall weight of making alleviate greatly, has solved to make above big, the heavy technical barrier of LED illuminating lamp volume of 200W.In addition, because the power supply source of heat pipe is a low-voltage dc voltage, and then had not only saved electric energy but also guaranteed the safe handling coefficient of illuminating lamp.
Description of drawings
Fig. 1 is a kind of embodiment master TV structure schematic diagram of the present utility model;
Fig. 2 is a kind of embodiment of the present utility model left side TV structure schematic diagram;
Fig. 3 is an another kind of embodiment structural representation of the present utility model.
The specific embodiment
Be elaborated for a kind of LED heat abstractor of the present utility model below in conjunction with accompanying drawing.
Embodiment one, and as depicted in figs. 1 and 2, a kind of LED heat abstractor comprises the substrate 1 of encapsulation LED light source, heat pipe 2 that is connected with aforesaid substrate 1 and the radiating fin 3 that is connected with heat pipe 2.
The heat absorbing end 21 of described heat pipe 2 is connected with described substrate 1, and described radiating fin 3 is located at the radiating end 22 of heat pipe 2.The heat absorbing end 21 of described heat pipe 2 is connected with described substrate 1, and the heat absorbing end 21 that comprises heat pipe 2 is interted at an end of LED substrate 1.Heat pipe 2 comprises 4, and wherein per 2 are divided into one group, and every group of heat pipe 2 difference symmetries are connected with substrate 1 two ends.When promptly one group of heat pipe 2 was connected with substrate 1 one ends, corresponding substrate 1 other end of first group of heat pipe 2 one end of another group heat pipe 2 and connection was connected.Heat pipe 2 also can comprise 1 or a plurality of.
When being provided with, the radiating end 22 of described heat pipe 2 is double flat upwards.Just heat pipe 2 curves the U type, thus 21 one-tenth parastates of the radiating end 22 of heat pipe 2 and heat absorbing end.Simultaneously, when being provided with, the radiating end 22 of described heat pipe 2 upwards can also be bent 90 degree.The radiating end 22 of described heat pipe 2 upwards bends 90 degree, refers to heat pipe 2 and curves the L type.
Described heat pipe 2 comprises capillary formula heat pipe.
Described radiating fin 3 comprises that thickness is 0.2 millimeter to 0.5 millimeter heat conductor thin slice.The heat conductor thin slice mainly comprises the heat conductor thin slice that metal materials such as aluminium, copper are formed.Described radiating fin 3 comprises more than 1 or 1.
Embodiment two, and as shown in Figure 2, a kind of LED heat abstractor comprises the substrate 1 of encapsulation LED light source, heat pipe 2 that is connected with aforesaid substrate 1 and the radiating fin 3 that is connected with heat pipe 2.
The heat absorbing end 21 of described heat pipe 2 is connected with described substrate 1, and described radiating fin 3 is located at the radiating end 22 of heat pipe 2.The heat absorbing end 21 of described heat pipe 2 is connected with described substrate 1, and the heat absorbing end 21 that comprises heat pipe 2 is interted at an end of LED substrate 1.Heat pipe 2 comprises 4, and wherein per 2 are divided into one group, and every group of heat pipe 2 difference symmetries are connected with substrate 1 two ends.When promptly one group of heat pipe 2 was connected with substrate 1 one ends, corresponding substrate 1 other end of first group of heat pipe 2 one end of another group heat pipe 2 and connection was connected.Heat pipe 2 also can comprise 1 or a plurality of.
When being provided with, the radiating end 22 of the described heat pipe 2 upwards angle of bending is spent greater than 1 degree and less than 90.Upwards bending and of heat pipe 2 just from the horizontal by a acute angle greater than 1 degree.
Described heat pipe 2 comprises capillary formula heat pipe.
Described radiating fin 3 comprises that thickness is 0.2 millimeter to 0.5 millimeter heat conductor thin slice.The heat conductor thin slice mainly comprises the heat conductor thin slice that metal materials such as aluminium, copper are formed.Described radiating fin 3 comprises more than 1 or 1.
The operation principle of this heat abstractor is: the heat that produces during LED work is delivered to the heat absorbing end 21 of heat pipe 2 by substrate 1, the heat absorbing end 21 of heat pipe 2 is delivered to rapidly on the radiating fin 3 of radiating end 22 by the working fluid (heat-conducting medium or refrigerant) in the pipe, forming heat exchange by cross-ventilation is dispersed in the air, thereby reach the analgesic purpose of rapid cooling, and then guarantee that led light source works for a long time under low temperature environment.
LED heat abstractor of the present utility model has good heat dissipation effect by above-mentioned design, and then has guaranteed the work of led light source long-term stability, has reached led light source desirable service life.Simultaneously, design of the present utility model makes the LED illuminating lamp overall weight of making alleviate greatly, has solved to make above big, the heavy technical barrier of LED illuminating lamp volume of 200W.In addition, because the power supply source of heat pipe is a low-voltage dc voltage, and then had not only saved electric energy but also guaranteed the safe handling coefficient of illuminating lamp.
The above; it only is the preferable specific embodiment of the utility model; but protection domain of the present utility model is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the utility model discloses; the variation that can expect easily or replacement all should be encompassed within the protection domain of the present utility model.Therefore, protection domain of the present utility model should be as the criterion with the protection domain of claims.
Claims (10)
1. a LED heat abstractor is characterized in that, this heat abstractor comprises the substrate of encapsulation LED light source, heat pipe that is connected with aforesaid substrate and the radiating fin that is connected with thermal conducting tube phase.
2. LED heat abstractor according to claim 1 is characterized in that, described heat pipe comprises 1 or a plurality of.
3. LED heat abstractor according to claim 2 is characterized in that described heat pipe comprises 4, and is divided into two groups, and two every group, two groups of heat pipe symmetries are connected with substrate.
4. LED heat abstractor according to claim 3 is characterized in that, described heat pipe comprises capillary formula heat pipe.
5. LED heat abstractor according to claim 1 is characterized in that, the heat absorbing end of described heat pipe is connected with described substrate, and described radiating fin is located at the radiating end of heat pipe.
6. LED heat abstractor according to claim 1 or 5 is characterized in that when being provided with, the radiating end of described heat pipe is higher than the heat absorbing end of heat pipe on a vertical plane.
7. LED heat abstractor according to claim 6 is characterized in that, when being provided with, the radiating end of described heat pipe upwards bends 90 degree or 180 degree.
8. LED heat abstractor according to claim 6 is characterized in that, when being provided with, the radiating end of the described heat pipe upwards angle of bending is spent greater than 1 degree and less than 90.
9. LED heat abstractor according to claim 1 is characterized in that, described radiating fin comprises 1 or multi-disc.
10. according to claim 1 or 9 described LED heat abstractors, it is characterized in that described radiating fin comprises that thickness is 0.2 millimeter to 0.5 millimeter heat conductor thin slice.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201098800U CN201535493U (en) | 2009-07-22 | 2009-07-22 | LED radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201098800U CN201535493U (en) | 2009-07-22 | 2009-07-22 | LED radiating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201535493U true CN201535493U (en) | 2010-07-28 |
Family
ID=42535272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201098800U Expired - Fee Related CN201535493U (en) | 2009-07-22 | 2009-07-22 | LED radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201535493U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110536585A (en) * | 2018-05-24 | 2019-12-03 | 广达电脑股份有限公司 | Cooling device and server unit |
-
2009
- 2009-07-22 CN CN2009201098800U patent/CN201535493U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110536585A (en) * | 2018-05-24 | 2019-12-03 | 广达电脑股份有限公司 | Cooling device and server unit |
| US10779439B2 (en) | 2018-05-24 | 2020-09-15 | Quanta Computer Inc. | Remote heat exchanger |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Zhongshan Hongbao Power Co., Ltd. Assignor: Du Jifang Contract record no.: 2011440000084 Denomination of utility model: Method for making LED heat radiator Granted publication date: 20100728 License type: Exclusive License Record date: 20110301 |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100728 Termination date: 20110722 |