CN201520812U - Electroplating mold of connector terminal - Google Patents
Electroplating mold of connector terminal Download PDFInfo
- Publication number
- CN201520812U CN201520812U CN2009202681473U CN200920268147U CN201520812U CN 201520812 U CN201520812 U CN 201520812U CN 2009202681473 U CN2009202681473 U CN 2009202681473U CN 200920268147 U CN200920268147 U CN 200920268147U CN 201520812 U CN201520812 U CN 201520812U
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- plate
- hole slot
- cover plate
- electroplating
- electrode
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Abstract
The utility model discloses an electroplating mold of a connector terminal, comprising an electroplating electrode connected with an electrode of an electroplating rectifier as well as a bottom plate, a hole slot plate and a cover plate which are arranged in a stacked manner, wherein the hole slot plate is arranged on the bottom plate; the cover plate covers the hole slot plate; the middle of the hole slot plate is provided with a hole slot; the side surface of the hole slot plate is provided with a liquid injecting hole; the cover plate is symmetrically provided with two inclined plates; and one end of each inclined plate is connected with the hole slot, and the other end thereof is exposed to the outer side of the cover plate; and an electrode net is arranged between the two inclined plates and electrically connected with the anode of the rectifier. The electroplating mold can convert the immersion plating technique in the prior art into a spray-plating technique, and use a tape-running mode for feeding, and when the inner side of the terminal reaches the control standard of 0.38mum, the thickness of a gold film at the outer side of the terminal is only between 0.1mum to 0.25mum, thus greatly saving the use amount of gold of noble metals, and reducing the production cost.
Description
Technical field
The utility model discloses a kind of mould, particularly a kind of mould for electroplating connector terminal.
Background technology
Along with the application of electronic product in people's life is more and more, the accessory of electronic product has also obtained broad development.At present, electronic product develops towards the modularization direction, all be connected between module and motherboard or module and the module by junctor, terminal on the junctor of the prior art needs half, and zinc-plated half is gold-plated, what adopt when zinc-plated and gold-plated is to electroplate processing mode, the gold-plated part contact site (being effective working position) of terminal is in the inboard, at present, it all is the mode of whole gold-plated position immersion plating that general manufacturer takes, the gold-plated thickness of general bonder terminal all is controlled at more than the 0.38um, if the production technique according to general manufacturer is operated, the contact site of bonder terminal is in controlling valu 0.38um, and the thickness of the electrogilding of product outside can reach more than 0.5um～0.55um.Though galvanized product can satisfy the requirement that junctor uses, be exactly that golden consumption is big with the result of this mode, a lot of all is unnecessary waste, has improved production cost greatly.
Summary of the invention
Big at the consumption of gold when gold-plated of the above-mentioned bonder terminal of mentioning of the prior art, cause the shortcoming of unnecessary waste, the utility model provides a kind of new plating mould, it comprises the base plate of stacked setting, hole slot plate and cover plate, be symmetrically installed with swash plate on the cover plate, the electrode network that the ruthenium-iridium-tantalum alloy is made is installed in the middle of two swash plates, logical positive electrode on the electrode network, strip is connected on the swash plate, strip is to walk the mode charging of material, the inboard at gold-plated position belongs to the height district in the electroplating process, the sedimentation rate height, the thickness of electrogilding reaches in the inboard under the condition of control criterion of 0.38um, and the golden thickness in the outside only between 0.1um～0.25um, has been saved golden consumption greatly.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of mould for electroplating connector terminal, include the electroplated electrode that is connected with the electroplating rectifier electrode, mould comprises base plate, hole slot plate and the cover plate of stacked setting, the hole slot plate is installed in above the base plate, the cover plate lid is contained on the hole slot plate, have hole slot in the middle of the hole slot plate, hole slot plate side has liquid filling hole, be symmetrically installed with two swash plates on the cover plate, swash plate one end links to each other with hole slot, the other end is exposed to the cover plate outside, is provided with electrode network in the middle of two swash plates, and electrode network is electrically connected with the rectifier anode.
The technical scheme that its technical problem that solves the utility model adopts further comprises:
Described electrode network material adopts the ruthenium-iridium-tantalum alloy.
Described electrode network adopts the titanium matrix, and the titanium matrix outside is coated with the ruthenium iridium alloy.
Described titanium matrix thickness is 1mm.
Be installed with more than one conductive pin on the described cover plate, electrode network is electrically connected with conductive pin, and conductive pin is electrically connected with the rectifier anode.
The beneficial effects of the utility model are: utilize the utility model to change immersion plating technology of the prior art into spraying plating process, utilize the canoe charging, reach the following time of condition of the control criterion of 0.38um in the terminal inboard, the golden thickness in the terminal outside is only between 0.1um～0.25um, thereby saved the usage quantity of noble metal gold greatly, reduced production cost.
Below in conjunction with the drawings and specific embodiments the utility model is described further.
Description of drawings
Fig. 1 faces structural representation for the utility model.
Fig. 2 looks up structural representation for the utility model.
Fig. 3 is the utility model plan structure synoptic diagram.
Fig. 4 is the A-A cross-sectional view of Fig. 1.
Fig. 5 is the utility model side-looking structural representation.
Among the figure, 1-base plate, 2-hole slot plate, 3-swash plate, 4-cover plate, 5-electrode network, 6-preset pieces, 7-conductive pin, 8-liquid filling hole.
Embodiment
Present embodiment is the utility model preferred implementation, and other all its principles are identical with present embodiment or proximate with basic structure, all within the utility model protection domain.
Please referring to accompanying drawing 1 to accompanying drawing 5, the utility model mainly comprises base plate 1, hole slot plate 2 and cover plate 4, in the present embodiment, base plate 1, hole slot plate 2, cover plate 4 and preset pieces 6 adopt synthetic glass to make.Base plate 1 is the base layer support plate, sealing and fixing is equipped with hole slot plate 2 on the base plate 1, have hole slot in the middle of the hole slot plate 2, be used to hold and mobile electroplate liquid (or being called plating liquid medicine), hole slot plate 2 sides and base plate 1 approximated position have liquid filling hole 8, in the hole slot on electroplate liquid is injected in the hole slot plate 2 from liquid filling hole 8, make it that overflow forms a fixedly liquid level in swash plate 3 cracks.Be installed with cover plate 4 on the hole slot plate 2, the cover plate mid-way is provided with two swash plates 3, in the present embodiment, two swash plates 3 are symmetrical arranged, be provided with certain crack in the middle of two swash plates 3, be provided with electrode network 5 in the crack, the electrode network 5 in the present embodiment adopts ruthenium-iridium-tantalum net alloy, by thickness be the titanium of 1mm as matrix, form through spraying ruthenium iridium alloy.Electrode network 5 is embedded in the middle of the swash plate anode when electroplating, in order to guarantee to electroplate coating evenly, every a segment distance conductive pin 7 is installed on the cover plate 4, conductive pin 7 is electrically connected with electrode network 5, conductive pin 7 links to each other with the anode line of electroplating rectifier is electric.Be installed with preset pieces 6 on the cover plate 4, in the present embodiment, base plate 1, hole slot plate 2 and cover plate 4 be installed together by preset pieces 6.
The utility model in use, to directly be connected to swash plate 3 enterprising walking bands according to the later terminal row of processing requirement electronickelling, during clamping, be that strip inboard (being effective working face) is towards electrode network 5, electroplate liquid directly overflows from the crack of two swash plates, flows outward from the inboard of product.Because in electroplating process, the bonder terminal inboard is nearer from anode (being electrode network 5), the anode line of rectifier is connected conductive pin 7 and is electrically connected with the electrode network 5 that inert anode ruthenium-iridium-tantalum material is made, with galvanized product as negative electrode, under the effect of electroplate liquid, form and electroplate the loop, in electroplating the loop, the inboard at gold-plated position belongs to the height district in the electroplating process, the sedimentation rate height, the thickness of electrogilding reaches in the inboard under the condition of control criterion of 0.38um, the golden thickness in the outside is only between 0.1um～0.25um, even the thickness in the outside is along with increase the duration of service of mould, thickness increases to some extent, and mould can be controlled at outside thickness below 0.25um duration of service substantially in 6 months, save the usage quantity of noble metal gold greatly, reduced production cost.
Swash plate 3 specifications of plating mould are done suitable adjustment according to the shape of plated item and plating area different, and most of product of bonder terminal can use the supporting different swash plates of this mould to produce, and has reduced die design and manufacturing cost.
Claims (5)
1. mould for electroplating connector terminal, include the electroplated electrode that is connected with the electroplating rectifier electrode, it is characterized in that: described mould comprises base plate, hole slot plate and the cover plate of stacked setting, the hole slot plate is installed in above the base plate, the cover plate lid is contained on the hole slot plate, have hole slot in the middle of the hole slot plate, hole slot plate side has liquid filling hole, be symmetrically arranged with two swash plates on the cover plate, swash plate one end links to each other with hole slot, the other end is exposed to the cover plate outside, is provided with electrode network in the middle of two swash plates, and electrode network is electrically connected with the rectifier anode.
2. mould for electroplating connector terminal according to claim 1 is characterized in that: described electrode network material adopts ruthenium-iridium-tantalum.
3. mould for electroplating connector terminal according to claim 2 is characterized in that: described electrode network adopts the titanium matrix, and the titanium matrix outside is coated with the ruthenium iridium alloy.
4. mould for electroplating connector terminal according to claim 3 is characterized in that: described titanium matrix thickness is 1mm.
5. according to claim 1 or 2 or 3 or 4 described mould for electroplating connector terminal, it is characterized in that: be installed with more than one conductive pin on the described cover plate, electrode network is electrically connected with conductive pin, and conductive pin is electrically connected with the rectifier anode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202681473U CN201520812U (en) | 2009-07-01 | 2009-10-23 | Electroplating mold of connector terminal |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920165821.5 | 2009-07-01 | ||
| CN2009202681473U CN201520812U (en) | 2009-07-01 | 2009-10-23 | Electroplating mold of connector terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201520812U true CN201520812U (en) | 2010-07-07 |
Family
ID=42506989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202681473U Expired - Lifetime CN201520812U (en) | 2009-07-01 | 2009-10-23 | Electroplating mold of connector terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201520812U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101713086B (en) * | 2009-07-01 | 2011-08-10 | 深圳格力浦电子有限公司 | Mould for electroplating connector terminal |
| CN102373496A (en) * | 2011-11-04 | 2012-03-14 | 符士正 | Electrode for mold electroplating and process thereof |
-
2009
- 2009-10-23 CN CN2009202681473U patent/CN201520812U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101713086B (en) * | 2009-07-01 | 2011-08-10 | 深圳格力浦电子有限公司 | Mould for electroplating connector terminal |
| CN102373496A (en) * | 2011-11-04 | 2012-03-14 | 符士正 | Electrode for mold electroplating and process thereof |
| CN102373496B (en) * | 2011-11-04 | 2015-04-01 | 符士正 | Electrode for mold electroplating and process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20100707 Effective date of abandoning: 20091023 |