CN201508299U - Tiny metal filament/ball deformability measuring apparatus - Google Patents
Tiny metal filament/ball deformability measuring apparatus Download PDFInfo
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- CN201508299U CN201508299U CN2009201991542U CN200920199154U CN201508299U CN 201508299 U CN201508299 U CN 201508299U CN 2009201991542 U CN2009201991542 U CN 2009201991542U CN 200920199154 U CN200920199154 U CN 200920199154U CN 201508299 U CN201508299 U CN 201508299U
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- ball
- deformability
- vibration amplitude
- measuring apparatus
- amplitude arm
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Abstract
The present utility model discloses a tiny metal filament/ball deformability measuring apparatus mainly comprising a cable clamp, a amplitude pole, a linking tool, a linking platform and a base plate, the base plate is provided with a link bar, the cable clamp and the amplitude pole are connected and fixed on the link bar, the linking platform is fixed on the base plate, one end of the amplitude pole is clamped with the linking tool which corresponds to the linking platform, the other end of the amplitude pole is installed with a grating ruler, and the cable clamp is provided with a force sensor which is positioned on the upper part of the amplitude pole. A metallic material can be measured by a tiny metal filament/ball deformability measuring apparatus and then a deformability performance comparison is performed, the measuring of ten kinds of metal filament samples can be completed within a few hours by using the measuring apparatus of the utility model, and the measuring apparatus having big execution speed and high resolution power can provide reliable feedback information for scientific researchers and perform comparison and evaluation to deformability performance.
Description
Technical field
The utility model relates generally to the detection range of material property, mainly is the measurement mechanism of a kind of minute metallic silk/ball deformability.
Background technology
The gold ball bonding technology has satisfied the requirement of the packaging technology nineties in last century and has obtained developing rapidly and widespread use.Along with the difficulty that in high-density packages, runs into and microelectronic industry to constantly the chasing of profit, the researchist brings into use the more cheap copper of better technological properties, price to replace gold.Advantages such as the superior electrical that copper had, calorifics, mechanical property and low cost make that substituting traditional spun gold bonding that is used to go between with copper wire becomes the new direction of semiconductor packaging process development.Yet because copper wire and copper ball hardness are higher, the deformable performance is relatively poor relatively, and damage appears in silicon easily in the pompon bonding process.For overcoming the above problems, novel copper wire developer adopts the method for adjusting copper wire chemical constitution and manufacturing process to improve the deformable performance of copper wire and corresponding copper ball.Need in the performance history that the copper ball that copper wire sample and they obtain is carried out the key property test and obtain feedback information after burning ball technology.It is time-consuming to adopt classic method such as tension test, mixcrohardness test to test, and the test period is long.Copper wire and copper ball size are little in addition, only are tens of microns, and the artificial interference factor is many in the specimen preparation process, and the test figure deviation is big, and measuring accuracy is poor.Add the defective of the principle of micro-hardness testing method own, the impression scale effect is obvious, and test effect is unsatisfactory.Copper wire and the test of copper ball deformable performance have more become the copper wire bottleneck of research and development fast.For shortening the R﹠D cycle of new copper wire, the copper wire research staff is badly in need of a kind of new method of can be at short notice copper wire sample and their pairing copper ball deformabilities being investigated.
The utility model content
The utility model will solve the shortcoming of above-mentioned prior art, provides a kind of and can obtain the result fast, more intuitively the measurement mechanism of minute metallic silk/ball deformability.
The utility model solves the technical scheme that its technical matters adopts: the measurement mechanism of this minute metallic silk/ball deformability, mainly comprise wire clamp, vibration amplitude arm, bonding tool, bonding platform and base, base is provided with connecting link, wire clamp and vibration amplitude arm are fastened on the connecting link, be fixed with the bonding platform on the base, one end of vibration amplitude arm accompanies bonding tool, bonding tool is corresponding with the bonding platform, the other end of vibration amplitude arm is equipped with the grating chi, wire clamp is provided with force transducer, and force transducer is positioned at the top of vibration amplitude arm.
Described wire clamp and vibration amplitude arm are connected and fixed by hinge and connecting link, and wire clamp and vibration amplitude arm can be along the twisting spot wobbles.
The effect that the utility model is useful is: the utility model is measured metal material by the measurement mechanism of minute metallic silk/ball deformability, carry out the deformable performance then relatively, the method of measuring by this measurement mechanism can be finished the measurement of 10 kinds of tinsel samples in a few hours, execution speed is fast, the resolving power height, can provide reliable feedback information to the scientific research personnel rapidly, the deformable performance is compared assessment.
Description of drawings
Fig. 1 is the structural representation of the utility model device;
Fig. 2 is the variable characteristic comparative measurement schematic diagram of the utility model;
Fig. 3 is the schematic flow sheet of the utility model measuring method.
Description of reference numerals: wire clamp 1, force transducer 2, bonding tool 3, bonding platform 4, vibration amplitude arm 5, hinge 6, connecting link 7, grating chi 8, metal material 9, base 10.
Embodiment
The utility model is described in further detail below in conjunction with drawings and Examples:
As shown in Figure 1, the measurement mechanism of this minute metallic silk/ball deformability, mainly comprise wire clamp 1, vibration amplitude arm 5, bonding tool 3, bonding platform 4 and base 10, wire clamp 1 adopts rigid material to make, when being subjected to little load, do not deform guaranteeing, vibration amplitude arm 5 has certain flexibility, be subjected to after the little load pure elastic deformation to take place, base 10 is provided with connecting link 7, wire clamp 1 and vibration amplitude arm 5 are connected and fixed by hinge 6 and connecting link 7, wire clamp 1 and vibration amplitude arm 5 can be fixed with bonding platform 4 along the twisting spot wobble on the base 10, bonding platform 4 is fixed on the base 10 by the mode of mechanical compaction, one end of vibration amplitude arm 5 accompanies bonding tool 3, and the holding position fixes, and bonding tool 3 is corresponding with bonding platform 4, accompanies metal material to be measured 9 in the bonding tool 3, the other end of vibration amplitude arm 5 is equipped with grating chi 8, the measuring accuracy of grating chi 8 is a submicron order, and the displacement measurement that can satisfy under the micro-meter scale occasion is used, and grating chi 8 is mainly used in the change in displacement of vibration amplitude arm 5 on the z direction and measures.Wire clamp 1 is provided with force transducer 2, and force transducer 2 is positioned at the top of vibration amplitude arm 5.
In the compressing deformation process, rock deformation pressure impels vibration amplitude arm 5 to swing, and drives bonding tool 3 oppress metal material 9 generation bullets, plastic yield on bonding platform 4, subsequently, rock deformation pressure on the bonding tool 3 will be cancelled, and the elastic deformation on the metal material 9 obtains replying.Measure the change in displacement of bonding tool 3 on the z direction by grating chi 8, promptly be out of shape front-back direction and change.Because tinsel or Metal Ball closely contact with bonding tool 3 in deformation process all the time, so the distortion situation of metal material 9 can reflect indirectly by the change in displacement of bonding tool 3 on the z direction.And the force transducer 2 of fixed in position is mainly used to employed practical distortion pressure in the monitoring compressing deformation process on the wire clamp 1.During to vibration amplitude arm 5 imposed loads, wire clamp 1 holding position is constant, and vibration amplitude arm 5 can be because of the stressed elastic deformation that takes place, the relative position of the force transducer 2 on vibration amplitude arm 5 and the wire clamp 1 changes, and force transducer 2 is converted into mechanical signal with the relative position variable signal by certain calculation method and exports by terminal.By the change in displacement before and after 9 distortion of grating chi 8 record metal materials, measure the practical distortion load by force transducer 2, therefore can calculate under specific load tinsel or deflection that Metal Ball took place.
As shown in Figure 2, the left side be hard sphere, changeability is poor; The right side is soft ball, and changeability is good; The size of tinsel or Metal Ball deflection is relevant with deformation load size and the deformability of self.Adopt identical deformation load at different metal silk or Metal Ball sample, so good tinsel or the Metal Ball of deformability incited somebody to action more easy deformation, the high or ball Gao Gengxiao of silk after the distortion.
As shown in Figure 3, the measuring method of this minute metallic silk/ball deformability, metal material to be measured 9 is clipped in the bonding tool 3, bonding tool 3 moves downward until metal material 9 and contacts with bonding platform 4, the position z1 of record bonding tool 3 this moment, metal material 9 contacts with bonding platform 4 and realizes by the induced signal of force transducer 2; After then metal material 9 being applied the appointment deformation load, force metal material 9 that plastic yield takes place, the appointment deformation load that applies is realized by the signal data of force transducer 2, under same measuring condition, carry out guaranteeing, after cancelling deformation load, metal material 9 elastic deformations are replied, by the bonding tool 3 position z2 after 9 distortion of grating chi 8 record metal materials; According to these two position datas, calculate the amount of plastic deformation that metal material 9 is taken place under the certain variations loading, by the deformability that the amount of plastic deformation that compares different metal material 9 is come comparison metal material 9, represent the deformability that tinsel or ball are had under certain variations load with following formula:
D wherein
FBe the deformability coefficient of metal material under appointment deformation load F, D
Tinsel/Metal BallInitial diameter for metal material.
Different tinsel samples and their pairing Metal Ball can be carried out deformability test, relatively their deformability coefficient D under equal deformation condition by above method
FJust can find rapidly who has higher deformability, and the deformability of all samples can be sorted, realize the purpose of quick and precisely more different sample deformabilities.
In addition to the implementation, all employings are equal to the technical scheme of replacement or equivalent transformation formation, all drop on the protection domain of the utility model requirement.
Claims (4)
1. the measurement mechanism of minute metallic silk/ball deformability, mainly comprise wire clamp (1), vibration amplitude arm (5), bonding tool (3), bonding platform (4) and base (10), it is characterized in that: base (10) is provided with connecting link (7), wire clamp (1) and vibration amplitude arm (7) are fastened on the connecting link (7), be fixed with bonding platform (4) on the base (10), one end of vibration amplitude arm (5) accompanies bonding tool (3), bonding tool (3) is corresponding with bonding platform (4), the other end of vibration amplitude arm (5) is equipped with grating chi (8), wire clamp (1) is provided with force transducer (2), and force transducer (2) is positioned at the top of vibration amplitude arm (5).
2. the measurement mechanism of minute metallic silk according to claim 1/ball deformability is characterized in that: described wire clamp (1) and vibration amplitude arm (5) are connected and fixed by hinge (6) and connecting link (7), and wire clamp (1) and vibration amplitude arm (5) can be along the twisting spot wobbles.
3. the measurement mechanism of minute metallic silk according to claim 1/ball deformability is characterized in that: accompany metal material to be measured (9) in the described bonding tool (3).
4. the measurement mechanism of minute metallic silk according to claim 1/ball deformability is characterized in that: described bonding platform (4) is fixed on the base (10) by the mode of mechanical compaction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201991542U CN201508299U (en) | 2009-10-22 | 2009-10-22 | Tiny metal filament/ball deformability measuring apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201991542U CN201508299U (en) | 2009-10-22 | 2009-10-22 | Tiny metal filament/ball deformability measuring apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201508299U true CN201508299U (en) | 2010-06-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201991542U Expired - Fee Related CN201508299U (en) | 2009-10-22 | 2009-10-22 | Tiny metal filament/ball deformability measuring apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201508299U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102042938B (en) * | 2009-10-22 | 2013-02-13 | 浙江金凯微电子有限公司 | Device and method for measuring deformability of micro metal wire/sphere |
-
2009
- 2009-10-22 CN CN2009201991542U patent/CN201508299U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102042938B (en) * | 2009-10-22 | 2013-02-13 | 浙江金凯微电子有限公司 | Device and method for measuring deformability of micro metal wire/sphere |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100616 Termination date: 20101022 |