CN201498511U - Vacuum clamping sucker of semiconductor wafer - Google Patents
Vacuum clamping sucker of semiconductor wafer Download PDFInfo
- Publication number
- CN201498511U CN201498511U CN2009202341113U CN200920234111U CN201498511U CN 201498511 U CN201498511 U CN 201498511U CN 2009202341113 U CN2009202341113 U CN 2009202341113U CN 200920234111 U CN200920234111 U CN 200920234111U CN 201498511 U CN201498511 U CN 201498511U
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- Prior art keywords
- sucker
- communicated
- vacuum
- semiconductor wafer
- vacuum generator
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- Expired - Fee Related
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to an improved vacuum clamping sucker of a semiconductor wafer, which has simple structure and low cost. The vacuum clamping sucker of a semiconductor wafer comprises a sucker, a box base, a motor, a pipeline and an electromagnetic valve, wherein a circular groove is arranged in the middle of the sucker; the output end of the motor is connected with the clamping end of the sucker. The vacuum clamping sucker of a semiconductor wafer is characterized in that: the motor is an ordinary motor; an axial blinding hole is arranged at the central position of the circular groove; a horizontal slant through hole is arranged in the middle radial direction of the clamping end of the sucker; the through hole is communicated with the blinding hole and is provided with a vacuum generator; a vacuum port of the vacuum generator is communicated with the blinding hole; an air supply port of the vacuum generator is communicated with outside compressed air; and an air outlet of the vacuum generator is communicated with the outside air.
Description
(1) technical field
The utility model relates to the semiconductor wafer technical field of processing equipment, is specially a kind of semiconductor wafer vacuum clamping sucking disk.
(2) background technology
The vacuum clamping sucking disk of conventional semiconductor wafer, see Fig. 1, it comprises vacuum equipment 1, sucker 2, housing seat 3, quill shaft motor 4, swivel joint 5, electromagnetically operated valve 6, holding screw 7, vacuum pipe 8, vacuum equipment 1 produces vacuum, usually pressure be-60～-100KPa, be delivered to swivel joint 5 via vacuum pipe 8, the vacuum loop of electromagnetically operated valve 6 On/Off vacuum pipe 8 under the control of digital control system, swivel joint 5 is connected the lower end of quill shaft motor 4 rotation axiss with hollow axle, holding screw 7 is fixed on sucker 2 upper end of quill shaft motor 4 rotation axiss, semiconductor wafer 9 is adsorbed on the sucker 2 under vacuum action securely, and quill shaft motor 4 drives semiconductor wafer 9 high speed rotating.Must adopt quill shaft motor 4 as motor in this structure, its equipment cost height, and this complex structure.
(3) summary of the invention
At the problems referred to above, the utility model provides a kind of semiconductor wafer vacuum clamping sucking disk, and it is simple in structure, and equipment cost is low.
Its technical scheme is such: it comprises sucker, housing seat, motor, pipeline, electromagnetically operated valve, the middle part of described sucker has circular groove, described motor output end connects the bare terminal end of described sucker, it is characterized in that: described motor is a common electric machine, the center of described circular groove has axial blind hole, the bare terminal end middle part of described sucker radially has a horizontal tilt through hole, described through hole and described blind hole connect, in the described through hole vacuum generator is housed, the vacuum port of described vacuum generator is communicated with described blind hole, the air supply opening of described vacuum generator is communicated with outside compressed air and is connected, and the exhaust outlet of described vacuum generator is communicated with outside air.
It is further characterized in that: joint is equipped with on described housing seat top, described housing seat inwall has a cannelure, described joint is communicated with described cannelure, described cannelure is communicated with the air supply opening of described vacuum generator, described compressed air connects described joint by pipeline, and the exhaust outlet of described vacuum generator is communicated with the formed cavity of bare terminal end of described housing seat, sucker.
In the said structure of the present utility model, after semiconductor wafer is loaded on the described sucker, described vacuum generator work, suck compressed air, making becomes vacuum in the described blind hole, causes the firm sticking of semiconductor wafer on described sucker, air and then discharge from the exhaust outlet of described vacuum generator and to enter outside air, the motor that this moment, rotated the bottom is a common electric machine, and it is simple in structure, and equipment cost is low.
(4) description of drawings
Fig. 1 is the front view structural representation of the vacuum clamping sucking disk of semiconductor wafer;
The structural representation of Fig. 2 front view of the present utility model;
Fig. 3 is the mounting structure schematic diagram of vacuum generator of the present utility model.
(5) embodiment
See Fig. 2, Fig. 3, the utility model comprises sucker 1, housing seat 2, motor 3, pipeline 4, electromagnetically operated valve 5, the middle part of sucker 1 has circular groove 6, motor 3 outputs connect the bare terminal end 7 of sucker 1, motor 3 is a common electric machine, the center of circular groove 6 has axial blind hole 8, bare terminal end 7 middle parts of sucker 1 radially have a horizontal tilt through hole 10, through hole 10 connects with blind hole 8, vacuum generator 11 is housed in the through hole 10, the vacuum port 12 of vacuum generator 11 is communicated with blind hole 8, and the air supply opening 13 of vacuum generator 11 is communicated with outside compressed air and is connected, and the exhaust outlet 14 of vacuum generator 11 is communicated with outside air.Joint 15 is equipped with on housing seat 2 tops, housing seat 2 inwalls have a cannelure 16, joint 15 is communicated with cannelure 16, cannelure 16 is communicated with the air supply opening 13 of vacuum generator 11, compressed air is by pipeline 4 jointings 15, and the exhaust outlet 14 of vacuum generator 11 is communicated with the bare terminal end 7 formed cavitys 17 of housing seat 2, sucker 1.9 is semiconductor wafer among the figure.
Claims (4)
1. semiconductor wafer vacuum clamping sucking disk, it comprises sucker, housing seat, motor, pipeline, electromagnetically operated valve, the middle part of described sucker has circular groove, described motor output end connects the bare terminal end of described sucker, it is characterized in that: described motor is a common electric machine, the center of described circular groove has axial blind hole, the bare terminal end middle part of described sucker radially has a horizontal tilt through hole, described through hole and described blind hole connect, in the described through hole vacuum generator is housed, the vacuum port of described vacuum generator is communicated with described blind hole, and the air supply opening of described vacuum generator is communicated with outside compressed air and is connected, and the exhaust outlet of described vacuum generator is communicated with outside air.
2. according to the described a kind of semiconductor wafer vacuum clamping sucking disk of claim 1, it is characterized in that: joint is equipped with on described housing seat top, and described housing seat inwall has a cannelure, and described joint is communicated with described cannelure.
3. according to the described a kind of semiconductor wafer vacuum clamping sucking disk of claim 2, it is characterized in that: described cannelure is communicated with the air supply opening of described vacuum generator, and described compressed air connects described joint by pipeline.
4. according to the described a kind of semiconductor wafer vacuum clamping sucking disk of claim 3, it is characterized in that: the exhaust outlet of described vacuum generator is communicated with the formed cavity of bare terminal end of described housing seat, sucker.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202341113U CN201498511U (en) | 2009-07-29 | 2009-07-29 | Vacuum clamping sucker of semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202341113U CN201498511U (en) | 2009-07-29 | 2009-07-29 | Vacuum clamping sucker of semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201498511U true CN201498511U (en) | 2010-06-02 |
Family
ID=42441712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202341113U Expired - Fee Related CN201498511U (en) | 2009-07-29 | 2009-07-29 | Vacuum clamping sucker of semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201498511U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103112242A (en) * | 2013-02-01 | 2013-05-22 | 中国电子科技集团公司第四十八研究所 | Sucker device of full-automatic screen printer |
| CN103200514A (en) * | 2013-02-05 | 2013-07-10 | 王之华 | Microphone casing internal insulation isolation ring manufacturing method and microphone casing internal insulation isolation ring manufacturing device |
| CN103763845A (en) * | 2014-01-29 | 2014-04-30 | 刘斌 | Application of radiation source alpha to pick-and-place device |
| CN110056566A (en) * | 2019-04-21 | 2019-07-26 | 亚米拉自动化技术（苏州）有限公司 | A kind of vacuum chuck for compromise face absorption |
-
2009
- 2009-07-29 CN CN2009202341113U patent/CN201498511U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103112242A (en) * | 2013-02-01 | 2013-05-22 | 中国电子科技集团公司第四十八研究所 | Sucker device of full-automatic screen printer |
| CN103200514A (en) * | 2013-02-05 | 2013-07-10 | 王之华 | Microphone casing internal insulation isolation ring manufacturing method and microphone casing internal insulation isolation ring manufacturing device |
| CN103200514B (en) * | 2013-02-05 | 2015-07-08 | 王之华 | Microphone casing internal insulation isolation ring manufacturing method |
| CN103763845A (en) * | 2014-01-29 | 2014-04-30 | 刘斌 | Application of radiation source alpha to pick-and-place device |
| CN110056566A (en) * | 2019-04-21 | 2019-07-26 | 亚米拉自动化技术（苏州）有限公司 | A kind of vacuum chuck for compromise face absorption |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100602 Termination date: 20120729 |