CN201456254U - Guiding wheel for cutting single-crystal silicon - Google Patents
Guiding wheel for cutting single-crystal silicon Download PDFInfo
- Publication number
- CN201456254U CN201456254U CN2009200752385U CN200920075238U CN201456254U CN 201456254 U CN201456254 U CN 201456254U CN 2009200752385 U CN2009200752385 U CN 2009200752385U CN 200920075238 U CN200920075238 U CN 200920075238U CN 201456254 U CN201456254 U CN 201456254U
- Authority
- CN
- China
- Prior art keywords
- cutting
- guiding wheel
- coating
- guide wheel
- crystal silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The utility model belongs to the technical field of mechanical manufacture equipment, and relates to a cutting equipment component, in particular to a guiding wheel for cutting single-crystal silicon. In order to solve the problems that the service life of guiding wheels for cutting single-crystal silicon is commonly shorter, thereby the guiding wheels need replacing frequently, the utility model provides a guiding wheel for cutting the single-crystal silicon. The guiding wheel at least comprises a metal shaft core and a plurality of linear slots for cutting steel wires and coiling on the guiding wheel, the guiding wheel further comprises a coating arranged on the surface of the metal shaft core, a plurality of linear slots are arranged on the coating, the coating is made of polyurethane, the guiding wheel which adopts the structure of the utility model can be continuously used for 1200 to 2000 hours, the service life is long, the production efficiency is greatly improves, and thereby the production cost is lowered.
Description
Technical field
The utility model belongs to the machining equipment technical field, relates to a kind of cutting equipment parts, is specifically related to a kind of guide wheel that is used for cutting silicon.
Background technology
Circle cutting technique or line cutting technology in general employing of the above specification silicon single crystal of existing cutting 200mm disk, but increase along with the silicon wafer diameter, interior circle cutting technique strengthens the damage layer of silicon chip surface, generally be about 30～40 microns, line cutting technology is to adopt guide wheel to drive line of cut silicon rod is cut, though it is little that this technology has an otch, the loss of silicon rod otch is little (to be about 60% of interior circle cutting technique, this is equivalent to 6 disks of inside diameter slicer cutting and saves out 1 disk), the silicon chip surface damage layer more shallow (being about 10～15 microns) of cutting, sheet protonatomic mass human factor is few, and cutting efficiency is higher (to be approximately interior 6～8 times of justifying cutting technique.About 8 hours, once can cut out about 400 disks in the cutting process) characteristics, but the service life of guide wheel is generally shorter, thereby needs the frequent guide wheel of changing, and brings certain influence for the cutting of silicon wafer.
Summary of the invention
Technical problem to be solved in the utility model is that the life-span of the existing guide wheel that is used for cutting silicon is generally shorter, thereby needs the frequent problem of changing guide wheel, and a kind of guide wheel that is used for cutting silicon is provided.
The utility model solves this technical problem by following scheme:
A kind of guide wheel that is used for cutting silicon, at least comprise that metal shaft core and several are used to cut steel wire and are wrapped in wire casing on the guide wheel, described guide wheel also comprises the coating that is located on the metal shaft wicking surface, and described several wire casings are located on this coating, and described coating is made by polyurethane.
Polyurethane material is because have higher mechanical strength, remarkable wearability, outstanding resistance to compression, hardness range is wide, and under high rigidity, still has high resiliency, the surface smoothness height, performances such as machining property is superior are widely used, the utility model utilizes the characteristics that polyurethane is wear-resisting, machining property is superior, outside described metal shaft core, apply polyurethane coating, and be used to cut steel wire and be wrapped in wire casing on the guide wheel in that several are set on coating, come cutting silicon as the steel wire guide wheel.
As a suggestion of the present utility model, polyurethane coating thickness is generally 5-10mm, after common guide wheel adopts structure described in the utility model to carry out corresponding improvement, can use continuously 1200-2000 hour, long service life has improved production efficiency greatly, has dropped to production cost.
Because the degree of depth of wire casing fluting can influence wiring and wire jumper, it is thick that the wire casing spacing can directly influence silicon wafer, and the wire casing angle can influence steel wire stability and wiring difficulty or ease.Therefore the utility model also improves the size of wire casing, and the wire casing degree of depth after the improvement is 50-3000 μ m, and its spacing is greater than 150 μ m, and the wire casing angle is 40 °-150 °.
Description of drawings
Accompanying drawing 1 is the embodiment 1 described a kind of shaft section figure of cutting silicon guide wheel and partial enlarged drawing of wire casing of being used for.
The specific embodiment
Embodiment 1
A kind of guide wheel that is used for cutting silicon, at least comprise that metal shaft core 3 and several are used to cut steel wire and are wrapped in wire casing 2 on the guide wheel, described guide wheel also comprises the coating 1 that is located on the metal shaft wicking surface, and described several wire casings 2 are located on this coating 1, and described coating 1 is made by polyurethane.
The length of metal shaft core is 340mm, has applied the polyurethane coating of one deck 6mm outside the metal shaft core, and described coating layer thickness is 7mm, and the depth H of described wire casing is 1600 μ m, and spacing P is 180 μ m, and wire casing angle a is 45 °.
Should be appreciated that those skilled in the art can make various changes or modifications the present invention after having read instruction foregoing of the present invention, these equivalent form of values fall within the application's appended claims institute restricted portion equally.
Claims (2)
1. guide wheel that is used for cutting silicon, at least comprise that metal shaft core and several are used to cut steel wire and are wrapped in wire casing on the guide wheel, it is characterized in that described guide wheel also comprises the coating that is located on the metal shaft wicking surface, described several wire casings are located on this coating, and described coating is made by polyurethane.
2. a kind of guide wheel that is used for cutting silicon according to claim 1 is characterized in that described coating layer thickness is 5-10mm, and the degree of depth of described wire casing is 50-3000 μ m, and spacing is greater than 150 μ m, and the wire casing angle is 40 °-150 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200752385U CN201456254U (en) | 2009-07-24 | 2009-07-24 | Guiding wheel for cutting single-crystal silicon |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200752385U CN201456254U (en) | 2009-07-24 | 2009-07-24 | Guiding wheel for cutting single-crystal silicon |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201456254U true CN201456254U (en) | 2010-05-12 |
Family
ID=42383607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009200752385U Expired - Fee Related CN201456254U (en) | 2009-07-24 | 2009-07-24 | Guiding wheel for cutting single-crystal silicon |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201456254U (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101973083A (en) * | 2010-09-29 | 2011-02-16 | 常州亿晶光电科技有限公司 | Cutting wire guide wheel component of silicon rod cut square machine |
| CN102441947A (en) * | 2010-10-15 | 2012-05-09 | 上海启发电子科技有限公司 | Wear-resistant guide wheel and production method thereof |
| CN103316811A (en) * | 2013-07-01 | 2013-09-25 | 镇江荣德新能源科技有限公司 | Guide wheel coating mould of silicon wafer cutter |
| CN103395131A (en) * | 2013-08-02 | 2013-11-20 | 苏州协鑫光伏科技有限公司 | Multi-wire cutting machine guide wheel wire groove and machining method thereof |
| CN103448152A (en) * | 2013-08-20 | 2013-12-18 | 洛阳鸿泰半导体有限公司 | Guide wheel device for extracting solar silicon rod |
| CN103507169A (en) * | 2013-09-27 | 2014-01-15 | 无锡荣能半导体材料有限公司 | Orientation wheel of squaring machine |
| CN103507175A (en) * | 2013-10-29 | 2014-01-15 | 高佳太阳能股份有限公司 | Guide pulley structure for silicon wafer cutting |
| CN103978311A (en) * | 2013-02-13 | 2014-08-13 | 应用材料瑞士有限责任公司 | Wire guide and a method for forming a wire guide |
| CN104097269A (en) * | 2013-09-30 | 2014-10-15 | 凡登（江苏）新型材料有限公司 | Guide wheel with customized groove type for multi-line cutting and preparation method thereof |
| CN106273012A (en) * | 2016-08-08 | 2017-01-04 | 保定爱廸新能源股份有限公司 | A kind of adjustable diameter guide wheel |
-
2009
- 2009-07-24 CN CN2009200752385U patent/CN201456254U/en not_active Expired - Fee Related
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101973083A (en) * | 2010-09-29 | 2011-02-16 | 常州亿晶光电科技有限公司 | Cutting wire guide wheel component of silicon rod cut square machine |
| CN102441947A (en) * | 2010-10-15 | 2012-05-09 | 上海启发电子科技有限公司 | Wear-resistant guide wheel and production method thereof |
| CN102441947B (en) * | 2010-10-15 | 2015-08-05 | 上海启发电子科技有限公司 | A kind of Wear-resistant guide wheel and production method thereof |
| CN103978311A (en) * | 2013-02-13 | 2014-08-13 | 应用材料瑞士有限责任公司 | Wire guide and a method for forming a wire guide |
| CN103316811A (en) * | 2013-07-01 | 2013-09-25 | 镇江荣德新能源科技有限公司 | Guide wheel coating mould of silicon wafer cutter |
| CN103316811B (en) * | 2013-07-01 | 2016-01-20 | 镇江荣德新能源科技有限公司 | A kind of guide wheel coating mould of silicon chip cutter |
| CN103395131A (en) * | 2013-08-02 | 2013-11-20 | 苏州协鑫光伏科技有限公司 | Multi-wire cutting machine guide wheel wire groove and machining method thereof |
| CN103448152A (en) * | 2013-08-20 | 2013-12-18 | 洛阳鸿泰半导体有限公司 | Guide wheel device for extracting solar silicon rod |
| CN103507169A (en) * | 2013-09-27 | 2014-01-15 | 无锡荣能半导体材料有限公司 | Orientation wheel of squaring machine |
| WO2015043384A1 (en) * | 2013-09-30 | 2015-04-02 | 凡登（江苏）新型材料有限公司 | Multi-line cutting guide wheel with customized groove type, and manufacturing method therefor |
| CN104097269A (en) * | 2013-09-30 | 2014-10-15 | 凡登（江苏）新型材料有限公司 | Guide wheel with customized groove type for multi-line cutting and preparation method thereof |
| CN104097269B (en) * | 2013-09-30 | 2016-06-29 | 凡登（江苏）新型材料有限公司 | A kind of multi-wire saw guide wheel customizing grooved and preparation method thereof |
| CN103507175A (en) * | 2013-10-29 | 2014-01-15 | 高佳太阳能股份有限公司 | Guide pulley structure for silicon wafer cutting |
| CN106273012A (en) * | 2016-08-08 | 2017-01-04 | 保定爱廸新能源股份有限公司 | A kind of adjustable diameter guide wheel |
| CN106273012B (en) * | 2016-08-08 | 2017-11-03 | 保定爱廸新能源股份有限公司 | A kind of adjustable diameter guide wheel |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201456254U (en) | Guiding wheel for cutting single-crystal silicon | |
| EP2508636A3 (en) | Polycrystalline diamond compacts, method of fabricating same, and various application | |
| TW201119772A (en) | A sawing wire with abrasive particles partly embedded in a metal wire and partly held by an organic binder | |
| JP2006002937A (en) | Fluid dynamic pressure bearing device, its manufacturing method, spindle motor and recording disk drive | |
| US20170183761A1 (en) | Superhard structure and method of making same | |
| CN111923262B (en) | Circular wire saw and manufacturing method thereof | |
| CN102700014A (en) | Diamond micro-powder plated titanium, nickel-phosphorous and nickel composite diamond wire saw as well as preparation method thereof | |
| US9352448B2 (en) | Superhard structure and method of making same | |
| CN108475561B (en) | Power cable with corrosion-resistant armor | |
| CN101628451B (en) | Saw wire | |
| JP2010234597A (en) | Cutting blade, method for manufacturing cutting blade, and cutting apparatus | |
| WO2021200514A1 (en) | Laminated core and noise filter | |
| CN102501324A (en) | Slot structure of guide wheel of linear cutting machine | |
| CN112440396A (en) | Circular wire saw and manufacturing method thereof | |
| KR101127447B1 (en) | A diamond endless wire rope saw and method for preparing the same | |
| CN202029258U (en) | Composite plating diamond wire rope taking pre-deforming wire as base line | |
| CN110165800A (en) | A kind of processing method of the structure and its stator core of stator core | |
| JP5486039B2 (en) | Spacer used in magnetic disk device and magnetic disk device | |
| CN203697273U (en) | Silicon slice cutting wire | |
| CN206320233U (en) | A kind of thread pressing wheel damping device | |
| JP2003334763A (en) | Fixed abrasive grain wire saw | |
| JP2009114456A (en) | Method for purifying lubricant for magnetic recording medium | |
| CN103008786A (en) | Resin binder fretsaw with spiral groove core wire | |
| CN214644912U (en) | Novel electroplating diamond wire | |
| CN217847634U (en) | Amorphous alloy single-frame iron core and transformer iron core |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100512 Termination date: 20130724 |