CN214644912U - Novel electroplating diamond wire - Google Patents
Novel electroplating diamond wire Download PDFInfo
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- CN214644912U CN214644912U CN202120079216.7U CN202120079216U CN214644912U CN 214644912 U CN214644912 U CN 214644912U CN 202120079216 U CN202120079216 U CN 202120079216U CN 214644912 U CN214644912 U CN 214644912U
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- diamond
- axial
- chip groove
- wire
- diamond wire
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Abstract
The utility model discloses a novel electroplating diamond wire, including baseline, metallic coating, diamond granule, the wire of axial chip groove is evenly seted up to the surface of baseline, the metallic coating plating is at the surface of baseline, diamond granule inlays and distributes in the metallic coating. This novel electroplating buddha's warrior attendant line, through the axial chip groove, can strengthen the mobility of cutting fluid, promote the clastic discharge of cutting, improve cutting efficiency, width, the degree of depth, the groove interval through the axial chip groove are controllable, can screen small-size footpath diamond granule and plate in the chip groove, and large-size footpath diamond granule plates outside the chip groove, realizes that diamond granule axial arranges in order, and through the even regular distribution of axial chip groove, make diamond granule present the unsmooth range of rule, can further strengthen the cutting power.
Description
Technical Field
The utility model belongs to the technical field of electroplate diamond wire, concretely relates to novel electroplating buddha's warrior attendant line.
Background
The electroplated diamond wire is a wire cutting tool with diamond particles consolidated on the surface, has the advantages of narrow cutting seam, high cutting speed, environmental friendliness and the like, and is widely applied to the field of cutting of hard and brittle materials such as crystalline silicon, gems, ceramics and the like. The nickel-plated layer for the electroplated diamond wire in the current market fixes diamond particles on a steel wire base line with a circular section, the electroplated diamond wire depends on gaps among the diamond particles as chip removal channels, and has the characteristics of narrow gaps and random arrangement, cutting chips generated in the cutting process can be adhered around the diamond particles, and the chip removal channels are blocked to cause the reduction of the cutting performance of the electroplated diamond wire.
Disclosure of Invention
The utility model provides a novel electroplate diamond wire, to prior art not enough, the utility model provides a possess the smooth and easy advantage of arranging with the diamond axial in order of chip removal, solved the problem of proposing in the above-mentioned background art.
The utility model provides a following technical scheme: the utility model provides a novel electroplating diamond wire, includes baseline, metallic coating, diamond granule, the wire of axial chip groove is evenly seted up to the surface of baseline, the metallic coating plating is at the surface of baseline, diamond granule inlays the distribution in the metallic coating.
Further, the diameter of the base line is 40 μm to 500 μm.
Further, the axial chip grooves are uniformly arranged on the outer circumferential surface of the base line in a spaced mode.
Furthermore, the width of the axial chip grooves is 5-50 μm, the depth is 3-30 μm, and the distance between adjacent grooves is 20-200 μm.
Further, the metal coating is made of simple substance nickel or nickel-cobalt alloy.
Further, the metal plating layer and the diamond particles are fixed on the base line by a composite plating method.
Has the advantages that:
1. this novel electroplating buddha's warrior attendant line through the axial chip groove, can strengthen the mobility of cutting fluid, promotes the clastic discharge of cutting, improves cutting efficiency.
2. This novel electroplating diamond wire, width, the degree of depth, the groove interval through axial chip groove are controllable, can screen small-size footpath diamond granule and plate in the chip groove, and large-size footpath diamond granule plates outside the chip groove, realizes that diamond granule axial arranges in order.
3. This novel electroplating buddha's warrior attendant line, through the even regular distribution of axial chip groove, make diamond granule present the unsmooth range of rule, can further strengthen the cutting force.
Drawings
FIG. 1 is a cross-sectional view of an electroplated diamond wire according to the present invention;
fig. 2 is a schematic view of the electroplated diamond wire of the present invention.
In the figure: 1. a baseline; 2. a metal plating layer; 3. diamond particles; 4. axial chip grooves.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1
Referring to fig. 1-2, a novel electroplated diamond wire includes a base wire 1, a metal plating layer 2, and diamond particles 3, wherein the outer surface of the base wire 1 is uniformly provided with metal wires having axial chip-removing grooves 4, the metal plating layer 2 is plated on the outer surface of the base wire 1, and the diamond particles 3 are embedded and distributed in the metal plating layer 2.
Wherein the diameter of the base line 1 is 300. mu.m.
Wherein, the axial chip grooves 4 are evenly arranged on the outer circumference surface of the base line 1 at intervals.
Wherein the width of the axial chip grooves 4 is 35 μm, the depth is 20 μm, and the distance between adjacent grooves is 135 μm.
Wherein, the metal plating layer 2 is made of nickel-cobalt alloy.
Wherein the metal plating layer 2 and the diamond particles 3 are fixed on the base string 1 by a composite plating method.
Example 2
Referring to fig. 1-2, a novel electroplated diamond wire includes a base wire 1, a metal plating layer 2, and diamond particles 3, wherein the outer surface of the base wire 1 is uniformly provided with metal wires having axial chip-removing grooves 4, the metal plating layer 2 is plated on the outer surface of the base wire 1, and the diamond particles 3 are embedded and distributed in the metal plating layer 2.
Wherein the diameter of the base line 1 is 100. mu.m.
Wherein, the axial chip grooves 4 are evenly arranged on the outer circumference surface of the base line 1 at intervals.
Wherein the width of the axial chip grooves 4 is 12 μm, the depth is 7 μm, and the distance between adjacent grooves is 63 μm.
Wherein, the metal plating layer 2 is made of simple substance nickel.
Wherein the metal plating layer 2 and the diamond particles 3 are fixed on the base string 1 by a composite plating method.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a novel electroplating diamond wire, includes baseline (1), metallic coating (2), diamond granule (3), its characterized in that: the outer surface of the base line (1) is uniformly provided with metal wires with axial chip removal grooves (4), the metal coating (2) is plated on the outer surface of the base line (1), and the diamond particles (3) are embedded and distributed in the metal coating (2).
2. The novel electroplated diamond wire of claim 1, characterized in that: the diameter of the base line (1) is 40-500 μm.
3. The novel electroplated diamond wire of claim 1, characterized in that: the axial chip discharge grooves (4) are uniformly arranged on the outer circumferential surface of the base line (1) at intervals.
4. The novel electroplated diamond wire of claim 1, characterized in that: the width of the axial chip grooves (4) is 5-50 mu m, the depth is 3-30 mu m, and the distance between adjacent grooves is 20-200 mu m.
5. The novel electroplated diamond wire of claim 1, characterized in that: the metal coating (2) is made of simple substance nickel or nickel-cobalt alloy.
6. The novel electroplated diamond wire of claim 1, characterized in that: the metal coating (2) and the diamond particles (3) are fixed on the base line (1) through a composite electroplating method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120079216.7U CN214644912U (en) | 2021-01-13 | 2021-01-13 | Novel electroplating diamond wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120079216.7U CN214644912U (en) | 2021-01-13 | 2021-01-13 | Novel electroplating diamond wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214644912U true CN214644912U (en) | 2021-11-09 |
Family
ID=78515332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120079216.7U Active CN214644912U (en) | 2021-01-13 | 2021-01-13 | Novel electroplating diamond wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214644912U (en) |
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2021
- 2021-01-13 CN CN202120079216.7U patent/CN214644912U/en active Active
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