CN201413836Y - Packaging structure of illuminating device - Google Patents
Packaging structure of illuminating device Download PDFInfo
- Publication number
- CN201413836Y CN201413836Y CN2009201592627U CN200920159262U CN201413836Y CN 201413836 Y CN201413836 Y CN 201413836Y CN 2009201592627 U CN2009201592627 U CN 2009201592627U CN 200920159262 U CN200920159262 U CN 200920159262U CN 201413836 Y CN201413836 Y CN 201413836Y
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- Prior art keywords
- light
- emitting diode
- wavelength conversion
- conversion assembly
- substrate
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Abstract
The utility model provides a packaging structure of an illuminating device, comprising a substrate having a base plate; at least one light-emitting diode arranged on the base plate; a first transparent resin used for covering and protecting at least one light-emitting diode; a wavelength conversion assembly having a transparent body; a phosphor layer coated on the bottom surface of the transparentbody, wherein when the wavelength conversion assembly is combined with the substrate, the phosphor layer is between the base plate and the transparent body; a support part that is arranged between the substrate and the wavelength conversion assembly around at least one light-emitting diode and used for supporting the wavelength conversion assembly and keeping gap between the phosphor layer and the surface of the first transparent resin. A plurality of through holes are formed in the support part. The substrate and the wavelength conversion assembly are manufactured respectively, then combinedinto the illuminating device, therefore whole scrapped substrate that is caused by poor manufacture of the transparent body and the phosphor layer can be avoided. In addition, a plurality of the through holes formed in the support part can lower temperature of the light-emitting diode.
Description
Technical field
The utility model relates to the encapsulating structure that the light-emitting device of light-emitting diode is arranged in a kind of.
Background technology
Figure 1A is the vertical view of existing light-emitting diode assembly.Figure 1B is the profile of the existing light-emitting diode assembly shown in Figure 1A.With reference to Figure 1B, existing light-emitting diode assembly is to utilize the mode that changes mutually layer by layer made.For example, on substrate 101, be provided with a plurality of light-emitting diodes 102, and on substrate 101, form bundle portion 103 one innings, shown in Figure 1A around a plurality of light-emitting diodes 102.Then, cover a plurality of light-emitting diodes 102, and fill up the zone that innings bundle portion 103 is enclosed with the light-transmissive resin layer 104 that contains fluorescent material.Then, a transparent body 105 is set on light-transmissive resin layer 104, and makes light-transmissive resin layer 104 and the transparent body 105 stacking contacts.When light-emitting diode 102 electrified light emittings, the fluorescent material in the light-transmissive resin layer 104 can be subjected to the exciting of part light of light-emitting diode 102 and send the light of the optical wavelength that differs from light-emitting diode 102.
Yet; because the fluorescent material in the light-transmissive resin layer 104 has bigger proportion; so be sink to innings bottom in the zone that bundle portion 103 is enclosed gradually along with the time through regular meeting,, and then influence the luminous efficiency and the optical appearance of this light-emitting device promptly near the surface of substrate 101.Be head it off, must in light-transmissive resin layer 104, use the fluorescent material of more amount, to obtain desired light conversion effect.In addition, the mode manufacturing that existing light-emitting diode assembly utilization changes layer by layer mutually forms, if error takes place when coating contains the light-transmissive resin layer 104 of fluorescent material, tend to cause scrapping of whole base plate 101 and light-emitting diode 102, thereby improve cost depletions.
Moreover, existing light-emitting diode assembly is the structure because of changing mutually layer by layer also, and when this light-emitting device running, light-emitting diode 102 fails to loose effectively to remove because of the luminous heat that produces, and easily allow fluorescent material heat damage in the light-transmissive resin layer 104, and then influence the luminous efficiency and the optical appearance of this light-emitting device.Therefore, in existing light-emitting diode assembly, must use can resistant to elevated temperatures expensive fluorescent material, just can prolong the useful life of light-emitting diode assembly, so can't reduce its manufacturing cost.
The utility model content
Comprehensive above-mentioned reason need provide a luminous device structure that can reduce cost and improve heat dissipation problem.A kind of encapsulating structure of light-emitting device is provided now, and this encapsulating structure comprises separable pedestal and wavelength Conversion assembly.Pedestal comprises: a substrate; At least one light-emitting diode is located on this substrate; And first transparent resin, in order to cover and this at least one light-emitting diode of protection; One wavelength Conversion assembly comprises: a transparent body; An and luminescent coating, coat on the bottom surface of this transparent body, wherein when this wavelength Conversion assembly combines with this pedestal, this luminescent coating is between between this substrate and this transparent body, when this at least one lumination of light emitting diode, this luminescent coating is subjected to the exciting of part light of this at least one light-emitting diode, and sends the light of the optical wavelength that differs from this at least one light-emitting diode; And a support portion, being arranged between this pedestal and this wavelength Conversion assembly, and round this at least one light-emitting diode, this support portion is in order to supporting this wavelength Conversion assembly, and keeps the gap between the surface of this luminescent coating and this first transparent resin; Wherein form a plurality of perforations in this support portion, these a plurality of perforations in order at this wavelength Conversion assembly with after this pedestal combines, when this light-emitting device running, gap between the surface of this luminescent coating and this first transparent resin is communicated with external environment and produce convection current, and then reduce the temperature of this at least one light-emitting diode.
Wherein this gap is between between 0.3mm to 1.0mm.
Wherein this bottom surface of this transparent body more comprises a notch portion, in order to clog this luminescent coating.
Wherein this transparent body is hemisphere, any convex surface body or flat-surface bodies.
Wherein the thickness of first transparent resin is no more than 0.3mm.
Compared with prior art, the utlity model has following beneficial effect:
The utility model is by the making respectively of pedestal and wavelength Conversion assembly, and row causes scrapping of whole pedestal in conjunction with forming light-emitting device, can eliminating because of the making of the transparent body or luminescent coating is bad again, thereby avoids unnecessary cost waste.In addition, a plurality of perforations that support portion of the present utility model forms make gap between the surface of luminescent coating and first transparent resin communicate with external environment and produce convection current, and then reduce the temperature of this at least one light-emitting diode.
Description of drawings
The utility model can the easy understanding by above-mentioned detailed description and enclose corresponding graphic, and the similar construction package of similar reference number representative.
Figure 1A is the vertical view of the light-emitting device of existing light-emitting diode.
Figure 1B is the profile of the existing light-emitting diode assembly shown in Figure 1A.
Fig. 2 A is the cross sectional view according to the light-emitting device pedestal of one embodiment of the invention.
Fig. 2 B is the vertical view of Fig. 2 A.
Vertical view when Fig. 2 C is provided with perforation for the described structure of Fig. 2 A.
Fig. 3 is the cross sectional view according to the wavelength Conversion assembly of one embodiment of the invention.
Fig. 4 is the encapsulation cross sectional view, shows that the pedestal that Fig. 2 C is painted according to one embodiment of the invention combines with the wavelength Conversion assembly that Fig. 3 is painted.
Fig. 5 is the encapsulation cross sectional view according to another embodiment of the present invention.
The element numbers simple declaration:
101 substrates
102 light-emitting diodes
103 innings of bundle portions
104 light-transmissive resin layers
105 transparent bodies
200 pedestals
202 substrates
204 light-emitting diodes
209 support portions
211 first transparent resins
213 perforations
300 wavelength Conversion assemblies
301 bottom surfaces
302 luminescent coatings
306 transparent bodies
Embodiment
Embodiment of the present utility model will illustrate with reference to alterations.When read describing in detail, can be simultaneously with reference to alterations, and this graphic part of also regarding this detailed description as.
Fig. 2 A snuggles up to the cross sectional view according to the light-emitting device pedestal 200 of one embodiment of the invention.Fig. 2 B is the vertical view of the light-emitting device pedestal 200 shown in Fig. 2 A.Substrate 202 can be semiconductor, metal, pottery or metal-base composites.On substrate 202, be provided with a plurality of light-emitting diodes 204.In this embodiment, shown in Fig. 2 B, arround a plurality of light-emitting diodes 204 on the substrate 202, be provided with support portion 209.Be noted that support portion 209 used in the present embodiment is a cirque structure, but in fact can be not limited thereto.Then, on a plurality of light-emitting diodes 204, cover first transparent resin 211, and its thickness is about 0.3mm.First transparent resin 211 makes these light-emitting diodes and air isolated in order to protect a plurality of light-emitting diodes 204, not polluted and corrosion by any gas and aqueous vapor.When coating first transparent resin 211, support portion 209 can be used as a limitation border, and it overflows predetermined scope in order to prevent first transparent resin 211.After first transparent resin 211 solidifies, shown in Fig. 2 C, a plurality of perforations 213 that are parallel to substrate 202 surfaces can be set on support portion 209, for example 4, but in fact can be not limited thereto.
Fig. 3 is the cross sectional view according to the wavelength Conversion assembly 300 of one embodiment of the invention.Wavelength Conversion assembly 300 comprises a transparent body 306.Be noted that, the used transparent body 306 in the present embodiment, it is shaped as hemisphere, but in fact can be not limited thereto.This transparent body also can be any convex surface body or flat-surface bodies.On the bottom surface 301 of the transparent body 306, scribble luminescent coating 302.So, compared to the light-emitting diode assembly shown in Figure 1B, only need use a small amount of fluorophor just can make whole applying area reach the thickness and the uniformity of expection, and reduce the waste of fluorophor.
Fig. 4 is the encapsulation cross sectional view, shows that the pedestal 200 that Fig. 2 C is painted according to one embodiment of the invention combines with the wavelength Conversion assembly 300 that Fig. 3 is painted.When pedestal 200 combined with wavelength Conversion assembly 300, support portion 209 can be in order to supporting wavelength Conversion assembly 300, and keep the gap between the surface of the luminescent coating 302 and first transparent resin 211.This gap is preferably between between the 0.3mm to 1.0mm.When a plurality of light-emitting diode 204 electrified light emittings, luminescent coating 302 can be subjected to the exciting of part light of these light-emitting diodes and send the light of the optical wavelength that differs from these light-emitting diodes.When light-emitting device (combination of pedestal 200 and wavelength Conversion assembly 300) running, perforation 213 on the support portion 209 can make the gap of 211 of luminescent coating 302 and first transparent resins communicate with external environment and produce convection current, the heat utilization convection current that so can make a plurality of light-emitting diode 204 and produced and be passed to the external world, and then reduce the temperature of a plurality of light-emitting diodes 204.
Fig. 5 is the encapsulation cross sectional view according to another embodiment of the present invention.Be with the difference of the encapsulation figure of Fig. 4: the bottom surface 301 of the transparent body 306 of Fig. 5 has a notch portion.Luminescent coating 302 is clogged in this notch portion, the thickness and the uniformity that so can more accurate control luminescent coating 302.
The above only is a preferred implementation of the present utility model; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection range of the present utility model.
Claims (5)
1. the encapsulating structure of a light-emitting device is characterized in that, comprising:
One pedestal comprises:
One substrate;
At least one light-emitting diode is located on this substrate; And
In order to cover and to protect first transparent resin of this at least one light-emitting diode;
One wavelength Conversion assembly comprises:
One transparent body; And
One luminescent coating is coated on the bottom surface of this transparent body,
Wherein when this wavelength Conversion assembly combines with this pedestal, this luminescent coating is between between this substrate and this transparent body, when this at least one lumination of light emitting diode, this luminescent coating is subjected to the exciting of part light of this at least one light-emitting diode, and sends the light of the optical wavelength that differs from this at least one light-emitting diode; And
One support portion is arranged between this pedestal and this wavelength Conversion assembly, and round this at least one light-emitting diode, and this support portion is in order to supporting this wavelength Conversion assembly, and keeps the gap between the surface of this luminescent coating and this first transparent resin;
Wherein form a plurality of perforations in this support portion, these a plurality of perforations in order at this wavelength Conversion assembly with after this pedestal combines, when this light-emitting device running, gap between the surface of this luminescent coating and this first transparent resin is communicated with external environment and produce convection current, and then reduce the temperature of this at least one light-emitting diode.
2. the encapsulating structure of light-emitting device as claimed in claim 1 is characterized in that, wherein this gap is between between 0.3mm to 1.0mm.
3. the encapsulating structure of light-emitting device as claimed in claim 1 is characterized in that, wherein this bottom surface of this transparent body more comprises one in order to clog the notch portion of this luminescent coating.
4. the encapsulating structure of light-emitting device as claimed in claim 1 is characterized in that, wherein this transparent body is hemisphere, any convex surface body or flat-surface bodies.
5. the encapsulating structure of light-emitting device as claimed in claim 1 is characterized in that, wherein the thickness of first transparent resin is no more than 0.3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201592627U CN201413836Y (en) | 2009-06-19 | 2009-06-19 | Packaging structure of illuminating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201592627U CN201413836Y (en) | 2009-06-19 | 2009-06-19 | Packaging structure of illuminating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201413836Y true CN201413836Y (en) | 2010-02-24 |
Family
ID=41715717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201592627U Expired - Fee Related CN201413836Y (en) | 2009-06-19 | 2009-06-19 | Packaging structure of illuminating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201413836Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101901864A (en) * | 2010-06-23 | 2010-12-01 | 深圳市瑞丰光电子股份有限公司 | LED (Light-Emitting Diode) module and LED illumination device |
| CN102097573A (en) * | 2010-12-03 | 2011-06-15 | 东莞市胤腾光电科技有限公司 | High-power light emitting diode (LED) bracket and method for packaging LEDs by using same |
| CN103782401A (en) * | 2011-09-16 | 2014-05-07 | 株式会社东芝 | Semiconductor light emitting device and method for manufacturing same |
| CN106444243A (en) * | 2015-08-07 | 2017-02-22 | 高准精密工业股份有限公司 | Illuminating device |
-
2009
- 2009-06-19 CN CN2009201592627U patent/CN201413836Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101901864A (en) * | 2010-06-23 | 2010-12-01 | 深圳市瑞丰光电子股份有限公司 | LED (Light-Emitting Diode) module and LED illumination device |
| CN102097573A (en) * | 2010-12-03 | 2011-06-15 | 东莞市胤腾光电科技有限公司 | High-power light emitting diode (LED) bracket and method for packaging LEDs by using same |
| CN103782401A (en) * | 2011-09-16 | 2014-05-07 | 株式会社东芝 | Semiconductor light emitting device and method for manufacturing same |
| CN106444243A (en) * | 2015-08-07 | 2017-02-22 | 高准精密工业股份有限公司 | Illuminating device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100224 Termination date: 20130619 |