CN201409255Y - Solder resisting structure of thick copper circuit board - Google Patents
Solder resisting structure of thick copper circuit board Download PDFInfo
- Publication number
- CN201409255Y CN201409255Y CN2009200403045U CN200920040304U CN201409255Y CN 201409255 Y CN201409255 Y CN 201409255Y CN 2009200403045 U CN2009200403045 U CN 2009200403045U CN 200920040304 U CN200920040304 U CN 200920040304U CN 201409255 Y CN201409255 Y CN 201409255Y
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- CN
- China
- Prior art keywords
- circuit board
- solder resisting
- face
- welding resistance
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a solder resisting structure of a thick copper circuit board, which comprises the circuit board and a solder resisting layer. A circuit (namely a copper wire) is formed onthe surface of the circuit board, the solder resisting layer comprises a first solder resisting face and a second solder resisting face, the solder resisting layer covers the surface of the circuit board according to a design area, the first solder resisting face covers the surface of the circuit board in the design area, the second solder resisting face covers the surface of the first solder resisting face, a plurality of skip printing points are arranged on the first solder resisting face, and the second solder resisting face on the surface of the first solder resisting face is filled in theskip printing points of the first solder resisting face. As the second solder resisting face is filled in the skip printing points of the first solder resisting face, the design area which needs solder resisting on the surface of the circuit board is completely covered by the solder resisting layer, thereby effectively solving the problem of insufficient solder resisting filling of the thick copper circuit board.
Description
Technical field
The utility model relates to a kind of heavy copper circuit board, especially a kind of solder mask structure of heavy copper circuit board.
Background technology
At present, general circuit board (PCB) product uses more≤and the Copper Foil of 70um is as the conducting wire, and thicker Copper Foil is not difficult to be applied in batches produce owing to the associated production manufacturing technology has maturation.Yet fields such as automobile, industrial equipment, electronic communication, LCD, PDP, led module more and more need application of high voltages, high electric current, high integrated PCB, impel the PCB producer must design and manufacture the thick Copper Foil pcb board of high multilayer.
Because making, thick copper PCB is different from traditional PCB, the manufacture method that is used in common PCB is applied to can produce many problems in the thick copper PCB making, because copper thickness reaches 175um, very easily occurs the problem of wire mark welding resistance lack of fill in the solder mask manufacturing process of plate.
Summary of the invention
In order to overcome above-mentioned defective, the utility model provides a kind of solder mask structure of heavy copper circuit board, and the solder mask structure of this heavy copper circuit board can effectively solve the problem of the welding resistance lack of fill of heavy copper circuit board.
The utility model for the technical scheme that solves its technical problem and adopt is:
A kind of solder mask structure of heavy copper circuit board, comprise circuit board and solder mask, circuit board surface is formed with circuit (being copper cash), described solder mask comprises first and second welding resistance face, described solder mask is covered in circuit board surface by design section, and the first welding resistance face is covered in the circuit board surface in the design section, and the second welding resistance face is covered in the first welding resistance face surface, this first welding resistance face is provided with some skip printing points, and the second welding resistance face on the first welding resistance face surface is filled in the skip printing point of the first welding resistance face.
The beneficial effects of the utility model are: because the second welding resistance face is filled in the skip printing point of the first welding resistance face, make circuit board surface cover solder mask fully in the design section of welding resistance, effectively solve the problem of the welding resistance lack of fill of heavy copper circuit board.
Description of drawings
Fig. 1 is cross-sectional view of the present utility model (single face with circuit board is an example).
Embodiment
Embodiment: a kind of solder mask structure of heavy copper circuit board, comprise circuit board 1 and solder mask, circuit board surface is formed with circuit 2 (being copper cash), described solder mask comprises first and second welding resistance face 3,4, described solder mask is covered in circuit board surface by design section, the first welding resistance face 3 is covered in circuit board 1 surface in the design section, the second welding resistance face 4 is covered in the first welding resistance face, 3 surfaces, the second welding resistance face 4 that this first welding resistance face 3 is provided with some skip printing point 5, the first welding resistance faces 3 surfaces is filled in the skip printing point 5 of the first welding resistance face 3.
Because the second welding resistance face 4 is filled in the skip printing point 5 of the first welding resistance face 3, make circuit board 1 surface cover solder mask fully in the design section of welding resistance, effectively solve the problem of the welding resistance lack of fill of heavy copper circuit board.
Claims (1)
1. the solder mask structure of a heavy copper circuit board, comprise circuit board (1) and solder mask, circuit board surface is formed with circuit (2), it is characterized in that: described solder mask comprises first and second welding resistance face (3,4), described solder mask is covered in circuit board surface by design section, the first welding resistance face is covered in the circuit board surface in the design section, the second welding resistance face is covered in the first welding resistance face surface, this first welding resistance face is provided with some skip printing points (5), and the second welding resistance face on the first welding resistance face surface is filled in the skip printing point of the first welding resistance face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200403045U CN201409255Y (en) | 2009-04-17 | 2009-04-17 | Solder resisting structure of thick copper circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200403045U CN201409255Y (en) | 2009-04-17 | 2009-04-17 | Solder resisting structure of thick copper circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201409255Y true CN201409255Y (en) | 2010-02-17 |
Family
ID=41680201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009200403045U Expired - Lifetime CN201409255Y (en) | 2009-04-17 | 2009-04-17 | Solder resisting structure of thick copper circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201409255Y (en) |
-
2009
- 2009-04-17 CN CN2009200403045U patent/CN201409255Y/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100217 |