CN201369750Y - Mobile-phone camera welded by reflow soldering technology - Google Patents
Mobile-phone camera welded by reflow soldering technology Download PDFInfo
- Publication number
- CN201369750Y CN201369750Y CNU2009201146202U CN200920114620U CN201369750Y CN 201369750 Y CN201369750 Y CN 201369750Y CN U2009201146202 U CNU2009201146202 U CN U2009201146202U CN 200920114620 U CN200920114620 U CN 200920114620U CN 201369750 Y CN201369750 Y CN 201369750Y
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- CN
- China
- Prior art keywords
- reflow soldering
- mobile phone
- lens mount
- trim ring
- venthole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model relates to a mobile-phone camera welded by the reflow soldering technology, in particular to a small-sized camera device arranged in the mobile-phone, wherein the camera is connected on a mobile-phone mainboard in a reflow soldering way. The camera consists of a lens holder, an optical lens, a pressing ring, a photosensitive chip and a circuit board, wherein the optical lens, the pressing ring, the photosensitive chip and the circuit board are sequentially arranged in the lens holder; the outside is communicated with a chamber above the photosensitive chip by an air outlet hole originally, but in the camera, the outside is communicated with a ventilation gap above the pressing ring, and a notch is arranged at the outer circumference of the pressing ring; an air outlet channel is formed between the notch and the lens holder; the air outlet hole and the air outlet channel are dislocated; and the ventilation gap is communicated with the chamber above the photosensitive chip by the air outlet channel. Therefore, the structure can not affect the pressure emission when in reflow soldering, and the outside dust can only falls down to the pressing ring after entering the air outlet hole, thereby preventing the stain and dirt spots from being caused on photosensitive chip due to the affection of the dust; meanwhile, the lower surface of the pressing ring is provided with a ring slot, which leads the glue not to overflow when in sticking and fixing, thereby ensuring the connecting structure to be beautiful, firm and reliable.
Description
Technical field
The utility model relates to a kind of mobile phone cam, is meant a kind of mobile phone cam of Reflow Soldering welding specifically.
Background technology
Mobile phone cam is a kind of small-sized image pickup device that is installed in the mobile phone, generally all has two camera functions, thus higher to structural requirement, need mobile phone cam to have the image data acquiring time and lack, characteristics such as the Back end data processing speed is fast.The structure of this mobile phone cam mainly reaches optical lens, trim ring, sensitive chip and the wiring board etc. that are installed in successively in the lens mount by lens mount to be formed, and optical lens is installed on the lens mount, and trim ring is fixed in the lens mount through a glue; Sensitive chip is installed in the circuit board, and this wiring board one side is fixed on the lens mount through a glue, and another side but is to adopt connector that connector, golden finger are connected on the cell phone mainboard connector or socket mode.The connected mode cost height of these several wiring boards and cell phone mainboard, take the cell phone mainboard space big, be unfavorable for automated production, in order to solve the defective of above-mentioned connected mode, the high-end mobile phone of Xiao Shouing has adopted more advanced syndeton in the market, its wiring board is connected on the cell phone mainboard to cross the Reflow Soldering mode by pad, this technology is also referred to as surface mounting technology, it is simple and easy to have operation, cost is low, reduce camera in characteristics such as mobile phone volume inside utilization rate, flexible good processabilities, so be subjected to the welcome of manufacturer deeply to greatest extent.Yet, though cross the mobile phone cam of Reflow Soldering is a kind of more advanced process technology, also solve existing mobile phone cam and connected the existing defective of cell phone mainboard, but in actual use, still there are many defectives in this structure, for example the air pressure that produced in the lens mount when making Reflow Soldering can in time emit, often be provided with venthole at the lens mount top, this venthole directly communicates with the chamber of sensitive chip top, therefore the air pressure of crossing the Reflow Soldering generation can emit from this venthole fast, thisly directly connect extraneous venthole structure and make extraneous dust drop to the sensitive chip surface easily, be infected with sensitive chip and produce stain and dirty point with sensitive chip top chamber.Simultaneously, the trim ring lower surface of this structure is the plane, fixedly the time, can occur the some glue vestige of a circle projection through a glue and lens mount inwall between trim ring excircle and the lens mount inwall, and is not only very ugly, and it is also little reliable to connect effect.
Summary of the invention
Technical problem to be solved in the utility model is to overcome the defective of prior art and a kind of mobile phone cam that makes the Reflow Soldering welding that sensitive chip is difficult for being infected with dust is provided, and the trim ring of this mobile phone cam is connected attractive in appearance, solid and reliable with lens mount.
Technical problem of the present utility model is achieved through the following technical solutions:
A kind of mobile phone cam of Reflow Soldering welding, this mobile phone cam comprise lens mount and are installed in lens mount interior optical lens, trim ring, sensitive chip and wiring board successively that described lens mount top is provided with aperture and venthole; Described trim ring and lens mount are fixed, and form airspace between this trim ring upper surface and the lens mount, it is characterized in that described trim ring excircle is provided with breach, forms outlet passageway between this breach and the lens mount inwall; Described lens mount venthole communicates with airspace, communicates and misplaces with the trim ring outlet passageway simultaneously.
The dislocation angle of described venthole and outlet passageway is 45 °～180 °.
Described venthole and outlet passageway are on same diameter circle or different-diameter circle.
Described trim ring top is provided with the concave inward structure of symmetrical centre, and optical lens is installed in this concave inward structure; Described trim ring bottom is provided with the outer male structure of symmetrical centre, and this evagination construction profile becomes annular groove, is provided with the some glue of cementation lens mount and trim ring in the annular groove.
Described venthole is up-small and down-big taper hole.
Small aperture Φ=0.2mm～the 0.4mm of described venthole.
Described aperture is up big and down small taper hole, this aperture cone angle=75 ± 5 °.
Described breach is the groove structure or cuts flat structure.
Compared with prior art, the airspace that the utility model will original extraneous venthole that communicates with sensitive chip top chamber changes into above extraneous and the trim ring communicates, and be provided with breach at the trim ring excircle, between this breach and lens mount inwall, form outlet passageway, utilize outlet passageway that airspace is communicated with sensitive chip top chamber again, and guarantee that venthole and outlet passageway misplace, in the use of historical facts or anecdotes border, air pressure discharging when this structure neither influenced Reflow Soldering, extraneous dust can only be dropped on the trim ring after venthole enters, avoided sensitive chip to be subjected to dust and be infected with and produce stain and dirty point; Simultaneously, trim ring lower surface and lens mount junction are provided with annular groove, and this annular groove does not overflow when making a glue fixedly, guarantee the attractive in appearance and solid and reliable of syndeton.
Description of drawings
Fig. 1 is a sectional structure schematic diagram of the present utility model.
Fig. 2 is the three-dimensional exploded view of Fig. 1.
Embodiment
To elaborate again to the utility model embodiment by above-mentioned accompanying drawing below.
As Fig. 1～shown in Figure 2,1-lens mount, 2-venthole, 3-aperture, 4-optical lens, 5-trim ring, 6-outlet passageway, 7-point glue, 8-sensitive chip, 9-wiring board, 10-chamber, 11-airspace, 12-fool proof sign, 13-breach, 14-concave inward structure.
A kind of mobile phone cam of Reflow Soldering welding, comprise the lens mount 1 that is cuboid, this lens mount is similar to a kind of cover structure, optical lens 4, trim ring 5, sensitive chip 8 and wiring board 9 are packed into successively by the lens mount below, be respectively equipped with venthole 2, aperture 3 and fool proof sign 12 at the lens mount top, venthole is up-small and down-big taper hole, the air pressure that this taper hole helps in the lens mount 1 is released fast, the small aperture of taper hole can be according to the lens mount inner wall space and the temperature when crossing Reflow Soldering carry out value, be generally Φ=0.2mm～0.4mm; Aperture 3 is shaped as up big and down small taper hole structure as the through hole that enters of mobile phone cam receiving optical signals, and this hole cone angle carries out value according to the size of optical lens, is generally α=75 ± 5 °; Fool proof sign 12 makes the pin footnote know again, is to be used to guarantee that mobile phone cam correctly is installed to the reference identification on the cell phone mainboard (not shown).
Described trim ring 5 tops are provided with the concave inward structure 14 of symmetrical centre and printing opacity, paste optical lens 4 in this concave inward structure, the trim ring bottom is provided with the outer male structure of symmetrical centre, this evagination construction profile becomes annular groove, can charge into a glue 7 in the annular groove and carry out the fixing of trim ring 5 and lens mount 1 inwall, owing to have annular groove to hold for some glue, so the some glue after charging into can not overflow the trim ring surface, not only syndeton is attractive in appearance, and more solid and reliable.Behind trim ring 5 fix in position, must guarantee to leave airspace 11 between trim ring upper surface and the lens mount inner top surface, this gap communicates with venthole 2.Trim ring 5 excircles are provided with breach 13, and breach is a kind of flat structure of cutting, and form outlet passageway 6 between itself and lens mount 1 inwall, and with lens mount on venthole 2 arranged in dislocation, the angle that staggers is the best with 180 ° generally.Utilize this outlet passageway that airspace 11 is communicated with the chamber 10 of sensitive chip 8 tops, the dust that enters from venthole 2 can only drop on trim ring 5 like this, and hold by the concave inward structure 14 on trim ring top, avoided in the existing structure dust directly to drop on the sensitive chip 8 and produce stain and dirty point through venthole.
Described sensitive chip 8 is fixed as one with wiring board 9, and the wiring board one side is fixed on lens mount 1 bottom through a glue, and in the miscellaneous part in the lens mount is enclosed in; Another side is connected on the cell phone mainboard (not shown) to cross the Reflow Soldering mode through pad.Wiring board 9 directly pastes lens mount on the wiring board with the focal depth range that is to use optical lens being connected of lens mount 1, satisfies fixing depth of field requirement, thereby can realize high efficiency automated production.When extraneous light after the aperture on the lens mount 13 passes optical lens 4 and is received by sensitive chip 8, the light signal that sensitive chip is about to receive is transformed into the signal of telecommunication, and by wiring board 9 picture signal is delivered in the cell phone mainboard controller.
Advantages such as the preceding camera that the utility model can be used as 3G mobile carries out video capture or video call, has IMAQ data time weak point, and the Back end data processing speed is fast.Can satisfy the automated production needs by mode of exempting to focus and the mode of crossing Reflow Soldering, reduce production costs, effectively reduce camera and take the cell phone mainboard space.Air pressure discharging when the structure of this mobile phone cam neither influenced Reflow Soldering, make extraneous dust after venthole enters, can only drop on the trim ring again to greatest extent, having avoided sensitive chip to be subjected to dust is infected with and produces stain and dirty point, structure is more reliable, has also prolonged the useful life of mobile phone cam virtually.
Claims (8)
1, a kind of mobile phone cam of Reflow Soldering welding, this mobile phone cam comprises lens mount (1) and is installed in lens mount interior optical lens (4), trim ring (5), sensitive chip (8) and wiring board (9) successively that described lens mount (1) top is provided with aperture (3) and venthole (2); Described trim ring (5) is fixing with lens mount (1), form airspace (11) between this trim ring upper surface and the lens mount, it is characterized in that described trim ring (5) excircle is provided with breach (13), forms outlet passageway (6) between this breach and lens mount (1) inwall; Described lens mount venthole (2) communicates with airspace (11), communicates and misplaces with trim ring (5) outlet passageway (6) simultaneously.
2, the mobile phone cam of a kind of Reflow Soldering welding according to claim 1 is characterized in that the described venthole (2) and the dislocation angle of outlet passageway (6) are 45 °～180 °.
3, the mobile phone cam of a kind of Reflow Soldering welding according to claim 1 and 2 is characterized in that described venthole (2) and outlet passageway (6) are on same diameter circle or different-diameter circle.
4, the mobile phone cam of a kind of Reflow Soldering welding according to claim 1 is characterized in that described trim ring (5) top is provided with the concave inward structure (14) of symmetrical centre, and optical lens (4) is installed in this concave inward structure; Described trim ring (5) bottom is provided with the outer male structure of symmetrical centre, and this evagination construction profile becomes annular groove, is provided with the some glue (7) of cementation lens mount (1) and trim ring (5) in the annular groove.
5, the mobile phone cam of a kind of Reflow Soldering welding according to claim 1 is characterized in that described venthole (2) is up-small and down-big taper hole.
6, the mobile phone cam of a kind of Reflow Soldering welding according to claim 5 is characterized in that the small aperture Ф=0.2mm～0.4mm of described venthole (2).
7, the mobile phone cam of a kind of Reflow Soldering welding according to claim 1 is characterized in that described aperture (3) is up big and down small taper hole, this aperture cone angle=75 ± 5 °.
8, the mobile phone cam of a kind of Reflow Soldering welding according to claim 1 is characterized in that described breach (13) is the groove structure or cuts flat structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2009201146202U CN201369750Y (en) | 2009-02-27 | 2009-02-27 | Mobile-phone camera welded by reflow soldering technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2009201146202U CN201369750Y (en) | 2009-02-27 | 2009-02-27 | Mobile-phone camera welded by reflow soldering technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201369750Y true CN201369750Y (en) | 2009-12-23 |
Family
ID=41488638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2009201146202U Expired - Lifetime CN201369750Y (en) | 2009-02-27 | 2009-02-27 | Mobile-phone camera welded by reflow soldering technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201369750Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102654629A (en) * | 2011-03-01 | 2012-09-05 | 英属盖曼群岛恒景科技股份有限公司 | Lens module and method for manufacturing diaphragm of lens module |
| CN105093461A (en) * | 2015-07-13 | 2015-11-25 | 南昌欧菲光电技术有限公司 | Camera module group |
-
2009
- 2009-02-27 CN CNU2009201146202U patent/CN201369750Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102654629A (en) * | 2011-03-01 | 2012-09-05 | 英属盖曼群岛恒景科技股份有限公司 | Lens module and method for manufacturing diaphragm of lens module |
| CN105093461A (en) * | 2015-07-13 | 2015-11-25 | 南昌欧菲光电技术有限公司 | Camera module group |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20091223 |