CN201361611Y - Low-frequency piezoelectric ceramic frequency device - Google Patents
Low-frequency piezoelectric ceramic frequency device Download PDFInfo
- Publication number
- CN201361611Y CN201361611Y CNU2009201142540U CN200920114254U CN201361611Y CN 201361611 Y CN201361611 Y CN 201361611Y CN U2009201142540 U CNU2009201142540 U CN U2009201142540U CN 200920114254 U CN200920114254 U CN 200920114254U CN 201361611 Y CN201361611 Y CN 201361611Y
- Authority
- CN
- China
- Prior art keywords
- cover plate
- reed
- ceramic
- cavity
- lower cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000000919 ceramic Substances 0.000 title claims abstract description 28
- 235000014676 Phragmites communis Nutrition 0.000 claims abstract description 33
- 229920006335 epoxy glue Polymers 0.000 claims abstract description 5
- 239000003292 glue Substances 0.000 claims abstract description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000004033 plastic Substances 0.000 abstract description 6
- 229920003023 plastic Polymers 0.000 abstract description 6
- 238000012545 processing Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000007769 metal material Substances 0.000 abstract description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000010358 mechanical oscillation Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
A low-frequency piezoelectric ceramic frequency device comprises a first reed (2), a vibrator (5), a second reed (6), a ceramic upper cover plate (1), a pi-shaped ceramic frame (9) and a ceramic lower cover plate (8). The upper cover plate, the frame and the lower cover plate are overlapped and bonded together by glue to form a cavity with an opening at one end. The first reed, the vibrator and the second reed are overlapped in the cavity, the first reed is contacted with the inner electrode on the upper cover plate, the second reed is contacted with the inner electrode on the lower cover plate, a piece of cover plate paper (4) is arranged at the opening of the cavity, and the outer surface of the cover plate paper is sealed by epoxy glue (3). The component of the low-frequency piezoelectric ceramic frequency device is mainly made of ceramic or metal materials, and has strong high-temperature resistance, so that the high-temperature deformation phenomenon caused by insufficient temperature resistance and uneven plastic manufacturing of plastic parts is avoided; and because the lead-out wire of the reed is omitted structurally and the processing characteristic of the ceramic is combined, the volume of the device can be obviously reduced.
Description
Technical field
The utility model relates to a kind of structure of low frequency piezoelectric ceramics frequency device.
Background technology
Piezoelectric ceramics such as piezoelectric ceramic filter, piezoelectric ceramics resonator frequency device has been widely used in fields such as communication, TV, computer, industrial automation.Low frequency piezoelectric ceramics frequency device is that the principle of utilizing piezoelectric ceramic vibrator can produce mechanical oscillation under action of alternative electric field is made.Its structure is made up of vibration cavity, reed, piezoelectric vibrator etc.This type of surface installing type device in the market all adopts oscillator is placed in the cavity that plastic frame and metal spring leaf form, and then packs into and have in the plastic casing of protective effect, by pin electrode is drawn.The manufacturing technology of this type of device is ripe relatively, is difficult to control but depositing at surrounding material, and volume is relatively large, is prone to the phenomenon of plastic deformation after the welding, and solderability also often is subjected to the bad influence of exit moulding, is unfavorable for further developing of components and parts miniaturization.
Summary of the invention
The utility model is intended to propose a kind of structure that has stronger high temperature resistant property and be easy to the low frequency piezoelectric ceramics frequency device of miniaturization.
This low frequency piezoelectric ceramics frequency device comprises the framework of pottery of upper cover plate, ∏ shape of first reed, oscillator, second reed, pottery and the lower cover of pottery.Interior electrode is arranged on the inner surface of upper cover plate, positive electrode is arranged on the outer surface, interior electrode is arranged on the inner surface of lower cover, positive electrode is arranged on the outer surface.Upper cover plate, framework, three parts of lower cover fold and bond together with glue the cavity of one one end opening of formation mutually.First reed, oscillator, second reed are stacked and placed in the above-mentioned cavity mutually, and first reed contacts with interior electrode on the upper cover plate, and second reed contacts with interior electrode on the lower cover.There is lateral electrode the side of upper cover plate, framework and lower cover, and the interior electrode and the positive electrode of cover plate are connected.Opening part at cavity has a cover plate paper, and cover plate paper outside seals with epoxy glue.
The member of this low frequency piezoelectric ceramics frequency device mainly is to be made by pottery or metal material, all has stronger resistance to elevated temperatures, has avoided working of plastics heatproof deficiency and has made the high temperature deformation phenomenon of moulding inequality and causing; Again because of having saved the reed lead-out wire on the structure, and, the volume of device is obviously dwindled in conjunction with the processing characteristics of pottery.
Description of drawings
Fig. 1 is the structure chart of this low frequency piezoelectric ceramics frequency device;
Fig. 2 is the cutaway view of low frequency piezoelectric ceramics frequency device;
Fig. 3 is the outer surface of cover plate sheet;
Fig. 4 is the inner surface of cover plate sheet;
Fig. 5 is the framework sheet;
Fig. 6 is a reed;
Fig. 7 is the side view of reed;
Fig. 8 is the side view of shell array;
Fig. 9 is the cut-away view of shell array;
Figure 10 is the side view of outer cover unit;
Figure 11 is the A-A cutaway view of outer cover unit.
The specific embodiment
As depicted in figs. 1 and 2, this low frequency piezoelectric ceramics frequency device comprises first reed 2, oscillator 5, second reed 6, the framework 9 of the upper cover plate 1 of pottery, the pottery of ∏ shape and the lower cover 8 of pottery.Interior electrode is arranged on the inner surface of upper cover plate, positive electrode 10 is arranged on the outer surface, interior electrode 7 is arranged on the inner surface of lower cover, positive electrode is arranged on the outer surface.Upper cover plate, framework, three parts of lower cover fold and bond together with glue the cavity of one one end opening of formation mutually.First reed, oscillator, second reed are stacked and placed in the above-mentioned cavity mutually, and first reed contacts with interior electrode on the upper cover plate, and second reed contacts with interior electrode on the lower cover.There is lateral electrode 17 side of upper cover plate, framework and lower cover, and the interior electrode and the positive electrode of cover plate are connected.Opening part at cavity has a cover plate paper 4, and cover plate paper outside seals with epoxy glue 3.
The shell of this low frequency piezoelectric ceramics frequency device can adopt the method for large stretch of array assembling to make.
The manufacturing process of this low frequency piezoelectric ceramics frequency device is as follows:
1, make the framework sheet: compacting cavity array when ceramic green is made through becoming processing such as burning, grinding, end mill, cleaning, forms the framework sheet that has cavity 13 arrays shown in Figure 5 again.
2, make upper and lower cover plate sheet: upper and lower cover plate sheet is identical.According to the product size requirement, the substrate of the ceramic cover plate sheet that bakes is ground, holds mill, cleans; On two faces of cover plate sheet, stamp electrode, and carry out silver ink firing and handle, form Fig. 3 and positive electrode array 11 and interior electrode array 12 shown in Figure 4 with the silver slurry.
3, be imprinted on the cover plate sheet with the epoxy resin of printing screen with special use, bonding with above-mentioned cover plate sheet framework large stretch of 15, being heating and curing makes it to form one.
4, on another piece cover plate sheet, stamp epoxy resin again, and be bonded as one with resulting sub-assembly of last step and be heating and curing, become Fig. 8 and shell array shown in Figure 9 with silk screen.14 and 16 are respectively the large stretch of and lower cover sheet of upper cover plate among the figure.
5, the shell array after bonding is cut into Figure 10 and outer cover unit shown in Figure 11.
6, after being superimposed, first reed 2, oscillator 5 and second reed 6 pack in the outer cover unit, in the shell of again cover plate paper 4 being packed into, with the opening part sealing of epoxy glue 3 with shell.First reed is identical with the structure of second reed, and its shape as shown in Figure 6 and Figure 7.
7, make lateral electrode 17 by sputter, electrode plating nickel tin layer, the interior electrode of cover plate is linked to each other with the positive electrode 10 of cover plate by lateral electrode, be formed into article unit.
8, carry out product test, sign, packing, finish product processing.
This low frequency piezoelectric ceramics frequency device is because the vibration cavity (shell) that cover plate and framework are formed is after ceramic substrate is fired into, by grinding, hold mill, bonding, cutting to form, so the resistant to elevated temperatures uniformity of device is fine, and volume is little, in light weight, processing simple, meets the demand for development and the direction of current components and parts.
Claims (1)
1, a kind of low frequency piezoelectric ceramics frequency device, comprise first reed (2), oscillator (5), second reed (6), it is characterized in that it also comprises the upper cover plate (1) of pottery, the lower cover (8) of framework of the pottery of ∏ shape (9) and pottery, interior electrode is arranged on the inner surface of upper cover plate, positive electrode (10) is arranged on the outer surface, interior electrode (7) is arranged on the inner surface of lower cover, positive electrode is arranged on the outer surface, upper cover plate, framework, three parts of lower cover fold and bond together with glue the cavity of one one end opening of formation mutually, first reed, oscillator, second reed is stacked and placed in the above-mentioned cavity mutually, first reed contacts with interior electrode on the upper cover plate, second reed contacts with interior electrode on the lower cover, upper cover plate, there is lateral electrode (17) side of framework and lower cover, the interior electrode and the positive electrode of cover plate are connected, opening part at cavity has a cover plate paper (4), and cover plate paper outside seals with epoxy glue (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2009201142540U CN201361611Y (en) | 2009-02-20 | 2009-02-20 | Low-frequency piezoelectric ceramic frequency device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2009201142540U CN201361611Y (en) | 2009-02-20 | 2009-02-20 | Low-frequency piezoelectric ceramic frequency device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201361611Y true CN201361611Y (en) | 2009-12-16 |
Family
ID=41472271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2009201142540U Expired - Lifetime CN201361611Y (en) | 2009-02-20 | 2009-02-20 | Low-frequency piezoelectric ceramic frequency device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201361611Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110404752A (en) * | 2019-08-05 | 2019-11-05 | 中北大学 | A kind of industrial high-power multidirectional amplitude regulation ultrasonic vibration installation |
| CN111033775A (en) * | 2017-09-25 | 2020-04-17 | Tdk株式会社 | Vibration assembly |
-
2009
- 2009-02-20 CN CNU2009201142540U patent/CN201361611Y/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111033775A (en) * | 2017-09-25 | 2020-04-17 | Tdk株式会社 | Vibration assembly |
| CN110404752A (en) * | 2019-08-05 | 2019-11-05 | 中北大学 | A kind of industrial high-power multidirectional amplitude regulation ultrasonic vibration installation |
| CN110404752B (en) * | 2019-08-05 | 2020-08-18 | 中北大学 | Industrial high-power multidirectional amplitude regulation and control ultrasonic vibration device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20091216 |
|
| CX01 | Expiry of patent term |