CN201352285Y - Main pressing mechanism for bonding process of liquid crystal display module - Google Patents
Main pressing mechanism for bonding process of liquid crystal display module Download PDFInfo
- Publication number
- CN201352285Y CN201352285Y CNU2009201015600U CN200920101560U CN201352285Y CN 201352285 Y CN201352285 Y CN 201352285Y CN U2009201015600 U CNU2009201015600 U CN U2009201015600U CN 200920101560 U CN200920101560 U CN 200920101560U CN 201352285 Y CN201352285 Y CN 201352285Y
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- low friction
- block
- supporting frame
- liquid crystal
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Abstract
The utility model discloses a main pressing mechanism for a bonding process of a liquid crystal display module, solving the technical problems that when the prior device connects a flexible printed circuit board and a liquid crystal display screen by compression, the pressure is uneven and an FPC pin generates the deviation relative to an LCD pin. The main pressing mechanism comprises an inverted L-shaped support frame body (1) of the main pressing mechanism, a low friction cylinder (3) and a pressing head (13), the low friction cylinder (3) is arranged on a top plate of the support frame body (1) of the main pressing mechanism, the low friction cylinder (3) and a rectangular cylinder connecting block (6) are connected together, the lower end of the rectangular cylinder connecting block (6) is fixedly connected with a main pressing leveling device (8), a second adapter plate (9), a thermal insulation plate and the pressing head (13), the pressing head (13) is a rectangular block body with an inverted convex longitudinal section, and a heating pipe mounting hole (16), a thermocouple mounting hole (17) and a cuboid-shaped pressing head blade (18) are respectively arranged in the pressing head (13), thereby realizing the accurate compression connection of an FPC and an LCD and having the advantages of simple equipment structure and convenient maintenance.
Description
Technical field
The present invention relates to a kind of crimping apparatus, particularly a kind of flexible circuit printed panel (FPC) and LCDs (LCD) are crimped onto together equipment.
Background technology
Pressure is irregular, the technical matters of the not enough relative LCD pin off normal with the FPC pin of pressure in that flexible circuit printed panel (FPC) is existed during with LCDs (LCD) crimping for existing equipment.
Summary of the invention
The main pressure mechanism that is used for the LCD MODULE technological process provided by the invention has solved existing equipment, and pressure is irregular, the technical matters of the not enough relative LCD pin off normal with the FPC pin of pressure in that flexible circuit printed panel (FPC) is existed during with LCDs (LCD) crimping.
The present invention overcomes the above problems by following scheme:
Liquid crystal display (LCD) module binding process is meant in making the LCD MODULE process anisotropic conductive film is attached to technological process on the liquid-crystalline glasses by technological requirement.
A kind of main pressure mechanism that is used for liquid crystal display (LCD) module binding process, the supporting frame 1 that comprises down L shaped main pressure mechanism, low friction cylinder 3 and pressure head 13, described low friction cylinder 3 is arranged on down on the top board of supporting frame 1 of L shaped main pressure mechanism, the output shaft of low friction cylinder 3 is fixed together by the upper end of floating junction 4 with the rectangle cylinder contiguous block 6 of the top board below that is positioned at supporting frame 1, the lower end of rectangle cylinder contiguous block 6 is fixed with first card extender 7, the lower end of first card extender 7 is fixed with the main levelling device 8 of pressing, the main lower end of levelling device 8 of pressing is fixedly connected with second card extender 9, the lower end of second card extender 9 is fixed with thermal insulation board, be fixedly connected with described pressure head 13 in the lower end of thermal insulation board, this pressure head 13 is the rectangle block of reversed convex type for the longitudinal section, in this pressure head 13, be respectively arranged with heating tube mounting hole 16 and thermocouple mounting hole 17, also be provided with the pressure head cutting edge 18 of cuboid in the bottom of this pressure head; In the side plate of the described supporting frame 1 that falls L shaped main pressure mechanism, be provided with the guide rail slide block and pay 2, the guide rail that this guide rail slide block is paid in 2 is fixedly installed on the side plate of supporting frame 1 along the direction vertical with surface level, this guide rail slide block is paid slide block in 2 and the one side of slide block web joint 5 is fixed together, the rear end face of the another side of slide block web joint 5 and cylinder web joint 6 is fixed together, and the guide rail of pressure head 13 on the side plate of the driving lower edge supporting frame 1 of low friction cylinder 3 moved up and down.
Described main press levelling device 8 by T shape first regulating block that sets gradually from top to bottom, I-shaped second regulating block, rectangle the 3rd regulating block and lateral adjustments differential head 14, vertically regulate the differential head and form, and T shape first regulating block, I-shaped second regulating block, rectangle the 3rd regulating block are movably connected by rotating shaft 22.
Described thermal insulation board has three layers, and ground floor thermal insulation board 10, the second layer that promptly sets gradually from top to bottom put hot plate 11 and the 3rd layer of thermal insulation board 12.
The present invention has realized the accurate crimping of FPC and LCD, and the device structure simple-to-maintain is convenient.
Description of drawings:
Fig. 1 structural representation of the present invention
Fig. 2 main structural representation of pressing levelling device of the present invention
The structural representation of Fig. 3 pressure head of the present invention
Embodiment
A kind of main pressure mechanism that is used for liquid crystal display (LCD) module binding process, the supporting frame 1 that comprises down L shaped main pressure mechanism, low friction cylinder 3 and pressure head 13, described low friction cylinder 3 is arranged on down on the top board of supporting frame 1 of L shaped main pressure mechanism, the output shaft of low friction cylinder 3 is fixed together by the upper end of floating junction 4 with the rectangle cylinder contiguous block 6 of the top board below that is positioned at supporting frame 1, the lower end of rectangle cylinder contiguous block 6 is fixed with first card extender 7, the lower end of first card extender 7 is fixed with the main levelling device 8 of pressing, the main lower end of levelling device 8 of pressing is fixedly connected with second card extender 9, the lower end of second card extender 9 is fixed with thermal insulation board, be fixedly connected with described pressure head 13 in the lower end of thermal insulation board, this pressure head 13 is the rectangle block of reversed convex type for the longitudinal section, in this pressure head 13, be respectively arranged with heating tube mounting hole 16 and thermocouple mounting hole 17, also be provided with the pressure head cutting edge 18 of cuboid in the bottom of this pressure head; In the side plate of the described supporting frame 1 that falls L shaped main pressure mechanism, be provided with the guide rail slide block and pay 2, the guide rail that this guide rail slide block is paid in 2 is fixedly installed on the side plate of supporting frame 1 along the direction vertical with surface level, this guide rail slide block is paid slide block in 2 and the one side of slide block web joint 5 is fixed together, the rear end face of the another side of slide block web joint 5 and cylinder web joint 6 is fixed together, and the guide rail of pressure head 13 on the side plate of the driving lower edge supporting frame 1 of low friction cylinder 3 moved up and down.
Described main press levelling device 8 by T shape first regulating block that sets gradually from top to bottom, I-shaped second regulating block, rectangle the 3rd regulating block and lateral adjustments differential head 14, vertically regulate the differential head and form, and T shape first regulating block, I-shaped second regulating block, rectangle the 3rd regulating block are movably connected by rotating shaft 22.
Described thermal insulation board has three layers, and ground floor thermal insulation board 10, the second layer that promptly sets gradually from top to bottom put hot plate 11 and the 3rd layer of thermal insulation board 12.
Claims (3)
1, a kind of main pressure mechanism that is used for liquid crystal display (LCD) module binding process, the supporting frame (1) that comprises down L shaped main pressure mechanism, low friction cylinder (3) and pressure head (13), it is characterized in that: described low friction cylinder (3) is arranged on down on the top board of supporting frame (1) of L shaped main pressure mechanism, the output shaft of low friction cylinder (3) is fixed together by the upper end of floating junction (4) with the rectangle cylinder contiguous block (6) of the top board below that is positioned at supporting frame (1), the lower end of rectangle cylinder contiguous block (6) is fixed with first card extender (7), the lower end of first card extender (7) is fixed with the main levelling device (8) of pressing, the main lower end of levelling device (8) of pressing is fixedly connected with second card extender (9), the lower end of second card extender (9) is fixed with thermal insulation board, be fixedly connected with described pressure head (13) in the lower end of thermal insulation board, this pressure head (13) is the rectangle block of reversed convex type for the longitudinal section, in this pressure head (13), be respectively arranged with heating tube mounting hole (16) and thermocouple mounting hole (17), also be provided with the pressure head cutting edge (18) of cuboid in the bottom of this pressure head; In the side plate of the described supporting frame (1) that falls L shaped main pressure mechanism, be provided with the guide rail slide block and pay (2), the guide rail that this guide rail slide block is paid in (2) is fixedly installed on the side plate of supporting frame (1) along the direction vertical with surface level, this guide rail slide block is paid slide block in (2) and the one side of slide block web joint (5) is fixed together, the rear end face of the another side of slide block web joint (5) and cylinder web joint (6) is fixed together, and the guide rail of pressure head (13) on the side plate of the driving lower edge supporting frame (1) of low friction cylinder (3) moved up and down.
2, a kind of main pressure mechanism that is used for liquid crystal display (LCD) module binding process according to claim 1, it is characterized in that: described main press levelling device (8) by T shape first regulating block that sets gradually from top to bottom, I-shaped second regulating block, rectangle the 3rd regulating block and lateral adjustments differential head (14), vertically regulate the differential head and form, and T shape first regulating block, I-shaped second regulating block, rectangle the 3rd regulating block are movably connected by rotating shaft (22).
3, a kind of main pressure mechanism that is used for liquid crystal display (LCD) module binding process according to claim 1 and 2, it is characterized in that: described thermal insulation board has three layers, and ground floor thermal insulation board (10), the second layer that promptly sets gradually from top to bottom put hot plate (11) and the 3rd layer of thermal insulation board (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2009201015600U CN201352285Y (en) | 2009-02-16 | 2009-02-16 | Main pressing mechanism for bonding process of liquid crystal display module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2009201015600U CN201352285Y (en) | 2009-02-16 | 2009-02-16 | Main pressing mechanism for bonding process of liquid crystal display module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201352285Y true CN201352285Y (en) | 2009-11-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2009201015600U Expired - Lifetime CN201352285Y (en) | 2009-02-16 | 2009-02-16 | Main pressing mechanism for bonding process of liquid crystal display module |
Country Status (1)
| Country | Link |
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| CN (1) | CN201352285Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101515076B (en) * | 2009-02-16 | 2011-06-15 | 太原风华信息装备股份有限公司 | Main pressure mechanism used for a liquid crystal display (LCD) module binding process |
| CN104552864A (en) * | 2015-01-15 | 2015-04-29 | 马宁 | Cylinder device for plastic extruding machine |
| CN106873198A (en) * | 2017-03-10 | 2017-06-20 | 深圳市诚亿自动化科技有限公司 | The accurate main pressure indenter device of thermostatic type |
-
2009
- 2009-02-16 CN CNU2009201015600U patent/CN201352285Y/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101515076B (en) * | 2009-02-16 | 2011-06-15 | 太原风华信息装备股份有限公司 | Main pressure mechanism used for a liquid crystal display (LCD) module binding process |
| CN104552864A (en) * | 2015-01-15 | 2015-04-29 | 马宁 | Cylinder device for plastic extruding machine |
| CN106873198A (en) * | 2017-03-10 | 2017-06-20 | 深圳市诚亿自动化科技有限公司 | The accurate main pressure indenter device of thermostatic type |
| CN106873198B (en) * | 2017-03-10 | 2019-10-29 | 深圳市诚亿自动化科技有限公司 | The accurate main pressure indenter device of thermostatic type |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20091125 Effective date of abandoning: 20090216 |