CN106873198A - The accurate main pressure indenter device of thermostatic type - Google Patents
The accurate main pressure indenter device of thermostatic type Download PDFInfo
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- CN106873198A CN106873198A CN201710144197.XA CN201710144197A CN106873198A CN 106873198 A CN106873198 A CN 106873198A CN 201710144197 A CN201710144197 A CN 201710144197A CN 106873198 A CN106873198 A CN 106873198A
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- spring
- adjustment plate
- pressure head
- plate
- thermostatic type
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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Abstract
The present invention provides a kind of accurate main pressure indenter device of thermostatic type, including pressure head installing plate, it is installed on the cylinder mounting seat on pressure head installing plate, it is installed on pressure head installing plate and along the longitudinally disposed linear guides of pressure head installing plate, it is installed on the mechanism for adjusting parallelism on the sliding block of linear guides, low rubbing cylinder, spring connecting mechanism, double thermal insulation mechanism and heating pressure head mechanism, low rubbing cylinder is installed in cylinder mounting seat, and the upside that low rubbing cylinder passes through spring connecting mechanism drive connection mechanism for adjusting parallelism, heating pressure head mechanism is installed on the downside of mechanism for adjusting parallelism by double thermal insulation mechanism.The present invention provides a kind of accurate main pressure indenter device of thermostatic type, its radial clearance problem for not only solving floating junction, while by using double thermal insulation mechanism, effectively preventing the transmission of the heat direction guiding rail of calandria, the precision of guide rail is ensure that, the life-span of guide rail is extended.
Description
Technical field
The present invention relates to the post-processing technology field of liquid crystal module, more particularly to a kind of main pressure pressure head dress of accurate thermostatic type
Put.
Background technology
It is well known that, it is necessary to by IC and FPC together with the connection of LCD in the last handling process of liquid crystal module, this
One process needs two operations completions, precompressed (PRE-BONDIND) and main pressure (MAIN BONDIND).The main pressure heading machine of thermostatic type
Structure is used for latter operation.In prepressing procedures, IC or FPC is passed through into ACF (Anisotropic Conductive
Film, anisotropic conductive film) tentatively it is fitted on LCD, then, in main pressure operation, the pressure head of constant temperature is applied on IC or FPC
Plus constant pressure, the temperature of ACF will reach 180 DEG C, real by certain hour (IC is usually 8 seconds, and FPC is usually 12 seconds)
The final laminating of existing IC or FPC.Although the operation seems simple, but there is the high control of pressure accuracy and bonding
(BONDIND) required precision.First, the explosion of ACF particles is uniform；Secondly, the circuit on BUMP and LCD on IC is correspondence
, for IC, spacing (PITCH) very little between circuit, it is desirable to the aligning accuracy after main pressure is completed for ± 3 μ, on FPC
Circuit be also corresponding with the circuit of LCD, aligning accuracy is ± 10 μ, and quality (particle explosion uniformity and the bonding of product
Precision) mainly ensured by main pressure pressure heads mechanism.Therefore, the performance of pressure head structure directly determines bonding quality.Wherein, pressure head in
The depth of parallelism between IC or FPC support platforms is the premise for ensureing quality.
Main pressure pressure head is the core institution of COG, FOG module device, and it is whether reasonable that pressure head structure is designed to, and decides LCD
Or the quality and production efficiency of LCM product qualities, the structure design of existing main pressure pressure head, four part-structures are broadly divided into, the
A part is driving structure, mainly includes the parts such as cylinder, cylinder mounting seat and floating junction, and Part II is tied to be oriented to
Structure, major part is linear guides, and Part III is that pressure head parallelism adjusts structure, the depth of parallelism for adjusting pressure head and LCD,
Major part has X to parts such as adjustment part, Y-direction adjustment part, connection sheets, and Part IV is that pressure head performs structure, main zero
The part part such as including radiating block, thermal insulation board, pressure head mounting seat, heat block, pressure head.However, in practical operation, it has been found that
There is the defect in following design in existing main pressure pressure head：1st, the floating junction for being connected by SMC of cylinder and pressure head, the floating connects
Head radial clearance is big, and cylinder action is easily inclined in the pressure of pressure head, influences bonding precision；2nd, the parallelism adjusting mechanism of pressure head
It is unreasonable, the adjustment of the depth of parallelism is realized by the deformation of part, its mechanism is unstable, it is necessary to often adjustment, influence production effect
Rate；3rd, original pressure heads mechanism quality is excessive, huge structure, it is impossible to realize small pressure output, it is impossible to meet small size IC or FPC
Bonding；4th, the stability of parallelism adjusting mechanism is poor, and often change, causes off normal and particle explosion status not in process of production
Uniformly.
The content of the invention
It is an object of the invention to provide a kind of accurate main pressure indenter device of thermostatic type, it not only solves floating junction
Radial clearance problem, while by using double thermal insulation mechanism, effectively preventing the transmission of the heat direction guiding rail of calandria,
The precision of guide rail is ensure that, the life-span of guide rail is extended.
What the present invention was realized in：
A kind of main pressure indenter device of accurate thermostatic type, including pressure head installing plate, be installed on the pressure head installing plate
Cylinder mounting seat, be installed on the pressure head installing plate and along the longitudinally disposed linear guides of the pressure head installing plate, install
In the mechanism for adjusting parallelism on the sliding block of the linear guides, low rubbing cylinder, spring connecting mechanism, double thermal insulation mechanism with
And heating pressure head mechanism, the low rubbing cylinder is installed in the cylinder mounting seat, and the low rubbing cylinder is by described
The upside of mechanism for adjusting parallelism described in spring connecting mechanism drive connection, the heating pressure head mechanism passes through the double thermal insulation
Mechanism is installed on the downside of the mechanism for adjusting parallelism.
Used as the improvement of the above-mentioned accurate main pressure indenter device of thermostatic type, the mechanism for adjusting parallelism includes guide rails assembling
Plate, X are installed on the sliding block of the linear guides to adjustment plate and Y-direction adjustment plate, the guide rails assembling plate, and the X is to tune
The downside of whole plate is flexibly connected to the mutual cooperation of axle sleeve to bearing pin and X by X with the downside of the guide rails assembling plate, is made
Obtain the X to be rotated relative to the guide rails assembling plate to centered on bearing pin by the X to adjustment plate, the X is to the upper of adjustment plate
X is provided between the upside of side and the guide rails assembling plate to adjustment structure and X to resetting structure, under the Y-direction adjustment plate
Side is by the mutual cooperation of Y-direction bearing pin and Y-direction axle sleeve and the X to being flexibly connected on the downside of adjustment plate so that the Y-direction
Adjustment plate is rotated relative to the X centered on the Y-direction bearing pin to adjustment plate,
The upside of the Y-direction adjustment plate and the X are answered to Y-direction adjustment structure is provided between the upside of adjustment plate with Y-direction
Bit architecture.
Used as the improvement of the above-mentioned accurate main pressure indenter device of thermostatic type, the X includes being installed on the X to adjustment structure
To the first screw top board in adjustment plate and the X being installed on the guide rails assembling plate to adjusting screw, the X is to regulation spiral shell
One end of nail abuts with the first screw top board and is connected, and the Y-direction adjustment structure includes being installed in the Y-direction adjustment plate
Second screw top board and the X is installed on to the Y-direction adjusting screw in adjustment plate, one end of the Y-direction adjusting screw and institute
State the second screw top board and abut connection.
Used as the improvement of the above-mentioned accurate main pressure indenter device of thermostatic type, the X includes X to reset bullet to resetting structure
Spring, the X being arranged on the guide rails assembling plate to spring card slot and be arranged at the X to the 2nd X in adjustment plate to
Spring card slot, an X be correspondingly arranged to spring card slot with the 2nd X to spring card slot collectively form the receiving X to
First spring effect space of back-moving spring；The Y-direction resetting structure includes Y-direction back-moving spring, is arranged at the X to adjustment plate
On the first Y-direction spring card slot and the second Y-direction spring card slot for being arranged in the Y-direction adjustment plate, the first Y-direction spring
Draw-in groove is correspondingly arranged with the second Y-direction spring card slot and collectively forms the second spring for accommodating Y-direction back-moving spring effect sky
Between.
Used as the improvement of the above-mentioned accurate main pressure indenter device of thermostatic type, the spring connecting mechanism includes two spring cores
Axle, two spring carriers and two compression springs, are provided with cylinder connector, two spring on the piston rod of the low rubbing cylinder
Bracket is separately mounted in the left and right sides plane of the cylinder connector, and one end of each central spindle of the spring sequentially passes through respectively
It is screwed into after spring carrier described in compression spring described in one and in the screw of the Y-direction adjustment plate, each central spindle of the spring
The other end is disposed with packing ring and two nuts so that the two ends of each compression spring respectively with the corresponding packing ring and
The corresponding spring carrier abuts connection, and then causes the low rubbing cylinder by the spring connecting mechanism drive connection
The upside of the mechanism for adjusting parallelism.
Used as the improvement of the above-mentioned accurate main pressure indenter device of thermostatic type, the double thermal insulation mechanism includes that first is heat-insulated
Block, heat-insulated transfer block and the second heat insulation, the heating pressure head mechanism include heating component and are fixed on the heating component
On pressure head, be disposed between the downside of the Y-direction adjustment plate and the heating component first heat insulation, it is described every
Hot transfer block and second heat insulation.
Used as the improvement of the above-mentioned accurate main pressure indenter device of thermostatic type, the heating component includes calandria and installation
In some heating tubes on the calandria.
Used as the improvement of the above-mentioned accurate main pressure indenter device of thermostatic type, the mechanism for adjusting parallelism is aluminum alloy junction
Structure.
The beneficial effects of the invention are as follows：The main pressure indenter device of accurate thermostatic type that the present invention is provided, its low rubbing cylinder
By the upside of spring connecting mechanism drive connection mechanism for adjusting parallelism, with existing by being replaced using spring connecting mechanism
Floating junction, it can be ensured that the output pressure of low rubbing cylinder acts perpendicularly to IC or FPC surfaces, and then solves prior art
The radial clearance problem that middle use floating junction is attached and exists.Meanwhile, its heating pressure head mechanism passes through double thermal insulation machine
Structure is fixed on the downside of mechanism for adjusting parallelism, effectively to prevent the heat direction guiding rail of calandria by double thermal insulation mechanism
Transmission, it is ensured that the precision of guide rail, extend the life-span of guide rail.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, without having to pay creative labor, may be used also
Other accompanying drawings are obtained with according to these accompanying drawings.
Fig. 1 is a kind of main pressure overall structure diagram of preferred embodiment of indenter device of accurate thermostatic type of the invention.
Fig. 2 is the fractionation structural representation of the mechanism for adjusting parallelism of the accurate main pressure indenter device of thermostatic type shown in Fig. 1.
Fig. 3 is the local fractionation structural representation one of the accurate main pressure indenter device of thermostatic type shown in Fig. 1.
Fig. 4 is the local fractionation structural representation two of the accurate main pressure indenter device of thermostatic type shown in Fig. 1.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
As shown in figure 1, the present embodiment provides a kind of accurate thermostatic type main pressure indenter device 1, the accurate main pressure of thermostatic type
Indenter device 1 includes pressure head installing plate 11, the cylinder mounting seat 12 being installed on pressure head installing plate 11, is installed on pressure head installing plate
Adjusted on 11 and along the longitudinally disposed linear guides 13 of pressure head installing plate 11, the depth of parallelism being installed on the sliding block of linear guides 13
Section mechanism 14, low rubbing cylinder 15, spring connecting mechanism 16, double thermal insulation mechanism 17 and heating pressure head mechanism 18, low friction
Cylinder 15 is installed in cylinder mounting seat 12, and low rubbing cylinder 15 is adjusted by the drive connection depth of parallelism of spring connecting mechanism 16
The upside of mechanism 14, heating pressure head mechanism 18 is installed on the downside of mechanism for adjusting parallelism 14 by double thermal insulation mechanism 17.
In the present embodiment, as shown in Figures 1 and 2, mechanism for adjusting parallelism 14 includes guide rails assembling plate 141, X to adjustment
Plate 142 and Y-direction adjustment plate 143, guide rails assembling plate 141 are installed on the sliding block of linear guides 13, and X is under adjustment plate 142
(there is peace side (having mounting hole) to bearing pin 1441 and X by X to the mutual cooperation of axle sleeve 1442 and the downside of guide rails assembling plate 141
Dress hole) be flexibly connected so that X to adjustment plate 142 by X to being rotated relative to guide rails assembling plate 141 centered on bearing pin 1441,
Specifically, X is installed on guide rails assembling plate 141 to bearing pin 1441 by bearing pin fixing screws 1443, and outside puts X to axle sleeve
1442, X coordinate to external diameter and the X of axle sleeve 1442 to the hole of the downside of adjustment plate 142, so, side energy from X to adjustment plate 142
Enough by X to bearing pin 1441 and X to axle sleeve 1442 cooperate to be X to swing relative to guide rails assembling plate 141.X is to tune
X is provided between the upside of whole plate 142 and the upside of guide rails assembling plate 141 to adjustment structure and X to resetting structure, wherein, X to
Adjustment structure includes being installed on X to the first screw top board 1451 in adjustment plate 142 and being installed on guide rails assembling plate 141
X is abutted with the first screw top board 1451 to one end of adjusting screw 1452 and is connected to adjusting screw 1452, X, and X is to resetting structure bag
Include X and to spring card slot 1462 and be arranged at X to adjustment to back-moving spring 1461, the X being arranged on guide rails assembling plate 141
To spring card slot (not shown), an X is correspondingly arranged the 2nd X on plate 142 with the 2nd X to spring card slot 1462 to spring card slot
First spring effect spaces of the receiving X to back-moving spring 1461 is collectively formed, during work, when clockwise direction turns X to regulation
During screw 1452, the screw can withstand the first screw top board 1451 so that X is swung (with X to pin clockwise to adjustment plate 142
Centered on axle 1441).When counter clockwise direction turns X to adjusting screw 1452, because X is to the effect of back-moving spring 1461, X to
Adjustment plate 142 can counterclockwise swing (by X to bearing pin 1441 centered on).Because Y-direction adjustment plate 143 is mounted in X to tune
In whole plate 141, therefore, Y-direction adjustment plate 143 follows X to move (X-direction) together to adjustment plate 141.
Likewise, as shown in Figures 1 and 2, the downside (having mounting hole) of Y-direction adjustment plate 143 passes through Y-direction bearing pin 1471 and Y
It is flexibly connected to the downside (having mounting hole) of adjustment plate 142 with X to the mutual cooperation of axle sleeve 1472 so that Y-direction adjustment plate
143 are rotated relative to X centered on Y-direction bearing pin 1471 to adjustment plate 142, and specifically, Y-direction bearing pin 1471 fixes spiral shell by bearing pin
Nail 1473 is installed on X in adjustment plate 142, and outside puts Y-direction axle sleeve 1472, external diameter and the Y-direction adjustment plate of Y-direction axle sleeve 1472
The hole of 143 downside coordinates, and so, the downside of Y-direction adjustment plate 143 can be by Y-direction bearing pin 1471 and the phase of Y-direction axle sleeve 1472
Mutually coordinate to do Y-direction swing to adjustment plate 142 relative to X.The upside of Y-direction adjustment plate 143 and upside from X to adjustment plate 142 it
Between be provided with Y-direction adjustment structure and Y-direction resetting structure, wherein, Y-direction adjustment structure includes being installed on the in Y-direction adjustment plate 143
Two screw top boards 1481 and X is installed on to the Y-direction adjusting screw 1482 in adjustment plate 142, one end of Y-direction adjusting screw 1482
Abutted with the second screw top board 1481 and be connected.Y-direction resetting structure includes Y-direction back-moving spring 1491, is arranged at X to adjustment plate 142
On the first Y-direction spring card slot (not shown) and the second Y-direction spring card slot 1493 for being arranged in Y-direction adjustment plate 143, first
Y-direction spring card slot and the second Y-direction spring card slot 1493 are correspondingly arranged the second spring work that common structure accommodates Y-direction back-moving spring 1491
Use space.During work, when Y-direction adjusting screw 1482 is turned clockwise, the screw heads on the second spiral shell in Y-direction adjustment plate 143
Screw top plate 1481 so that Y-direction adjustment plate 143 is done and counterclockwise swing (centered on Y-direction bearing pin 1471).When counterclockwise
When turning Y-direction adjusting screw 1482, the Y-direction back-moving spring 1491 for being compressed promotes Y-direction adjustment plate 143 to do and swings clockwise
(centered on Y-direction bearing pin 1471).It can be seen that, in the mechanism for adjusting parallelism 14 of this accurate main pressure indenter device 1 of thermostatic type,
Which employs new adjustment principle, delicate structure and it is easily adjusted, the holding for the depth of parallelism is highly stable.And, this is parallel
Degree adjustment mechanism 14 is aluminium alloy structure so that the weight of this accurate main pressure indenter device 1 of thermostatic type mitigates significantly, realizes
The stabilization output of small pressure 0.5KG, can meet the demand of all products.
As shown in Figures 1 and 3, spring connecting mechanism 16 includes two central spindle of the spring 161, two spring carriers 162 and two pressures
Contracting spring 163, is provided with cylinder connector 151 on the piston rod of low rubbing cylinder 15, two spring carriers 162 are separately mounted to cylinder
In the left and right sides plane of joint 151, one end of each central spindle of the spring 161 sequentially passes through a compression spring 163 and a bullet respectively
It is screwed into after dumb iron 162 in the screw of Y-direction adjustment plate 143, the other end of each central spindle of the spring 161 is disposed with packing ring 164
And two nuts 165 so that the two ends of each compression spring 163 are supported with corresponding packing ring 164 and corresponding spring carrier 162 respectively
Connect in succession, and then cause upside of the low rubbing cylinder 15 by the drive connection mechanism for adjusting parallelism 14 of spring connecting mechanism 16.
The main pressure indenter device 1 of the accurate thermostatic type of sheet in the present embodiment, cylinder connector 151 is installed on the piston rod of low rubbing cylinder 15
On, circular arc head below withstands the plane above Y-direction adjustment plate 143, and the central spindle of the spring 161 in compression spring 163 is pacified
In Y-direction adjustment plate 143, spring carrier 162 is fixed on cylinder connector 151, can by the high and low position of adjusting nut 165
To adjust the amount of force between cylinder connector 151 and Y-direction adjustment plate 143, Y-direction adjustment plate 143 is not made in the course of the work not
As for departing from cylinder connector 151 because of gravity.Due to realizing a contact, it is ensured that pressure head hangs down in the pressure that IC applies with IC
Directly, stress is optimal, it is ensured that bonding (BONDING) precision of pressure head.
As shown in Fig. 1 and Fig. 4, double thermal insulation mechanism 17 includes the first heat insulation 171, heat-insulated transfer block 172 and second
Heat insulation 173, the pressure head 182 that heating pressure head mechanism 18 includes heating component 181 and is fixed on heating component 181, Y-direction adjustment
It is heat-insulated the first heat insulation 171, heat-insulated transfer block 172 and second to be disposed between the downside of plate 143 and heating component 181
Block 173.Heating component 181 includes calandria 1811 and some heating tubes 1812 being installed on calandria 1811.Specifically,
Some heating tubes 1812 are installed on calandria 1811, and pressure head 182 is fixed on heating by a block pressur plate by four cup head screws
On body 1811, heating pressure head mechanism 18 is collectively constituted.Four cup head screws 191 are from above through heat-insulated transfer block 172, the
Two thermal insulation boards 173 are connected with calandria 1811 so that 18 one-tenth of heat-insulated transfer block 172, the second thermal insulation board 173 and heating pressure head mechanism
It is an entirety.Wherein, a heat insulating washer 192 and a metal coating packing ring 193 are respectively filled on each glass of head screw 191,
The purpose of metal coating packing ring 193 is to prevent head of screw from damaging heat insulating washer 192 by pressure.Four cup head screws 194 are from following
Up it is connected with Y-direction adjustment plate 143 through heat-insulated transfer block 172, the first thermal insulation board 171, it is so far, heating pressure head mechanism 18, double
Layer heat-shield mechanism 17 and Y-direction adjustment plate 143 are connected to an entirety, likewise, respectively filling one on each glass of head screw 194
Heat insulating washer 195 and a metal coating packing ring 196.The first heat insulation is respectively provided with by the both sides of heat-insulated transfer block 172
171 and second thermal insulation board 173, realize double thermal insulation.Also, in heat-insulated transfer block 172, there is the cooling for shaping to circulate
Passage, communicates with joint below, realizes that pneumatic circulating is cooled down, and further prevents the heat of calandria 1811 to linear guides
13 conduction, it is ensured that the kinematic accuracy of pressure head, extend the life-span of linear guides.
As shown in Figures 1 to 4, need to be followed the steps below when this accurate main pressure indenter device 1 of thermostatic type works：
Step one：Adjustment pressure head press against the depth of parallelism of platform with LCD.Specifically, be press against in LCD and pressure-sensitive is placed on platform
Paper, and decline pressure head 182, is pressed on pressure-sensitive paper, and the time is less than 0.3 second, will pressure head 182 rise.According to the face of pressure-sensitive paper
Color change situation, to adjusting screw 1451 and Y-direction adjusting screw 1471, pressure head 182 press against platform with LCD can phase for turn X respectively
Answer ground to tend to parallel, be press against in LCD pressure-sensitive paper is placed on platform again, pressure head 182 is declined, the color of pressure-sensitive paper is observed again
Change, according to color change situation, the depth of parallelism again to pressure head is adjusted according to the method described above.Until the color of pressure-sensitive paper
After uniformity in the range of pressure head, X is tight to the Y-direction of trip bolt 1421 and Y-direction adjustment plate 143 to the X of adjustment plate 142 for locking
Gu screw 1431.
Step 2：Regulation magnitude of back pressure.Specifically, in order to accurately control pressure head 182 act on pressure on IC, it is necessary to
Simultaneously to the source of the gas that the both sides supply pressure of low rubbing cylinder 15 is different, pressure head 182 is controlled to act on using both pressure differentials
In the power on IC, the enterprising outlet pressure of low rubbing cylinder 15 is referred to as main pressure, the lower inlet pressure quilt of low rubbing cylinder 15
Referred to as back pressure, the effect of back pressure is the gravity of the motion parts for offsetting this accurate main pressure indenter device 1 of thermostatic type.During regulation,
First by main pressure regulation to zero pressure, then, the progressively precise pressure regulating valve of turn back pressure, with promoting this accurate thermostatic type down on hand
It is main pressure indenter device 1 motion parts so that pressure head 182 can rest on the optional position in stroke range and also it is static not
Dynamic, now, pressure head 182 can not automatically decline because of gravity, be exactly now the back-pressure for needing.Because the present invention is closed using aluminium
Golden structure manufactures the motion parts (i.e. mechanism for adjusting parallelism 14) of this accurate main pressure indenter device 1 of thermostatic type, mitigates significantly
The weight of the motion parts of this accurate main pressure indenter device 1 of thermostatic type, and using low rubbing cylinder 15 carry out drive ram 182
Lifting, therefore, it is possible to cause pressure head 182 worked under smaller pressure.
Step 3：Pressure head 182 is heated up, until reaching the setting temperature of pressure head 182, (displays temperature of temp controlled meter about exists
300℃)。
Step 4：Operational process.When LCD reaches working position, low rubbing cylinder 15 can decline under program, pass through
Spring connecting mechanism 16, pressure head 182 declines together along linear guides 13, until the working face of pressure head 182 fall within LCD IC or
On FPC, and continue to keep the constant pressure of a period of time, IC is kept for the time of constant pressure be generally 8 seconds, and FPC is kept for the time one of constant pressure
As be 12 seconds.Then pressure head 182 rises the bonding (BONDING) for completing IC or FPC on LCD.
The main pressure indenter device of accurate thermostatic type that the present embodiment is provided, its low rubbing cylinder is driven by spring connecting mechanism
The upside of dynamic connection mechanism for adjusting parallelism, with by replacing existing floating junction using spring connecting mechanism, it can be ensured that
The output pressure of low rubbing cylinder acts perpendicularly to IC or FPC surfaces, and then solves to enter using floating junction in the prior art
The radial clearance problem that row is connected and existed.Meanwhile, its heating pressure head mechanism is fixed on the depth of parallelism and adjusts by double thermal insulation mechanism
The downside of mechanism is saved, effectively to prevent the transmission of the heat direction guiding rail of calandria by double thermal insulation mechanism, it is ensured that lead
The precision of rail, extends the life-span of guide rail.
Presently preferred embodiments of the present invention is the foregoing is only, is not intended to limit the invention, it is all in essence of the invention
Within god and principle, any modification, equivalent substitution and improvements made etc. should be included within the scope of the present invention.
Claims (8)
1. the main pressure indenter device of a kind of accurate thermostatic type, it is characterised in that including pressure head installing plate, be installed on the pressure head peace
The cylinder mounting seat on plate is filled, is installed on the pressure head installing plate and linearly led along the longitudinally disposed of the pressure head installing plate
Rail, the mechanism for adjusting parallelism being installed on the sliding block of the linear guides, low rubbing cylinder, spring connecting mechanism, it is double-deck every
Heat engine structure and heating pressure head mechanism, the low rubbing cylinder are installed in the cylinder mounting seat, and the low rubbing cylinder
By the upside of mechanism for adjusting parallelism described in the spring connecting mechanism drive connection, the heating pressure head mechanism is by described
Double thermal insulation mechanism is installed on the downside of the mechanism for adjusting parallelism.
2. the accurate main pressure indenter device of thermostatic type as claimed in claim 1, it is characterised in that the mechanism for adjusting parallelism
Including guide rails assembling plate, X to adjustment plate and Y-direction adjustment plate, the guide rails assembling plate is installed on the sliding block of the linear guides
On, the X enters on the downside of mutual cooperation and the guide rails assembling plate to the downside of adjustment plate by X to bearing pin and X to axle sleeve
Row is flexibly connected so that the X is rotated to centered on bearing pin by the X to adjustment plate relative to the guide rails assembling plate, the X
To being provided with X between the upside of adjustment plate and the upside of the guide rails assembling plate to adjustment structure and X to resetting structure, the Y
Connected to the activity of being carried out on the downside of adjustment plate with the X by the mutual cooperation of Y-direction bearing pin and Y-direction axle sleeve to the downside of adjustment plate
Connect so that the Y-direction adjustment plate is rotated relative to the X centered on the Y-direction bearing pin to adjustment plate, the Y-direction adjustment plate
Upside and the X to being provided with Y-direction adjustment structure and Y-direction resetting structure between the upside of adjustment plate.
3. the accurate main pressure indenter device of thermostatic type as claimed in claim 2, it is characterised in that the X is to adjustment structure bag
Include and be installed on the X to the first screw top board in adjustment plate and the X being installed on the guide rails assembling plate to adjusting screw,
The X is abutted with the first screw top board to one end of adjusting screw and is connected, and the Y-direction adjustment structure is described including being installed on
The second screw top board in Y-direction adjustment plate and the X is installed on to the Y-direction adjusting screw in adjustment plate, the Y-direction adjusts spiral shell
One end of nail abuts with the second screw top board and is connected.
4. the accurate main pressure indenter device of thermostatic type as claimed in claim 2, it is characterised in that the X is to resetting structure bag
Include X and to spring card slot and be arranged at the X to adjustment plate to back-moving spring, the X being arranged on the guide rails assembling plate
On the 2nd X to spring card slot, an X is correspondingly arranged to spring card slot with the 2nd X to spring card slot and collectively forms
Accommodate first spring effect spaces of the X to back-moving spring；The Y-direction resetting structure includes Y-direction back-moving spring, is arranged at institute
X is stated to the first Y-direction spring card slot in adjustment plate and the second Y-direction spring card slot being arranged in the Y-direction adjustment plate, it is described
First Y-direction spring card slot is correspondingly arranged to collectively form with the second Y-direction spring card slot and accommodates the second of the Y-direction back-moving spring
Spring effect space.
5. the accurate main pressure indenter device of thermostatic type as claimed in claim 2, it is characterised in that the spring connecting mechanism bag
Two central spindle of the spring, two spring carriers and two compression springs are included, cylinder connector are installed on the piston rod of the low rubbing cylinder,
Two spring carrier is separately mounted in the left and right sides plane of the cylinder connector, one end point of each central spindle of the spring
It is screwed into the screw of the Y-direction adjustment plate after not sequentially passing through spring carrier described in compression spring described in one and, it is each described
The other end of central spindle of the spring is disposed with packing ring and two nuts so that the two ends of each compression spring respectively with it is corresponding
The packing ring and the corresponding spring carrier abut connection, and then cause that the low rubbing cylinder connects machine by the spring
The upside of mechanism for adjusting parallelism described in structure drive connection.
6. the accurate main pressure indenter device of thermostatic type as claimed in claim 2, it is characterised in that the double thermal insulation mechanism bag
The first heat insulation, heat-insulated transfer block and the second heat insulation are included, the heating pressure head mechanism includes heating component and is fixed on institute
State heating component on pressure head, be disposed between the downside of the Y-direction adjustment plate and the heating component described first every
Hot block, the heat-insulated transfer block and second heat insulation.
7. the accurate main pressure indenter device of thermostatic type as claimed in claim 2, it is characterised in that the heating component include plus
Hot body and some heating tubes being installed on the calandria.
8. the main pressure indenter device of accurate thermostatic type as described in claim 1-7 is any, it is characterised in that the depth of parallelism is adjusted
Section mechanism is aluminium alloy structure.
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| CN107561742A (en) * | 2017-09-28 | 2018-01-09 | 苏州富强加能精机有限公司 | With this pressure device of the LCDs of fender strainer |
| CN107884965A (en) * | 2017-12-23 | 2018-04-06 | 苏州富强科技有限公司 | Three-dimensional pressure head micro-adjusting mechanism for LCDs press fit device |
| CN107942551A (en) * | 2017-12-23 | 2018-04-20 | 苏州富强科技有限公司 | Adaptive pressure head micro-adjusting mechanism for liquid crystal display pressing device |
| CN111679465A (en) * | 2020-06-10 | 2020-09-18 | 深圳汉和智造有限公司 | False pressure device |
| CN112213871A (en) * | 2019-07-11 | 2021-01-12 | 东莞市华慧智能装备有限公司 | Automatic parallel pressure head on mobile phone display screen binding equipment |
| CN113329563A (en) * | 2021-04-30 | 2021-08-31 | 东莞联鹏智能装备有限公司 | Bonding head, bonding device and forming method of cooling channel |
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| CN106873198B (en) | 2019-10-29 |
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