CN110850648B - Display panel and manufacturing method thereof - Google Patents
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- CN110850648B CN110850648B CN201911039653.XA CN201911039653A CN110850648B CN 110850648 B CN110850648 B CN 110850648B CN 201911039653 A CN201911039653 A CN 201911039653A CN 110850648 B CN110850648 B CN 110850648B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract
The application discloses a display panel and a manufacturing method thereof, wherein the display panel comprises a first binding layer and a second binding layer which are positioned in a binding region and are arranged oppositely, and conductive adhesive arranged between the first binding layer and the second binding layer; the first binding layer comprises a plurality of first binding electrodes arranged at intervals and a first buffer insulating layer filled between the plurality of first binding electrodes; the second binding layer comprises a plurality of second binding electrodes arranged at intervals and a second buffer insulating layer filled between the plurality of second binding electrodes; the plurality of first binding electrodes and the plurality of second binding electrodes are arranged in a one-to-one correspondence manner and are electrically connected through conductive adhesive. First buffering insulating layer and second buffering insulating layer in this application can play the effect of effective support conducting resin, have avoided the conducting resin to take place serious deformation and produce the bubble, have guaranteed that first binding electrode and the second that corresponds bind the stability of signal of telecommunication transmission between the electrode, have improved display panel's yield.
Description
Technical Field
The present disclosure relates to display panels, and particularly to a display panel and a method for manufacturing the same.
Background
The driving principle of a medium-small-sized LCD (Liquid Crystal Display) is to feed an electric signal through a Flexible Printed Circuit (FPC), and then process the electric signal through a driving chip IC and guide the electric signal into a Liquid Crystal Display panel, so that the Liquid Crystal panel makes a corresponding response, thereby displaying a colorful picture.
Generally, an FPC is bonded to a glass substrate of an LCD through an Anisotropic Conductive Film (ACF), so that an electrode on the FPC and an electrode on the glass substrate are electrically connected through the ACF, thereby transmitting an electrical signal. For COF (Chip On FPC, driver Chip is set On FPC) products, in the process of binding FPC and glass substrate (Bonding), the FPC and glass substrate are bound by a pressure head at FPC side under the condition of pressurization and high temperature, the pressure head at FPC side extrudes the FPC, so that the FPC and ACF are extruded and deformed in the gap area between the electrodes, the FPC forms a certain bounce, the FPC rebounds and lifts the ACF (Spring-Back phenomenon) at the later stage of pressing, bubbles are generated in the ACF, the electric connection strength between the FPC and the glass substrate is reduced, and the electrodes of the FPC and the glass substrate are induced to corrode due to the air in the bubbles. Therefore, the existing binding structure has serious quality hidden trouble, and the technical problem needs to be solved urgently.
Disclosure of Invention
The embodiment of the application provides a display panel and a manufacturing method thereof, so as to prevent a conductive adhesive between a first binding layer and a second binding layer in a binding region from generating bubbles to influence normal transmission of an electric signal.
The embodiment of the application provides a display panel, which comprises a binding region, wherein the display panel comprises a first binding layer and a second binding layer which are positioned in the binding region and are arranged oppositely, and conductive adhesive arranged between the first binding layer and the second binding layer; the first binding layer comprises a plurality of first binding electrodes arranged at intervals and a first buffer insulating layer filled between the plurality of first binding electrodes; the second binding layer comprises a plurality of second binding electrodes arranged at intervals and a second buffer insulating layer filled between the plurality of second binding electrodes; the plurality of first binding electrodes and the plurality of second binding electrodes are arranged in a one-to-one correspondence manner and are electrically connected through the conductive adhesive.
Optionally, the first buffer insulating layer and the first binding electrode have the same height, and the second buffer insulating layer and the second binding electrode have the same height.
Optionally, the first buffer insulating layer and the second buffer insulating layer are made of the same material.
Optionally, the display panel further includes a substrate and a flexible circuit board; the substrate is positioned on one side of the first binding layer away from the second binding layer; the flexible circuit board is located in the binding region and located on one side, far away from the first binding layer, of the second binding layer, and the flexible circuit board is electrically connected with the second binding electrode.
Optionally, the display panel further includes a display area; the binding area is positioned at one side of the display area; the display panel further comprises a TFT array layer positioned in the display area, wherein the TFT array layer comprises a source electrode, a drain electrode and a passivation layer covering the source electrode and the drain electrode; the plurality of first binding electrodes, the source electrode and the drain electrode are arranged on the same layer and are made of the same material; the first buffer insulating layer and the passivation layer are arranged on the same layer and are made of the same material.
The embodiment of the present application further provides a manufacturing method of a display panel, where the display panel includes a binding region, and the manufacturing method includes the following steps:
a plurality of first binding electrodes are arranged at intervals in the binding region;
filling a first buffer insulating layer between the plurality of first binding electrodes to form a first binding layer;
covering the first binding layer with conductive adhesive;
a plurality of second binding electrodes are arranged at intervals;
filling a second buffer insulating layer between the plurality of second binding electrodes to form a second binding layer;
and aligning the second binding layer with the first binding layer, so that the plurality of second binding electrodes correspond to the plurality of first binding electrodes one to one and are electrically connected through the conductive adhesive.
Optionally, the display panel further includes a display area; the binding area is positioned at one side of the display area; the display panel further comprises a substrate; the step of arranging a plurality of first binding electrodes at intervals in the binding region comprises the following steps:
covering the substrate with a whole metal layer;
and patterning the metal layer to form a source electrode and a drain electrode of a TFT array layer of the display panel in the display area, and forming a plurality of first binding electrodes arranged at intervals in the binding area.
Optionally, the filling of the first buffer insulating layer between the plurality of first binding electrodes includes the following steps:
covering the entire insulating layer on the substrate on which the source electrode, the drain electrode and the plurality of first binding electrodes are formed;
and patterning the insulating layer to remove the insulating layer on the plurality of first binding electrodes, form a passivation layer covering the source and drain electrodes, and fill the first buffer insulating layer between the plurality of first binding electrodes.
Optionally, the display panel further includes a flexible circuit board located in the bonding region; the plurality of second binding electrodes are formed on the flexible circuit board; the filling of the second buffer insulating layer between the plurality of second binding electrodes includes the steps of:
coating an insulating layer on one side of the second binding electrodes away from the flexible circuit board;
and removing the insulating layer on the plurality of second binding electrodes to form a second buffer insulating layer filled between the plurality of second binding electrodes.
Optionally, the first buffer insulating layer and the second buffer insulating layer are made of the same material.
The beneficial effect of this application does: in the application, fill first buffering insulating layer between a plurality of first binding electrodes on first binding layer, and bind the second buffering insulating layer between the electrode at a plurality of second binding electrodes on layer at the second, make first binding layer and second bind the layer and bind the back through conductive adhesive, first buffering insulating layer and second buffering insulating layer can play the effect of effective support conductive adhesive, avoided conductive adhesive to take place serious deformation and produce the bubble, guaranteed that every first binding electrode and the stability of the electricity connection between the electrode is bound to the second that corresponds, thereby guaranteed the normal transmission of the signal of telecommunication between flexible circuit board and the display panel inside, display panel's yield has been improved.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a schematic top view of a display panel according to an embodiment of the present disclosure;
FIG. 2 is a schematic structural view of section A-A' of FIG. 1;
fig. 3 is a schematic cross-sectional structure diagram of a display panel according to an embodiment of the present disclosure;
fig. 4 is a schematic block diagram of a process of a method for manufacturing a display panel according to an embodiment of the present disclosure.
Detailed Description
Specific structural and functional details disclosed herein are merely representative and are provided for purposes of describing example embodiments of the present application. This application may, however, be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the present application, it is to be understood that the terms "center," "lateral," "upper," "lower," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and therefore should not be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified. Furthermore, the term "comprises" and any variations thereof are intended to cover non-exclusive inclusions.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
The present application is further described below with reference to the accompanying drawings and examples.
As shown in fig. 1 to 3, an embodiment of the present application provides a display panel 1, which includes a bonding region 2, wherein the display panel 1 includes a first bonding layer 3 and a second bonding layer 4 located in the bonding region 2 and oppositely disposed, and a conductive adhesive 5 disposed between the first bonding layer 3 and the second bonding layer 4; the first binding layer 3 includes a plurality of first binding electrodes 6 arranged at intervals and a first buffer insulating layer 7 filled between the plurality of first binding electrodes 6; the second binding layer 4 includes a plurality of second binding electrodes 8 arranged at intervals and a second buffer insulating layer 9 filled between the plurality of second binding electrodes 8; the plurality of first binding electrodes 6 and the plurality of second binding electrodes 8 are arranged in one-to-one correspondence and electrically connected through the conductive adhesive 5.
Specifically, the display panel 1 further includes a substrate 10 and a flexible circuit board 11; the substrate 10 is positioned on one side of the first binding layer 3 away from the second binding layer 4; the flexible circuit board 11 is positioned in the binding region 2, the flexible circuit board 11 is positioned on one side of the second binding layer 4 far away from the first binding layer 3, and the flexible circuit board 11 is electrically connected with the second binding electrode 8; the flexible circuit board 11 is provided with a driving chip 14, and the driving chip 14 provides an electrical signal to the inside of the display panel 1 through the second binding electrode 8 and the first binding electrode 6 so that the display panel 1 displays normally.
Specifically, the display panel 1 further includes a display area 12; the binding region 2 is positioned at one side of the display region 12; the display panel 1 further includes a TFT array layer 13 located in the display region 12, the TFT array layer 13 including a source electrode, a drain electrode, and a passivation layer (not shown) covering the source electrode and the drain electrode; the plurality of first binding electrodes 6 and the source and drain electrodes are arranged in the same layer (i.e., formed in the same process, the distance from the first binding electrodes 6 to the substrate 10 and the distance from the source and drain electrodes to the substrate 10 may be the same or different), and the materials are the same; the first buffer insulating layer 7 and the passivation layer are arranged on the same layer and are made of the same material.
Specifically, the materials of the first buffer insulating layer 7 and the second buffer insulating layer 9 are the same, and of course, the materials of the first buffer insulating layer 7 and the second buffer insulating layer 9 may be different, which is not limited herein.
Specifically, the Conductive paste 5 includes Anisotropic Conductive Film (ACF) including Conductive particles to electrically connect each of the first bonding electrodes with the corresponding second bonding electrode.
Specifically, the display panel 1 may be a liquid crystal display panel, or may be an organic electroluminescent display panel, and is not limited herein.
In this embodiment, the first buffer insulating layer 7 is filled between the plurality of first binding electrodes 6 of the first binding layer 3, and the second buffer insulating layer 9 is filled between the plurality of second binding electrodes 8 of the second binding layer 4, so that after the first binding layer 3 and the second binding layer 4 are bound by the conductive adhesive 5, the first buffer insulating layer 7 and the second buffer insulating layer 9 can play a role of effectively supporting the conductive adhesive 5, thereby preventing the conductive adhesive 5 from being seriously deformed to generate bubbles, ensuring the stability of the electrical connection between each first binding electrode 6 and the corresponding second binding electrode 8, ensuring the normal transmission of electrical signals between the flexible circuit board 11 and the inside of the display panel 1, and improving the yield of the display panel 1.
Optionally, in this embodiment, the first buffer insulating layer 7 and the first bonding electrode 6 have the same height, and the second buffer insulating layer 9 and the second bonding electrode 8 have the same height.
Specifically, in the binding process of the first binding layer 3 and the second binding layer 4, a pressure head positioned above the flexible circuit board 11 presses the second binding layer 4 on the flexible circuit board 11 towards the first binding layer 3, so that the conductive adhesive 5 between the first binding layer 3 and the second binding layer 4 is fully contacted with the first binding layer 3 and the second binding layer 4 to achieve the binding effect; in the extrusion process, if there is the space between a plurality of first binding electrodes 6 of first binding layer 3 or between a plurality of second binding electrodes 8 of second binding layer 4, then the position in flexible circuit board 11 correspondence space can take place deformation and extrude corresponding conducting resin 5 because of the exerting pressure of pressure head, make conducting resin 5 take place deformation and be full of the space, after binding, do not have the pressure head to exert pressure to flexible circuit board 11, the flexible circuit board 11 that takes place deformation can take place the bounce-back, can be full of conducting resin 5 in the space and lift at the bounce-back in-process, make conducting resin 5 seriously take place deformation and produce the bubble, thereby lead to the conducting particle maldistribution in the conducting resin 5, the stability that first binding electrode 6 and second bind the electricity between the electrode 8 has seriously been influenced.
In this embodiment, the first buffer insulating layer 7 having the same height as the first binding electrodes 6 is filled between the plurality of first binding electrodes 6 of the first binding layer 3, so that a gap between two adjacent first bindings is avoided; second buffer insulating layers 9 with the same height as the second binding electrodes 8 are filled between the second binding electrodes 8 of the second binding layer 4, so that a gap between two adjacent second bindings is avoided; binding the in-process at first layer 3 and the second of binding 4, first buffering insulating layer 7 and second buffering insulating layer 9 can effectual support conducting resin 5 and flexible circuit board 11, avoid conducting resin 5 and flexible circuit board 11 to take place serious deformation, thereby avoided conducting resin 5 gassing, guaranteed every first stability of binding the electricity between electrode 6 and the second that corresponds and binding the electrode 8, thereby guaranteed the normal transmission of the signal of telecommunication between flexible circuit board 11 and the display panel 1 inside, the yield of display panel 1 has been improved.
As shown in fig. 4, an embodiment of the present application further provides a manufacturing method of a display panel, where the display panel includes a binding region, and the manufacturing method of the display panel includes the following steps:
s401: a plurality of first binding electrodes are arranged at intervals in the binding region.
Specifically, as shown in fig. 1 and 3, the display panel 1 includes a binding region 2 and a display region 12; the binding region 2 is positioned at one side of the display region 12; the display panel 1 further comprises a substrate 10; step S401 includes the steps of:
covering the substrate 10 with a whole metal layer;
the metal layer is patterned to form source and drain electrodes (not shown) of the TFT array layer 13 of the display panel 1 in the display region 12, and a plurality of first binding electrodes 6 disposed at intervals in the binding region 2.
Specifically, the TFT array layer 13 further includes a gate electrode, a gate insulating layer, and an active layer (not shown in the figure), and the source electrode and the drain electrode may be directly disposed on the substrate 10, or disposed on the substrate 10 provided with the gate electrode, the gate insulating layer, and the active layer, that is, the thin film transistor in the TFT array layer 13 may be a top gate structure or a bottom gate structure, which is not limited herein; the first binding electrode 6 is electrically connected to the source and drain electrodes for transferring an electrical signal.
S402: and filling a first buffer insulating layer between the plurality of first binding electrodes to form a first binding layer.
Specifically, step S402 includes the following steps:
covering the whole insulating layer on the substrate on which the source electrode, the drain electrode and the first binding electrodes are formed;
the insulating layer is patterned to remove the insulating layer on the plurality of first binding electrodes, form a passivation layer covering the source and drain electrodes, and form a first buffer insulating layer filled between the plurality of first binding electrodes.
Specifically, the material of the insulating layer includes silicon oxide, silicon nitride, or a silicon nitride compound.
S403: and covering the first binding layer with conductive adhesive.
S404: a plurality of second binding electrodes are arranged at intervals.
Specifically, as shown in fig. 1 and 3, the display panel 1 further includes a flexible circuit board 11 located in the bonding area 2; a plurality of second binding electrodes 8 are formed on the flexible circuit board 11;
s405: and filling a second buffer insulating layer between the plurality of second binding electrodes to form a second binding layer.
Specifically, step S405 includes the following steps:
coating an insulating layer on one side of the second binding electrodes away from the flexible circuit board;
and removing the insulating layer on the plurality of second binding electrodes to form a second buffer insulating layer filled between the plurality of second binding electrodes.
S406: and aligning the second binding layer with the first binding layer, so that the plurality of second binding electrodes correspond to the plurality of first binding electrodes one to one and are electrically connected through the conductive adhesive.
Specifically, the second binding layer is aligned with the first binding layer, so that the plurality of second binding electrodes and the plurality of first binding electrodes are in one-to-one correspondence, the second binding layer is bonded with the first binding layer through a pressure head after alignment, the second binding layer is bonded with the first binding layer through conductive adhesive, and the plurality of second binding electrodes and the plurality of first binding electrodes are electrically connected through the conductive adhesive.
Specifically, the first buffer insulating layer and the first binding electrode are the same in height, and the second buffer insulating layer and the second binding electrode are the same in height; the first buffer insulating layer and the second buffer insulating layer are made of the same material, and certainly, the first buffer insulating layer and the second buffer insulating layer may also be made of different materials, which is not limited herein.
Specifically, the conductive paste includes anisotropic conductive paste.
In this embodiment, the prepared display panel 1 is filled with the first buffer insulating layer 7 between the first binding electrodes 6 of the first binding layer 3, and is filled with the second buffer insulating layer 9 between the second binding electrodes 8 of the second binding layer 4, so that after the first binding layer 3 and the second binding layer 4 are bound by the conductive adhesive 5, the first buffer insulating layer 7 and the second buffer insulating layer 9 can play a role of effectively supporting the conductive adhesive 5, thereby preventing the conductive adhesive 5 from being seriously deformed to generate bubbles, ensuring the stability of the electrical connection between each first binding electrode 6 and the corresponding second binding electrode 8, ensuring the normal transmission of electrical signals between the flexible circuit board 11 and the inside of the display panel 1, and improving the yield of the display panel 1.
In summary, although the present application has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present application, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application, so that the scope of the present application shall be determined by the appended claims.
Claims (10)
1. The display panel is characterized by comprising a binding region, wherein the display panel comprises a first binding layer and a second binding layer which are positioned in the binding region and are arranged oppositely, and conductive adhesive arranged between the first binding layer and the second binding layer;
the first binding layer comprises a plurality of first binding electrodes arranged at intervals and a first buffer insulating layer filled between the plurality of first binding electrodes;
the second binding layer comprises a plurality of second binding electrodes arranged at intervals and a second buffer insulating layer filled between the plurality of second binding electrodes;
the plurality of first binding electrodes and the plurality of second binding electrodes are arranged in a one-to-one correspondence manner and are electrically connected through the conductive adhesive.
2. The display panel of claim 1, wherein the first buffer insulating layer has the same height as the first binding electrode, and the second buffer insulating layer has the same height as the second binding electrode.
3. The display panel according to claim 1, wherein the first buffer insulating layer and the second buffer insulating layer are the same material.
4. The display panel of claim 1, wherein the display panel further comprises a substrate and a flexible circuit board; the substrate is positioned on one side of the first binding layer away from the second binding layer; the flexible circuit board is located in the binding region and located on one side, far away from the first binding layer, of the second binding layer, and the flexible circuit board is electrically connected with the second binding electrode.
5. The display panel of claim 1, wherein the display panel further comprises a display area; the binding area is positioned at one side of the display area; the display panel further comprises a TFT array layer positioned in the display area, wherein the TFT array layer comprises a source electrode, a drain electrode and a passivation layer covering the source electrode and the drain electrode; the plurality of first binding electrodes, the source electrode and the drain electrode are arranged on the same layer and are made of the same material.
6. A manufacturing method of a display panel, wherein the display panel comprises a binding region, the manufacturing method comprising the steps of:
a plurality of first binding electrodes are arranged at intervals in the binding region;
filling a first buffer insulating layer between the plurality of first binding electrodes to form a first binding layer;
covering the first binding layer with conductive adhesive;
a plurality of second binding electrodes are arranged at intervals;
filling a second buffer insulating layer between the plurality of second binding electrodes to form a second binding layer;
and aligning the second binding layer with the first binding layer, so that the plurality of second binding electrodes correspond to the plurality of first binding electrodes one to one and are electrically connected through the conductive adhesive.
7. The method for manufacturing a display panel according to claim 6, wherein the display panel further comprises a display region; the binding area is positioned at one side of the display area; the display panel further comprises a substrate;
the step of arranging a plurality of first binding electrodes at intervals in the binding region comprises the following steps:
covering the substrate with a whole metal layer;
and patterning the metal layer to form a source electrode and a drain electrode of a TFT array layer of the display panel in the display area, and forming a plurality of first binding electrodes arranged at intervals in the binding area.
8. The method for manufacturing a display panel according to claim 7, wherein the filling of the first buffer insulating layer between the plurality of first bonding electrodes comprises the steps of:
covering the entire insulating layer on the substrate on which the source electrode, the drain electrode and the plurality of first binding electrodes are formed;
and patterning the insulating layer to remove the insulating layer on the plurality of first binding electrodes, form a passivation layer covering the source and drain electrodes, and fill the first buffer insulating layer between the plurality of first binding electrodes.
9. The method of manufacturing a display panel according to claim 6, wherein the display panel further comprises a flexible circuit board located in the bonding region; the plurality of second binding electrodes are formed on the flexible circuit board;
the filling of the second buffer insulating layer between the plurality of second binding electrodes includes the steps of:
coating an insulating layer on one side of the second binding electrodes away from the flexible circuit board;
and removing the insulating layer on the plurality of second binding electrodes to form a second buffer insulating layer filled between the plurality of second binding electrodes.
10. The method for manufacturing a display panel according to claim 6, wherein the first buffer insulating layer and the second buffer insulating layer are made of the same material.
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| CN201911039653.XA CN110850648B (en) | 2019-10-29 | 2019-10-29 | Display panel and manufacturing method thereof |
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| CN201911039653.XA CN110850648B (en) | 2019-10-29 | 2019-10-29 | Display panel and manufacturing method thereof |
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| CN110850648B true CN110850648B (en) | 2022-05-31 |
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| CN111292634B (en) * | 2020-03-26 | 2022-08-09 | 京东方科技集团股份有限公司 | Display substrate and display panel |
| CN114706239B (en) * | 2022-03-30 | 2023-07-18 | 绵阳惠科光电科技有限公司 | Display device and binding state detection method |
| CN114898662B (en) * | 2022-05-06 | 2023-09-26 | 武汉天马微电子有限公司 | Module and substrate |
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