CN201321502Y - Decoppering resin filter pocket - Google Patents
Decoppering resin filter pocket Download PDFInfo
- Publication number
- CN201321502Y CN201321502Y CNU2008201766821U CN200820176682U CN201321502Y CN 201321502 Y CN201321502 Y CN 201321502Y CN U2008201766821 U CNU2008201766821 U CN U2008201766821U CN 200820176682 U CN200820176682 U CN 200820176682U CN 201321502 Y CN201321502 Y CN 201321502Y
- Authority
- CN
- China
- Prior art keywords
- bag
- gold plating
- resin
- plating liquid
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
A decoppering resin filter pocket comprises a pocket body in a sealing state and a plurality of ion exchange resin particles, wherein a containing part is arranged in the pocket body, the ion exchange resin particles are contained in the containing part, and thereby when gold plating liquid passes through the decoppering resin filter pocket, copper ions in the gold plating liquid can be absorbed through the internal ion exchange resin particles to lower the concentration of the copper ions in the gold plating liquid. The decoppering resin filter pocket can be directly launched into an impurity removing filter cartridge of an electroplating device for use without installing a copper ion recovery device additionally, and the cost on manufacture can be lowered.
Description
Technical field
The utility model relates to a kind of filter bag, particularly a kind ofly removes the resin of copper filter bag in order to what remove cupric ion.
Background technology
Usually circuit card when gold-plated, is being inserted the plating bath of an electroplating device with circuit card, and be dipped in the gold plating liquid in the plating bath, to carry out the circuit card craft of gilding.Yet gold plating liquid is recycling down for a long time, and the content of copper ion in the gold plating liquid can improve gradually, thereby causes the generation of many substandard products.Therefore,, the gold plating liquid in the plating bath must be transported to a cover cupric ion retrieving arrangement via the pipeline guiding, carry out the program that cupric ion reclaims, to lower the content of cupric ion in the gold plating liquid after use after a while.
The above-mentioned common volume of cupric ion retrieving arrangement is bigger, and the equipment price costliness, has therefore improved the cost of making.In view of this, the utility model proposes a kind of reasonable in design and effectively improve the problems referred to above the removal cupric ion remove the resin of copper filter bag.
Summary of the invention
Main purpose of the present utility model is to provide a kind of resin of copper filter bag that removes, ion exchange resin bead is equipped with in its inside, when gold plating liquid passed through to remove the resin of copper filter bag, ion exchange resin bead can adsorb the cupric ion in the gold plating liquid, to reduce the concentration of cupric ion in the gold plating liquid.
In order to achieve the above object, the utility model provides a kind of resin of copper filter bag that removes, and comprising: a bag, and it is sealed state and inside is provided with a holding part; And a plurality of ion exchange resin bead, be placed in the holding part of this bag.
The utlity model has following beneficial effect: ion exchange resin bead in the bag of the present utility model can adsorb the cupric ion in the gold plating liquid, with the content of copper ion in effective attenuating gold plating liquid.In addition, the utility model removes in the removal of impurity filter cylinder that the resin of copper filter bag can directly drop into electroplating device and uses, and need not additionally to install additional the cupric ion retrieving arrangement, can reduce the cost in the manufacturing.
For making those skilled in the art can further understand feature of the present utility model and technology contents, see also following about detailed description of the present utility model and accompanying drawing, yet accompanying drawing only provide with reference to and explanation, be not to be used for the utility model is limited.
Description of drawings
Fig. 1 is the schematic perspective view that the utility model removes the resin of copper filter bag.
Fig. 2 is the cross-sectional schematic that the utility model removes the resin of copper filter bag.
Fig. 3 is the synoptic diagram of electroplating device.
Fig. 4 is that the utility model removes the resin of copper filter bag and is positioned over synoptic diagram in the removal of impurity filter cylinder.
Fig. 5 is that the utility model removes the resin of copper filter bag and is positioned over and carries out the regenerated synoptic diagram in the staving.
Wherein, description of reference numerals is as follows:
100 remove resin of copper filter bag 10 bags
11 holding parts, 20 ion exchange resin bead
30 electroplating devices, 31 plating baths
32 pipelines, 33 pumps
34 pipelines, 35 valve bodies
36 storage tanks, 37 pipelines
38 removal of impurity filter cylinders, 39 pipelines
41 pipelines, 42 valve bodies
43 removal of impurity filter cylinders, 431 filtering element (cartridge)s
44 pipelines, 45 pumps
50 stavings, 51 solution
Embodiment
See also Figure 1 and Figure 2, the resin of copper filter bag 100 that removes of the present utility model comprises: a bag 10 and a plurality of ion exchange resin bead 20, wherein bag 10 has the sightless filter opening of a plurality of naked eyes (figure does not show).In the present embodiment, bag 10 is made with polypropylene (PP) material, has 13 centimeters of length, the square appearance of wide 10 centimeters sizes and the filter opening of 10 micron pore size, but not as limit.In addition, bag 10 inside are provided with a holding part 11, are used for ccontaining described ion exchange resin bead 20.
Ion exchange resin bead 20 is creamy white spherical, and size distribution is 0.3～1.1 millimeter, and in order to the absorbing copper ion, and ion exchange resin bead 20 can remove adsorbed cupric ion behind reproducer, thereby reusable.
Use of the present utility model when removing the resin of copper filter bag, be about to three side seams of bag 10 earlier and close, and described ion exchange resin bead 20 is after cleaning, in the holding part 11 of the bag 10 of just packing into, close the 4th side seam of bag 10 this moment again, makes bag 10 form sealed state; Of the present utility model except that resin of copper filter bag 100 by above-mentioned composition to form.
Figure 3 shows that one can carry out the electroplating device 30 of gold-plated operation to circuit card, comprise a plating bath 31, a storage tank 36 and two removal of impurity filter cylinders 38,43, storage tank 36 links to each other with plating bath 31 via pipeline 32,34, and links to each other with removal of impurity filter cylinder 38 via pipeline 37.Removal of impurity filter cylinder 38 is connected in plating bath 31 via pipeline 39 in addition.Removal of impurity filter cylinder 43 links to each other with plating bath 31 via pipeline 32,41, and links to each other with removal of impurity filter cylinder 38 via pipeline 44.
There is gold plating liquid plating bath 31 inside, and circuit card is down directly immersed in the gold plating liquid by plating bath 31 tops, to carry out gold-plated program.Plating bath 31 is connected with pipeline 32, and pipeline 32 is provided with a pump 33, in order to the gold plating liquids in the plating bath 31 are pumped in the pipeline 32.Pipeline 32 also is connected with pipeline 34,41 simultaneously, and pipeline 34 is provided with valve body 35, and also is provided with valve body 42 on the pipeline 41, and whether valve body 35,42 will allow gold plating liquid change its course to carry out gold-plated program or the program of filtering gold plating liquid in order to decision.If valve body 34 is opened and valve body 42 is closed, gold plating liquid promptly flow to pipeline 34 and enters to the storage tank 36 from pipeline 32, and the pipeline 37 of flowing through, removal of impurity filter cylinder 38 and pipeline 39 get back in the plating bath 31, constantly carries out gold-plated program (shown in the solid arrow among Fig. 3) circularly with this.
After gold plating liquid recycles for some time, the content of copper ion of gold plating liquid increases, can directly drop into a plurality of resin of copper filter bags 100 that remove in the removal of impurity filter cylinder 43 this moment, removal of impurity filter cylinder 43 inside have a plurality of filtering element (cartridge)s 431 (please cooperate consult shown in Figure 4) in addition, the described resin of copper filter bag 100 that removes can be folded in respectively between the described filtering element (cartridge) 431, so that have more contact area with gold plating liquid.
This moment valve body 35 closed and valve body 42 is opened, make gold plating liquid in pipeline 41 flow to removal of impurity filter cylinder 43 and make except that resin of copper filter bag 100 and be dipped in the gold plating liquid.The cupric ion that gold plating liquid includes promptly can be adsorbed by the polyion exchange resin particle in the bag 10 20, thereby reduces the content of copper ion in the gold plating liquid.On proportional distribution, the gold plating liquid of 1L is used with 5～10 ion exchange resin bead 20 that restrain approximately.Moreover bag 10 can be retained in inside with ion exchange resin bead 20 of fragmentation, reduces the obstruction of filtering element (cartridge) 431.
Also be provided with a pump 45 on the pipeline 44, in order to the gold plating liquid in the removal of impurity filter cylinder 43 is pumped in the pipeline 44.Gold plating liquid with remove resin of copper filter bag 100 and react after, can be transferred to removal of impurity filter cylinder 38 via pipeline 44, filter remaining impurity, get back to plating bath 31 via pipeline 39 more at last, finish the program (shown in the dotted arrow among Fig. 3) of filtering gold plating liquid.
When the adsorptive capacity of ion exchange resin bead 20 reaches capacity or processing efficiency is when reducing, promptly should carry out reproducer, see also shown in Figure 5ly, can prepare to contain sulfuric acid (H
2SO
4) the staving 50 of solution 51, and will immerse in the solution 51 except that resin of copper filter bag 100, make and after question response is finished, remove the cupric ion stripping that ion exchange resin bead 20 is adsorbed resin of copper filter bag 100 and can use once again.In addition, can float on solution 51 surfaces, therefore be easier to take owing to remove resin of copper filter bag 100, comparatively convenient on manipulating.
Therefore, the resin of copper filter bag that removes of the present utility model has characteristics described as follows and function:
1, ion exchange resin bead in the bag of the present utility model can adsorb the cupric ion in the gold plating liquid, with the content of copper ion in effective attenuating gold plating liquid.
2, of the present utility model removing in the removal of impurity filter cylinder that the resin of copper filter bag can directly drop into electroplating device used, and need not additionally to install additional the cupric ion retrieving arrangement, can save the cost in the manufacturing.
3, ion exchange resin bead after the fragmentation can be retained in bag inside, stops up with the filtering element (cartridge) that reduces in the removal of impurity filter cylinder.
The above only is a preferable possible embodiments of the present utility model, is not to limit to protection domain of the present utility model thus, so the equivalent structure that uses the utility model specification sheets and accompanying drawing content to be done such as changes, all is contained in the scope of the present utility model.
Claims (5)
1, a kind of resin of copper filter bag that removes is characterized in that, comprising:
One bag, it is sealed state and inside is provided with a holding part; And
A plurality of ion exchange resin bead are placed in the holding part of this bag.
2, the resin of copper filter bag that removes as claimed in claim 1 is characterized in that, the bag of this bag for making with the polypropylene material.
3, the resin of copper filter bag that removes as claimed in claim 1 is characterized in that this bag has a plurality of filter openings.
4, the resin of copper filter bag that removes as claimed in claim 3 is characterized in that the aperture of described filter opening is 10 microns.
5, the resin of copper filter bag that removes as claimed in claim 1 is characterized in that the size distribution of described ion exchange resin bead is 0.3～1.1 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201766821U CN201321502Y (en) | 2008-11-10 | 2008-11-10 | Decoppering resin filter pocket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201766821U CN201321502Y (en) | 2008-11-10 | 2008-11-10 | Decoppering resin filter pocket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201321502Y true CN201321502Y (en) | 2009-10-07 |
Family
ID=41158888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201766821U Expired - Fee Related CN201321502Y (en) | 2008-11-10 | 2008-11-10 | Decoppering resin filter pocket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201321502Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109280908A (en) * | 2017-07-19 | 2019-01-29 | 凯基有限公司 | The continuous purification system of plating by chemical displacement gold solution and Impurity Nickel and impurity copper |
-
2008
- 2008-11-10 CN CNU2008201766821U patent/CN201321502Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109280908A (en) * | 2017-07-19 | 2019-01-29 | 凯基有限公司 | The continuous purification system of plating by chemical displacement gold solution and Impurity Nickel and impurity copper |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091007 Termination date: 20121110 |