CN201298985Y - Assembly mold for printed wiring board and radiation fins - Google Patents
Assembly mold for printed wiring board and radiation fins Download PDFInfo
- Publication number
- CN201298985Y CN201298985Y CNU2008202030069U CN200820203006U CN201298985Y CN 201298985 Y CN201298985 Y CN 201298985Y CN U2008202030069 U CNU2008202030069 U CN U2008202030069U CN 200820203006 U CN200820203006 U CN 200820203006U CN 201298985 Y CN201298985 Y CN 201298985Y
- Authority
- CN
- China
- Prior art keywords
- wiring board
- radiation fins
- screw pair
- pressing
- fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Supply And Installment Of Electrical Components (AREA)
Abstract
The utility model relates to a mold used for fixing a printed wiring board and radiation fins in assembly and pressing of the same. The assembly mold is in a plate-shaped structure, is provided with a first positioning screw pair used for fixing a wiring board, a second positioning screw pair used for fixing radiation fins and a limiting screw pair used for preventing over-pressing; the relative positions of the first positioning screw pair and the second positioning screw pair are determined according to different wiring boards, the dimensions of the radiation fins and the relative positions of the wiring boards and the radiation fins; and two limiting screws of the limiting screw pair respectively follow two positioning screws of the second positioning screw pair. The mold is utilized to fix and then press the wiring board and the radiation fins, the phenomena of relative malposition and displacement of the wiring boards and the radiation fins in the pressing process due to the action of pressure are avoided, the pressing precision is improved, and the waste ratio of pressed boards is greatly reduced.
Description
Technical field
The utility model relate to a kind of can be when being used for the assembling of printed substrate and fin with the assembly jig of the two accurate contraposition and location.
Background technology
Along with being extensive use of of electron trade medium-high frequency signal, its precision requirement to the wiring board various aspects is also more and more higher, the precision of fin position during comprising pressing fin on wiring board.Traditional compression method is used the direct pressing of pressing machine then just with wiring board and the artificial naked eyes contraposition of fin.The situation that fin misplaces, is shifted in the pressing process, often occurs, increased the scrappage of wiring board so greatly, increased the production cost of enterprise.
The utility model content
The assembly jig of the two accurate contraposition and location can be avoided dislocation in the pressing process, displacement phenomenon when the purpose of this utility model provides a kind of printed substrate and fin assembling, reduce the wiring board scrappage.
For achieving the above object, the technical scheme taked of the utility model is:
The assembly jig of a kind of printed substrate and fin is provided, described assembly jig is a platy structure, it is right that described mould is provided with first locating pin that is used for fixing wiring board, second locating pin that is used for fixing fin is to preventing that with being used to the banking pin of excessive pressing is right, described two locating pins to a banking pin to forming the locating pin group.Described locating pin and banking pin are all perpendicular to Die and mould plate is surperficial and above the mould upper surface, described banking pin is slightly short in locating pin.
On described tabular assembly jig, a plurality of locating pin groups can be set, be convenient to place simultaneously a plurality of wiring boards, increase work efficiency with the fin pressing.
Before printed substrate and the fin pressing wiring board and fin are fixed on the described mould successively, so just can avoid in the pressing process because the pressure effect produces the relative phenomenon that misplaces, is shifted with fin of wiring board, improved the precision of pressing, greatly reduce the scrappage of plate after the pressing, be beneficial to Cost Control.
Description of drawings
Fig. 1 is that the utility model embodiment forms schematic diagram;
Fig. 2 is Figure 1A-A place schematic cross-section.
Embodiment
The utility model is described in further detail below in conjunction with embodiment and accompanying drawing.
As in Fig. 1 frame of broken lines and shown in Figure 2, assembly jig described in the utility model is a platy structure, is provided with locating pin 1-1 and 1-2, the locating pin 2-1 and 2-2 that is used for fixing fin B that is used for fixing wiring board A both sides, the banking pin 3-1,3-2 that is used to prevent fin and the excessive pressing of wiring board on mould.
In the present embodiment, be provided with six groups of same locating pin groups on the described Die and mould plate.Locating pin 1-1 and 1-2,2-1 and 2-2 all exceeds 0.1 inch on described Die and mould plate plane, and the size that this exceeds is suitable with wiring board thickness, and banking pin 3-1,3-2 exceeds 0.02 inch on described Die and mould plate plane.The outside of locating pin 1-1,1-2 is provided with and is used to the hole 5,6 that makes things convenient for wiring board to take onboard.
As Fig. 2, during use, the wiring board both sides that will accomplish fluently location hole earlier in advance are fixed on the described assembly jig by means of locating pin 1-1 and 1-2, and the fin that will accomplish fluently location hole again is put in wiring board needs the place, fixes by means of locating pin 2-1 and 2-2.Wiring board needs pressing fin place normally to be arranged to groove.Nail is fixing because wiring board and fin all are positioned, and phenomenon all can not be shifted when using pressing by outside force.Banking pin is supported on the fin bottom, makes the fin bottom leave minim gap with bottom portion of groove, is provided with conducting resinl in the gap.After fixing assembly jig is placed on pressing on the pressing lathe, after pressing is good, can be easily 5,6 holds wiring board it is taken off from mould from the hole.
Claims (2)
1, the assembly jig of a kind of printed substrate and fin, described assembly jig is a platy structure, it is characterized in that: be provided with by the locating pin (1-1) that is used for fixing wiring board, (1-2) on described mould, be used for fixing locating pin (2-1), (2-2) of fin and be used to prevent the banking pin (3-1) of excessive pressing, the locating pin group that (3-2) are formed; Described locating pin and banking pin are all perpendicular to Die and mould plate is surperficial and above the mould upper surface, described banking pin (3-1), (3-2) are slightly short in locating pin (1-1), (1-2), (2-1), (2-2).
2, the assembly jig of a kind of printed substrate according to claim 1 and fin is characterized in that: be provided with on described mould and be used to the hole (5), (6) that make things convenient for wiring board to take.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202030069U CN201298985Y (en) | 2008-11-04 | 2008-11-04 | Assembly mold for printed wiring board and radiation fins |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202030069U CN201298985Y (en) | 2008-11-04 | 2008-11-04 | Assembly mold for printed wiring board and radiation fins |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201298985Y true CN201298985Y (en) | 2009-08-26 |
Family
ID=41044975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008202030069U Expired - Fee Related CN201298985Y (en) | 2008-11-04 | 2008-11-04 | Assembly mold for printed wiring board and radiation fins |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201298985Y (en) |
-
2008
- 2008-11-04 CN CNU2008202030069U patent/CN201298985Y/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090826 Termination date: 20171104 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |