CN201298550Y

CN201298550Y - Novel lead frame structure for semiconductor

Info

Publication number: CN201298550Y
Application number: CNU2008201563723U
Authority: CN
Inventors: 徐进寿; 叶国欣
Original assignee: Shanghai Seefull Electronic Co Ltd
Current assignee: Shanghai Seefull Electronic Co Ltd
Priority date: 2008-12-01
Filing date: 2008-12-01
Publication date: 2009-08-26
Anticipated expiration: 2018-12-01

Abstract

A novel lead frame structure for a semiconductor comprises an upper lead frame and a radiating fin which are different in thickness, wherein, a plurality of locating detents protrude from the periphery of the bonding surface between the upper lead frame and the radiating fin, a front side groove is formed on the bonding surface of the radiating fin, a locating groove in embedded connection with the locating detents is formed on the back side of the groove, and the locating detents are bent over and fixed to the back side of the radiating fin. The utility model has the following advantages: an irregular thick-and-thin lead frame is divided into the upper lead frame and the radiating fin which are different in thickness for assembly; materials used for manufacturing the upper lead frame and the radiating fin can vary in nature, thereby reducing material cost; and the upper lead frame is connected and fixed with the radiating fin in a purely mechanical manner, so that the process is briefer and more practical with improved production efficiency.

Description

Novel semi-conductor wire support structure

Technical field

The utility model relates to a kind of semiconductor lead supporting structure, and particularly a kind of mechanical system of using is with the upper conductor frame of two different-thickness and unlike material and the novel semi-conductor wire support structure of fin assembling formation.

Background technology

At present the special-shaped thickness wire support of semiconductor structure roughly has two kinds: one is to use the copper material drawing of special-shaped thickness, but the cost that uses profile shapes with respect to sheet material than higher, and the drawing of the profile shapes difficulty of also coming than sheet material; Two are to use the upper conductor frame of thin slice and the fin of sheet to weld or the colloid be adhesively fixed by tin cream, owing to use tin cream welding or colloid to be bonded and fixed at together, need in encapsulation procedure, increase extra operation and equipment, make it unfavorable to some extent aspect processing procedure control and cost control.

The utility model content

Technical problem of the present utility model is that a kind of low cost will be provided, the novel semi-conductor wire support structure of effectively enhancing productivity.

In order to solve above technical problem, the utility model provides a kind of novel semi-conductor wire support structure, this supporting structure comprises the upper conductor frame and the fin of two different-thickness, stretch out several locating detents around upper conductor frame and the fin faying face, the faying face of fin is provided with the front groove, the groove back side is provided with the location notch chimeric with locating detent, and the back side of fin is fixed in the locating detent bending.

Superior effect of the present utility model is:

1) upper conductor frame and the fin that special-shaped thickness wire support is divided into two different-thickness assembled, and upper conductor frame and fin can select unlike material for use, as above lead frame copper material, and the fin aluminium has reduced cost;

2), thereby reach the required performance of semiconductor device owing to the metal of selecting unlike material for use cooperates;

3) because upper conductor frame and fin adopt the simple mechanical mode to be connected and fixed, technology is more succinct practical, has reduced cost, has improved production efficiency effectively, and existing follow-up encapsulation procedure be need not to do any change.

Description of drawings

Fig. 1 is the front view of upper conductor frame;

Fig. 2 is the end view of upper conductor frame;

Fig. 3 is a locating detent A-A cutaway view among Fig. 1;

Fig. 4 is the front view of fin;

Fig. 5 is the end view of fin;

Fig. 6 is a location notch B-B cutaway view among Fig. 4;

Fig. 7 is that the utility model upper conductor frame and fin cooperate and the installation front view;

Fig. 8 is that the utility model upper conductor frame and fin are engaged in location notch C-C cutaway view;

Fig. 9 is that the utility model upper conductor frame and fin are installed in location notch C-C cutaway view;

The number in the figure explanation

1-upper conductor frame; 101-locating detent;

The faying face of 102-upper conductor frame;

2-fin; 201-groove;

202-location notch; The faying face of 203-fin;

204-back side groove.

Embodiment

See also shown in the accompanying drawing, the utility model will be further described.

As Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5 and shown in Figure 6, the utility model provides a kind of novel semi-conductor wire support structure, this supporting structure comprises the upper conductor frame 1 and the fin 2 of two different-thickness, upper conductor frame 1 stretches out several locating detents 101 all around with the faying face 102 of fin 2, the faying face of fin 2 is provided with front groove 201, groove 201 back sides are provided with the location notch 201 chimeric with locating detent 101, and the back side of fin 2 is fixed in locating detent 101 bendings.

As Fig. 6, Fig. 7 and shown in Figure 8, during with upper conductor frame 1 and fin 2 assemblings, at first the faying face 102 of upper conductor frame is put into the front groove 201 of fin 2, and the locating detent 101 of upper conductor frame 1 is fit in the location notch 202 of fin 2, the faying face 102 and fin 2 faying faces 203 of upper conductor frame 1 are close together, locating detent 101 with upper conductor frame 1 bends inwards then, make in the back side groove 204 of its fin 1 that links closely, upper conductor frame 1 and fin 2 are achieved a fixed connection.Because the locating detent 101 of upper conductor frame 1 is positioned at the back side groove 204 of fin 2, when encapsulation, wrap up fully, so a change does not influence the outward appearance and the quality of product by capsulation material.

From above assembling of the present utility model is implemented as can be known: the utility model is that the upper conductor frame 1 of two different-thickness and fin 2 are combined into special-shaped thickness wire support, owing to adopt simple mechanical system to be connected and fixed, realize comparatively easily by wire support manufacturer, save owing to use the equipment and the operation of tin cream welding or colloid bonding, and select metal replacement high-valency metal at a low price for use according to actual conditions fin 2 or upper conductor frame 1 in force, effectively reduce the cost of material.

Above embodiment only is a preferable case of the present utility model.Any with simple mechanical system, as riveted joint etc., connect upper conductor frame and fin to form wire support, all should belong in the claimed patent covering scope of the utility model.

Claims

1, a kind of novel semi-conductor wire support structure is characterized in that:

This supporting structure comprises the upper conductor frame and the fin of two different-thickness, stretch out several locating detents around upper conductor frame and the fin faying face, the faying face of fin is provided with the front groove, and the groove back side is provided with the location notch chimeric with locating detent, and the back side of fin is fixed in the locating detent bending.