CN201298538Y

CN201298538Y - UV processing device for wafers or substrates

Info

Publication number: CN201298538Y
Application number: CNU2008201150928U
Authority: CN
Inventors: 鲁迪·波特曼
Original assignee: BOWATAKE Co Ltd
Current assignee: BOWATAKE Co Ltd
Priority date: 2007-05-15
Filing date: 2008-05-15
Publication date: 2009-08-26
Anticipated expiration: 2018-05-15
Also published as: DE202007007003U1; SG148111A1

Abstract

The utility model discloses a UV processing device for wafers or substrates by UV light, which comprises a UV light resource (3), wherein, the UV light resource (3) comprises a plurality of LEDs (11) and a heat sink (12). The LEDs emit UV light or UV containing light. The heat sink is used for emitting waste heat generated by the LEDs into ambient environment.

Description

The device that is used for the UV processing of wafer or substrate

Technical field

The utility model relates to the device that a kind of ultraviolet (UV) that is used for wafer or substrate is handled.UV light refers to ultraviolet light.

The term wafer refers to the thin disk made by semi-conducting material at first, but generally also comprises the thin disk of being made by other material of for example glass now.The shape of wafer is round.Contrast therewith, the similar object of rectangle is called substrate.Term substrate also comprises printed circuit board (PCB).

Background technology

This device that is used for the UV processing for example uses so that make the binding agent deactivation in semi-conductor industry, promptly partly or wholly reduces their cementitiousness.Gaseous discharge lamp or UV fluorescent tube are as the UV light source.Gaseous discharge lamp needs be ready for operation up to them very long warm-up time, therefore produces the very used heat of a large amount.UV fluorescent tube efficient is low.

The utility model content

The utility model has the purpose of this device that improves performance based on research and development.

The utility model proposes the device of the UV processing that is used for object, described object is particularly wafer or substrate for example, it is the device that the utility model provides a kind of UV that is used for wafer or substrate to handle, described device comprises the UV light source, described UV light source comprises a plurality of light-emitting diodes (LED) and heat sink, wherein said LED is emission UV light or contains the LED of the light of UV light, and wherein heat sink be that the used heat that is used for being produced by LED is dispersed into the heat sink of surrounding environment.Preferably, heat sinkly constitute by pottery.In a preferred embodiment, this device also comprises and is used to receive the glass plate that object is wafer or substrate, and the UV light source is arranged in the glass plate below with fixed form and illuminates the predetermined surface zone of glass plate.

Have several advantages according to device of the present utility model:

-thermal diffusion is very low, this means that sheet metal only stands suitable temperature.

The useful life of-UV light source is very long, this means that maintenance cost is therefore very low.

-UV light is evenly distributed on the whole surf zone.

-device directly is ready for operation.Avoided warm-up time.

Description of drawings

The accompanying drawing that comprises in this manual and constitute this specification part illustrates one or more execution mode of the present utility model, and with describe one in detail and be used from explanation principle of the present utility model and enforcement.Accompanying drawing is not drawn in proportion.In the accompanying drawings:

Fig. 1 and 2 shows according to particularly first execution mode of the device handled of the UV of wafer or substrate of object that is used for of the present utility model;

Fig. 3 and 4 shows second execution mode of this device;

Fig. 5 shows the 3rd execution mode of this device; And

Fig. 6 shows the 4th execution mode of this device.

Embodiment

The statement of carrying out is applied to wafer and substrate similarly below.For easy reason, will only use the term wafer below.Fig. 1 and Fig. 2 schematically show the vertical view and the end view of first execution mode of the device that the UV that is used for wafer or substrate handles respectively.This device comprises base plate 1, is furnished with transportation system 2 and UV light source 3 in base plate 1, and wherein UV light source 3 upwards shines UV light.Transportation system 2 comprises motor 4, roller 5 and conveyer belt 6.Motor 4 drives at least one conveyer belt 6.UV light source 3 is arranged in the centre of transportation system 2.In example, the left-half of transportation system 2 is as loading surface 7, and right half part is as unloading surface 8.One by one wafer is placed in and loads on the surface 7 in operating process, is sent to unloading surface 8 along arrow on the indicated transporting direction 10 by transportation system 2 in transportation plane 9, and is taken off from unloading surface 8.This loading and unloading can be carried out or be undertaken by full-automatic loading depot and discharge point by enough hands.

UV light source 3 comprises a plurality of LED11, and LED11 launches ultraviolet light in the predetermined angular zone, and described predetermined angular is about 120 ° in this example.As required and use, can use dissimilar LED11.Ultraviolet light-emitting diode (UV LED) is specially suitable, and it mainly or almost ad hoc is transmitted in the light in the UV scope.Can obtain a kind of UV LED from Nichia company, the optical output power of light that this UV LED emission wavelength is about 365nm and acquisition 310mW.This UV LED can use by the intergrated lens system in being packaged in shell.This intergrated lens system is used for the light at predetermined angular zone emission UV.In application-specific, can use white light LEDs as LED 11, this white light LEDs emission comprises the white light of quite a large amount of UV rays.

LED 11 not only produces UV light, also produces used heat.In order to realize the longest probable life of LED 11, the operating temperature of LED 11 must be remained low as far as possible.Therefore, UV light source 3 comprises the passive cooling segment or heat sink 12 and the active cooling segment of fan 13 forms of heat sink 12 forms, and wherein fan 13 allows air to flow through heat sink 12.Therefore the used heat that is produced by LED11 can be delivered in the surrounding environment effectively.LED 11 for example is installed on the printed circuit board (PCB) 14, and printed circuit board (PCB) 14 is fastened to heat sink 12.Printed circuit board (PCB) 14 is chosen as and makes printed circuit board (PCB) 14 may mode will be directed to heat sink 12 by the used heat that LED 11 produces with best.

When using the pottery conduct to be used for heat sink 12 material, can realize extra high cooling performance.Heat sink 12 can be made or can be made by the several ceramic blocks that are arranged between two guide rails by single-piece ceramic material, and can install separately.

LED 11 is with delegation or be arranged in transportation 9 belows, plane and be lateral shift with multirow as shown in figure, and described in this example multirow is a triplex row.Be sized in the transversely distance A of the adjacent LED 11 of measurement, make that the cone-shaped beam of described LED is overlapping in edge at least, thereby can illuminate the whole useful width B of device with respect to transporting direction 10.In this example, distance A is A=1cm.Give LED 11 supply of current from constant-current supply, wherein preferably per eight LED 11 (perhaps any other quantity) are connected in series.

Following execution mode is based on identical technology, and is still different on form of implementation.Therefore, saidly above also be applicable to following execution mode similarly.

Fig. 3 and Fig. 4 schematically show vertical view and the end view according to second execution mode of device of the present utility model, and wherein, UV light source 3 is arranged in transportation 9 tops, plane and irradiation downwards.UV light source 3 be fastened to base plate 1 or the lid that can open on.Conveyer belt 6 extends continuously.UV LED 11 arranges with delegation in this example.

Fig. 5 schematically shows the vertical view according to the 3rd execution mode of device of the present utility model, wherein wafer is placed on the glass plate 15, and UV light source 3 is arranged on the support 16, and described support 16 can move back and forth on the guiding device 17 that is arranged in below the glass plate 15.The upwards irradiation of LED 11 of in row, arranging on the other hand, transverse to the driving direction 19 of support.

Fig. 6 schematically shows the vertical view according to the 4th execution mode of device of the present utility model, has not wherein both had the transportation of wafer also not have any of UV light source 3 to move.UV light source 3 comprises by row by being listed as the LED 11 that arranges and illuminate presumptive area.The cone-shaped beam of adjacent LED 11 is overlapping in the plane that is formed by surf zone in edge.With the same in the example of front, LED 11 be arranged in heat sink on.

Described device be suitable for any desired object particularly the UV of wafer or substrate handle.In semicon industry, when expectation reduces the cementitiousness of semiconductor chip on sheet metal, use this device.Semiconductor chip production is for being arranged in a plurality of integrated circuits on the wafer adjacent to each other.Wafer is glued on the adhesive sheet metal that is clipped on the framework in the end, is sawn into each semiconductor chip then.Afterwards, the sheet metal with each semiconductor chip is carried out UV handle, with the cementitiousness of destruction sheet metal or described cementitiousness is reduced to the degree of expectation.When doing like this, sheet metal is facing to the UV light source, and semiconductor chip is positioned at a side that deviates from the UV light source of sheet metal.

Also be suitable for being coated with the processing of the wafer, substrate etc. of photoresist according to device of the present utility model, and wherein photoresist must be used the UV optical processing.

When needs use UV light to come cured binders, also can use described device.

Though illustrated and described execution mode of the present utility model and application, but understand it will be apparent to those skilled in the art that of benefit of the present disclosure, under the situation of the utility model notion that does not break away from this paper, can make and be different from foregoing many modifications.Therefore, the utility model only is subjected to claims and is equal to the restriction of the spirit of description.

Claims

1. device that the UV that is used for wafer or substrate handles, comprise UV light source (3), it is characterized in that, described UV light source comprises a plurality of LED (11) and heat sink (12), wherein, described LED is the LED that can launch UV light or contain the light of UV light, and described heat sink be to be used for and will to be dispersed into the heat sink of surrounding environment by the used heat that described LED produces.

2. the device that the UV that is used for wafer or substrate according to claim 1 handles is characterized in that, describedly heat sinkly is made of pottery.

3. the device that the UV that is used for wafer or substrate according to claim 1 and 2 handles, it is characterized in that, described device also comprises the glass plate (15) that is used to receive described wafer or substrate, wherein, described UV light source is arranged in described glass plate below with fixed form and illuminates the predetermined surface zone of described glass plate.