CN201234360Y

CN201234360Y - Construction for enhancing high temperature breaking resistance performance of ceramic

Info

Publication number: CN201234360Y
Application number: CNU2008201621517U
Authority: CN
Inventors: 吕越斌
Original assignee: Hangzhou Heatwell Mechanical & Electrical Co Ltd
Current assignee: Hangzhou Heatwell Mechanical & Electrical Co Ltd
Priority date: 2008-08-04
Filing date: 2008-08-04
Publication date: 2009-05-06
Anticipated expiration: 2018-08-04

Abstract

The utility model relates to a structure for improving the high-temperature fracture resistance of a ceramic material, which mainly comprises a ceramic plate and a group of heating-wire mounting holes formed on the ceramic plate, wherein two adjacent heating-wire mounting holes are connected through grooves. The grooves are distributed uniformly or non-uniformly. The cross section of each groove is in the shape of semi-circle or trapezoid or triangle or other shapes. The structure has the advantages that through adding the grooves or press-wires to the plate, the thermal stress caused by temperature rise of the ceramic material is effectively reduced, so that the fracture resistance of the ceramic material is greatly improved.

Description

A kind of structure that improves the anti-crushing performance of ceramic high temperature

Technical field

The utility model relates to field of electric heating, mainly is a kind of structure that improves the anti-crushing performance of ceramic high temperature.

Background technology

Original ceramic wafer be slab construction as depicted in figs. 1 and 2, have one group of heating wire installing hole on the flat board; With ceramic-insulated electric heating product, ceramic wafer has certain stress impact effect owing to expand with heat and contract with cold to material in the cyclic process repeatedly of heating cooling, finally makes ceramic surface produce slight crack and causes pottery broken.

Summary of the invention

The utility model will solve above-mentioned existing shortcoming, and a kind of structure that improves the anti-crushing performance of ceramic high temperature is provided.

The utility model solves the technical scheme that its technical problem adopts: the structure of the anti-crushing performance of this raising ceramic high temperature, mainly comprise ceramic wafer, and have one group of heating wire installing hole on the described ceramic wafer, be connected by groove between the adjacent heating wire installing hole.

Described groove evenly distributes or uneven distribution.

The cross section of described groove is semicircle or trapezoidal or triangle or other shapes.

The effect that the utility model is useful is: after increasing groove or line ball on the flat board, can effectively reduce because the thermal stress that pottery heats up and produces, can be greatly improved to the crush resistance of pottery.

Description of drawings

Fig. 1 is the main TV structure schematic diagram of prior art;

Fig. 2 is the A-A sectional structure schematic diagram of Fig. 1;

Fig. 3 is the utility model master TV structure schematic diagram;

Fig. 4 is the A-A sectional structure schematic diagram 1 of Fig. 3;

Fig. 5 is the A-A sectional structure schematic diagram 2 of Fig. 3;

Fig. 6 is the A-A sectional structure schematic diagram 3 of Fig. 3;

Description of reference numerals: ceramic wafer 1, heating wire installing hole 2, groove 3.

Embodiment

Below in conjunction with drawings and Examples the utility model is described in further detail.

As shown in Figure 3, the structure of the anti-crushing performance of this raising ceramic high temperature mainly comprises ceramic wafer 1, has one group of heating wire installing hole 2 on the described ceramic wafer 1, is connected by groove 3 between the adjacent heating wire installing hole 2.The shape in described groove 3 cross sections is unrestricted, can be different shape, or the line ball that certain depth is arranged, and the distribution of groove can right-angled intersection or oblique or is parallel to each other, as long as be evenly distributed.As shown in Figure 4, the cross section of described groove 3 is trapezoidal; As shown in Figure 5, the cross section of described groove 3 is a triangle; As shown in Figure 6, the cross section of described groove 3 is semicircle.

Heating wire is installed in the heating wire installing hole 2, the heating of heating wire heats up pottery, and the ceramic thermal stress of slab construction is bigger, after increasing groove or line ball on the ceramic wafer 1, can effectively reduce because the thermal stress that pottery heat up to produce, can be greatly improved the crush resistance of pottery.

In addition to the implementation, the utility model can also have other execution modes.All employings are equal to the technical scheme of replacement or equivalent transformation formation, all drop on the protection range of the utility model requirement.

Claims

1, a kind of structure that improves the anti-crushing performance of ceramic high temperature mainly comprises ceramic wafer (1), it is characterized in that: have one group of heating wire installing hole (2) on the described ceramic wafer (1), be connected by groove (3) between the adjacent heating wire installing hole (2).

2, the structure of the anti-crushing performance of raising ceramic high temperature according to claim 1 is characterized in that: described groove (3) evenly distributes.

3, the structure of the anti-crushing performance of raising ceramic high temperature according to claim 1 and 2 is characterized in that: the cross section of described groove (3) is for semicircle.

4, the structure of the anti-crushing performance of raising ceramic high temperature according to claim 1 and 2, it is characterized in that: the cross section of described groove (3) is trapezoidal.

5, the structure of the anti-crushing performance of raising ceramic high temperature according to claim 1 and 2, it is characterized in that: the cross section of described groove (3) is a triangle.