CN201221731Y - LED bulb with reflecting cup - Google Patents
LED bulb with reflecting cup Download PDFInfo
- Publication number
- CN201221731Y CN201221731Y CNU2008200445611U CN200820044561U CN201221731Y CN 201221731 Y CN201221731 Y CN 201221731Y CN U2008200445611 U CNU2008200445611 U CN U2008200445611U CN 200820044561 U CN200820044561 U CN 200820044561U CN 201221731 Y CN201221731 Y CN 201221731Y
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- CN
- China
- Prior art keywords
- ceramic
- led chip
- reflector
- reflecting cup
- led bulb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
The utility model discloses an LED bulb with a reflecting cup, which comprises an LED chip and a reflecting cup, wherein, the bottom of the reflecting cup is provided with a ceramic base with a high coefficient of heat conduction, and the ceramic base extends towards the inner side of the reflecting cup; and the LED chip is bonded on the side of the ceramic base. The utility model has the advantages that heat can be fast transmitted through the ceramic base with the high coefficient of heat conduction; the LED chip is bonded on a column surface, so reflection rays can be sufficiently collected by the reflecting cup, and a light source with high luminous emissivity can be obtained; the optical property is good, and the service life is long.
Description
Technical field
The utility model relates to a kind of LED bulb with reflector.
Background technology
In the design of traditional LED bulb, as shown in Figure 1, horizontally disposed ceramic substrate (or metal substrate) 6 is arranged at the bottom of reflector 1, the led chip 3 that binding has matrix to put on the top surface of ceramic substrate (or metal substrate) 6.During work, led chip 3 is luminous, and light reflects away through the reflecting surface of reflector 1, and the heat of generation outwards transmits by ceramic substrate (or metal substrate) 6.This design, because led chip is horizontally disposed, most light is that direct projection is gone out, and only peripheral small part light is through the reflector reflection, and its light extraction efficiency is not high, can't obtain the light source of desirable optical characteristics; And can produce the maximum temperature point in the matrix centre, and the working environment that is positioned at the led chip at matrix center is the most abominable, its working life also is the shortest, thereby has influence on the working life of whole LED bulb.
Summary of the invention
The purpose of this utility model provides a kind of light extraction efficiency height, optical characteristics is better and long working life, heat dispersion better with the LED bulb of reflector.
Technical solution of the present utility model is: a kind of LED bulb with reflector, comprise led chip, reflector, be provided with the base of ceramic with high heat-conduction coefficient that extends in described reflector bottom in cup, described led chip is bundled on the side of this base of ceramic.
Base of ceramic extends in reflector, led chip is bundled in respectively on the cylinder of base of ceramic, can shine light on the reflecting surface of reflector by three dimensions fully, and fully be gathered into light source with desired optical properties, improved light extraction efficiency, simultaneously, such binding mode can increase the distance between the led chip in the unit space, improve the heat dissipation environment of chip greatly, and select for use pottery to process pedestal with high heat-conduction coefficient, can very fast heat be spread out of, significantly improve the radiating efficiency of led chip, prolong the service life of chip and bulb.
Described base of ceramic is column or post taper, helps processing pedestal like this, is convenient to bind led chip simultaneously.
The horizontal cross-section of described base of ceramic is regular polygon, dodecagon preferably, led chip can be bundled in respectively on each cylinder of regular polygon, the spacing between the adjacent chips is less, the space availability ratio height, reflection evenly, optical characteristics is better.
The utility model has the advantages that: the base of ceramic of high heat-conduction coefficient can transfer out heat very soon, led chip is bundled on the cylinder, helps fully collecting reflection ray by reflector, obtains the light source of high light-emitting efficiency, good optical properties, long service life.
Description of drawings
Accompanying drawing 1 is the sectional structure chart of the LED bulb of band reflector in the prior art;
Accompanying drawing 3 is the vertical view of base of ceramic among the utility model embodiment;
1, reflector, 2, base of ceramic, 3, led chip, 4, the electrode connection-peg, 5, protective cover, 6, substrate.
The specific embodiment
Embodiment: consult Fig. 2, a kind of LED bulb with reflector, comprise reflector 1, led chip 3, be provided with the column base of ceramic 2 with high heat-conduction coefficient that extends in described reflector 1 bottom in cup, described led chip 3 is bundled on the post side of this base of ceramic 2.As shown in Figure 3, in the present embodiment, described base of ceramic 2 is the post cone of dodecagon, and described led chip 3 is bundled in respectively on each bar post side of this base of ceramic 2.The openend of reflector 1 is provided with the protective cover 5 of printing opacity, and base of ceramic 2 is provided with the electrode connection-peg 4 that is electrically connected with each led chip 3.
Base of ceramic 2 can use beryllium oxide, aluminium oxide and aluminum fluoride ceramic material with high heat-conduction coefficient to form, and has heat transfer well, the characteristics of long service life.Led chip 3 is bundled in respectively on each cylinder of base of ceramic 2, the space availability ratio height, can fully light be shone on the reflecting surface of reflector, and fully be gathered into light source with desired optical properties, improved light extraction efficiency, simultaneously, such binding mode can increase the distance between the led chip in the unit space, improve the heat dissipation environment of chip greatly, cooperate base of ceramic 2 with high heat-conduction coefficient, can very fast heat be spread out of, significantly improve radiating efficiency, prolong the service life of chip.
Above-listed detailed description is specifying at one of the utility model possible embodiments, this embodiment is not in order to limit claim of the present utility model, allly do not break away from the equivalence that the utility model does and implement or change, all should be contained in the claim of this case.
Claims (5)
1, a kind of LED bulb with reflector comprises led chip, reflector, it is characterized in that: be provided with the base of ceramic with high heat-conduction coefficient that extends in described reflector bottom in cup, described led chip is bundled on the side of this base of ceramic.
2, a kind of LED bulb with reflector according to claim 1, it is characterized in that: described base of ceramic is column.
3, a kind of LED bulb with reflector according to claim 1, it is characterized in that: described base of ceramic is the awl column.
4, a kind of LED bulb with reflector according to claim 1 and 2, it is characterized in that: the horizontal cross-section of described base of ceramic is regular polygon.
5, a kind of LED bulb with reflector according to claim 1 and 2, it is characterized in that: the horizontal cross-section of described base of ceramic is dodecagon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200445611U CN201221731Y (en) | 2008-03-06 | 2008-03-06 | LED bulb with reflecting cup |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200445611U CN201221731Y (en) | 2008-03-06 | 2008-03-06 | LED bulb with reflecting cup |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201221731Y true CN201221731Y (en) | 2009-04-15 |
Family
ID=40575237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200445611U Expired - Fee Related CN201221731Y (en) | 2008-03-06 | 2008-03-06 | LED bulb with reflecting cup |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201221731Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102062320A (en) * | 2010-12-16 | 2011-05-18 | 西安炬光科技有限公司 | LED (Light Emitting Diode) light source module with optical reshaping and preparation method thereof |
| CN102473811A (en) * | 2009-07-23 | 2012-05-23 | 飞利浦拉米尔德斯照明设备有限责任公司 | LED with molded reflective sidewall coating |
| CN103775858A (en) * | 2012-10-22 | 2014-05-07 | 浙江锐迪生光电有限公司 | 4 pi emergent light LED (Light Emitting Diode) light emitting pipe with chip flipped in transparent ceramic tube and illuminating lamp |
| CN106568002A (en) * | 2009-05-28 | 2017-04-19 | 皇家飞利浦电子股份有限公司 | Illumination device with an envelope enclosing a light source |
| CN108397751A (en) * | 2011-05-20 | 2018-08-14 | 吉佳特锐股份公司 | LED illumination device with adjustable light distribution |
-
2008
- 2008-03-06 CN CNU2008200445611U patent/CN201221731Y/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106568002A (en) * | 2009-05-28 | 2017-04-19 | 皇家飞利浦电子股份有限公司 | Illumination device with an envelope enclosing a light source |
| CN102473811A (en) * | 2009-07-23 | 2012-05-23 | 飞利浦拉米尔德斯照明设备有限责任公司 | LED with molded reflective sidewall coating |
| CN102473811B (en) * | 2009-07-23 | 2015-08-26 | 飞利浦拉米尔德斯照明设备有限责任公司 | There is the LED of molded reflective sidewall coating |
| CN102062320A (en) * | 2010-12-16 | 2011-05-18 | 西安炬光科技有限公司 | LED (Light Emitting Diode) light source module with optical reshaping and preparation method thereof |
| CN108397751A (en) * | 2011-05-20 | 2018-08-14 | 吉佳特锐股份公司 | LED illumination device with adjustable light distribution |
| CN103775858A (en) * | 2012-10-22 | 2014-05-07 | 浙江锐迪生光电有限公司 | 4 pi emergent light LED (Light Emitting Diode) light emitting pipe with chip flipped in transparent ceramic tube and illuminating lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090415 Termination date: 20100306 |