CN201196682Y - Ultrasonic sensor capable of adjusting sensibility and aftershock - Google Patents

Ultrasonic sensor capable of adjusting sensibility and aftershock Download PDF

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Publication number
CN201196682Y
CN201196682Y CNU2007200808127U CN200720080812U CN201196682Y CN 201196682 Y CN201196682 Y CN 201196682Y CN U2007200808127 U CNU2007200808127 U CN U2007200808127U CN 200720080812 U CN200720080812 U CN 200720080812U CN 201196682 Y CN201196682 Y CN 201196682Y
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CN
China
Prior art keywords
circuit board
aftershock
pressure block
metal shell
ultrasonic sensor
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Expired - Fee Related
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CNU2007200808127U
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Chinese (zh)
Inventor
李铭
欧贵兵
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Chengdu Huichi Electron Science & Technology Co Ltd
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Chengdu Huichi Electron Science & Technology Co Ltd
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Priority to CNU2007200808127U priority Critical patent/CN201196682Y/en
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Abstract

The utility model discloses an ultrasonic sensor capable of adjusting the sensitivity and the aftershock, which mainly comprises a metal shell, a piezoelectric chip, a circuit board, a first leading foot, a second leading foot, a pressure block which controls the stress of the piezoelectric chip, a sound-absorbing cotton layer which absorbs the aftershock of vibration of the sensor, and silica gel filler, wherein the circuit board is provided with a through hole which is provide with an internal thread; an adjusting device is arranged inside the through hole; and the lower end of the adjusting device is movably connected with the upper end face of the pressure block. The ultrasonic sensor can precisely control the sensitivity and the aftershock of products on the basis of not changing raw materials and simply changing production facilities, makes the products meet the demand of different customers, improves the serviceability and the up-to-standard rate of the products, saves the cost, improves the production efficiency, and most importantly makes the consistency of the performance of the adjusted products almost reach 100 percent.

Description

The ultrasonic sensor of scalable sensitivity, aftershock
Technical field
The utility model relates to a kind of distance measuring sensor, and particularly a kind of distance that is used to detect between carrier and the peripheral barrier is as the scalable sensitivity of range radar, the ultrasonic sensor of aftershock.
Background technology
The sensor that detects distance between carrier and the peripheral barrier all adopts ultrasonic sensor at present, and this type of sensor utilizes ultrasonic technology to realize the range finding detection.Ultrasonic sensor is launched ultrasonic pulse signal by phased manner, and the ultrasonic pulse signal of reception object reflected back, measure distance between carrier and the barrier with the mistiming between two pulse signals, measure the distance results of calculating and compare judgement according to caution scope setting value, and make corresponding response action, to reach the purpose of the caution of reporting to the police.
Yet with regard to existing equipment and technology, in the ultrasonic sensor production run, can't carry out accurate in locating to measurement sensitivity, the aftershock of ultrasonic sensor, reach the precision of regulation, so also exist bigger difference between the product that same production line is produced, these differences but are vital to product sensitivity, aftershock and precision thereof.The ultrasonic sensor of producing just can't be measured sensitivity to it once finalizing the design, aftershock is changed, so have only by oscillograph or sweep generator ultrasonic sensor is detected, to distinguish the product of different sensitivity, aftershock and accuracy value thereof.
The conforming qualification rate of measurement sensitivity, aftershock and precision thereof of producing product is lower.When producing in enormous quantities in particular for large order, often ordering Fang Jun requires ordered ultrasonic sensor measurement sensitivity, aftershock and accuracy value thereof to want consistent, this has brought a huge difficult problem to manufacturing enterprise---and produce the product that does not meet customer requirement and only scrap, its product is poor for applicability, simultaneously just have to continue to produce product and detect in order to satisfy requirement of client, the continuous like this process of producing repeatedly, detect, producing has not only seriously reduced production efficiency, has increased huge cost to enterprise simultaneously.
Of paramount importancely in the multiple reason that makes a difference be: the one, be subjected to using the influence of starting material consistance difference, cause the big and a large amount of secondary product of discreteness of properties of product; The 2nd, the restriction that present production equipment and technology thereof are not good enough.Though the former can adopt the starting material of high conformity to carry out processing and manufacturing, also just reduce the difference between the product as much as possible, directly cause the increase of cost simultaneously, this brings huge financial burden also for undoubtedly enterprise and client; And the latter improves or create once the production equipment or the technology of overlapping the ten minutes mature and reliable is not overnight attainable, and the funds of developing equally also are huge.
The utility model content
The purpose of this utility model is to overcome above-mentioned technical deficiency, and the ultrasonic sensor of a kind of scalable sensitivity, aftershock is provided.
For achieving the above object, the technical scheme that is adopted is: mainly comprise a metal shell, metal shell is the hollow columnar cavity of an end opening, other end sealing, and the platform that chamber, the bottom surface wall of its cavity inner sealing one end is constituted extends to form a boss or concave station up or down; And a piezo chips, piezo chips utilizes the principle of piezoelectric effect that electric energy and ultrasound wave are transformed mutually, promptly when emission is hyperacoustic, with the electric energy conversion, launches ultrasound wave; And when receiving echo, then ultrasonic vibration is converted to electric signal; And a circuit board, circuit board connects leading foot and it is positioned, and circuit board one end below is provided with the conduction pile crown, and the conduction pile crown is communicated with metal shell; And first and second leading foots, at regular intervals between two leading foots, an end of two leading foots is fixedly connected on the circuit board, and the other end is linked on the ultrasonic range finder; And the pressure block of the stress of a control piezo chips; And the acoustical cotton layer of the aftershock of Absorbing Sensor vibration; And silica gel filler; Described piezo chips is fixed in the bottom in the metal shell, pressure block places the piezo chips top, and piezo chips and pressure block are separated by the acoustical cotton layer, the circuit board that is connected with leading foot places the pressure block top, and and pressure block between be separated with certain distance, silica gel filler is fixed circuit board and be sealed in the metal shell, and the silica gel filler upper surface is higher than the circuit board upper surface, and first and second leading foots are connected to form the loop with piezo chips and conduction pile crown respectively by extension line;
Described circuit board is provided with a tapped through hole, and a regulating device is installed in this through hole, and the lower end of regulating device and the upper surface of pressure block flexibly connect, and pressure block can move as microspur along with regulating device.Regulating device is one and regulates bolt or other is similar to the device of bolt.The shape of the shape of through hole and regulating device is complementary on the circuit board.
The leading foot of ultrasonic sensor is linked on oscillograph or the sweep generator, under the monitoring of oscillograph or sweep generator, change the prestress of transformation electrical chip by mechanical mode, promptly change the pressure block end face that is connected with regulating device and the distance of piezo chips by screwing in or screw out regulating device, to change the suffered pressure of piezo chips, the piezo chips internal stress is changed, waveform that observation oscilloscope or sweep generator are shown or frequency, the ultrasonic sensor that all are conditioned remains in the consistent waveform or frequency range, thus the sensitivity of precisely control product, aftershock.Make product can satisfy different clients' demand, improve the applicability and the qualification rate of product.
The present invention do not change starting material and simply change on the basis of production equipment can precisely control product sensitivity, aftershock, make product can satisfy different clients' demand, improve the applicability and the qualification rate of product, saved cost, improved production efficiency, the most important thing is to make that the properties of product consistance after regulating almost reaches 100%.
Description of drawings
Fig. 1 is the ultrasonic sensor structural representation;
Among the figure: 1-metal shell, 2-piezo chips, 3-circuit board, 4-leading foot, 5-pressure block,
6-acoustical cotton layer, 7-conduction pile crown, 8-extension line, 9-silica gel filler, 10-regulating device.
Embodiment
Below in conjunction with accompanying drawing the utility model is described in further detail:
As shown in Figure 1, a kind of ultrasonic sensor, mainly comprise: a metal shell 1, metal shell 1 are the hollow columnar cavity of an end opening, other end sealing, and the platform that chamber, the bottom surface wall of its cavity inner sealing one end is constituted extends to form a boss or concave station up or down; And a piezo chips 2, piezo chips 2 utilizes the principle of piezoelectric effect that electric energy and ultrasound wave are transformed mutually, promptly when emission is hyperacoustic, with the electric energy conversion, launches ultrasound wave; And when receiving echo, then ultrasonic vibration is converted to electric signal; And a circuit board 3, circuit board 3 connects leading foot 4 and it is positioned, and circuit board 3 one ends below is provided with conduction pile crown 7, and conduction pile crown 7 is communicated with metal shell 1; And at regular intervals between first and second leading foots, 4, two leading foots 4, an end of two leading foots 4 is fixedly connected on the circuit board 3, and the other end is linked on the ultrasonic range finder; And the pressure block 5 of the stress of a control piezo chips; And the acoustical cotton layer 6 of the aftershock of Absorbing Sensor vibration; And silica gel filler 9; Described piezo chips 2 is fixed in the bottom in the metal shell 1, pressure block 5 places piezo chips 2 tops, and piezo chips 2 and pressure block 2 are separated by acoustical cotton layer 6, the circuit board 3 that is connected with leading foot 4 places pressure block 5 tops, and and 5 of pressure blocks be separated with certain distance, silica gel filler 9 is fixed circuit board 3 and be sealed in the metal shell 1, silica gel filler 9 upper surfaces are higher than circuit board 3 upper surfaces, and first and second leading foots 4 are connected to form the loop with piezo chips 2 and conduction pile crown 7 respectively by extension line 8; Circuit board 3 is provided with a tapped through hole, and a regulating device 10 is installed in this through hole, and the upper surface of the lower end of regulating device 10 and pressure block 5 flexibly connects.Regulating device 10 is one and regulates bolt or other is similar to the device of bolt.The shape of the shape of through hole and regulating device 10 is complementary on the circuit board 3.
The leading foot 4 of ultrasonic sensor is linked on oscillograph or the sweep generator, under the monitoring of oscillograph or sweep generator, change the prestress of transformation electrical chip 2 by mechanical mode, promptly change pressure block 5 end faces that are connected with regulating device 10 and the distance of piezo chips 2 by screwing in or screw out regulating device 10, to change the suffered pressure of piezo chips 2, piezo chips 2 internal stresss are changed, waveform that observation oscilloscope or sweep generator are shown or frequency, the ultrasonic sensor that all are conditioned remains in the consistent waveform or frequency range, at last circuit board 3 and the regulating device 10 usefulness silica gel fillers 9 that regulate are sealed firm processing once more, thus the sensitivity of precisely control product, aftershock.

Claims (3)

1. the ultrasonic sensor of a scalable sensitivity, aftershock is characterized in that: mainly comprise
One metal shell (1), metal shell (1) are the hollow columnar cavity of an end opening, other end sealing, and the platform that chamber, the bottom surface wall of its cavity inner sealing one end is constituted extends to form a boss or concave station up or down; And
One piezo chips (2), piezo chips (2) utilize the principle of piezoelectric effect that electric energy and ultrasound wave are transformed mutually, promptly when emission is hyperacoustic, with the electric energy conversion, launch ultrasound wave; And when receiving echo, then ultrasonic vibration is converted to electric signal; And
One circuit board (3), circuit board (3) connect leading foot (4) and it are positioned, and circuit board (3) one ends below is provided with conduction pile crown (7), and conduction pile crown (7) is communicated with metal shell (1); And
First and second leading foots (4), at regular intervals between two leading foots (4), an end of two leading foots (4) is fixedly connected on the circuit board (3), and the other end is linked on the ultrasonic range finder; And
The pressure block (5) of the stress of one control piezo chips; And
The acoustical cotton layer (6) of the aftershock of Absorbing Sensor vibration, and
Circuit board (3) is fixing and be sealed in silica gel filler (9) in the metal shell (1), and silica gel filler (9) upper surface is higher than circuit board (3) upper surface;
Described piezo chips (2) is fixed in the bottom in the metal shell (1), pressure block (5) places piezo chips (2) top, and piezo chips (2) and pressure block (2) are separated by acoustical cotton layer (6), the circuit board (3) that is connected with leading foot (4) places pressure block (5) top, and and pressure block (5) between be separated with certain distance, silica gel filler (9) is fixed circuit board (3) and be sealed in the metal shell (1), silica gel filler (9) upper surface and circuit board (3) upper surface are on same surface level, and first and second leading foots (4) are connected to form the loop with piezo chips (2) and conduction pile crown (7) respectively by extension line (8); Circuit board (3) is provided with a tapped through hole, and a regulating device (10) is installed in this through hole, and the upper surface of the lower end of regulating device (10) and pressure block (5) flexibly connects.
2. the ultrasonic sensor of scalable sensitivity according to claim 1, aftershock is characterized in that: regulating device (10) is one and regulates bolt.
3. the ultrasonic sensor of scalable sensitivity according to claim 1, aftershock is characterized in that: circuit board (3) is gone up the shape of through hole and the shape of regulating device (10) is complementary.
CNU2007200808127U 2007-08-27 2007-08-27 Ultrasonic sensor capable of adjusting sensibility and aftershock Expired - Fee Related CN201196682Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2007200808127U CN201196682Y (en) 2007-08-27 2007-08-27 Ultrasonic sensor capable of adjusting sensibility and aftershock

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2007200808127U CN201196682Y (en) 2007-08-27 2007-08-27 Ultrasonic sensor capable of adjusting sensibility and aftershock

Publications (1)

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CN201196682Y true CN201196682Y (en) 2009-02-18

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103534603A (en) * 2011-05-09 2014-01-22 罗伯特·博世有限公司 Ultrasonic measurement system having reduced minimum range and method for detecting an obstacle
CN105004436A (en) * 2015-07-30 2015-10-28 安徽天康股份有限公司 Flat-tube protective sleeve sheet-type temperature sensor and manufacturing method thereof
CN109633655A (en) * 2018-12-29 2019-04-16 肇庆奥迪威传感科技有限公司 Ultrasonic ranging method and supersonic range finder
CN114211210A (en) * 2021-12-31 2022-03-22 上海飞卓智能科技有限公司 Quick response temperature surface mounting process

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103534603A (en) * 2011-05-09 2014-01-22 罗伯特·博世有限公司 Ultrasonic measurement system having reduced minimum range and method for detecting an obstacle
CN103534603B (en) * 2011-05-09 2017-01-18 罗伯特·博世有限公司 Ultrasonic measurement system having reduced minimum range and method for detecting an obstacle
US9557168B2 (en) 2011-05-09 2017-01-31 Robert Bosch Gmbh Ultrasonic measuring system having a reduced minimum range and method for detecting an obstacle
CN105004436A (en) * 2015-07-30 2015-10-28 安徽天康股份有限公司 Flat-tube protective sleeve sheet-type temperature sensor and manufacturing method thereof
CN105004436B (en) * 2015-07-30 2018-01-02 安徽天康(集团)股份有限公司 A kind of flat tube protective case slice type temperature sensor and preparation method thereof
CN109633655A (en) * 2018-12-29 2019-04-16 肇庆奥迪威传感科技有限公司 Ultrasonic ranging method and supersonic range finder
CN109633655B (en) * 2018-12-29 2020-10-16 肇庆奥迪威传感科技有限公司 Ultrasonic distance measuring method and ultrasonic distance measuring device
CN114211210A (en) * 2021-12-31 2022-03-22 上海飞卓智能科技有限公司 Quick response temperature surface mounting process
CN114211210B (en) * 2021-12-31 2022-12-09 飞卓科技(上海)股份有限公司 Quick response temperature surface mounting process

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C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090218

Termination date: 20130827