CN201188717Y - Flexible circuit board - Google Patents
Flexible circuit board Download PDFInfo
- Publication number
- CN201188717Y CN201188717Y CNU2008200098033U CN200820009803U CN201188717Y CN 201188717 Y CN201188717 Y CN 201188717Y CN U2008200098033 U CNU2008200098033 U CN U2008200098033U CN 200820009803 U CN200820009803 U CN 200820009803U CN 201188717 Y CN201188717 Y CN 201188717Y
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- cover layer
- contact areas
- display module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a flexible circuit board which is applicable to an electronic device. The electronic device comprises a drive module and a display module. The flexible circuit board comprises a body, a first covering layer and a second covering layer, wherein, the body is provided with a plurality of conductive grounding zones and a plurality of contact point zones, and the body is respectively connected with the drive module and the display module; the first covering layer covers the contact point zones, and the second covering layer covers the first covering layer and the conductive grounding zones. The flexible circuit board which is applicable to the electronic device has good grounding performance, solving the problems of the radiated interference and the sensitivity due to the electrical connection of the flexible circuit board, and further effectively overcoming the noise influence.
Description
Technical field
The utility model relates to a kind of flexible circuit board, particularly about a kind of structural improvement that can be used for the flexible circuit board of electronic installation.
Background technology
General printed circuit board (PCB) is because top with many electronic component and must be fixed in the machine, so base material has certain thickness and hardness.And the characteristic of flexible circuit board is with above-mentioned different, the base material of flexible circuit board is very thin and can be crooked, the output value that to the greatest extent let it be only account for traditional hard circuit board 1/10th less than, but because of its special function is the indispensable angle of wanting of information age now, because the characteristic of flexible circuit board deflection, can be used for reducing the volume and the weight of machinery, the flexible circuit board demand is rising in recent years rapidly, for more effective weight and volume that reduces machinery, flexible circuit board is also more and more accurate now.Usually below 0.1mm, its thickness is to have only 1/20 of general printed circuit plate thickness to the gross thickness that the base material of flexible circuit board adds solid.
See also Fig. 1, be used for the schematic diagram of electronic installation for the flexible circuit board of prior art.Electronic installation 1 comprises a display module 100 and a printed circuit board (PCB) (not shown).And flexible circuit board 110 is in order to connecting display module 100 and printed circuit board (PCB), and comprises most conductive earthing districts 102 and most contact areas 101.Wherein, conductive earthing district 102 and contact areas 101 are all covered by a polymeric laminate, cover to go up the silver slurry again.When flexible circuit board 110 bendings, the phenomenon of radiated interference takes place easily, and because 102 surfaces, conductive earthing district are covered by polymeric laminate, cause the conductivity when silver slurry contacts not good, and can't absorbed radiation reduce interference, for example: the volumetric spaces of mobile phone is little, and the high-frequency signals that display module produced is coupled to printed circuit board (PCB) (printedcircuit board easily, PCB) on, and if the radiation of high-frequency noise is higher with the field pattern MD of antenna for mobile phone on this flexible circuit board, then the receptivity to mobile phone will cause direct influence.
Because every problem of prior art, in order to take into account solutions, this creator proposes a kind of flexible circuit board based on research and development and many practical experience for many years, with implementation and the foundation as the above-mentioned shortcoming of improvement.
The utility model content
In view of this, the purpose of this utility model is exactly to can be used for electronic installation in that a kind of flexible circuit board is provided, with the radiated interference and the sensing degree problem of the electric connection that solves flexible circuit board.
According to the purpose of this utility model, a kind of flexible circuit board is proposed, can be used for an electronic installation, this electronic installation can be a mobile phone.This electronic installation comprises a driver module and a display module, and this flexible circuit board comprises: a body, one first cover layer and one second cover layer.This body has most conductive earthing districts and most contact areas, this body is in order to connect this driver module and this display module, this first cover layer contact is covered on the described contact areas, and this second cover layer contact is covered in this first cover layer and the described conductive earthing district.Wherein said conductive earthing district and described contact areas are to arrange with mutual equi-spaced apart.Wherein this body is to carry out bending with elastic force own to connect.Wherein this first cover layer is a pi.Wherein this second cover layer is an aluminium foil or silver medal slurry.Wherein this contact areas comprises a data drive circuit.
The beneficial effects of the utility model:
The utility model can be used for electronic installation, and ground connection property preferably can be provided, and with the radiated interference and the sensing degree problem of the electric connection that solves flexible circuit board, and further effectively intercepts the noise influence.
Description of drawings
Fig. 1 is used for the schematic diagram of electronic installation for the flexible circuit board of prior art.
Fig. 2 A is the end view that flexible circuit board of the present utility model is used for electronic installation.
Fig. 2 B is the sectional axonometric drawing of flexible circuit board of the present utility model.
The main element symbol description
1: electronic installation;
100: display module;
101: contact areas;
102: the conductive earthing district;
110: flexible circuit board;
2: electronic installation;
200: the conductive earthing district;
201: contact areas;
202: the first cover layers;
203: the second cover layers;
210: display module;
220: driver module; And
230: flexible circuit board.
The utility model specifies representative graph to be: Fig. 2 B.
The component symbol simple declaration of this representative graph:
200: the conductive earthing district;
201: contact areas;
202: the first cover layers;
203: the second cover layers; And
230: flexible circuit board.
Embodiment
For the effect that can further understand technical characterictic of the present utility model and be reached, careful assistant with preferred embodiment and cooperate detailed explanation as after.
Hereinafter with reference to relevant indicators, the flexible circuit board according to the utility model preferred embodiment is described, to be convenient to understand for making, the similar elements among the following embodiment is to illustrate with identical symbology.
Replace conventional discrete formula passive device, advantage is at the usage quantity that reduces the discrete type passive device, at present the material of the flexible circuit board of multilayer is formed by macromolecule or polynary ester, because flexible circuit board itself has pliability, promptly be flexible to a predetermined extent and do not damage, also from the earliest single sided board, develop into afterwards double sided board, four laminates even more multi-layered plate on the flexible circuit board processing procedure; Therefore flexible circuit board is from script transmission line function, develop into the material that can design the built-in type element, to reduce the cost of manufacture of module, still, accurate modular device buries in the inherent flexible circuit board also can the radiated interference phenomenon take place because of crooked connected mode.
See also Fig. 2 A and Fig. 2 B, it is the embodiment schematic diagram that is used for electronic installation for flexible circuit board of the present utility model.Among Fig. 2 A, electronic installation 2 comprises a display module 210 and a driver module 220.Wherein, display module 210 can be liquid crystal panel, and driver module 220 can be printed circuit board (PCB).Flexible circuit board 230 comprises a body, one first cover layer 202 and one second cover layer 203.This body is in order to connect display module 210 and driver module 220.Flexible circuit board 230 is light compared to printed circuit board (PCB), thin and have flexibility, makes that flexible circuit board 230 can be crooked to carry out connecting moves by elastic force own.Bury passive device for can utilize special dielectric material and resistance material in the flexible circuit board 230, in the metal laminated structure of flexible circuit board 230, make, can be during practical application according to capacitance characteristic and demand, and adopt high low-k or resistance substrate material to make built-in capacity device, inductor, resistor and high frequency transmission line.
See also Fig. 2 B, the body of flexible circuit board 230 comprises most conductive earthing districts 200 and most contact areas 201 comprise a data drive circuit, and described conductive earthing district 200 and described contact areas 201 are to arrange with mutual equi-spaced apart.Wherein, first cover layer 202 only contacts and covers contact areas 201, but contact does not cover conductive earthing district 200, then, after covering one deck solid (AD), the conductive earthing district 200 of flexible circuit board 230 just exposes and can be covered by the contact of second cover layer 203, produces preferably ground connection property and solves the radiated interference phenomenon that crooked place produces.Wherein, the first above-mentioned cover layer can be pi (polyimide) and constitutes, and second cover layer can be aluminium foil or the silver slurry constitutes.
From the above, because of complying with flexible circuit board of the present utility model, first cover layer only contacts the covering contact areas, but do not cover the conductive earthing district, thereby after covering second cover layer, the conductive earthing district is contacted fully with second cover layer, can provide ground connection property preferably thus, and further effectively intercept the noise influence.
The above only is an illustrative, but not is restricted.Anyly do not break away from spirit of the present utility model and category, and, all should be contained in the accompanying claim its equivalent modifications of carrying out or change.
Claims (6)
1, a kind of flexible circuit board can be used for an electronic installation, and this electronic installation comprises a driver module and a display module, it is characterized in that, this flexible circuit board comprises:
One body has most conductive earthing districts and most contact areas, and this body connects this driver module and this display module respectively;
One first cover layer only is covered on the described contact areas; And
One second cover layer is to be covered on this first cover layer and the described conductive earthing district.
2, flexible circuit board as claimed in claim 1 is characterized in that, wherein said conductive earthing district and described contact areas are to arrange with mutual equi-spaced apart.
3, flexible circuit board as claimed in claim 1 is characterized in that, wherein this body is to carry out bending with elastic force own to connect.
4, flexible circuit board as claimed in claim 1 is characterized in that, wherein this first cover layer is a pi.
5, flexible circuit board as claimed in claim 1 is characterized in that, wherein this second cover layer is an aluminium foil or silver medal slurry.
6, flexible circuit board as claimed in claim 1 is characterized in that, wherein this contact areas comprises a data drive circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200098033U CN201188717Y (en) | 2008-03-17 | 2008-03-17 | Flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200098033U CN201188717Y (en) | 2008-03-17 | 2008-03-17 | Flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201188717Y true CN201188717Y (en) | 2009-01-28 |
Family
ID=40311736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200098033U Expired - Fee Related CN201188717Y (en) | 2008-03-17 | 2008-03-17 | Flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201188717Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019091080A1 (en) * | 2017-11-08 | 2019-05-16 | 歌尔股份有限公司 | Electronic device |
| CN112566390A (en) * | 2019-09-10 | 2021-03-26 | 宏启胜精密电子(秦皇岛)有限公司 | Multilayer flexible circuit board and preparation method thereof |
-
2008
- 2008-03-17 CN CNU2008200098033U patent/CN201188717Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019091080A1 (en) * | 2017-11-08 | 2019-05-16 | 歌尔股份有限公司 | Electronic device |
| CN112566390A (en) * | 2019-09-10 | 2021-03-26 | 宏启胜精密电子(秦皇岛)有限公司 | Multilayer flexible circuit board and preparation method thereof |
| CN112566390B (en) * | 2019-09-10 | 2022-04-15 | 宏启胜精密电子(秦皇岛)有限公司 | Multilayer flexible circuit board and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090128 Termination date: 20150317 |
|
| EXPY | Termination of patent right or utility model |