CN201174132Y - Wireless RFID body - Google Patents

Wireless RFID body Download PDF

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Publication number
CN201174132Y
CN201174132Y CNU2008200853019U CN200820085301U CN201174132Y CN 201174132 Y CN201174132 Y CN 201174132Y CN U2008200853019 U CNU2008200853019 U CN U2008200853019U CN 200820085301 U CN200820085301 U CN 200820085301U CN 201174132 Y CN201174132 Y CN 201174132Y
Authority
CN
China
Prior art keywords
melt adhesive
radio frequency
hot melt
circuit chip
chip assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2008200853019U
Other languages
Chinese (zh)
Inventor
黄仲民
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
VANSKEE TECHNOLOGY (HANGZHOU) Co Ltd
Original Assignee
VANSKEE TECHNOLOGY (HANGZHOU) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by VANSKEE TECHNOLOGY (HANGZHOU) Co Ltd filed Critical VANSKEE TECHNOLOGY (HANGZHOU) Co Ltd
Priority to CNU2008200853019U priority Critical patent/CN201174132Y/en
Application granted granted Critical
Publication of CN201174132Y publication Critical patent/CN201174132Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a wireless radio frequency identifier, which belongs to the automatic identification technical field. The utility model is applicable to non-contact type IC cards, labels and paper tickets. The wireless radio frequency identifier which comprises an outer layer and an intermediate layer is characterized in that: the intermediate layer consists of a coil, an integrated circuit chip assembly and hot-melt adhesive; the coil and the integrated circuit chip assembly are arranged in the hot-melt adhesive, and the intermediate layer and the outer layer are adhered together through the hot-melt adhesive. The wireless radio frequency identifier simplifies the production material and production process, ensures the product reliability and economical efficiency, and meets the requirements of various occasions and applications.

Description

A kind of radio frequency identification body
Technical field:
The utility model relates to a kind of radio frequency identification body, belongs to the automatic identification technology field, is applicable to untouchable IC-card, label, paper ticket etc.
Background technology:
Radio RF recognition technology (is Radio Frequency Identification, be called for short RFID) be a kind of contactless automatic identification technology, it is by the automatic recognition objective object of radiofrequency signal and obtain related data, identification work need not manual intervention, can work in various rugged surroundings, the radio frequency identification body promptly is to adopt this principle to make.Present radio frequency identification body is mostly with form productions such as card, label, paper tickets, in process of production, earlier with the antenna of copper, aluminium or silver-colored material and chip and plastic pad material assemble become the middle layer after, with double faced adhesive tape applying skin-material and middle layer, carry out the die-cut product of finishing at last again.Prior production process need expend multiple material, and must adopt expensive automation equipment production, and cost is higher, is difficult to take into account the double requirements of competitive power and production cost on market with keen competition.
Summary of the invention:
The purpose of this utility model provides a kind of radio frequency identification body that can overcome above-mentioned deficiency of the prior art, this radio frequency identification body has been simplified and has been produced required material, equipment and production procedure, guarantee product reliability and economy, can satisfy the requirement of various occasions and various uses.
The utility model solves the problems of the technologies described above the technical scheme that is adopted: the utility model comprises skin and middle layer, it is characterized in that: described middle layer is made up of coiling, circuit chip assembly and hot melt adhesive, coiling and circuit chip assembly are positioned among the hot melt adhesive, pass through the hot melt adhesive gluing between middle layer and the skin.Remove plastics system pad material and the double faced adhesive tape in the middle layer like this from, improved and simplified technology, reduced cost.
Coiling and circuit chip assembly in the utility model are embedded among the hot melt adhesive.
Hot melt adhesive in the utility model is meant the colloid that softens and produce tackness and solidify at normal temperatures under specified temp, adopt one of ethene-vinyl acetate polymkeric substance (EVA), thermoplastic polyester, polyester ammonia, polyolefin, synthetic rubber and other chemical polymerization glue to make.These materials are produced easily, low price, and can process it by modes such as laser, electric heating, have avoided existing radio frequency identification body can only adopt the situation of expensive ultrasonic equipment heating, and then have reduced the equipment threshold, have simplified cost.
Skin in the utility model adopts one of Polyvinylchloride (PVC), polyethylene terephthalate (PET), polypropylene (PP), paper to make.In actual applications, can also adopt materials such as other chemical polymerization things or timber.
The utility model compared with prior art; have the following advantages: coiling and circuit chip assembly are embedded in the hot melt adhesive; integral body constitutes smooth middle layer after treating the hot melt adhesive cooling curing; protection and fixing coiling and the integrated chip assembly outer field double duty of gluing have simultaneously been played; production equipment and production procedure have significantly been simplified; and reduced the kind of material; integral body has reduced cost; having promoted production efficiency and yields, is a kind of novel radio radio-frequency (RF) identification body of practicality.
Description of drawings:
Fig. 1 is a structure cross-sectional schematic of the present utility model.
Embodiment:
Embodiment 1:
Referring to Fig. 1, the utility model is made up of skin 1 and middle layer 2, and wherein middle layer 2 comprises hot melt adhesive 2-1, coiling 2-2 and circuit chip assembly 2-3.
After heating makes it softening to hot melt adhesive 2-1, will make middle layer 2 among coiling 2-2 and the circuit chip assembly 2-3 embedding hot melt adhesive 2-1, wherein coiling 2-2 and circuit chip assembly 2-3 link together.Simultaneously, utilize the stickiness of hot melt adhesive 2-1 under soft state with two skin 1 gluings in the middle layer 2 both sides, to be cooledly carry out the die-cut radio frequency identification body of making again after fixing.
Embodiment 2:
Referring to Fig. 1, its structure is identical with embodiment 1.After heating makes it softening to hot melt adhesive 2-1, will make middle layer 2 among coiling 2-2 and the circuit chip assembly 2-3 embedding hot melt adhesive 2-1, wherein coiling 2-2 and circuit chip assembly 2-3 link together.Treat that hot melt adhesive 2-1 cooling is die-cut into middle layer 2 size shape of corresponding radio frequency identification body afterwards, application demand according to the radio frequency identification body chooses suitable skin 1 then, again middle layer 2 is heated, utilize the stickiness of hot melt adhesive 2-1 under soft state with two skin 1 gluings in the middle layer 2 both sides, to be cooledly make the radio frequency identification body after fixing.

Claims (4)

1, a kind of radio frequency identification body, comprise skin and middle layer, it is characterized in that: described middle layer is made up of coiling, circuit chip assembly and hot melt adhesive, and coiling and circuit chip assembly are positioned among the hot melt adhesive, passes through the hot melt adhesive gluing between middle layer and the skin.
2, radio frequency identification body according to claim 1, it is characterized in that: described coiling and circuit chip assembly are embedded among the hot melt adhesive.
3, radio frequency identification body according to claim 1, it is characterized in that: described hot melt adhesive is meant the colloid that softens and produce tackness and solidify at normal temperatures under specified temp, adopts one of ethene-vinyl acetate polymkeric substance, thermoplastic polyester, polyester ammonia, polyolefin, synthetic rubber and other chemical polymerization glue to make.
4, radio frequency identification body according to claim 1 is characterized in that: described outer one of Polyvinylchloride, polyethylene terephthalate, polypropylene, paper of adopting is made.
CNU2008200853019U 2008-04-03 2008-04-03 Wireless RFID body Expired - Fee Related CN201174132Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008200853019U CN201174132Y (en) 2008-04-03 2008-04-03 Wireless RFID body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008200853019U CN201174132Y (en) 2008-04-03 2008-04-03 Wireless RFID body

Publications (1)

Publication Number Publication Date
CN201174132Y true CN201174132Y (en) 2008-12-31

Family

ID=40201257

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2008200853019U Expired - Fee Related CN201174132Y (en) 2008-04-03 2008-04-03 Wireless RFID body

Country Status (1)

Country Link
CN (1) CN201174132Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011011987A1 (en) * 2009-07-28 2011-02-03 东莞植富商标印制有限公司 Heat transfer electronic radio frequency identification tag

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011011987A1 (en) * 2009-07-28 2011-02-03 东莞植富商标印制有限公司 Heat transfer electronic radio frequency identification tag

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20081231

Termination date: 20140403