CN201166308Y - Illuminating device - Google Patents
Illuminating device Download PDFInfo
- Publication number
- CN201166308Y CN201166308Y CNU2008200008304U CN200820000830U CN201166308Y CN 201166308 Y CN201166308 Y CN 201166308Y CN U2008200008304 U CNU2008200008304 U CN U2008200008304U CN 200820000830 U CN200820000830 U CN 200820000830U CN 201166308 Y CN201166308 Y CN 201166308Y
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- light
- emitting diode
- emitting device
- optical module
- backlight unit
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Abstract
A light-emitting device is mainly formed by a light-emitting diode module which can finish die bond and wire bonding and a pre-finished optical module, wherein the optical module is formed by respectively molding light gathering portions which can gather lights and scattering portions for scattering lights on the upper and the lower planes of a light-permeable plate, thereby effectively presenting lights generated by the light-emitting diode module after being assembled.
Description
Technical field
A kind of light-emitting device can produce light after current lead-through, the utility model refers to a kind of light-emitting device that utilizes a light-emitting diode (LED) module and an optical module to assemble especially.
Background technology
Light-emitting device generally is that general reference can produce the device in light source, and for example common fluorescent tube, bulb, light emitting diode all belong to this type of, and the alleged light-emitting device of the utility model then is based on the light-emitting device of light emitting diode as light emitting source; See also Fig. 1, be to be a kind of existing light-emitting device shown in the figure, it promptly is as light emitting source with light emitting diode, light-emitting device 10 as shown in FIG., it is in the recessed cup 102 of a base (Substrate) 101, sets firmly a light-emitting diode chip for backlight unit (light-emittingdiode, LED) 103, through finishing the routing operation with after connecting electrode, be subjected to current lead-through again, then light-emitting diode chip for backlight unit 103 can be luminous; See also Fig. 2, be to be existing another kind of light-emitting device shown in the figure, as shown in FIG., this light-emitting device 20 also has a base 201, light-emitting diode chip for backlight unit (light-emittingdiode, LED) 203 cover and are fixedly arranged in the recessed cup 202, it is to utilize two electrodes (2031 that take shape in light-emitting diode chip for backlight unit 203 surfaces, 2032), corresponding electrode position in the recessed cup 202 is fixed in adhesion respectively, to save the operation of routing, simultaneously, also can reach and make the luminous of plane on the light-emitting diode chip for backlight unit 203, can not be subjected to the influence of plain conductor, and then promote its whole luminous efficiency; But, only pipe so, with regard to present technology, as light emitting source, its efficient is still limited with light-emitting diode chip for backlight unit, with regard to the luminous efficiency of integral body, still remain significantly to be promoted, can replace the light-emitting device of existing fluorescent tube or bulb-type, so, how the light emitting diode that present majority is applied to throw light on is towards high-power direction research and development; Existing on the market at present many light emitting diodes that utilize are applied successively as the light fixture of light emitting source, for example MR16 (light emitting diode bulb) promptly is an example, its whole volume is suitable big, the space of its reservation is except that being assembled with several light emitting diodes, still need and install a reflecting part, with as light reflection surface, by this light reflection surface, promote the luminous efficiency of light emitting diode, but many or use the result of High Power LED is that the temperature of whole light-emitting device is promoted, and then have influence on whole luminous efficiency, for example, when high temperature produced, the speed of the optical attenuation of light emitting diode was then faster, situation about can't take into account like this has been an insurmountable problem since the industry always.
Summary of the invention
Because above-mentioned problem and demand, the inventor studies and analyzes at the characteristic of light and led configurations, phase can be found out appropriate solution, main purpose of the present utility model promptly is to provide a kind of luminous efficiency good, manufacture process is simple and easy, and more is applicable to the light-emitting device that uses as illumination.
In order to achieve the above object, the utility model is as light source with a light-emitting diode (LED) module, again with a process optical design, and ready-made optical module, finish the group structure with it, because this optical module is through special optical design, mainly when light is passed through, can be subjected to effectively focusing on again row and disperse, thus its luminous efficiency can significantly be promoted, moreover, can make light-emitting device integral body be tending towards slimming, so, be applied in the present bulb structure, then can make part that bulb vacates separately as the application of heat radiation.
Elaborate below in conjunction with the above and other features and advantages of accompanying drawing to the present invention (novel).
Description of drawings
Fig. 1 is a kind of existing light-emitting device.
Fig. 2 one plants existing light-emitting device in addition.
Fig. 3 is the cutaway view of the utility model light-emitting device;
Fig. 4 is the side view of the light-emitting device finished of group structure;
Fig. 5 is a preferred embodiment of the present utility model ();
Fig. 6 is another preferred embodiment of the present utility model (two);
Fig. 7 is another preferred embodiment of the present utility model (three);
Fig. 8 is another preferred embodiment of the present utility model (four);
Fig. 9 is another preferred embodiment of the present utility model (five);
Figure 10 is another preferred embodiment of the present utility model (six).
Description of reference numerals:
The 10-light-emitting device; The 101-base; The recessed cup of 102-; The 103-light-emitting diode chip for backlight unit; The 20-light-emitting device; The 201-base; The recessed cup of 202-; The 203-light-emitting diode chip for backlight unit; The 2031-electrode; The 2032-electrode;
The 30-light-emitting device; The 301-light-emitting diode (LED) module; The 3011-reflection seat; The 3012-light-emitting diode chip for backlight unit; The 3013-electrode; The 302-optical module; The 3021-substrate; The 3022-light collecting part; The 3023-scattering part; The 3024-fluorescence coating; The 303-fluorescence coating; The 304-light-emitting diode chip for backlight unit; The 3041-electrode; The 305-optical module; The 3051-substrate; The 3052-light collecting part; 3053-first light guide section; The 3054-scattering part; 3055-second light guide section;
The 40-light emitting diode bulb; The 401-transparent surface; The 402-lamp housing; The 4021-substrate; The 4022-light collecting part; The 4023-scattering part; The 403-open-work;
The 50-light-emitting device; The 501-light-emitting diode (LED) module; 502-first optical module; The 5021-substrate; The 5022-light collecting part; The 5023-scattering part; 503-second optical module; The 5031-substrate; The 5032-light collecting part; The 5033-scattering part; 504-ringwall portion; The 505-dotted line.
The specific embodiment
See also Fig. 3, it shown in the figure cutaway view for the utility model light-emitting device, light-emitting device 30 as shown in FIG., it mainly is by a light-emitting diode (LED) module 301, and one optical module 302 structure of organizing form, wherein light-emitting diode (LED) module 301 is to comprise a reflection seat 3011, an and light-emitting diode chip for backlight unit 3012, light-emitting diode chip for backlight unit 3012 is to be fixed in the reflection seat 3011, reflection seat 3011 outsides are to form one group of electrode 3013, reflection seat 3011 can be made by silicon materials or ceramic material, can also be insulating barrier on the metal-plated; In addition, optical module 302 is to comprise the substrate 3021 of a light-permeable and take shape in a light collecting part 3022 of substrate 3021 lower planes and take shape in the scattering part 3023 on plane on the substrate 3021; As shown in FIG., light-emitting diode (LED) module 301 and optical module 302 are independent moulding respectively, during the group structure, be reflection seat 3011 tops that optical module 302 covered on light-emitting diode (LED) module 301, make light-emitting diode chip for backlight unit 3012, corresponding to the light collecting part 3022 of optical module 302, light-emitting diode (LED) module 301 and optical module 302 are finished interfixed, can finish; See also Fig. 4, shown in the figure, be the side view of the light-emitting device 30 finished of group structure, as shown in FIG., when light-emitting diode chip for backlight unit 3012 after current lead-through, can carry out luminous, light partly can be after reflection seat 3011 produces reflection, directive light collecting part 3022 after light passes through substrate 3021, is promptly outwards shed by scattering part 3023, again, scattering part 3023 wherein can be according to the lighting angle demand, and for example lighting angle is concentrated or lighting angle is dispersed, and makes convex lens or concavees lens; As above, it not only can promote luminous efficiency, and the group structure of its modular, has simplified the manufacture process of light-emitting device, moreover light-emitting diode (LED) module and optical module can carry out the slimming design on demand, thus, more can enlarge the scope of its application.
See also Fig. 5, be to be a preferred embodiment of the present utility model () shown in the figure, the alleged light-emitting device 30 of the utility model as shown in FIG., be to supply to be used for existing light emitting diode bulb 40, with as its light emitting source, and its required assembling space is little, and according to design of the present utility model, it is to install the transparent surface 401 that is approaching light emitting diode bulb 40, so, the space of lamp housing 402 remainders then can be made for other relevant application, for example heat dissipation design, as shown in FIG., can form a plurality of open-works 403 at its lamp housing 402,, reach the demand of high heat radiation so that the hot gas in the lamp housing 402 is dispersed fast.
See also Fig. 6, be to be another preferred embodiment of the present utility model (two) shown in the figure, light-emitting device 30 as shown in FIG., it is in the top of light-emitting diode chip for backlight unit 3012, be coated with one deck fluorescence coating 303, so, the effect that can make the component of light that light-emitting diode chip for backlight unit 3012 sent and fluorescence coating 303 produce colour mixture is to reach the requirement that can produce multiple colour system; See also Fig. 7, be to be another preferred embodiment of the present utility model (three) shown in the figure, these light-emitting device 30 applied light-emitting diode chip for backlight unit 304, it is the light-emitting diode chip for backlight unit that covers formula for a kind of lid, that is, be utilize its surface the electrode 3041 of moulding in advance, make light-emitting diode chip for backlight unit 304 can directly be fixedly arranged on the surface of reflecting part 3011, also finish simultaneously electrically connect, the light-emitting diode chip for backlight unit of this type is because of remaking the operation of metal wire routing, so its luminous area can not be subjected to covering of metal wire, with regard to the luminous efficiency of integral body, be the light-emitting diode chip for backlight unit that is better than finishing electrically connect, again with plain conductor, its surface also can be coated with one deck fluorescence coating 303 equally, to reach the effect of mixed light and adjustment colour system; See also shown in the figure again, can also be on the surface of scattering part 3023, coating one deck fluorescence coating 3024, this fluorescence coating 3024 promptly is to allow the light that appears scattering part 3023, can produce the effect of colour mixture, its effect is equal to above-mentioned fluorescence coating 303, and directly is coated on the surface of scattering part 3023, more can further prevent fluorescence coating 3024 because of the destructiveness that high temperature produced changes, can effectively prolong the service life of light-emitting device.
See also Fig. 8, be to be another preferred embodiment of the present utility model (four) shown in the figure, light-emitting device 30 as shown in FIG., it is to be formed by a light-emitting diode (LED) module 301 and another optical module 305 structure of organizing, as shown in FIG., it mainly is the lower plane at the substrate 3051 of optical module 305, form a light collecting part 3052, and, form one and be jagged first light guide section 3053 continuously at the periphery of light collecting part 3052, and, in the last plane of substrate 3051, form a scattering part 3054, and in the periphery of scattering part 3054, form one and be jagged second light guide section 3055 continuously, as shown in FIG., this first light guide section 3053 mainly is the light that light-emitting diode chip for backlight unit 3012 is sent, can be by the light collecting part 3052 that effectively leads, to increase the effect of its optically focused, again, second light guide section 3055 then can make 3054 scattered lights of scattering part, can be shed by more efficient, to promote whole luminous efficiency.
See also Fig. 9, be to be another preferred embodiment of the present utility model (five) shown in the figure, light-emitting device 40 shown in the figure, be to be formed by a light-emitting diode (LED) module 401 and optical module 402 structure of organizing, as shown in the figure, light-emitting diodes pipe die 401 is to be made of a light-emitting diode chip for backlight unit 4011 and a pedestal 4012, again, 402 of optical modules have a substrate 4021, and its lower plane forms a light collecting part 4022, and plane then forms a scattering part 4023 on it; See also shown in the figure again, the substrate 4012 of light-emitting diode (LED) module 401 is to be plane, it is the design of areflexia portion, it is the light collecting part 4022 that utilizes optical module 402, directly be covered in the top of light-emitting diode chip for backlight unit 4011, the light that utilizes light collecting part 4022 that light-emitting diode chip for backlight unit 4011 is sent directly is subjected to the effect of optically focused, and is shed by scattering part 4023, this structure can be simplified the manufacture process of light-emitting diode (LED) module 401, significantly reduces manufacturing cost.
See also Figure 10, be to be another preferred embodiment of the present utility model (six) shown in the figure, light-emitting device 50 as shown in FIG., it is the structure of adopting stack, it mainly is to be formed by a light-emitting diode (LED) module 501, one first optical module 502 and one second optical module 503 structure of organizing, wherein, first optical module 502 is to organize structure in the top of light-emitting diode (LED) module 501, and 503 of second optical modules are further organized structures in first optical module top; See also shown in the figure again, first optical module 502 is the light collecting parts 5022 that utilize its substrate 5021 lower planes, the light that light-emitting diode (LED) module 501 is sent is assembled, make it pass through substrate 5021, shed via its scattering part 5023 again, again, between first optical module 502 and second optical module 503, be that pad is provided with a loop shaped and lighttight ringwall portion 504, so, can make the light that sheds by first optical module 504, surrounded, forcing light to be subjected to the gathering again of the light collecting part 5032 of second optical module 503 again, and wear penetrated substrate 5031 after, shed by its scattering part 5033; See also the dotted line 505 shown in the figure, it is the desired angle of light process, sees through the stack manner that the utility model is taken off, and can allow the light emission effciency better, simultaneously, can meet customized demand.
As mentioned above as can be known, the light-emitting device that the utility model is taken off, mainly be to utilize a prefabricated light-emitting diode (LED) module of finishing, and more than one optical module is made mutual collocation group structure, to make the light-emitting device of a high-luminous-efficiency, it is to supply the demand that is used for present lighting device, can meet the demand of high heat radiation simultaneously; To sum up, the utility model is after it implements according to this, and can reach really provides a kind of luminous efficiency good, and manufacture process is simple and easy, and more is applicable to the purpose of the light-emitting device that uses as illumination.
The above specific embodiment only is preferred embodiment of the present utility model, and it is illustrative for the utility model, and nonrestrictive.Those skilled in the art carries out conversion, modification even equivalence to it under the situation that does not exceed the utility model spirit and scope, these changes all can fall into claim protection domain of the present utility model.
To sum up, the utility model light-emitting device is to have novelty of patent, creativeness, and to the value of industry; The applicant mentions the application of utility model patent according to the regulation of Patent Law.
Claims (11)
1. a light-emitting device is characterized in that, comprising:
One light-emitting diode (LED) module is formed by a reflection seat and a LED chip structure, and this light-emitting diode chip for backlight unit is to be fixed in this reflection seat, and this reflection seat outside is to form one group of electrode; And
One optical module is assembled in this reflection seat top, and it is the substrate with a light-permeable, and a planar shaping of this substrate has a scattering part, and another plane then forms a light collecting part; And
After this light-emitting diode (LED) module and this optical module were finished assembling, this light collecting part of this optical module was this light-emitting diode chip for backlight unit top that is positioned at this light-emitting diode (LED) module.
2. light-emitting device according to claim 1 is characterized in that, this light-emitting diode chip for backlight unit is to finish with one group of plain conductor and this reflecting part to electrically conduct.
3. light-emitting device according to claim 2 is characterized in that, this light-emitting diode chip for backlight unit top is to be coated with a fluorescence coating.
4. light-emitting device according to claim 1 is characterized in that, this light-emitting diode chip for backlight unit is to finish with one group of electrode and this reflection seat to electrically conduct.
5. light-emitting device according to claim 4 is characterized in that, this light-emitting diode chip for backlight unit top is to be coated with a fluorescence coating.
6. light-emitting device according to claim 1 is characterized in that, around this light collecting part of this optical module, is to be formed with one first light guide section.
7. light-emitting device according to claim 6 is characterized in that, this first light guide section is continuous zigzag.
8. light-emitting device according to claim 1 is characterized in that, around this scattering part of this optical module, is to be formed with one second light guide section.
9. light-emitting device according to claim 8 is characterized in that, this second light guide section is continuous zigzag.
10. light-emitting device according to claim 1 is characterized in that this light-emitting device also comprises another optical module, and this another optical module is the ringwall portion by a loop shaped, is stacked at the top of this optical module.
11. light-emitting device according to claim 1 is characterized in that, is coated with one deck fluorescence coating on this scattering part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200008304U CN201166308Y (en) | 2008-02-28 | 2008-02-28 | Illuminating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200008304U CN201166308Y (en) | 2008-02-28 | 2008-02-28 | Illuminating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201166308Y true CN201166308Y (en) | 2008-12-17 |
Family
ID=40191698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200008304U Expired - Fee Related CN201166308Y (en) | 2008-02-28 | 2008-02-28 | Illuminating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201166308Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101761811A (en) * | 2010-02-28 | 2010-06-30 | 东莞市万丰纳米材料有限公司 | LED (light emitting diode) floodlighting device and method for improving illuminance |
| CN102518956A (en) * | 2009-05-21 | 2012-06-27 | 沈育浓 | Packaging body for luminous source |
| CN104020546A (en) * | 2014-06-19 | 2014-09-03 | 深圳市世尊科技有限公司 | Focusing motor capable of achieving optical zooming and optical vibration prevention at the same time |
| TWI476351B (en) * | 2012-03-30 | 2015-03-11 | Radiant Opto Electronics Corp | Light source module and illuminating device using the same |
-
2008
- 2008-02-28 CN CNU2008200008304U patent/CN201166308Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102518956A (en) * | 2009-05-21 | 2012-06-27 | 沈育浓 | Packaging body for luminous source |
| CN101761811A (en) * | 2010-02-28 | 2010-06-30 | 东莞市万丰纳米材料有限公司 | LED (light emitting diode) floodlighting device and method for improving illuminance |
| TWI476351B (en) * | 2012-03-30 | 2015-03-11 | Radiant Opto Electronics Corp | Light source module and illuminating device using the same |
| CN104020546A (en) * | 2014-06-19 | 2014-09-03 | 深圳市世尊科技有限公司 | Focusing motor capable of achieving optical zooming and optical vibration prevention at the same time |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081217 Termination date: 20100228 |