CN201851969U - Light emitting diode (LED) flat panel surface light source - Google Patents

Light emitting diode (LED) flat panel surface light source Download PDF

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Publication number
CN201851969U
CN201851969U CN2010202914527U CN201020291452U CN201851969U CN 201851969 U CN201851969 U CN 201851969U CN 2010202914527 U CN2010202914527 U CN 2010202914527U CN 201020291452 U CN201020291452 U CN 201020291452U CN 201851969 U CN201851969 U CN 201851969U
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CN
China
Prior art keywords
led
light source
heat radiation
led module
surface light
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010202914527U
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Chinese (zh)
Inventor
朱贵财
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WENZHOU KEDI ELECTRONICS CO Ltd
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WENZHOU KEDI ELECTRONICS CO Ltd
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Filing date
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Application filed by WENZHOU KEDI ELECTRONICS CO Ltd filed Critical WENZHOU KEDI ELECTRONICS CO Ltd
Priority to CN2010202914527U priority Critical patent/CN201851969U/en
Application granted granted Critical
Publication of CN201851969U publication Critical patent/CN201851969U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model provides a light emitting diode (LED) flat panel surface light source, which comprises a heat radiation base, high-heat-radiation patch type LED module groups, a flat panel optical outer cover and a driving power supply, wherein a plurality of square grooves are arranged in the heat radiation base, the high-heat-radiation patch type LED module groups can be arranged in each square groove, each high-heat-radiation patch type LED module group consists of a dot matrix type ceramic support frame, an LED chip, a fluorescent powder layer and a transparent encapsulating body, the flat panel optical outer cover is arranged on the heat radiation base and has an effect of controlling light spot effects, and the driving power supply is arranged at the bottom of the heat radiation base and can drive the high-heat-radiation patch type LED module groups. The LED flat panel surface light source has the characteristics of high heat radiation, obvious energy-saving effect, flexibly adjustable power and the like and can replace the traditional ceiling lamps and grille lamps to be applied to the fields of LED office illumination, school illumination, family illumination and the like.

Description

LED platen surface light source
Technical field
The utility model relates to a kind of area source, relates in particular to a kind of LED platen surface light source, and alternative traditional lamp affixed to the ceiling, Grille lamp etc. are as indoor illumination light fitting.
Background technology
Along with the lifting of InGaN blue-light LED chip internal quantum efficiency and fluorescent RE powder launching efficiency, white light LEDs has been broken through the technical bottleneck of 100lm/W, progressively is applied to the LED field of illuminating lamps, conventional light source such as alternative incandescent lamp, mercury lamp, Metal halogen lamp.At present, the LED lighting mainly adopts direct insertion LED, adopting surface mounted LED and great power LED, wherein direct insertion LED configuration design is flexible, output is big, cost is low, little, the good heat dissipation of adopting surface mounted LED volume, and single wattage of great power LED and luminous flux height, optically focused are strong.For example, LED bulb lamp, LED Grille lamp, LED platen surface light source etc. all have the above-mentioned three types LED of employing as light source.
LED platen surface light source is one of product of current market in urgent need, it rely on luminously evenly disperse, advantage such as the customizable design of profile, alternative traditional Down lamp, lamp affixed to the ceiling.At present, adopt the platen surface light source of direct insertion LED because the light source pin is long, the heat conduction is bad, and light decay is obvious; Adopt the platen surface light source of adopting surface mounted LED, adopting surface mounted LED distributes discrete, the manufacturing processing technic complexity; Adopt the platen surface light source of great power LED, because the caloric value of LED is big, optically focused is strong, is not easy to the even distribution design of light of area source.
The utility model content
In order to solve the problems of the technologies described above, the utility model provides a kind of LED platen surface light source, and described LED platen surface light source has good heat-sinking capability, and high temperature resistant, ageing-resistant, increase the service life.
In order to reach above-mentioned technical purpose, the technical scheme that the utility model adopted is: a kind of LED platen surface light source comprises: heat dissipation base, be fixed in high-heat-dispersion LED module on the described heat dissipation base, be fixed in optical shield and driving power that described high-heat-dispersion LED module light appears direction, described heat dissipation base is provided with several grooves, and described groove is used to place described high-heat-dispersion LED module; Described high-heat-dispersion LED module comprises dot matrix ceramics bracket, LED device cell, phosphor powder layer and transparent encapsulating body.
Preferably, the structure of described optical shield is a slab construction, and is installed on the described heat dissipation base.
Preferably, described driving power is placed in the bottom of heat dissipation base.
Preferably, described heat dissipation base is provided with several square grooves, settles high heat radiation adopting surface mounted LED module on each square groove.
Preferably, described heat dissipation base is aluminum alloy material or ceramic material.
Preferably, described groove is a square structure, and the structure of structure and described high-heat-dispersion LED module is complementary.
Preferably, the below of described high-heat-dispersion LED module is provided with high thermal conductive silicon fat, thereby is connected in the described groove.
Preferably, described optical shield is PC or PMMA material, and shape can be for circular or square.
Preferably, described driving power is made up of power module and outer casing of power supply, and outer casing of power supply can reduce interacting of heat dissipation base and driving power for insulation, adiabatic material.
The beneficial effect that the utility model obtained is: owing to adopted the described high-heat-dispersion LED module based on ceramics bracket to be installed on the heat dissipation base, improved the heat-sinking capability of LED platen surface light source; Because the planar optics outer cover becomes striated or frosted shape through optical design and is installed on the heat dissipation base, and light is evenly distributed, control hot spot effect; Because the power of described high-heat-dispersion LED module and quantity customize, can make the LED platen surface light source series product of different capacity.This LED platen surface light source has been realized the excellent effect that heat radiation is good, light is evenly distributed and technological problems is simplified.
Described LED platen surface light source has features such as heat radiation is high, energy-saving effect is obvious, power can be adjusted flexibly.
The below of described high-heat-dispersion LED module is provided with high thermal conductive silicon fat, thereby is connected in the described groove.Adopt the good high thermal conductive silicon fat bonding of insulating properties between the two, the heat of LED module is transmitted on the heat dissipation base.
Described optical shield is PC or PMMA material, and shape can play the effect of control hot spot for circular or square, and light is evenly distributed.
Description of drawings
Fig. 1 is the structure vertical view of a specific embodiment of the utility model LED platen surface light source;
Fig. 2 is the structural section figure that Fig. 1 cuts open along the A-A cross section;
Fig. 3 is the structural representation of high-heat-dispersion LED module of a specific embodiment of the utility model LED platen surface light source.
The specific embodiment
At first make based on the high heat radiation of 4 * 4 dot matrix ceramics brackets adopting surface mounted LED module according to the purposes of LED platen surface light source, heat dissipation base 1 is provided with several and high heat radiation adopting surface mounted LED module 2 corresponding groove 11, select several high heat radiation adopting surface mounted LED modules 2 to be installed in the groove 11, groove 11 is coated with insulating heat conductive silicon grease thin layer 5 with the bottom of high heat radiation adopting surface mounted LED module 2, adopts metal lead wire to connect between the high heat radiation adopting surface mounted LED module 2.On heat dissipation base, be provided with an aperture 12 and pass lead-in wire high heat radiation adopting surface mounted LED module 2 is connected with driving power 4, and the planar optics outer cover 3 through optical design is installed on heat dissipation base, promptly form LED platen surface light source.
Referring to Fig. 1, Fig. 2, a kind of LED platen surface light source comprises heat dissipation base 1, based on the height of 4 * 4 dot matrix ceramics brackets heat radiation adopting surface mounted LED module 2, planar optics outer cover 3 and driving power 4.Described high heat radiation adopting surface mounted LED module 2 is bonded in the groove 11 of described heat dissipation base 1 by insulation high thermal conductive silicon fat thin layer 5.On described heat dissipation base 1, be provided with an aperture 1-2 and pass lead-in wire high heat radiation adopting surface mounted LED module 2 is connected with driving power 4, and on described heat dissipation base 1, the planar optics outer cover 3 through optical design is installed.
Referring to Fig. 3, high heat radiation adopting surface mounted LED module 2, comprise adopting surface mounted LED device cell 21, form the metal connecting piece 22 of 4 * 4 dot matrix modules and the positive terminal pad that certain area is arranged 23 that LED module 2 two ends are provided with respectively and negative terminal pad 23 based on ceramic material '.

Claims (7)

1. a LED platen surface light source comprises heat dissipation base, high heat radiation adopting surface mounted LED module, planar optics outer cover and driving power, and described heat dissipation base is provided with several square grooves, and each square groove can be settled described high heat radiation adopting surface mounted LED module; Described high heat radiation adopting surface mounted LED module is made up of dot matrix ceramics bracket, led chip, phosphor powder layer and transparent encapsulating body; Described planar optics outer cover is placed on the heat dissipation base; Described driving power is placed in the heat dissipation base bottom, can drive described several high heat radiation adopting surface mounted LED modules.
2. a kind of LED platen surface light source as claimed in claim 1 is characterized in that heat dissipation base is provided with several square grooves, settles high heat radiation adopting surface mounted LED module on each square groove.
3. a kind of LED platen surface light source as claimed in claim 2 is characterized in that heat dissipation base is aluminum alloy material or ceramic material, and the size of square groove is suitable with the size of high heat radiation adopting surface mounted LED module.
4. a kind of LED platen surface light source as claimed in claim 3 when it is characterized in that high heat radiation adopting surface mounted LED module is installed on square groove, adopts the good high thermal conductive silicon fat bonding of insulating properties between the two, and the heat of LED module is transmitted on the heat dissipation base.
5. a kind of LED platen surface light source as claimed in claim 4 is characterized in that high heat radiation adopting surface mounted LED module is made up of dot matrix ceramics bracket, led chip, phosphor powder layer and the transparent encapsulating body of 4 * 4 unit.
6. a kind of LED platen surface light source as claimed in claim 1 is characterized in that the planar optics outer cover is PC or PMMA material, and shape can be for circular or square.
7. a kind of LED platen surface light source as claimed in claim 1 is characterized in that driving power is made up of power module and outer casing of power supply, and outer casing of power supply is insulation, adiabatic material.
CN2010202914527U 2010-08-07 2010-08-07 Light emitting diode (LED) flat panel surface light source Expired - Fee Related CN201851969U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010202914527U CN201851969U (en) 2010-08-07 2010-08-07 Light emitting diode (LED) flat panel surface light source

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010202914527U CN201851969U (en) 2010-08-07 2010-08-07 Light emitting diode (LED) flat panel surface light source

Publications (1)

Publication Number Publication Date
CN201851969U true CN201851969U (en) 2011-06-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010202914527U Expired - Fee Related CN201851969U (en) 2010-08-07 2010-08-07 Light emitting diode (LED) flat panel surface light source

Country Status (1)

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CN (1) CN201851969U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102364211A (en) * 2011-10-27 2012-02-29 杭州希和光电子有限公司 Light-emitting diode (LED) module
WO2013154452A1 (en) 2012-04-13 2013-10-17 Общество с ограниченной ответственностью "ДиС ПЛЮС" Method for assembling a block of radiation sources and light-emitting diode lighting device comprising such a block
CN105070850A (en) * 2015-09-24 2015-11-18 京东方科技集团股份有限公司 Pedestal of laser packaging equipment and laser packaging equipment

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102364211A (en) * 2011-10-27 2012-02-29 杭州希和光电子有限公司 Light-emitting diode (LED) module
WO2013154452A1 (en) 2012-04-13 2013-10-17 Общество с ограниченной ответственностью "ДиС ПЛЮС" Method for assembling a block of radiation sources and light-emitting diode lighting device comprising such a block
CN105070850A (en) * 2015-09-24 2015-11-18 京东方科技集团股份有限公司 Pedestal of laser packaging equipment and laser packaging equipment
CN105070850B (en) * 2015-09-24 2017-04-05 京东方科技集团股份有限公司 The base and laser package equipment of laser package equipment
US10270066B2 (en) 2015-09-24 2019-04-23 Boe Technology Group Co., Ltd. Pedestal of laser packaging device and laser packaging device

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110601

Termination date: 20130807