CN201163631Y - Image sensing component and its cover - Google Patents
Image sensing component and its cover Download PDFInfo
- Publication number
- CN201163631Y CN201163631Y CNU2008200054270U CN200820005427U CN201163631Y CN 201163631 Y CN201163631 Y CN 201163631Y CN U2008200054270 U CNU2008200054270 U CN U2008200054270U CN 200820005427 U CN200820005427 U CN 200820005427U CN 201163631 Y CN201163631 Y CN 201163631Y
- Authority
- CN
- China
- Prior art keywords
- image sensing
- wall portion
- sensing chip
- circuit substrate
- top wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
The utility model provides a cover for an image-sensing component and the image-sensing component. The image-sensing component comprises a circuit substrate, an image-sensing chip arranged on the circuit substrate, a plurality of welding wires connected between the circuit substrate and the image-sensing chip, and the cover. The cover comprises an encicling wall part and a top wall part, wherein, the encircling wall part is arranged on the circuit substrate and encircles the image-sensing chip and the welding wires, and the top wall part extends inwards from the top edge of the encircling wall part. The top wall part forms a through hole corresponding to the image-sensing chip, and the bottom surface of the top wall part is depressed upwards to form a receiving groove used for receiving the welding wires. With the receiving groove used for receiving the welding wires formed on the bottom surface of the top wall part, a distance from the top wall part to the image-sensing chip can be reduced, and the whole thickness of the image-sensing component can be reduced.
Description
Technical field
The utility model relates to a kind of image sensing component, relates in particular to a kind of image sensing component that utilizes capping that image sensing chip is encapsulated.
Background technology
Image sensing component is common in the portable electronic devices such as mobile phone, mobile computer, in order to the function of taking a picture or photographing to be provided.
Common image sensing component is to utilize many bonding wire cross-over connections between substrate and this image sensing chip, to be electrically connected this substrate and this image sensing chip.And, utilize a capping that the image sensing chip on the substrate and these bonding wires are encapsulated.
Yet under the compact trend of portable electronic devices, the active development volume is littler invariably in each producer, and the thinner image sensing component of thickness.Therefore, how not influence under structural strength and the inherent function, each assembly of image sensing component is being improved, so that image sensing component has thinner thickness, the important topic that has become each producer and paid attention to.
The utility model content
A purpose of the present utility model is to provide a kind of capping that is used to reduce the thickness of image sensing component.
The image sensing component that provides a kind of thickness thinner is provided another purpose of the present utility model.
For reaching above-mentioned purpose, the capping of the image sensing component that provides according to the utility model, in order to the image sensing chip on the capping circuit substrate and the many bonding wires that are electrically connected between described circuit substrate and the described image sensing chip, described capping comprises: surrounding wall portion, be located on the described circuit substrate and around described image sensing chip and described bonding wire; And top wall portion, extend internally and be formed with the through hole of corresponding described image sensing chip by the apical margin of described surrounding wall portion, and the bottom surface of described top wall portion upwards is recessed to form the storage tank that is useful on corresponding ccontaining described bonding wire.
Image sensing component according to the utility model provides comprises: circuit substrate; Image sensing chip is arranged on the described circuit substrate; Many root beads line is electrically connected between described circuit substrate and the described image sensing chip; And capping, comprise and being located on the described circuit substrate and around the surrounding wall portion of described image sensing chip and described bonding wire, an and top wall portion that extends internally by the apical margin of described surrounding wall portion, described top wall portion is formed with the through hole of corresponding described image sensing chip, and the bottom surface of described top wall portion upwards is recessed to form a storage tank in order to ccontaining described bonding wire.
The capping and the image sensing component of the image sensing component that provides according to the utility model, owing to be formed with the storage tank that is electrically connected on the bonding wire between image sensing chip and the circuit substrate in order to ccontaining in the top wall portion bottom surface of capping, thereby can reduce the height of top wall portion bottom surface at a distance of the image sensing chip upper surface, the integral thickness of image sensing component is reduced.
Description of drawings
Fig. 1 is the cross-sectional schematic of image sensing component of the present utility model;
Fig. 2 is the schematic perspective view of the capping of image sensing component of the present utility model;
Fig. 3 is the schematic perspective view of another angle of capping of image sensing component of the present utility model.
[primary clustering symbol description]
21 circuit substrates, 22 image sensing chips
24 cappings of 23 bonding wires
241 surrounding wall portions, 242 top wall portion
243 through holes, 244 storage tanks
25 light transmission piece
Embodiment
Relevant technology contents of the present utility model in the preferred embodiment that following conjunction with figs. provides, can clearly illustrate:
Consult Fig. 1, there is shown a kind of preferred embodiment of image sensing component of the present utility model.This image sensing component comprises circuit substrate 21, image sensing chip 22, many root beads line 23, capping 24 and light transmission piece 25.
Circuit substrate 21 has a plurality of electrode (not shown) on surface provided thereon.
Image sensing chip 22 is arranged on the circuit substrate 21, and image sensing chip 22 can be electric charge coupling sensing component (CCD) or CMOS sensing component (CMOS).And image sensing chip 22 has a plurality of weld pad (not shown) of surface periphery provided thereon.
Above-mentioned bonding wire 23 is electrically connected on respectively between the weld pad of the electrode of circuit substrate 21 and image sensing chip 22.
Light transmission piece 25 correspondences are embedded in the through hole 243.Light transmission piece 25 can be filter infrared light glass (IR cut glass), anti-reflective glass (AR glass), blue light glass (blue glass) or clear glass.
Upwards be recessed to form storage tank 244 by bottom surface in the top wall portion 242 of capping 24, with the bonding wire 23 of ccontaining cross-over connection between image sensing chip 22 and circuit substrate 21, thereby can reduce the distance of top wall portion 242 bottom surfaces at a distance of image sensing chip 22 upper surfaces, the integral thickness of image sensing component is reduced, reach the purpose of this utility model really.
The foregoing description is only for the usefulness that the utility model is described; and be not to restriction of the present utility model; those skilled in the art are under the prerequisite that does not break away from spirit and scope of the present utility model, and the various equivalent structures of being made change all within protection range of the present utility model.Protection range of the present utility model is defined by the claims.
Claims (6)
1. the capping of an image sensing component in order to the image sensing chip on the capping circuit substrate and the many bonding wires that are electrically connected between described circuit substrate and the described image sensing chip, is characterized in that described capping comprises:
Surrounding wall portion is located on the described circuit substrate and around described image sensing chip and described bonding wire; And
Top wall portion is extended internally and be formed with the through hole of corresponding described image sensing chip by the apical margin of described surrounding wall portion, and the bottom surface of described top wall portion upwards is recessed to form the storage tank that is useful on corresponding ccontaining described bonding wire.
2. capping as claimed in claim 1 is characterized in that, described storage tank extends around described through hole in the form of a ring.
3. an image sensing component is characterized in that, comprising:
Circuit substrate;
Image sensing chip is arranged on the described circuit substrate;
Many root beads line is electrically connected between described circuit substrate and the described image sensing chip; And
Capping, comprise and being located on the described circuit substrate and around the surrounding wall portion of described image sensing chip and described bonding wire, an and top wall portion that extends internally by the apical margin of described surrounding wall portion, described top wall portion is formed with the through hole of corresponding described image sensing chip, and the bottom surface of described top wall portion upwards is recessed to form a storage tank in order to ccontaining described bonding wire.
4. image sensing component as claimed in claim 3 is characterized in that, described storage tank extends around described through hole in the form of a ring.
5. image sensing component as claimed in claim 3 is characterized in that, also comprises the light transmission piece that is embedded in the described through hole.
6. image sensing component as claimed in claim 5 is characterized in that, described light transmission piece is filter infrared light glass, anti-reflective glass, blue light glass or clear glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200054270U CN201163631Y (en) | 2008-02-22 | 2008-02-22 | Image sensing component and its cover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200054270U CN201163631Y (en) | 2008-02-22 | 2008-02-22 | Image sensing component and its cover |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201163631Y true CN201163631Y (en) | 2008-12-10 |
Family
ID=40184560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200054270U Expired - Fee Related CN201163631Y (en) | 2008-02-22 | 2008-02-22 | Image sensing component and its cover |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201163631Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104811589A (en) * | 2014-01-27 | 2015-07-29 | 南昌欧菲光电技术有限公司 | Portable electronic device and camera module set thereof |
| CN104811590A (en) * | 2014-01-27 | 2015-07-29 | 南昌欧菲光电技术有限公司 | Portable electronic device and camera module set thereof |
| CN114115448A (en) * | 2020-08-26 | 2022-03-01 | 北京小米移动软件有限公司 | Electronic device |
-
2008
- 2008-02-22 CN CNU2008200054270U patent/CN201163631Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104811589A (en) * | 2014-01-27 | 2015-07-29 | 南昌欧菲光电技术有限公司 | Portable electronic device and camera module set thereof |
| CN104811590A (en) * | 2014-01-27 | 2015-07-29 | 南昌欧菲光电技术有限公司 | Portable electronic device and camera module set thereof |
| CN114115448A (en) * | 2020-08-26 | 2022-03-01 | 北京小米移动软件有限公司 | Electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20100820 Address after: 330096 torch No. five, hi tech Development Zone, Jiangxi, Nanchang 36 Patentee after: Nanchang bright light Technology Co., Ltd. Address before: Lane 128, Lane 235, Lane 6, Baoshan Road, Taipei County, Taiwan, China Patentee before: Lingguang Science & Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081210 Termination date: 20150222 |
|
| EXPY | Termination of patent right or utility model |