CN201204788Y - Encapsulation assembly for shielding electromagnetic interference - Google Patents
Encapsulation assembly for shielding electromagnetic interference Download PDFInfo
- Publication number
- CN201204788Y CN201204788Y CNU2008201126168U CN200820112616U CN201204788Y CN 201204788 Y CN201204788 Y CN 201204788Y CN U2008201126168 U CNU2008201126168 U CN U2008201126168U CN 200820112616 U CN200820112616 U CN 200820112616U CN 201204788 Y CN201204788 Y CN 201204788Y
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- CN
- China
- Prior art keywords
- crown cap
- area
- ground connection
- substrate
- electromagnetic interference
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
A package assembly for shielding electromagnetic interference, comprising: a bearing area defined by a substrate top and a grounding area surrounding the bearing area, wherein the grounding area has a plurality of grounding pads arranged along the substrate edge; at least a chip arranged in the bearing area; a metal cover arranged in the grounding area and shielding the chip, wherein only the inside part of the metal cover is electrically connected with the grounding pads via a solder and the outside part is trimmed and aligned with the substrate edge. The utility model is characterized in that on the precondition of the same bearing area, the grounding area is reduced so as to the top area of the substrate can be reduced and approaching to the top area of the metal cover, and the utility model has a decreased package assembly volume.
Description
Technical field
This utility model is relevant with communication module group, particularly relevant for a kind of encapsulation assembly of shield electromagnetic interference.
Background technology
See also Fig. 6, the encapsulation assembly 1 that the known communication module is used includes: a supporting region 3 and an access area 4 around this supporting region 3 are defined in a substrate 2 tops, and this access area 4 has a plurality of ground connection weld pads 5; One is located at the chip 6 of this supporting region 3; One crown cap 7 is to be located at this access area 4 and to cover this chip 6, and this crown cap 7 electrically connects these a plurality of ground connection weld pads 5 via a scolder (solder) 8.Known technology is via these crown cap 7 ground connection are reached shield electromagnetic interference (electro-magneticinterference; EMI) purpose.
Yet known this encapsulation assembly 1 is to electrically connect this crown cap 7 via several ground connection weld pads 5 in the fixed point mode; Known technology is for improving the structural strength of this crown cap 7 and these 4 junctions, access area, this scolder 8 can be in these crown cap 7 inboards and the outside climb tin, reach the purpose that improves structural strength further to set firmly this crown cap 7; In other words, these crown cap 7 ora terminalis must be positioned at is located at this ground connection weld pad 5 centre, and respectively this ground connection weld pad 5 will provide two needed top surface area of solder joint to lay for this scolder 8.In addition and since be positioned at the edge electronic component must with this crown cap 1 intermarginal reservation one headroom district 9, to prevent electronic component and 1 short circuit of this crown cap; Therefore, with regard to this substrate 2, the area that these a plurality of ground connection weld pads 5 are positioned at part, solder joint and the headroom district 9 of these crown cap 7 inboards also can't dwindle, and causes the purpose that can't reach volume-diminishedization.
In sum, the encapsulation assembly that the known communication module is used has above-mentioned shortcoming and haves much room for improvement.
The utility model content
The main purpose of this utility model is to provide a kind of encapsulation assembly of shield electromagnetic interference, it can further dwindle the area of access area, the top surface area that makes the top surface area of substrate can dwindle and level off to crown cap has the characteristic of encapsulation assembly volume-diminishedization.
For reaching above-mentioned purpose, the encapsulation assembly of a kind of shield electromagnetic interference provided by the utility model is characterized in that, includes:
One substrate, top define a supporting region and an access area around this supporting region, and this access area has a plurality of ground connection weld pads along this edge of substrate fate cloth;
At least one chip of being located at this supporting region; And
One crown cap, be located at this access area and cover this chip, this crown cap electrically connects this ground connection weld pad ora terminalis place and contiguous this substrate ora terminalis, and this crown cap is only inboard to electrically connect this ground connection weld pad via a scolder, generally is outside this crown cap to trim this ground connection weld pad ora terminalis.
Wherein this crown cap has a plurality of perforation, and the installation position of these a plurality of perforation is selected from top and one of them place of sidewall of this crown cap.
Wherein the installation position of these a plurality of perforation is laid along the bearing of trend of this access area.
Wherein respectively should the perforation girth less than the wireless telecommunications frequency at 1/8th of air medium wavelength.
The beneficial effects of the utility model are:
Thus, the encapsulation assembly of this shield electromagnetic interference that this utility model provides is by said structure, and it can further dwindle the area of this access area and provide this crown cap needed affixed area under the identical prerequisite of this supporting region area; It is compared to known person, and this utility model can make the top surface area of this substrate dwindle and level off to the top surface area of this crown cap, has the characteristic of encapsulation assembly volume-diminishedization.
Description of drawings
In order to describe structure of the present utility model, feature and effect place in detail, following preferred embodiment and conjunction with figs. explanation as after, wherein:
Fig. 1 is the stereogram of this utility model first preferred embodiment.
Fig. 2 is the top side view of this utility model first preferred embodiment.
Fig. 3 is the cutaway view of Fig. 2 along the 3-3 direction, mainly discloses the structure of the encapsulation assembly of shield electromagnetic interference.
Fig. 4 is the stereogram of this utility model second preferred embodiment.
Fig. 5 is the top side view of this utility model second preferred embodiment.
Fig. 6 is the structural representation of the encapsulation assembly of known communication module.
The main element symbol description
10 ... the encapsulation assembly
20 ... substrate
22 ... supporting region
24 ... the access area
26 ... the ground connection weld pad
30 ... chip
40 ... crown cap
42 ... scolder
44 ... perforation
12 ... the encapsulation assembly
50 ... substrate
54 ... the access area
56 ... the ground connection weld pad
60 ... chip
70 ... crown cap
72 ... perforation
Embodiment
See also Fig. 1 to Fig. 3, the encapsulation assembly 10 of this utility model first shield electromagnetic interference that preferred embodiment provides includes: a substrate 20, a chip 30 and a crown cap 40.
A supporting region 22 and an access area 24 around this supporting region 22 are defined in these substrate 20 tops, and this access area 24 has a plurality of ground connection weld pads 26 that distribute along these substrate 20 ora terminalis.Wherein, these substrate 20 materials are with known identical, do not give unnecessary details in this appearance.
This chip 30 is located at this supporting region 22, and this substrate 20 and this chip 30 constitute communication module group; In the present embodiment, this chip 30 is not the feature of this utility model, does not give unnecessary details in this appearance.
This crown cap 40 is to be located at this access area 24 and to cover this chip 30, and this crown cap 40 electrically connects these ground connection weld pad 26 ora terminalis places and contiguous these substrate 20 ora terminalis; The principal character of present embodiment is: this crown cap 40 is only inboard to electrically connect these ground connection weld pads 26 via a scolder (solder) 42, and these crown cap 40 outsides generally are and trim this ground connection weld pad 26 ora terminalis; This crown cap 40 has a plurality of perforation 44, and the installation position of these a plurality of perforation 44 is top and one of them place of sidewall that are selected from this crown cap 40, for the situation of inspecting these crown cap 40 these ground connection weld pads 26 of connection; In the present embodiment, the installation position of these a plurality of perforation 44 is to be positioned at the top of this crown cap 40 and to lay along the bearing of trend of this access area 24.Wherein, respectively the girth (perimeter) of this perforation 44 must be less than the wireless telecommunications frequency at 1/8th of air medium wavelength; For example: when wireless telecommunications IC frequency is 2.4GHz, its aerial wavelength is about 12.5cm, and the girth of this perforation 44 then must be less than 15.6mm; When wireless telecommunications IC frequency is 5GHz, the about 6cm of its aerial wavelength, the girth of this perforation 44 then must be less than 7.5mm.
Via said structure, because this access area 24 is generally to lay in the form of a ring around this supporting region 22, these access area 24 welding gross areas are many compared to known technology, respectively this ground connection weld pad 26 only provides a needed top surface area of solder joint that this scolder 42 is laid, and the structural strength that enough sets firmly this crown cap 40 can be provided; In other words, under the identical prerequisite of these supporting region 22 areas, this crown cap 40 is only inboard to electrically connect these ground connection weld pads 26 with this scolder 42, causes this encapsulation assembly 10 further to dwindle this access area 24 and provides this crown cap 40 needed affixed areas in the area in these crown cap 40 outsides.Thus, this encapsulation assembly 10 is compared to known technology, and it can make the top surface area of this substrate 20 dwindle and level off to the top surface area of this crown cap 40, has the characteristic of encapsulation assembly volume-diminishedization.
See also Fig. 4 and Fig. 5, the encapsulation assembly 12 of this utility model second shield electromagnetic interference that preferred embodiment provides, its structure and first preferred embodiment are roughly the same, include equally: a substrate 50, a chip 60 and a crown cap 70; Only, its difference is: this crown cap 70 has a plurality of perforation 72, the installation position of these a plurality of perforation 72 is to be selected from the top of this crown cap 70 and one of them place of sidewall, connects the situation of ground connection weld pad 56 of the access area 54 of these substrates 50 for inspecting this crown cap 70; In the present embodiment, the installation position of these a plurality of perforation 72 is to be positioned at the top of this crown cap 70 and sidewall and to lay along the bearing of trend of this access area 54; Its purpose is the viewing angle that provides different, connects the situation of these a plurality of ground connection weld pads 56 to inspect this crown cap 70 really.Thus, present embodiment can reach the effect of aforementioned preferred embodiment equally, and provides another to implement aspect.
The utility model is taken off disclosed composed component among the embodiment in preceding, only for illustrating, is not the scope that is used for limiting this case, the alternative or variation of other equivalence element, and the claim scope that also should be this case contains.
Claims (4)
1, a kind of encapsulation assembly of shield electromagnetic interference is characterized in that, includes:
One substrate, top define a supporting region and an access area around this supporting region, and this access area has a plurality of ground connection weld pads along this edge of substrate fate cloth;
At least one chip of being located at this supporting region; And
One crown cap, be located at this access area and cover this chip, this crown cap electrically connects this ground connection weld pad ora terminalis place and contiguous this substrate ora terminalis, and this crown cap is only inboard to electrically connect this ground connection weld pad via a scolder, generally is outside this crown cap to trim this ground connection weld pad ora terminalis.
2, the encapsulation assembly of shield electromagnetic interference according to claim 1 is characterized in that wherein this crown cap has a plurality of perforation, and the installation position of these a plurality of perforation is selected from top and one of them place of sidewall of this crown cap.
As the encapsulation assembly of shield electromagnetic interference as described in the claim 2, it is characterized in that 3, wherein the installation position of these a plurality of perforation is laid along the bearing of trend of this access area.
4, the encapsulation assembly of shield electromagnetic interference according to claim 1 is characterized in that, wherein girth that respectively should perforation less than the wireless telecommunications frequency at 1/8th of air medium wavelength.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201126168U CN201204788Y (en) | 2008-04-18 | 2008-04-18 | Encapsulation assembly for shielding electromagnetic interference |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201126168U CN201204788Y (en) | 2008-04-18 | 2008-04-18 | Encapsulation assembly for shielding electromagnetic interference |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201204788Y true CN201204788Y (en) | 2009-03-04 |
Family
ID=40427101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201126168U Expired - Lifetime CN201204788Y (en) | 2008-04-18 | 2008-04-18 | Encapsulation assembly for shielding electromagnetic interference |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201204788Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102738052A (en) * | 2011-04-13 | 2012-10-17 | 群登科技股份有限公司 | Tool and electronic component film coating method utilizing the same |
| CN103418873A (en) * | 2012-05-17 | 2013-12-04 | 雷科股份有限公司 | Shielding screen welding or welding releasing method implemented by aid of laser welding machine |
-
2008
- 2008-04-18 CN CNU2008201126168U patent/CN201204788Y/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102738052A (en) * | 2011-04-13 | 2012-10-17 | 群登科技股份有限公司 | Tool and electronic component film coating method utilizing the same |
| CN102738052B (en) * | 2011-04-13 | 2014-08-13 | 群登科技股份有限公司 | Tool and electronic component film coating method utilizing the same |
| CN103418873A (en) * | 2012-05-17 | 2013-12-04 | 雷科股份有限公司 | Shielding screen welding or welding releasing method implemented by aid of laser welding machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20090206 Address after: No. 1558 Zhangdong Road, Zhangjiang hi tech park, Shanghai, zip code: 200000 Co-patentee after: Huanlong Electric Co., Ltd. Patentee after: Huanxu Electronics Co., Ltd. Address before: Taiwan, Nantou County Province, china: Patentee before: Huanlong Electric Co., Ltd. |
|
| ASS | Succession or assignment of patent right |
Owner name: HUAN SOLECTRON JIANMEI ELECTRONICS CO LTD Free format text: FORMER OWNER: UNIVERSAL SCIENTIFIC INDUSTRIAL CO., LTD. Effective date: 20090206 |
|
| ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: HUANLONG ELECTRIC CO LTD |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 200000 NO.1558, ZHANGDONG ROAD, IC INDUSTRY ZONE, ZHANGJIANG HIGH-TECHNOLOGY PARK, SHANGHAI CITY TO: 201203 NO.1558, ZHANGDONG ROAD, IC INDUSTRY ZONE, ZHANGJIANG HIGH-TECHNOLOGY PARK, SHANGHAI CITY |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20100802 Address after: Zhangjiang hi tech park integrated circuit industry Zhang Road 201203 Shanghai City No. 1558 Patentee after: Huanxu Electronics Co., Ltd. Address before: 200000 Zhangjiang East Road, integrated circuit Industrial Zone, Shanghai Zhangjiang hi tech Park 1558 Co-patentee before: Huanlong Electric Co., Ltd. Patentee before: Huanxu Electronics Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20090304 |