CN102738052B - Tool and electronic component film coating method utilizing the same - Google Patents

Tool and electronic component film coating method utilizing the same Download PDF

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Publication number
CN102738052B
CN102738052B CN 201110094121 CN201110094121A CN102738052B CN 102738052 B CN102738052 B CN 102738052B CN 201110094121 CN201110094121 CN 201110094121 CN 201110094121 A CN201110094121 A CN 201110094121A CN 102738052 B CN102738052 B CN 102738052B
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electronic component
element
tool
coating
surface
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CN 201110094121
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Chinese (zh)
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CN102738052A (en
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庄行禹
许佳荣
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群登科技股份有限公司
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Abstract

一种工具以及使用了该工具的电子元件镀膜方法,电子元件的镀膜方法用以对至少一电子元件进行镀膜,该电子元件具有一元件高度,该镀膜方法包含以下步骤:提供一工具,该工具的一承载面凹设有至少一与该电子元件的至少一元件侧面的外型相同的容置槽,且该容置槽的深度小于该元件高度;将至少一电子元件放置于该容置槽中,使该容置槽的至少一侧壁面靠合于该元件侧面;朝该电子元件进行至少一导电镀膜程序,以于该电子元件的一顶面与部分的该元件侧面形成一导电涂层;此外,本发明还同时揭露该工具的结构。 Using a tool and the tool's electronics plating method, plating method for an electronic component to be coated at least one electronic component, the electronic component having an element height, the plating method comprising the steps of: providing a tool that a supporting surface of concave shape and is provided with at least one identical side surface of at least one element of the electronic component accommodating groove, and the depth of the receiving groove is smaller than the height of the element; and at least one electronic component disposed in the accommodating groove in that the receiving groove against at least one side wall element bonded to the side surface; at least one electrically conductive coating procedure toward the electronic component to a surface of the electronic component element side surfaces of the portion forming a conductive coating ; in addition, the present invention also discloses the structure of the tool.

Description

—种工具以及使用了该工具的电子元件镀膜方法 - use of the kind of tool and tool electronic component deposition method

技术领域 FIELD

[0001] 本发明涉及一种工具与一种电子元件的镀膜方法,尤其涉及一种可避免电子元件于后续焊接时因爬锡而造成短路的工具与利用该工具的镀膜方法。 [0001] The present invention relates to a tool and method for plating an electronic component, particularly to an electronic component can be prevented at the time of subsequent welding caused by wicking deposition method using the tools and the tool a short circuit.

背景技术 Background technique

[0002] 在电路设计中,举凡导线、电路板以及各式大小电子元件都会产生电磁波,而这些不同元件所产生的电磁波有可能会对整体电路效能产生影响,这种现象我们称为电磁干扰(Electro Magnetic Interference, EMI),以目前的技术来看,对于电磁干扰并没有根本的解决办法,但是优良的电路设计以及布线设计可以将电磁干扰的问题降到最小。 [0002] In circuit design, covered the wire, the size of a circuit board and a variety of electronic components will generate electromagnetic waves, and these waves are generated by different elements may have impact on overall circuit performance, a phenomenon we called electromagnetic interference ( Electro magnetic interference, EMI), with current technology, electromagnetic interference and no fundamental solution, but excellent circuit design and layout design of electromagnetic interference problems can be minimized.

[0003] 而现有的技术当中,为了隔绝各电子元件之间的电磁干扰,最常使用的方法为利用金属壳将欲保护的电子元件框住,以形成一个导体屏蔽来阻绝电磁波,进而降低电磁干扰对电路的危害。 [0003] Among the prior art to decouple the electromagnetic interference between the electronic components, most commonly used method is to be protected by a metal shell framed electronic components, to form a conductive shield to block the electromagnetic waves, thereby reducing electromagnetic interference hazards circuit.

[0004] 但随着科技的快速发展,电子元件快速小型化、高频化且分布密度越来越高,例如现阶段的移动通讯产品,已经朝向将WiF1、BT与GPS等等无线模块整合至单一模块内的方向发展,也因此电磁干扰的问题就显得更加棘手。 [0004] However, with the rapid development of technology, the rapid miniaturization of electronic components, high frequency and distribution of higher density, for example, at this stage of mobile communication products, has been toward integrating WiF1, BT and GPS module to the radio, etc. direction within a single module, and therefore the problem of electromagnetic interference becomes more difficult.

[0005] 因此,现有技术发展出对电子元件的表面镀上一层导电涂层来阻绝电磁波的技术,请参见图1与图2,图1为电子元件设置于平板工具的示意图,图2为对电子元件镀上导电涂层后的示意图。 [0005] Thus, the prior art developed surface of the electronic component coated with a layer of conductive coating to block the electromagnetic waves in the art, see Figure 1 and 2, FIG. 1 shows an electronic component is provided on the tool plate, FIG 2 It is a schematic view of the electronic component plated with a conductive coating. 要通过镀膜的方式阻绝电磁波,一般而言,电子元件100的基材11内部或上表面必须具有接地区111,此接地区111可以是电路图案或者是接地层,并且必须外露于电子元件100的侧边,此外,通常基材11之上会设置有芯片12,以及包覆该芯片12的封胶体13 ;—开始,必须将电子元件100放置于呈一平面的平板工具200之上,紧接着朝电子元件100进行镀膜程序Cl,以于电子元件100的上表面与侧边形成导电涂层14,由于导电涂层14会与外露于电子元件100侧边的接地区111电性连结,因此就能够在使用时为电子元件100阻绝电池波。 To block the electromagnetic wave by way of plating, the substrate 11 inside Generally, the electronic element 100 or the upper surface must have a ground region 111, the region 111 may be connected to the circuit pattern or a ground layer, and the electronic components 100 to be exposed to the sides, and usually will be on the base 11 is provided with a chip 12, covering the chip and the package body 1312; and - starting, the electronic component 100 is placed in the form of a flat plane on the tool 200, followed by towards the coating process the electronic component 100 Cl, to form a conductive coating on the surface of the side edge 14 of the electronic device 100, since 111 is electrically connected with the conductive coating 14 will be exposed at the side of the electronic component 100 access area, thus able to block the cell-wave electronic device 100 in use.

[0006] 请参阅图3,3图3为电子元件焊接于电路板的示意图。 [0006] Please refer to FIG. 3, 3 3 is a schematic view of an electronic component soldered to the circuit board. 由于导电涂层14会形成于电子元件100的整个侧边,因此,当电子元件100焊接于电路板300的电路图案31时,很容易就会因为焊锡32的爬锡现象,使得电路图案31与导电涂层14电性耦接而产生短路。 Since the conductive coating 14 will be formed on the entire side of the electronic device 100, therefore, when the electronic element 100 is welded 31, a circuit pattern easily circuit board 300 as will wicking phenomenon of the solder 32 so that the circuit pattern 31 and conductive coating 14 is electrically coupled to the short circuit.

发明内容 SUMMARY

[0007] 本发明所欲解决的技术问题与目的: [0007] The present invention to solve the technical problem and the desired purposes:

[0008] 缘此,本发明的主要目的在于提供一种可避免电子元件于后续焊接时因爬锡而造成短路的工具,以及利用该工具的镀膜方法,该工具与镀膜方法可避免电子元件的侧边底部于镀膜程序时形成导电涂层。 [0008] The edge of this, the main object of the present invention is to provide an electronic component can be prevented at the time of subsequent welding short circuit caused by wicking tools, and deposition method using the tool, the tool can be avoided with the method of coating the electronic component the bottom side of the conductive coating is formed at the time of plating process.

[0009] 本发明解决问题的技术手段: [0009] The present invention for solving the Problem A:

[0010] 一种工具,用以承载至少一电子元件以进行至少一导电镀膜程序,该电子元件具有一元件高度,该工具包含工具本体与容置槽;工具本体具有一承载面;容置槽凹设于该承载面,具有至少一侧壁面,该容置槽的深度小于该元件高度,且该侧壁面所围绕的形状与该电子元件的至少一元件侧面的外型相同。 [0010] A tool for carrying at least one electronic component at least one electrically conductive coating procedure, the electronic component having an element height, the tool comprising a tool body with a receiving groove; tool body having a supporting surface; receiving groove recessed in the supporting surface, having at least one side wall, the depth of the receiving groove is smaller than the height of the element, and the side wall surface surrounded with the same shape as the shape of the side surface of at least one element of the electronic component.

[0011 ] 于本发明的一较佳实施例中,该承载面与该容置槽涂布有一绝缘漆。 [0011] In a preferred embodiment of the present invention, the supporting surface and the receiving groove is coated with an insulating varnish.

[0012] 于本发明的一较佳实施例中,该容置槽的该侧壁面还具有一夹持元件,以夹持该电子元件的元件侧面。 [0012] In a preferred embodiment of the present invention, the side wall surface of the receiving groove also having a clamping member, the clamping member to the side surface of the electronic component.

[0013] 本发明还揭露一种电子元件的镀膜方法,用以对至少一电子元件进行镀膜,该电子元件具有一元件高度,该镀膜方法包含以下步骤:提供一工具,该工具的一承载面凹设有至少一与该电子元件的至少一元件侧面的外型相同的容置槽,且该容置槽的深度小于该元件高度;将至少一电子元件放置于该容置槽中,使该容置槽的至少一侧壁面靠合于该元件侧面;朝该电子元件进行至少一导电镀膜程序,以于该电子元件的一顶面与部分的该元件侧面形成一导电涂层。 [0013] The present invention also discloses a method of coating an electronic component, at least one electronic component to be coated, the electronic component having an element height, the plating method comprising the steps of: providing a tool, a bearing surface of the tool a recess provided with at least the same as the shape of the side surface of at least one element of the electronic component accommodating groove, and the depth of the receiving groove is smaller than the height of the element; and at least one electronic component disposed in the receiving groove, so that the receiving groove against at least one side wall element is bonded to the side surface; at least one electrically conductive coating procedure toward the electronic component to a surface of the electronic component element side surfaces of the portion forming a conductive coating.

[0014] 于本发明的一较佳实施例中,该电子元件的元件侧面具有至少一接地区,且该接地区位于该元件侧面的底端往上至少该容置槽的深度处。 [0014] In a preferred embodiment of the present invention, the side surface of the electronic component element having at least one contact area and the contact area at the bottom end of the side surface of the element at least up to the depth of the receiving groove.

[0015] 于本发明的一较佳实施例中,该容置槽的该侧壁面还具有一夹持元件,以于该电子元件放置于该容置槽后,夹持该电子元件的元件侧面。 [0015] In a preferred embodiment of the present invention, the side wall surface of the receiving groove also having a clamping member to be placed after the receiving groove in the electronic component, the clamping member side of the electronic component .

[0016] 于本发明的一较佳实施例中,该工具的表层涂布有一绝缘漆。 [0016] In a preferred embodiment of the present invention, the surface coating of the tool with an insulating varnish.

[0017] 于本发明的一较佳实施例中,该导电镀膜程序包含涂抹、压合、电镀、溅镀与气相沉积的至少之一。 [0017] In a preferred embodiment of the present invention, the conductive coating process comprises painting, lamination, plating, and sputtering at least one vapor deposited coating.

[0018] 于本发明的一较佳实施例中,该导电涂层由铜、镍、金与铝的至少之一所组成。 [0018] In a preferred embodiment of the present invention, the conductive coating is composed of at least one of copper, nickel, gold and aluminum components.

[0019] 于本发明的一较佳实施例中,该镀膜方法于该导电涂层形成后,还包含一步骤:朝该电子元件进行至少一绝缘镀膜程序,以于该导电涂层外形成一绝缘涂层;更进一步,该绝缘涂层包含烤漆、不锈钢、防镀层与陶瓷的至少之一。 [0019] In a preferred embodiment of the present invention, the plating method after the conductive coating is formed, further comprising a step of: performing at least one insulating coating process toward the electronic component, to form a conductive coating on the outer insulating coating; Still further, the insulating coating comprises paint, stainless steel, preventing at least one of the ceramic coating.

[0020] 本发明对照现有技术的功效: [0020] The present invention controls the effectiveness of the prior art:

[0021] 相较于现有的电子元件镀膜方法,本发明的工具由于具有可贴合该元件侧面底部的容置槽,因此配合本发明的镀膜方法时,可以避免于元件侧面底部形成导电涂层,也即当电子元件焊接于电路板时,不会因爬锡使电路板的电路图案与导电涂层电性耦接而造成短路。 [0021] Compared to the conventional method of coating an electronic component, the tool according to the present invention has a receiving groove may be attached to the bottom side of the element, and therefore when the coating with the method of the present invention, can be avoided in the bottom side member forming a conductive coating layer, i.e., when the electronic component is soldered to the circuit board, the circuit will not wicking pattern of the circuit board and the conductive coating is electrically coupled to the short circuit.

[0022] 以下结合附图和具体实施例对本发明进行详细描述,但不作为对本发明的限定。 [0022] The following embodiments in conjunction with accompanying drawings and specific embodiments of the present invention will be described in detail, but do not limit the present invention. 附图说明 BRIEF DESCRIPTION

[0023] 图1为电子元件设置于平板工具的示意图; [0023] Fig 1 a schematic view of an electronic component provided in the plate for the tool;

[0024] 图2为对电子元件镀上导电涂层后的示意图; [0024] FIG. 2 is a schematic view of the electronic component plated with a conductive coating;

[0025] 图3为电子元件焊接于电路板的示意图; [0025] FIG. 3 is a schematic view of an electronic component is soldered to a circuit board;

[0026] 图4为电子元件的示意图; [0026] FIG. 4 is a schematic diagram of the electronic device;

[0027] 图5为本发明工具的示意图; [0027] FIG. 5 is a schematic of the tool of the present invention;

[0028] 图6为电子元件放置于容置槽的示意图; [0028] FIG. 6 is a schematic view of an electronic component is placed in the receiving groove;

[0029] 图7为于电子兀件表面形成导电涂层的不意图; [0029] FIG. 7 is not intended to be an electronic conductive coating is formed on the surface Wu;

[0030] 图8为于电子元件表面形成绝缘涂层的示意图; [0030] FIG. 8 is a schematic view of an electronic component to a surface of the insulating coating is formed;

[0031] 图9为经镀膜后的电子元件焊接于电路板的示意图;以及[0032] 图10为本发明的镀膜方法流程图。 [0031] FIG. 9 is an electronic component by the film is welded to the schematic diagram of a circuit board; and a deposition method [0032] FIG. 10 is a flowchart of the present invention.

[0033] 其中,附图标记 [0033] wherein reference numerals

[0034] 电子元件100 [0034] Electronic device 100

[0035]基材 11 [0035] The substrate 11

[0036] 接地区111 [0036] The contact region 111

[0037]芯片 12 [0037] Chip 12

[0038] 封胶体13 [0038] The encapsulant 13

[0039] 导电涂层14 [0039] The conductive coating 14

[0040] 平板工具200 [0040] Tablet tool 200

[0041] 电路板300 [0041] Circuit board 300

[0042] 电路图案31 [0042] The circuit pattern 31

[0043]焊锡 32 [0043] Solder 32

[0044] 镀膜程序Cl [0044] The coating process Cl

[0045] 电子元件400 [0045] The electronic component 400

[0046]基材 41 [0046] The substrate 41

[0047] 接地区411 [0047] access area 411

[0048]芯片 42 [0048] Chip 42

[0049] 封胶单元43 [0049] The sealant 43 units

[0050] 元件侧面44 [0050] The side member 44

[0051] 导电涂层45 [0051] The conductive coating 45

[0052] 绝缘涂层46 [0052] The insulating coating 46

[0053] 元件高度h [0053] The element height h

[0054]工具 500 [0054] Tools 500

[0055] 工具本体51 [0055] The tool body 51

[0056] 承载面511 [0056] 511 bearing surface

[0057] 容置槽52 [0057] The receiving groove 52

[0058] 侧壁面521 [0058] The sidewall surface 521

[0059] 绝缘漆53 [0059] 53 insulating paint

[0060]深度 d [0060] The depth d

[0061] 导电镀膜程序C2 [0061] The electrically conductive coating process C2

[0062] 绝缘镀膜程序C3 [0062] C3 insulating coating process

[0063] 电路板600 [0063] The circuit board 600

[0064] 电路图案61 [0064] The circuit pattern 61

[0065]焊锡 62 [0065] Solder 62

具体实施方式 Detailed ways

[0066] 本发明关于一种工具与一种电子元件的镀膜方法,尤指一种可避免电子元件于后续焊接时因爬锡而造成短路的工具与利用该工具的镀膜方法。 [0066] The present invention relates to a tool and method for plating an electronic component, particularly to an electronic component can be prevented at the time of subsequent welding caused by wicking deposition method using the tools and the tool a short circuit. 以下兹列举一较佳实施例以说明本发明,然本领域技术人员皆知此仅为一举例,而并非用以限定发明本身。 Hereby include the following embodiment a preferred embodiment to illustrate the invention, however this is well known to those skilled in only a way of example and not intended to limit the invention itself. 有关此较佳实施例的内容详述如下。 In relation to the preferred embodiment are detailed below.

[0067] 请参阅图4与图5,图4为电子元件的示意图,图5为本发明工具的示意图。 [0067] Please refer to FIG. 4 and FIG. 5, FIG. 4 is a schematic diagram illustrating an electronic device, the tool of the present invention in FIG. 5. 本发明的工具500是用以承载至少一电子元件400以进行至少一导电镀膜程序,该电子元件400具有一元件高度h,该工具500是包含工具本体51与容置槽52 ;于本实施例中,仅以一简单的电子元件结构作为示范,电子元件400可以具有基材41、芯片42与封胶单元43,基材41可以于内部埋设接地区411,当然接地区411也可设置于基材41的上表面,只要该接地区411外露于电子元件400的元件侧面44即可;芯片42则设置于基材41之上,并以封胶单元43包覆。 500 is a tool of the present invention for carrying at least one electronic component 400 to perform at least one electrically conductive coating procedure, the electronic component element 400 having a height h, in terms tool 500 comprising a tool body 51 and the receiving groove 52; in this embodiment in only a simple structure as an exemplary electronic device, the electronic component 400 may have a substrate 41, chip 42 and the sealant unit 43, the substrate 41 may be embedded inside the contact area 411, contact area 411 of course also be provided on the base the upper surface of member 41, as long as the exposed ground area 411 of the electronic component element 44 to the side surface 400; chip 42 is disposed on the substrate 41, and is coated with encapsulant 43 units.

[0068] 工具本体51是具有一承载面511 ;容置槽52是凹设于该承载面511,具有至少一侧壁面521,该容置槽52的深度d是小于该元件高度h,且该侧壁面521所围绕的形状是与该电子元件400的至少一元件侧面44的外型相同。 [0068] The tool body 51 having a bearing surface 511; receiving groove 52 is recessed in the bearing surface 511, 521 having at least one side wall, the receiving groove 52 is less than the depth D height H of the element, and the shape of the sidewall surface 521 is the same shape surrounded by at least one element of the side surface 44 of the electronic element 400.

[0069] 于本发明的一较佳实施例中,该承载面511与该容置槽52是涂布有一绝缘漆53,当然工具本体51的侧面或底面也可涂布绝缘漆53,但不影响本工具500的功能。 [0069] In a preferred embodiment of the present invention, the bearing surface 511 of the receiving groove 52 is coated with a varnish 53, of course, side or bottom of the tool body 51 may be coated with an insulating paint 53, but not affect the function of this tool 500.

[0070] 于本发明的一较佳实施例中,该容置槽52的该侧壁面521还可以具有一夹持元件(图未示),以夹持该电子元件400的元件侧面44,该夹持元件的实施方式可以有很多种态样,例如以片状的夹持面配合弹簧以夹持该电子元件400,或者以旋钮移动片状夹持面来夹持该电子元件400,只要能够使贴合电子元件400的元件侧面44即可。 [0070] In a preferred embodiment of the present invention, the side wall surface 521 of the receiving groove 52 may also have a clamping member (not shown), to the side surface of the clamping member 400 of electronic component 44, the embodiment clamping element can have a variety of aspects, such as a sheet holding surface to fit the spring 400 to sandwich the electronic component, or in a sheet-like knob to move clamping surface 400 to clamp the electronic component, as long as that the bonding element 44 side of the electronic element 400 can.

[0071] 请同时参阅图6、图7、图8、图9与图10,图6为电子元件放置于容置槽的示意图,图7为于电子元件表面形成导电涂层的示意图,图8为于电子元件表面形成绝缘涂层的示意图,图9为经镀膜后的电子元件焊接于电路板的示意图,图10为本发明的镀防方法流程图。 [0071] Please refer to FIG. 6, FIG. 7, FIG. 8, FIG. 9 and FIG. 10, FIG. 6 is a schematic view of an electronic component is placed in the receiving groove, FIG. 7 is a conductive coating is formed on the surface of the electronic component of the schematic of FIG. 8 is a schematic insulating coating formed on the surface of the electronic component, the electronic component of FIG. 9 is a schematic view after the coating is soldered to a circuit board, preventing the plating method of the present invention 10 is a flowchart of FIG. 本发明的镀膜方法是用以对至少一电子元件400进行镀膜,该电子元件400是具有一元件高度h,该镀膜方法包含以下步骤: Coating process of the present invention is used for at least one electronic component 400 is coated, the electronic component 400 is a component having a height h, in terms plating method comprising the steps of:

[0072] SlOl:提供一工具500,该工具500的一承载面511凹设有至少一与该电子元件400的至少一元件侧面44的外型相同的容置槽52,且该容置槽52的深度d小于该元件高度h。 [0072] SlOl: providing a tool 500, the tool supporting surface 500 of a recess 511 is provided with at least one of the at least one electronic component element side surfaces 44 of the same shape accommodating grooves 52 400, and the receiving groove 52 the depth d is less than the element height h.

[0073] S103:将至少一电子元件400放置于该容置槽52中,使该容置槽52的至少一侧壁面521靠合于该元件侧面44。 [0073] S103: at least one electronic component 400 disposed in the accommodating groove 52, the receiving groove 52 so that at least one side wall 521 against side surface 44 bonded to the element.

[0074] S105:朝该电子元件400进行至少一导电镀膜程序C2,以于该电子元件400的顶面与外露于容置槽52外的该元件侧面44形成一导电涂层45。 [0074] S105: at least one electrically conductive coating procedure C2 toward the electronic component 400 to the top surface of the receiving groove is exposed to the outer member 52 of the side surface of the electronic component 400 is formed of a conductive coating 44 45.

[0075] 于本发明的一较佳实施例中,该电子元件400的元件侧面44具有至少一接地区411,且该接地区411位于该元件侧面44的底端往上至少该容置槽52的深度d处,因此于进行导电镀膜程序C2时,导电涂层45即可与接地区411电性连结。 [0075] In a preferred embodiment of the present invention, the side member 44 of the electronic component 400 having a contact area of ​​at least 411, and the contact region 411 at the bottom side 44 of the element at least up to the receiving groove 52 when the depth d, electrically conductive coating procedures thus performed in C2, and the conductive coating 45 can be electrically connected to the ground region 411.

[0076] 此外,如同前面所述,该容置槽52的该侧壁面521还可以具有一夹持元件,以于该电子元件400放置于该容置槽52后,夹持该电子元件400的元件侧面44 ;还进一步,该工具500的表层涂布有一绝缘漆53,以避免于导电镀膜程序C2因同时受到镀膜而逐渐影响到批次镀膜时的精度。 [0076] Further, as described above, the receiving groove 521 of the sidewall surface 52 may also have a clamping member to be placed in the electronic component 400 after the receiving groove 52, the clamping element 400 of the electronic side member 44; further, the tool surface 500 is coated with an insulating varnish 53, in order to avoid the accuracy of the conductive coating process while being plated by C2 is gradually affecting the coating batch.

[0077] 于本发明的一较佳实施例中,上述的导电镀膜程序C2可以包含涂抹、压合、电镀、溅镀、气相沉积或其它可以于电子元件400表面形成导电镀膜的方法;此外该导电涂层可以是由铜、镍、金、铝或其它导体所组成。 [0077] In a preferred embodiment of the present invention, the above conductive coating process C2 may comprise smearing, pressing, plating, sputtering, vapor deposition, or other surface of the electronic component 400 may be a conductive film forming method; In addition, the conductive coating may be copper, nickel, gold, aluminum, or other conductors formed. [0078] 于本发明的一较佳实施例中,该镀膜方法于步骤S105之后,还可以包含: [0078] In a preferred embodiment of the present invention, after the deposition method in the step S105, it may further comprise:

[0079] S107:朝该电子元件400进行至少一绝缘镀膜程序C3,以于该导电涂层45外形成一绝缘涂层46,以进一步防止导电涂层45被碰触的机会,同时也可使电子元件400的外型还为美观;还进一步,该绝缘涂层46可以是烤漆、不锈钢、防镀层、陶瓷或其它绝缘材料;举例而言,若要进行绝缘镀膜程序C3,则前述步骤S105中可以进行两次的导电镀膜程序C2,第一次先镀上铜涂层以作为阻绝电磁波的主要涂层,紧接着再镀上镍涂层,以让后续进行绝缘镀膜程序C3时,能够顺利的使绝缘涂层46附着于导电涂层45之外。 [0079] S107: at least one insulating coating process C3 toward the electronic component 400, an insulating coating 46 is formed on the outer conductive coating 45 to further prevent the opportunity to be touched the conductive coating 45, while allowing exo electronic element 400 is further appearance; further, the insulating coating 46 may be a paint, stainless steel, plating resist, ceramic or other insulating material; for example, an insulation coating process to C3, then the step S105 may be twice the conductive coating process C2, the first first coating of copper plated as primary coating hinders the electromagnetic wave, and then immediately plated nickel coating, to allow for subsequent coating process the insulating C3, the smooth the insulating coating 46 adhered to the outside conductive coating 45.

[0080] 于上述步骤实施完毕后,即可将经过镀膜后的电子元件400自工具500取出,当电子元件400要焊接于电路板600的电路图案61时,即使焊锡62产生了爬锡现象,也难以接触到导电涂层45。 [0080] After completion of the above steps embodiment, tool 500 can be removed 400 from the electronic components through the coating, when the electronic components 400 to be soldered to the circuit pattern 61 of the circuit board 600, even if the solder 62 generates a wicking phenomenon, it is difficult to come into contact with the conductive coating 45.

[0081] 综合以上所述,相较于现有的电子元件镀膜方法,本发明的工具500由于具有可贴合该元件侧面44底部的容置槽52,因此配合本发明的镀膜方法时,可以避免于元件侧面44底部形成导电涂层45,也即当电子元件400焊接于电路板600时,不会因爬锡使电路板600的电路图案61与导电涂层45电性耦接而造成短路。 [0081] Based on the above the, compared to the conventional method of coating an electronic component, the tool 500 of the present invention, since having a receiving groove may be attached to the bottom side 44 of the element 52, with the plating method of the present invention, electrically conductive coating 45 to prevent the bottom side member 44 is formed, i.e. when the electronic device 400 is soldered to the circuit board 600, the circuit will not wicking patterns 61 and the circuit board 600, conductive coating 45 is electrically coupled to a short circuit caused by .

[0082]当然,本发明还可有其它多种实施例,在不背离本发明精神及其实质的情况下,熟悉本领域的技术人员当可根据本发明作出各种相应的改变和变形,但这些相应的改变和变形都应属于本发明所附的权利要求的保护范围。 [0082] Of course, the present invention may have a variety of other embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding modifications and variations according to the present invention, but these corresponding changes and variations should fall within the scope of the appended claims.

Claims (10)

1.一种工具,用以承载至少一电子元件以进行至少一导电镀膜程序,该电子元件具有一元件高度,且该电子元件的元件侧面具有至少一接地区,其特征在于,该工具包含: 一工具本体,具有一承载面;以及一容置槽,凹设于该承载面,具有至少一侧壁面,该容置槽的深度小于该元件高度,且该侧壁面所围绕的形状与该电子元件的至少一元件侧面的外型相同,该接地区位于该元件侧面的底端往上至少该容置槽的深度处。 1. A tool for carrying at least one electronic component at least one electrically conductive coating procedure, the electronic component having an element height, and the side surface of the electronic component element having at least one contact area, characterized in that, the tool comprising: a tool body having a supporting surface; and an accommodating groove recessed in the supporting surface, having at least one side wall, the depth of the receiving groove is smaller than the height of the element, and the shape of the side wall surface surrounded with the electronic at least one element of the same exterior side surface of the element, the element connection area at the bottom of the side surface of at least up to the depth of the receiving groove.
2.根据权利要求1所述的工具,其特征在于,该承载面与该容置槽涂布有一绝缘漆。 2. The tool according to claim 1, characterized in that the supporting surface of the receiving groove is coated with an insulating varnish.
3.根据权利要求1所述的工具,其特征在于,该容置槽的该侧壁面还具有一夹持元件,以夹持该电子元件的元件侧面。 3. The tool of claim 1, wherein the side wall surface of the receiving groove also having a clamping member, the clamping member to the side surface of the electronic component.
4.一种电子元件的镀膜方法,用以对至少一电子元件进行镀膜,该电子元件具有一元件高度,且该电子元件的元件侧面具有至少一接地区,其特征在于,该镀膜方法包含以下步骤: 提供一工具,该工具的一承载面凹设有至少一与该电子元件的至少一元件侧面的外型相同的容置槽,且该容置槽的深度小于该元件高度,该接地区位于该元件侧面的底端往上至少该容置槽的深度处; 将至少一电子元件放置于该容置槽中,使该容置槽的至少一侧壁面靠合于该元件侧面;以及朝该电子元件进行至少一导电镀膜程序,以于该电子元件的一顶面与部分的该元件侧面形成一导电涂层。 4. A method of coating an electronic component, at least one electronic component to be coated, the electronic component having an element height, and the side surface of the electronic component element having at least one contact area, wherein the coating method comprising steps of: providing a tool, a concave bearing surface provided with at least one of the tool shape and the same side of the at least one element of the electronic component accommodating groove, and the depth of the receiving groove is smaller than the height of the element, the bonding region the bottom end of the element located at least up to the side surface of the accommodating groove depth; at least one electronic component disposed in the receiving groove, so that the receiving groove against at least one side wall engaged with the side member; and towards the at least one electronic component electrically conductive coating procedure, a top surface to the side surface of the electronic component element is formed in a portion of the conductive coating.
5.根据权利要求4所述的电子元件的镀膜方法,其特征在于,该容置槽的该侧壁面还具有一夹持元件,以于该电子元件放置于该容置槽后,夹持该电子元件的元件侧面。 The coating method according to the electronic component as claimed in claim, wherein the side wall surface of the receiving groove also having a clamping member, in that the electronic component is placed on the rear of the receiving groove, the clamping the electronic component element side surfaces.
6.根据权利要求4所述的电子元件的镀膜方法,其特征在于,该工具的表层涂布有一绝缘漆。 The coating method according to Claim electronic component, wherein the surface coating of the tool with an insulating varnish.
7.根据权利要求4所述的电子元件的镀膜方法,其特征在于,该导电镀膜程序包含涂抹、压合、电镀、溅镀与气相沉积的至少之一。 The coating method according to the electronic component as claimed in claim, wherein the conductive coating comprises painting program, pressing, plating, at least one of sputtering and vapor deposition.
8.根据权利要求4所述的电子元件的镀膜方法,其特征在于,该导电涂层由铜、镍、金与铝的至少之一所组成。 The coating method according to Claim electronic component, wherein the conductive coating of copper, nickel, aluminum, gold and at least one of the components.
9.根据权利要求4所述的电子元件的镀膜方法,其特征在于,于该导电涂层形成后,还包含一步骤:朝该电子元件进行至少一绝缘镀膜程序,以于该导电涂层外形成一绝缘涂层。 9. The method of coating the electronic component 4 according to claim, characterized in that, after the conductive coating is formed on, further comprising a step of: performing at least one insulating coating process toward the electronic component, the conductive coating on the outer forming an insulating coating.
10.根据权利要求9所述的电子元件的镀膜方法,其特征在于,该绝缘涂层包含烤漆、不锈钢、防镀层与陶瓷的至少之一。 10. A method of coating an electronic component according to claim 9, characterized in that the insulating coating comprises paint, stainless steel, preventing at least one of the ceramic coating.
CN 201110094121 2011-04-13 2011-04-13 Tool and electronic component film coating method utilizing the same CN102738052B (en)

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Citations (2)

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Publication number Priority date Publication date Assignee Title
CN1442033A (en) 2000-04-21 2003-09-10 电子设备屏蔽公司 EMI and RFI shielding for printed circuit boards
CN201204788Y (en) 2008-04-18 2009-03-04 环隆电气股份有限公司 Encapsulation assembly for shielding electromagnetic interference

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JP2007165101A (en) * 2005-12-13 2007-06-28 Orion Denki Kk Electronic equipment equipped with antistatic function

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1442033A (en) 2000-04-21 2003-09-10 电子设备屏蔽公司 EMI and RFI shielding for printed circuit boards
CN201204788Y (en) 2008-04-18 2009-03-04 环隆电气股份有限公司 Encapsulation assembly for shielding electromagnetic interference

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