CN201163628Y - 一种改进的led光源封装结构 - Google Patents

一种改进的led光源封装结构 Download PDF

Info

Publication number
CN201163628Y
CN201163628Y CNU2008201012167U CN200820101216U CN201163628Y CN 201163628 Y CN201163628 Y CN 201163628Y CN U2008201012167 U CNU2008201012167 U CN U2008201012167U CN 200820101216 U CN200820101216 U CN 200820101216U CN 201163628 Y CN201163628 Y CN 201163628Y
Authority
CN
China
Prior art keywords
tube core
open hole
circular open
light source
transmission package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2008201012167U
Other languages
English (en)
Inventor
林明德
林威谕
王明煌
曾有助
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CONCORD OPTO ELECTRIC TECH (QUANZHOU) Co Ltd
Original Assignee
CONCORD OPTO ELECTRIC TECH (QUANZHOU) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CONCORD OPTO ELECTRIC TECH (QUANZHOU) Co Ltd filed Critical CONCORD OPTO ELECTRIC TECH (QUANZHOU) Co Ltd
Priority to CNU2008201012167U priority Critical patent/CN201163628Y/zh
Application granted granted Critical
Publication of CN201163628Y publication Critical patent/CN201163628Y/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

一种改进的LED光源封装结构，包括设置有罩住对应LED管芯的圆形开口孔的反射框架，圆形开口孔中灌注有用于包封LED管芯和部分连接线路的透光封装体，其特征在于：所述反射框架的每个圆形开口孔的顶面周沿设有固胶凹槽，该固胶凹槽灌注有与圆形开口孔中一体成型的透光封装体。利用固胶凹槽可提高透光封装体的粘着牢固度，保证透光封装体与发射框架稳固黏结在一起，防止透光封装体松脱，确保管芯的光出射效率，保护LED管芯和线路不受外界侵蚀。

Description

一种改进的LED光源封装结构
技术领域
本实用新型涉及发光二极管(LED)光源封装结构。
背景技术
如图1所示，现有发光二极管(LED)光源的封装结构是将发光二极管管芯1(以下简称LED管心)固定安装在电路板2(PCB或铝线路板)的绝缘层21上，电路板的绝缘层21顶面覆盖有电极铜箔22、底面叠置一高散热金属基板3上，LED管芯1的两电极端分别通过打线4与电路板的对应电极铜箔22作电性连接；对应设置有圆形开口孔51的反射框架5固定粘接在电路板2顶面，反射框架5的每个圆形开口孔51分别罩住对应的LED管芯1，每个圆形开口孔51中灌注环氧树脂、硅胶或其他透光材料制成的透光封装体6，以包封LED管芯1和部分连接线路。
上述结构的发光二极管(LED)光源的封装结构的不足是：灌注于反射框架圆形开口孔中的透光封装体在不同温、湿度变化过程中或受外力作用后，容易与反射框架圆形开口孔内周面发生脱层，以致透光封装体与反射框架圆形开口孔内周面分离，导致透光封装体与反射框架圆形开口孔内周面之间形成间隙甚至透光封装体脱落；如此，包封LED管芯和部分连接线路的环氧树脂的形状受到破坏，且空气将渗入透光封装体与反射框架圆形开口孔内周面之间脱层后所形成的间隙中，管芯折射率与空气折射率相差太大，致使管芯内部的全反射临界角很小，其有源层产生的光只有小部分被取出，大部分易在管芯内部经多次反射而被吸收，易发生全反射导致过多光损失，影响管芯的光出射效率，并可能导致LED管芯和连接线路受外界侵蚀，影响LED管芯和连接线路的安全，降低其使用寿命。
发明内容
本实用新型的目的是克服现有发光二极管(LED)光源的封装结构不合理，以致透光封装体容易与反射框架圆形开口孔内周面发生脱层、分离影响管芯的光出射效率和导致LED管芯和连接线路受外界侵蚀的技术问题，提高一种改进的LED光源封装结构，杜绝透光封装体与反射框架圆形开口孔内周面出现脱层、分离的现象，保证透光封装体与反射框架粘接牢固，确保管芯的光出射效率，保护LED管芯和线路不受外界侵蚀。
本实用新型的目的通过如下技术方案实现：
一种改进的LED光源封装结构，包括设置有罩住对应LED管芯的圆形开口孔的反射框架，圆形开口孔中灌注有用于包封LED管芯和部分连接线路的透光封装体，其特征在于：所述反射框架的每个圆形开口孔的顶面周沿设有固胶凹槽，该固胶凹槽灌注有与圆形开口孔中一体成型的透光封装体。
所述透光封装体的顶部为凸球面型或平面型。
所述反射框架圆形开口孔顶面周沿的固胶凹槽的横截面为弧形。
所述反射框架为高导热金属材料制成，反射框架的圆形开口孔孔底设有与反射框架一体成型用于固定安装LED管芯的桥接底部；该桥接底部上设有沿圆形开口孔轴向布置供LED管芯打线穿过的过线空间；LED管芯固装于桥接底部上，其两电极端分别通过穿过打线与电路板对应电极电导接。
本实用新型具有以下有益效果：
在反射框架的每个圆形开口孔的顶面周沿环设有固胶凹槽，该固胶凹槽中灌注有与圆形开口孔中一体成型的透光封装体，利用固胶凹槽可提高透光封装体的粘着牢固度，保证透光封装体与发射框架稳固黏结在一起，防止透光封装体松脱。本封装结构解决了现有透光封装体容易与反射框架圆形开口孔内周面发生脱层、分离的技术问题，保证透光封装体与反射框架粘接牢固，确保管芯的光出射效率，保护LED管芯和线路不受外界侵蚀。
附图说明
下面结合附图对本实用新型作进一步详细说明。
图1是现有发光二极管(LED)光源封装结构的剖视示意图。
图2是本实用新型第一实施例的剖视示意图。
图3是图2中的反射框架的A部放大示意图。
图4是图3的俯视图。
图5是本实用新型第一实施例的透光封装体顶部为平面型的结构示意图(局部)。
图6是本实用新型第二实施例的剖视示意图。
图7是图6中的反射框架的B部放大示意图。
图8是图7的俯视图。
具体实施方式
实施例1：参照图2。一种改进的LED光源封装结构，其LED管心1固定安装在电路板2的绝缘层21上，电路板的绝缘层21顶面覆盖有电极铜箔22、底面叠置一高散热金属基板3上，LED管芯1的两电极端分别通过打线4与电路板的对应电极铜箔22作电性连接；对应设置有圆形开口孔51的反射框架5固定粘接在电路板2顶面，反射框架5的每个圆形开口孔51分别罩住对应的LED管芯1，每个圆形开口孔51的顶面周沿分别设有横截面为弧形的固胶凹槽52(详见图3、图4)；每个固胶凹槽52和对应的圆形开口孔51中灌注一体成型的透光封装体6。透光封装体6的顶部为凸球面型。但不局限于此，见图5，透光封装体6的顶部也可采用平面型。固胶凹槽52的横截面弧形最好是优弧。
实施例2：本实施例与实施例1不同的是：
参照图6至图8。反射框架5采用高导热金属材料如铝、铜、铝铜合金制成；反射框架5的每个圆形开口孔51孔底中部均设有与反射框架5一体成型用于固定安装LED管芯1的条形桥接底部53，桥接底部53两侧与圆形开口孔51的内壁之间对应具有供穿线的空隙54。LED管芯1通过胶粘或共晶焊接方式倒置固定在桥接底部53的顶面上，电路板2配置于反射框架5的下方，反射框架5通过绝缘胶粘接在电路板2上或与电路板2留有绝缘间隙。LED管芯1的两电极端分别打线4与电路板的对应电极铜箔22作电性连接，搭接线4的一端与LED管芯1的对应电极端导接、另一端穿过空隙54与电路板2的对应电极铜箔22作电性连接。本实施例直接利用高导热性的反射框架5进行散热，而不再设置高散热金属基板。其余结构与实施例1相同，在此不再赘述。
以上所述，仅为本实用新型较佳实施例而已，故不能以此限定本实用新型实施的范围，即依本实用新型申请专利范围及说明书内容所作的等效变化与修饰，皆应仍属本实用新型专利涵盖的范围内。

Claims (7)

1.一种改进的LED光源封装结构，包括设置有罩住对应LED管芯的圆形开口孔的反射框架，圆形开口孔中灌注有用于包封LED管芯和部分连接线路的透光封装体，其特征在于：所述反射框架的每个圆形开口孔的顶面周沿设有固胶凹槽，该固胶凹槽灌注有与圆形开口孔中一体成型的透光封装体。
2.根据权利要求1所述的LED光源封装结构，其特征在于：所述透光封装体的顶部为凸球面型或平面型。
3.根据权利要求1或2所述的LED光源封装结构，其特征在于：所述反射框架圆形开口孔顶面周沿的固胶凹槽的横截面为弧形。
4.根据权利要求3所述的LED光源封装结构，其特征在于：所述固胶凹槽的横截面弧形为优弧。
5.根据权利要求1或2所述的LED光源封装结构，其特征在于：所述反射框架为高导热金属材料制成，反射框架的圆形开口孔孔底设有与反射框架一体成型用于固定安装LED管芯的桥接底部；该桥接底部上设有沿圆形开口孔轴向布置供LED管芯打线穿过的过线空间；LED管芯固装于桥接底部上，其两电极端分别通过穿过打线与电路板对应电极电导接。
6、根据权利要求5所述的LED光源封装结构，其特征在于：所述反射框架圆形开口孔顶面周沿的固胶凹槽的横截面为弧形。
7.根据权利要求6所述的LED光源封装结构，其特征在于：所述固胶凹槽的横截面弧形为优弧。
CNU2008201012167U 2008-01-18 2008-01-18 一种改进的led光源封装结构 Expired - Fee Related CN201163628Y (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008201012167U CN201163628Y (zh) 2008-01-18 2008-01-18 一种改进的led光源封装结构

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008201012167U CN201163628Y (zh) 2008-01-18 2008-01-18 一种改进的led光源封装结构

Publications (1)

Publication Number Publication Date
CN201163628Y true CN201163628Y (zh) 2008-12-10

Family

ID=40184557

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2008201012167U Expired - Fee Related CN201163628Y (zh) 2008-01-18 2008-01-18 一种改进的led光源封装结构

Country Status (1)

Country Link
CN (1) CN201163628Y (zh)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102142597A (zh) * 2009-09-22 2011-08-03 三星电机株式会社 天线图案框架、制造方法、模具、电子装置及壳制造方法
CN106531865A (zh) * 2016-10-24 2017-03-22 东莞市凯昶德电子科技股份有限公司 一种紫外led封装用的围坝陶瓷基板制备方法
CN106952996A (zh) * 2017-04-26 2017-07-14 深圳国冶星光电科技股份有限公司 一种led封装器件及其封装方法
CN107170733A (zh) * 2015-12-19 2017-09-15 嘉兴山蒲照明电器有限公司 Led灯丝及其led球泡灯
US10711951B1 (en) 2014-09-28 2020-07-14 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US10784428B2 (en) 2014-09-28 2020-09-22 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US10790419B2 (en) 2017-12-26 2020-09-29 Jiaxing Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US10790420B2 (en) 2017-12-26 2020-09-29 Jiaxing Super Lighting Electric Appliance Co., Ltd Light bulb with a symmetrical LED filament
US10976010B2 (en) 2015-08-17 2021-04-13 Zhejiang Super Lighting Electric Appliance Co., Lt LED filament and led light bulb
US11035525B2 (en) 2015-08-17 2021-06-15 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb
US11073248B2 (en) 2014-09-28 2021-07-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
US11085591B2 (en) 2014-09-28 2021-08-10 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11168843B2 (en) 2014-09-28 2021-11-09 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
US11421827B2 (en) 2015-06-19 2022-08-23 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11525547B2 (en) 2014-09-28 2022-12-13 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11543083B2 (en) 2014-09-28 2023-01-03 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11690148B2 (en) 2014-09-28 2023-06-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US11686436B2 (en) 2014-09-28 2023-06-27 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and light bulb using LED filament
US12007077B2 (en) 2014-09-28 2024-06-11 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102142597A (zh) * 2009-09-22 2011-08-03 三星电机株式会社 天线图案框架、制造方法、模具、电子装置及壳制造方法
CN102142597B (zh) * 2009-09-22 2014-03-26 三星电机株式会社 天线图案框架、制造方法、模具、电子装置及壳制造方法
US9419326B2 (en) 2009-09-22 2016-08-16 Samsung Electro-Mechanics Co., Ltd. Antenna pattern frame, method and mold for manufacturing the same, method for manufacturing an electronic device case, and electronic device
US11543083B2 (en) 2014-09-28 2023-01-03 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11629825B2 (en) 2014-09-28 2023-04-18 Zhejiang Super Lighting Electric Appliance Co., Lt LED light bulb with curved filament
US12007077B2 (en) 2014-09-28 2024-06-11 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US11997768B2 (en) 2014-09-28 2024-05-28 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US10711951B1 (en) 2014-09-28 2020-07-14 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US10784428B2 (en) 2014-09-28 2020-09-22 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US11892127B2 (en) 2014-09-28 2024-02-06 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED bulb lamp
US11686436B2 (en) 2014-09-28 2023-06-27 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and light bulb using LED filament
US11690148B2 (en) 2014-09-28 2023-06-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US11525547B2 (en) 2014-09-28 2022-12-13 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11187384B2 (en) 2014-09-28 2021-11-30 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
US11168843B2 (en) 2014-09-28 2021-11-09 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
US11073248B2 (en) 2014-09-28 2021-07-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
US11085591B2 (en) 2014-09-28 2021-08-10 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11421827B2 (en) 2015-06-19 2022-08-23 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11035525B2 (en) 2015-08-17 2021-06-15 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb
US10976010B2 (en) 2015-08-17 2021-04-13 Zhejiang Super Lighting Electric Appliance Co., Lt LED filament and led light bulb
CN107170733A (zh) * 2015-12-19 2017-09-15 嘉兴山蒲照明电器有限公司 Led灯丝及其led球泡灯
CN106531865A (zh) * 2016-10-24 2017-03-22 东莞市凯昶德电子科技股份有限公司 一种紫外led封装用的围坝陶瓷基板制备方法
CN106531865B (zh) * 2016-10-24 2019-06-21 东莞市国瓷新材料科技有限公司 一种紫外led封装用的围坝陶瓷基板制备方法
CN106952996A (zh) * 2017-04-26 2017-07-14 深圳国冶星光电科技股份有限公司 一种led封装器件及其封装方法
US10804446B2 (en) 2017-12-26 2020-10-13 Jiaxing Super Lighting Electric Appliance Co., Ltd LED light bulb with spectral distribution of natural light
US10797208B2 (en) 2017-12-26 2020-10-06 Jiaxing Super Lighting Electric Appliance Co., Ltd LED light bulb with conductive sections and exposed wires
US10790420B2 (en) 2017-12-26 2020-09-29 Jiaxing Super Lighting Electric Appliance Co., Ltd Light bulb with a symmetrical LED filament
US10790419B2 (en) 2017-12-26 2020-09-29 Jiaxing Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb

Similar Documents

Publication Publication Date Title
CN201163628Y (zh) 一种改进的led光源封装结构
CN103367619B (zh) 金属支架结构及发光二极管结构
KR100629496B1 (ko) Ｌｅｄ 패키지 및 그 제조방법
CN104103734B (zh) 发光二极管封装结构
CN102130277A (zh) 一种发光二极管封装
CN201936917U (zh) 一种发光二极管封装
CN209150149U (zh) 支架结构、led器件和灯组阵列
CN103367605A (zh) 一种薄膜型led器件及其制造方法
US20110175135A1 (en) Circuit Board For LED
CN102569595A (zh) 发光二极管封装结构
CN102322584A (zh) 一种采用cob封装技术的超薄led面光源
CN201584409U (zh) 发光二极管芯片承载座结构
CN213660405U (zh) 一种深紫外与可见光双波长led封装结构
CN209150150U (zh) Led器件和灯组阵列
CN201237098Y (zh) 大功率发光二极管
CN1474462A (zh) 表面黏着发光二极管的封装结构及其制造方法
CN206163520U (zh) 一种led封装支架及led发光体
CN103682063B (zh) 侧面发光型发光二极管封装结构及其制造方法
CN201732811U (zh) 一种无焊金线的led封装结构
CN205016561U (zh) Led封装结构
JP5063445B2 (ja) 低い熱抵抗を有する発光ダイオードランプ
CN208506438U (zh) 一种易于导热的背光模组及其液晶显示器
CN203466223U (zh) 一种发光二极管封装结构
CN202905776U (zh) 一种大功率led器件
CN102723420B (zh) 一种支架与led灯

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20081210

Termination date: 20160118

EXPY Termination of patent right or utility model