CN201153366Y - Novel double sided tape with double rows of points - Google Patents
Novel double sided tape with double rows of points Download PDFInfo
- Publication number
- CN201153366Y CN201153366Y CNU200820091439XU CN200820091439U CN201153366Y CN 201153366 Y CN201153366 Y CN 201153366Y CN U200820091439X U CNU200820091439X U CN U200820091439XU CN 200820091439 U CN200820091439 U CN 200820091439U CN 201153366 Y CN201153366 Y CN 201153366Y
- Authority
- CN
- China
- Prior art keywords
- adhesive tape
- body paper
- matrix sheet
- band matrix
- novel double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
A novel double-row-point double splice tape comprises an adhesive substrate, a piece of anti-sticking body paper, and two adhesive tapes, wherein, the longitudinal center line of the adhesive substrate is provided with a visual seam convenient for folding, and two rows of locating pinholes are arranged along two edges of the visual seam of the adhesive substrate and form two rows of embossments at one side of the anti-sticking body paper; a glue solution coating is coated at the side where the anti-sticking body paper and the adhesive substrate are to be pasted, and then the anti-sticking body paper and the adhesive substrate are pasted together; the two adhesive tapes are pasted between the anti-sticking body paper and the adhesive substrate, the two adhesive tapes are parallel to and symmetrical with a folded visual seam arranged on the longitudinal center line of the adhesive substrate, and the two adhesive tapes are respectively pasted between the visual seam and the two rows of locating pinholes.
Description
Technical field
The utility model relates to the two-sided adhesive tape that connects material of a kind of novel double point, relates in particular to a kind of automatic chip mounting in electronic component automatic chip mounting technology band that connects material that mainly is applicable to.
Background technology
Along with the fast development of electronics technology, to circuit integrated, reliability requirement is more and more higher, manufacture craft is also thereupon in continuous improvement.In electronic component automatic chip mounting technology, electronic component generally all connects material by automatic chip mounting and brings in the chip mounter, rationalization and the scientific operating efficiency of chip mounter and the positioning accuracy that electronic component is installed of directly having influence on that automatic chip mounting connects material and is with design.When the band that connects material that has electronic component entered chip mounter, chip mounter is the breakdown antisticking body paper gradually, and the electronic component that will expose is mounted on the circuit board one by one accurately.At present general on the market automatic chip mounting connects material and is with it to comprise band matrix sheet, antisticking body paper, two-sided tape and is connected adhesive tape.Connect adhesive tape sticking between band matrix sheet and antisticking body paper; usually also need between band matrix sheet and the antisticking body paper to paste and just can make it to reach the purpose of pasting mutually by two-sided tape; and owing between band matrix sheet and antisticking body paper, increased double faced adhesive tape; in the middle of the use of product, will increase the unstable properties of product, simultaneously also not too convenient in the middle of the use of product.
The utility model content
The technical problems to be solved in the utility model is: by reducing the double faced adhesive tape between band matrix sheet and the antisticking body paper, to reach the stability that increases product, can also reach simultaneously increases more convenient function of product in the middle of the use of product.
In order to solve the problems of the technologies described above, the utility model proposes following technical scheme: the two-sided adhesive tape that connects material of a kind of novel double point, it comprises that a band matrix sheet, an antisticking body paper, two connect adhesive tape.On the longitudinal centre line of this band matrix sheet, be provided with a void of being convenient to doubling and stitch, and be provided with two registration pin holes along the empty both sides of stitching of this doubling at this band matrix sheet.This two registration pin hole forms two row's raised points in antisticking body paper one side.This antisticking body paper is provided with the glue coating with the one side that band matrix sheet is pasted mutually, and this antisticking body paper is pasted mutually with band matrix sheet.This two connections adhesive tape sticking is between this antisticking body paper and band matrix sheet, and this two connects that the empty seam of doubling that is provided with on the longitudinal centre line of adhesive tape and this band matrix sheet parallels and symmetrical, this two connections adhesive tape stick on respectively that this void is stitched and this two registration pin hole between.
The utility model has following benefit: compare and saved double faced adhesive tape with the traditional automatic chip mounting band that connects material, make properties of product more stable, use convenient.
Description of drawings
Fig. 1 is the flat state structure chart of the two-sided adhesive tape that connects material of a kind of novel double point of the utility model.
Fig. 2 is that the two-sided adhesive tape that connects material of a kind of novel double point of the utility model is along A-A sectional structure chart among Fig. 1.
Embodiment
See also Fig. 1 to Fig. 2, the two-sided adhesive tape that connects material of a kind of novel double point, it comprises that a band matrix sheet 1, an antisticking body paper 2, two connect adhesive tape 3.On the longitudinal centre line of this band matrix sheet 1, be provided with a void seam 4 of being convenient to doubling, and be provided with two registration pin holes 5 along empty 4 the both sides of stitching of this doubling at this band matrix sheet 1.This two registration pin hole 5 forms two row's raised points in antisticking body paper 2 one sides.This antisticking body paper 2 is provided with the glue coating with the one side that band matrix sheet 1 is pasted mutually, and this antisticking body paper 2 is pasted mutually with band matrix sheet 1.This two connections adhesive tape 3 sticks between this antisticking body paper 2 and the band matrix sheet 1, and this two connects that the empty seam 4 of doubling that is provided with on the longitudinal centre line of adhesive tape 3 and this band matrix sheet 1 parallels and symmetrical, this two connections adhesive tape 3 stick on respectively this void stitch 4 and this two registration pin hole 5 between.
Claims (5)
1, the two-sided adhesive tape that connects material of a kind of novel double point is characterized in that: it is connected adhesive tape (3) and is formed by a band matrix sheet (1), an antisticking body paper (2), two; Be provided with the glue coating at this antisticking body paper (2) and band matrix sheet (1) one side of pasting mutually, this antisticking body paper (2) is pasted mutually with band matrix sheet (1), and this two connection adhesive tape (3) sticks on this antisticking body paper (2) and is with between the matrix sheet (1).
2, the two-sided adhesive tape that connects material of a kind of novel double point according to claim 1 is characterized in that: be provided with a void of being convenient to doubling and stitch (4) on the longitudinal centre line of this band matrix sheet (1).
3, the two-sided adhesive tape that connects material of a kind of novel double point according to claim 1 is characterized in that: this two connects the doubling void that is provided with on the longitudinal centre line of adhesive tape (3) and this band matrix sheet (1) and stitches (4) and parallel and symmetrical.
4, the two-sided adhesive tape that connects material of a kind of novel double point according to claim 1 is characterized in that: this two connection adhesive tape (3) sticks on respectively between this void seam (4) and this two registration pin hole (5).
5, the two-sided adhesive tape that connects material of a kind of novel double point according to claim 1 is characterized in that: be provided with two registration pin holes (5) at this band matrix sheet (1) along the empty both sides of stitching (4) of this doubling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200820091439XU CN201153366Y (en) | 2008-01-07 | 2008-01-07 | Novel double sided tape with double rows of points |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200820091439XU CN201153366Y (en) | 2008-01-07 | 2008-01-07 | Novel double sided tape with double rows of points |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201153366Y true CN201153366Y (en) | 2008-11-19 |
Family
ID=40129041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU200820091439XU Expired - Fee Related CN201153366Y (en) | 2008-01-07 | 2008-01-07 | Novel double sided tape with double rows of points |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201153366Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105575793A (en) * | 2015-12-14 | 2016-05-11 | 苏州市官田电子有限公司 | Etching waste adsorption die and manufacturing technology thereof |
| CN109749649A (en) * | 2018-02-01 | 2019-05-14 | 刘安夏 | A kind of stress tearing adhesive tape |
| CN114126396A (en) * | 2020-08-26 | 2022-03-01 | 金东奭 | Connecting clamp adhesive tape |
-
2008
- 2008-01-07 CN CNU200820091439XU patent/CN201153366Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105575793A (en) * | 2015-12-14 | 2016-05-11 | 苏州市官田电子有限公司 | Etching waste adsorption die and manufacturing technology thereof |
| CN105575793B (en) * | 2015-12-14 | 2018-04-10 | 苏州市官田电子有限公司 | One kind etching waste suction mould and its manufacturing process |
| CN109749649A (en) * | 2018-02-01 | 2019-05-14 | 刘安夏 | A kind of stress tearing adhesive tape |
| CN114126396A (en) * | 2020-08-26 | 2022-03-01 | 金东奭 | Connecting clamp adhesive tape |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081119 Termination date: 20100208 |