CN201146181Y

CN201146181Y - Inclined-tower type heat pipe radiator for micro-processor

Info

Publication number: CN201146181Y
Application number: CNU2008200001610U
Authority: CN
Inventors: 齐媛; 荆建一; 房盛
Original assignee: Individual
Current assignee: Individual
Priority date: 2008-01-04
Filing date: 2008-01-04
Publication date: 2008-11-05
Anticipated expiration: 2018-01-04

Abstract

The utility model provides a leaning tower type thermotube radiator for a microprocessor, which comprises a protecting hood (1), a thermotube (2), an upper head plate (3), a radiating pin (4), a lower radiating pin (5), a lower end plate (6), etc. The top end of the thermotube (2) is equipped with an injection tube (201) and is connected in a rotary extrusion sealing. The upper head plate (3) is arranged at the upper part of the thermotube (2), and the protecting hood (1) fastens the injection tube (201) and the upper head plate (3) the radiating pin (4) is arranged at the upper part of the radiator, and the lower part is provided with the radiating pin (5) and the lower end plate (6). The leaning tower type thermotube radiator for the microprocessor is characterized in that a sloping bottom (7) connected with the lower end plate (6) into a whole body is arranged at the bottom part of the thermotube (2). By adopting the utility model, internal thread or an axial groove of the thermotube increases the contact area of working substance steam and thermotube pipe wall, which is good for the conduction of the working substance steam and the thermotube pipe wall; a ring-shaped groove or a rib reinforcement at the upper part of the sloping bottom increases the rigidity and intensity of the sloping bottom. The leaning tower type thermotube radiator for the microprocessor has the characteristics of simple fabrication technology and quick radiating.

Description

Microprocessor leaning tower formula heat-pipe radiator

Technical field

The utility model relates to a kind of microprocessor leaning tower formula heat-pipe radiator, particularly computer microprocessor leaning tower formula heat-pipe radiator.

Background technology

Computer microprocessor commonly used at present generally is made up of minisize axial-flow blower fan and Aluminium Radiator with radiator.The microprocessor surface is close in the baseplane of radiator, during microprocessor work, heat is conducted to low temperature by high temperature, the heat that is microprocessor is through base plate of radiator, heat radiator fin, the heat radiation that forces by axial flow blower makes heat be taken away by flow air again, thereby reaches the thermolysis of microprocessor.The aluminum metal heat-transfer rate is very fast, but produces the speed of heat well below microprocessor, is easy to produce heat accumulation like this, thereby reduces radiating effect, causes the limit of temperature rise of this radiator restriction microprocessor limited, generally about 10～20 ℃.Raising along with the microprocessor basic frequency, operating current strengthens, some microprocessor surface temperatures can reach 100 ℃. and it is too far away from 35 ℃ of points of integrated circuit working temperature to waft, and has influenced the stability of microprocessor greatly, also " deadlock " phenomenon can occur sometimes and influences the operate as normal of computer.In order to address the above problem, many units have developed new radiator.These radiators can be divided into following several types: 1, the modified model of existing goods aluminium alloy heat radiator, promptly in the useful space that allows, by increasing size, improve shape; Inlay ways such as copper for aluminium or in aluminium by copper, improve heat-sinking capability to strengthen ways such as area of dissipation and increase material thermal conductivity, this class radiator one is that complex-shaped machining expense is higher, the 2nd, increase material cost, because the heat-sinking capability that increases is limited, its cost performance is lower, and its range of application is restricted.2, the tower type computer CPU phase-change heat sink that provided of Chinese patent specification 01263515.4, the bottom surface of the phase-change heat transfer pipe of this radiator directly is pressed on the microprocessor surface, during work, its heat is by the bottom surface of phase-change heat transfer pipe, making phase transformation heat pipe bottom is that the interior working medium heat absorption of evaporation section is vaporizated into steam, the middle and upper part of the steam that has a heat along the axial-movement of phase-change heat transfer pipe to the phase-change heat transfer pipe is condensation segment, and steam heat release condensation becomes worker quality liquid.The heat that discharges is conducted to by the phase-change heat transfer tube outer surface on the radiating fin that is enclosed within the phase-change heat transfer tube outer surface and by the heat radiation that forces of minisize axial-flow blower fan to be taken away by flow air.Getting back to phase-change heat transfer pipe bottom under the capillarity of the wick of the formed liquid of refrigerant vapor condensation in the phase-change heat transfer pipe is that evaporation section carries out circulation next time.This radiator heat-dissipation ability is big, generally can not burn out microprocessor, but in the phase-change heat transfer pipe capillary heat exchanger core is arranged, not only make its manufacturing process complexity, cost strengthens, and has also increased thermal resistance between phase-change heat transfer pipe and radiating fin, thereby its heat sinking function is given full play to.

Summary of the invention

The purpose of this utility model is exactly the shortcoming at existing product, and a kind of existing good thermal diffusivity is provided, the microprocessor that is easy to make simple in structure again leaning tower formula heat-pipe radiator.

The utility model is achieved through the following technical solutions: a kind of microprocessor leaning tower formula heat-pipe radiator, constitute by guard shield, heat pipe, upper head plate, radiating fin, bottom radiating fin, bottom plate and sloping bottom, liquid injection pipe is housed on described heat pipe top and spinning is tightly connected, the top of heat pipe is provided with upper head plate, guard shield fastens liquid injection pipe and upper head plate, top is provided with radiating fin, the bottom is provided with down radiating fin and bottom plate, it is characterized in that: the bottom of described heat pipe also is provided with the sloping bottom that is connected as a single entity with bottom plate.

The inner surface of above-mentioned heat pipe is provided with uniform vertically groove or internal thread, and the cross section of its axial groove can be triangle, rectangle, trapezoidal or fall shape such as trapezoidal.

The cross section of above-mentioned heat pipe is circular or oval.

The shape of above-mentioned radiating fin, bottom radiating fin can be a square or rectangular, and its surface can be planar chip, corrugated plate, strip piece and two-way strip piece.

Above-mentioned sloping bottom top can uniform ring-shaped groove or reinforcement, and its cross section can be rectangle, triangle, shape such as trapezoidal.

Adopt the utility model structure, because the internal thread or the axial groove of heat pipe, increased the contact area of working substance steam and thermotube wall, help the conduction of working substance steam and thermotube wall, the ring-shaped groove on sloping bottom top or reinforcement, one side has increased the rigidity and the intensity of sloping bottom, has increased the contact area with worker quality liquid on the other hand, it is simple to the utlity model has manufacturing process, the characteristics of rapid heat dissipation.

Description of drawings

Fig. 1 is structure master's cutaway view of the present utility model;

Fig. 2 is the vertical view of Fig. 1.

Among the figure: 1 is that guard shield, 2 is that heat pipe, 201 is that liquid injection pipe, 3 is that upper head plate, 4 is that radiating fin, 5 is that bottom radiating fin, 6 is that bottom plate, 7 is a sloping bottom.

Embodiment

As shown in Figure 1, the utility model comprises guard shield 1, heat pipe 2, upper head plate 3, radiating fin 4, bottom radiating fin 5, bottom plate 6 and sloping bottom 7, liquid injection pipe 201 is equipped with on described heat pipe 2 tops and spinning is connected with the top seal of heat pipe 2, the top of heat pipe 2 is provided with upper head plate 3, guard shield 1 fastens liquid injection pipe 201 and upper head plate 3, top is provided with radiating fin 4, the bottom is provided with bottom radiating fin 5 and bottom plate 6, and the bottom of heat pipe 2 also is provided with the sloping bottom 7 that is connected as a single entity with bottom plate 6.Upper head plate 3, radiating fin 4, bottom radiating fin 5, bottom plate 6 are contained in the corresponding site and the expanded joint of heat pipe 2 respectively; Sloping bottom 7 is connected as a single entity with heat pipe 2, has constituted microprocessor leaning tower formula heat-pipe radiator main body.

The inner surface of heat pipe 2 is provided with uniform vertically groove or internal thread, and the cross section of its axial groove can be triangle, rectangle, trapezoidal or fall shape such as trapezoidal.The cross section of heat pipe 2 is circular or oval.

The shape of radiating fin 4, bottom radiating fin 5 can be a square or rectangular, and its surface can be planar chip, corrugated plate, strip piece and two-way strip piece.

Sloping bottom 7 tops can uniform ring-shaped groove or reinforcement, and its cross section can be rectangle, triangle, shape such as trapezoidal.

Being known by Fig. 2, is the vertical view of Fig. 1, after vacuumizing with leaning tower formula heat-pipe radiator and inject working medium by 201 pairs of microprocessors of liquid injection pipe, immediately with liquid injection pipe 201 sealings.

The utility model needs to be fixed on the computer motherboard with fastener, and its sloping bottom 7 is closely contacted with processor and keeps certain pressure.Fastener be pressed on the bottom plate 6 be fixed on mainboard on base link to each other.Bottom surface at sloping bottom 7 should evenly be coated with one deck heat-conducting silicone grease.Guard shield 1 protection pipette 201.

During work, the heat that microprocessor produced is passed to sloping bottom 7 rapidly, make heat from the surface of microprocessor by the working medium in the sloping bottom heating tube 2, working medium heat absorption evaporation is also risen along the axis of heat pipe 2, have the tube wall of the steam of heat by heat pipe 2, to radiating fin 4, bottom radiating fin 5, heat is taken away by flow air entrained heat transferred by the heat radiation that forces by the minisize axial-flow blower fan; Working substance steam is emitted the heat condensation to be become worker quality liquid and is back to the bottom along the inwall of heat pipe 2 and proceeds heat absorption evaporation, heat release condensation.So move in circles, the heat that microprocessor produced is loose among air rapidly.

Heat pipe 2 has been in vacuum state before injecting working medium, so resistance is very little, working substance steam is risen rapidly and by heat pipe 2 tube walls heat is delivered to rapidly on radiating fin 4 and the bottom radiating fin 5.Internal thread or equally distributed axial groove are arranged on heat pipe 2 tube walls, the cross section of groove can be rectangle, triangle, trapezoidal, fall shape such as trapezoidal.Internal thread or axial groove have increased the contact area of working substance steam and heat pipe 2 tube walls, help the conduction of working substance steam and heat pipe 2 tube walls, and the operation principle of heat pipe and these structures make that to the utlity model has manufacturing process simple, the characteristics of rapid heat dissipation.Radiating fin 4, bottom radiating fin 5 all are sleeved on the heat pipe 2, can reduce the thermal resistance between radiating fin 4 and bottom radiating fin 5 and the heat pipe 2 by the method for mechanical expanded joint or extraordinary welding.The internal thread of sloping bottom 7 and heat pipe 2 inwalls or equally distributed axial groove, when making the microprocessor surface parallel with horizontal plane or vertical, the utility model can both effectively be worked.Ring-shaped groove or reinforcement are arranged at sloping bottom 7 tops, and the cross section of ring-shaped groove or reinforcement can be shapes such as triangle, rectangle; These ring-shaped grooves or reinforcement, one side has increased the rigidity and the intensity of sloping bottom 7, and the contact area of increase and worker quality liquid helps heat conduction between the two on the other hand.The size of bottom radiating fin 5 is determined according to the size of computer motherboard base, also can be cancelled.Bottom plate 6 is thicker than upper head plate 3, to bear the pressure of fastener.The surface of radiating fin 4, bottom radiating fin 5 can be that planar chip, corrugated plate also can be striped sheet or two-way strip piece, strengthens the heat conduction between itself and the air.Guard shield 1 is protected the solder joint that seals of liquid injection pipe 201.According to the caloric value of microprocessor, the utility model can be adorned a minisize axial-flow blower fan, also can adorn two.Make radiating rate fast, when the microprocessor surface was parallel with horizontal plane or vertical, the utility model can both effectively be worked.The simple cost of structure and manufacturing process is low, is characteristics of the present utility model.

Claims

1, a kind of microprocessor leaning tower formula heat-pipe radiator, by guard shield (1), heat pipe (2), upper head plate (3), radiating fin (4), bottom radiating fin (5), bottom plate formations such as (6), liquid injection pipe (201) is housed on described heat pipe (2) top and spinning is tightly connected, the top of heat pipe (2) is provided with upper head plate (3), guard shield (1) fastens liquid injection pipe (201) and upper head plate (3), top is provided with radiating fin (4), the bottom is provided with down radiating fin (5) and bottom plate (6), it is characterized in that: the bottom of described heat pipe (2) also is provided with the sloping bottom (7) that is connected as a single entity with bottom plate (6).

2, a kind of microprocessor according to claim 1 leaning tower formula heat-pipe radiator, it is characterized in that: the inner surface of described heat pipe (2) is provided with uniform vertically groove or internal thread, and the cross section of its axial groove can be triangle, rectangle, trapezoidal or fall shape such as trapezoidal.

3, a kind of microprocessor according to claim 1 leaning tower formula heat-pipe radiator, it is characterized in that: the cross section of described heat pipe (2) is for circular or oval.

4, a kind of microprocessor according to claim 1 leaning tower formula heat-pipe radiator, it is characterized in that: the shape of described radiating fin (4), bottom radiating fin (5) can be a square or rectangular, and its surface can be planar chip, corrugated plate, strip piece and two-way strip piece.

5, a kind of microprocessor according to claim 1 is characterized in that with leaning tower formula heat-pipe radiator: described sloping bottom (7) top can uniform ring-shaped groove or reinforcement, and its cross section can be rectangle, triangle, shape such as trapezoidal.