CN201122597Y - Light emitting diode chip packaging structure with thick guiding pin - Google Patents
Light emitting diode chip packaging structure with thick guiding pin Download PDFInfo
- Publication number
- CN201122597Y CN201122597Y CNU2007201285579U CN200720128557U CN201122597Y CN 201122597 Y CN201122597 Y CN 201122597Y CN U2007201285579 U CNU2007201285579 U CN U2007201285579U CN 200720128557 U CN200720128557 U CN 200720128557U CN 201122597 Y CN201122597 Y CN 201122597Y
- Authority
- CN
- China
- Prior art keywords
- emitting diode
- feet
- diode chip
- conductive
- backlight unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 title abstract description 10
- 239000000084 colloidal system Substances 0.000 claims abstract description 17
- 239000002184 metal Substances 0.000 claims description 33
- 238000009413 insulation Methods 0.000 claims description 30
- 238000010276 construction Methods 0.000 claims description 26
- 238000005538 encapsulation Methods 0.000 claims description 26
- 238000012856 packing Methods 0.000 claims description 12
- 230000005611 electricity Effects 0.000 claims description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 238000005253 cladding Methods 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
- 238000002347 injection Methods 0.000 abstract 3
- 239000007924 injection Substances 0.000 abstract 3
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The utility model relates to a light emitting diode chip packaging structure with thick conducting pins. The light emitting diode chip packaging structure comprises a plurality of mutually separated conducting pins, an insulating casing body, a plurality of light emitting diode chips and a packaging colloid. The lower surfaces of the conducting pins are clad by the insulating casing body, so as to form an injection groove used for exposing the upper surface of each conducting pin out, and both sides of the conducting pins extend out of the outer side of the insulating casing body; a plurality of light emitting diode chips are respectively arranged in the injection groove, and positive and negative electrode terminals of each light emitting diode chip are respectively and electrically connected to different conducting pins; the packaging colloid is filled in the injection groove, in order to cover the light emitting diode chips.
Description
Technical field
The utility model relates to a kind of LED encapsulation construction, refers to a kind of LED encapsulation construction that has thick guide feet and do not need to bend lead foot especially.
Background technology
See also shown in Figure 1ly, it is the generalized section of known vertically standing LED chip-packaging structure.By among the figure as can be known, known vertically standing LED chip-packaging structure comprises: a dielectric base 1a, a conduction rack 2a, a light-emitting diode chip for backlight unit 3a and a fluorescent colloid 4a.
Wherein, this conduction rack 2a has two the conductive connecting pin 20a, the 21a that roll over twice respectively along the two opposition side springs of this dielectric base 1a, electrically contact so that the lower surface of described a plurality of conductive connecting pin 20a, 21a can produce with a circuit board 5a, and this conductive connecting pin 20a, 21a have a positive electrode zone 200a and a negative electrode area 210a respectively.
Moreover, this light-emitting diode chip for backlight unit 3a has a positive electricity end 300a and the extreme 310a of a negative electricity, and this light-emitting diode chip for backlight unit 3a is set directly on this conductive connecting pin 20a, so that direct the generation with the positive electrode zone 200a of this conductive connecting pin 20a of this positive electricity end 300a electrically contacts, and the extreme 310a of negative electricity of this light-emitting diode chip for backlight unit 3a is by the negative electrode area 210a generation electric connection of a lead 6a and this conductive connecting pin 21a.
At last, this fluorescent colloid 4a covers on this light-emitting diode chip for backlight unit 3a, to protect this light-emitting diode chip for backlight unit 3a.By this, known vertically standing LED chip-packaging structure can produce the upwards illumination effect of light projector (as shown by arrows).
Yet above-mentioned vertically standing LED chip-packaging structure still has following several shortcomings:
1, described a plurality of conductive connecting pin 20a, 21a must could produce with circuit board 5a through bending and contact, and therefore increase the complexity of manufacturing process.
2, because the thickness of described a plurality of conductive connecting pin 20a, 21a is too thin, so area of dissipation is too small, and can't reach the advantage of high heat radiation.
3, because the thickness of described a plurality of conductive connecting pin 20a, 21a is too thin, therefore can't improves the supply of power supply, and make this light-emitting diode chip for backlight unit 3a can't produce higher luminous efficacy.
Therefore, known at present no matter be the LED encapsulation construction of vertical type or side formula as from the foregoing, obviously have inconvenience and exist, and remain to be improved with shortcoming.
The utility model content
Technical problem to be solved in the utility model is to provide a kind of LED encapsulation construction with thick guide feet, and it makes simple, and has thermal diffusivity and higher luminous efficacy preferably.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present utility model, provide a kind of LED encapsulation construction with thick guide feet, it comprises: a metal base; A plurality of conductive feet separated from one another, it extends from this metal base; One insulation shell, it coats the lower surface of described a plurality of conductive feet, to form an ejaculation groove that is used to expose the upper surface of each conductive feet; A plurality of light-emitting diode chip for backlight unit, it is electrically connected at described a plurality of conductive feet respectively; And a packing colloid, it is filled in this ejaculation groove, to cover described a plurality of light-emitting diode chip for backlight unit.
Therefore the utlity model has following advantage:
1, thick guide feet of the present utility model need not pass through bending, do not contact and can directly produce with circuit board, so the complexity of the utility model energy simplified manufacturing technique.
2, owing to adopt thick guide feet, so the utility model can increase area of dissipation, and reaches the advantage of high heat radiation.
3, owing to adopt thick guide feet, so the utility model can improve the supply of power supply, and makes light-emitting diode chip for backlight unit can produce higher luminous efficacy.
In order further to understand the utility model is to reach technology, means and the effect that predetermined purpose is taked, see also following about detailed description of the present utility model and accompanying drawing, believe that the purpose of this utility model, feature and characteristics ought get one thus and go deep into and concrete understanding, yet institute's accompanying drawing for reference and explanation usefulness are provided, is not to be used for the utility model is limited only.
Description of drawings
Fig. 1 is the generalized section of known vertically standing LED chip-packaging structure;
Fig. 2 is the flow chart of first embodiment of manufacture method that the utlity model has the LED encapsulation construction of thick guide feet;
Fig. 3 is the schematic perspective view of the metal base of the utility model first embodiment;
Fig. 4 is the vertical view of the metal base of the utility model first embodiment;
Fig. 5 is the 5-5 cutaway view of Fig. 3;
Fig. 6 is the schematic perspective view that the metal base of the utility model first embodiment combines with insulation shell;
Fig. 7 is electrically connected at the schematic perspective view of conductive feet for the light-emitting diode chip for backlight unit of the utility model first embodiment;
Fig. 8 is the schematic side view of first kind of set-up mode of the light-emitting diode chip for backlight unit of the utility model first embodiment;
Fig. 9 is filled in the schematic perspective view that penetrates in the groove for the packing colloid of the utility model first embodiment;
Figure 10 is the schematic perspective views of described a plurality of conductive feet of the utility model first embodiment after cut;
Figure 11 is described a plurality of conductive feet of the utility model first embodiment another angle schematic perspective views after cut;
Figure 12 is the schematic side view of second kind of set-up mode of the light-emitting diode chip for backlight unit of the utility model first embodiment;
Figure 13 is the schematic side view of the third set-up mode of the light-emitting diode chip for backlight unit of the utility model first embodiment;
Figure 14 is the schematic side view of the 4th kind of set-up mode of the utility model light-emitting diode chip for backlight unit;
Figure 15 is the flow chart of second embodiment of manufacture method that the utlity model has the LED encapsulation construction of thick guide feet;
Figure 16 is the schematic perspective view that the metal base of the utility model second embodiment combines with insulation shell;
Figure 17 is the flow chart of the 3rd embodiment of manufacture method that the utlity model has the LED encapsulation construction of thick guide feet;
Figure 18 is the schematic perspective view that the metal base of the utility model the 3rd embodiment combines with insulation shell;
Figure 19 is the schematic perspective view that the metal base of the utility model first embodiment combines with insulation shell;
Figure 20 is the schematic perspective view that the metal base of the utility model second embodiment combines with insulation shell; And
Figure 21 is the schematic perspective view that the metal base of the utility model the 3rd embodiment combines with insulation shell.
Wherein, description of reference numerals is as follows:
Dielectric base 1a conduction rack 2a
Conductive connecting pin 20a, 21a electrode zone 200a
The extreme 310a of positive electricity end 300a negative electricity
Anodal conductive part 1100 negative pole conductive parts 1101
Electro-cladding 110 insulation shells 2
Light-emitting diode chip for backlight unit 3 positive and negative electrode ends 30,31
Lead 4 packing colloids 5
Metal base 1 ' conductive feet 11 '
Groove 111 ' insulation shell 2 '
Penetrate groove 20 ' non-conductive regional 21 '
Light-emitting diode chip for backlight unit 3 ' positive and negative electrode end 30 ', 31 '
Lead 4 ' metal base 1 "
Anodal conductive part 1100 " negative pole conductive part 1101 "
Strengthen helping 12 " insulation shells 2 "
Light-emitting diode chip for backlight unit 3 " positive and negative electrode end 30 ", 31 "
Tin ball 4 "
Embodiment
See also Fig. 2 to shown in Figure 5, it is respectively the vertical view of metal base of schematic perspective view, the utility model first embodiment of metal base of flow chart, the utility model first embodiment of first embodiment of manufacture method of the LED encapsulation construction that the utlity model has thick guide feet and the 5-5 cutaway view of Fig. 3.
By in the flow chart of Fig. 2 as can be known, the manufacture method of the LED encapsulation construction that the utility model first embodiment is provided with thick guide feet, it comprises: at first, cooperate shown in Figure 3, one metal base 1 is provided, it has a plurality of extending and unsettled conductive feet 11, and the lower surface of each conductive feet 11 has groove 111 (step S100), and wherein this groove 111 is half erosion groove (halfetching concave groove).Wherein, this metal base 1 and described a plurality of conductive feet 11 are shaped out by etching technique, punching press or any forming mode.Moreover, by the mode of electroplating, shaping surface one deck electro-cladding 110 of this metal base 1 and described a plurality of conductive feet 11.In addition, thickness circle of each conductive feet 11 is between 0.4～3mm, so each conductive feet 11 has the thickness between 0.4～3mm.Certainly, the thickness of each conductive feet 11 also can be along with user's demand, and is designed to surpass the thickness of 3mm.
Then, see also shown in Figure 6, the schematic perspective view that it combines with insulation shell for the metal base of the utility model first embodiment.As shown in Figure 6, after this step S100, coat the lower surface of described a plurality of conductive feet 11, to form an ejaculation groove 20 (step S102) that is used to expose the upper surface of each conductive feet 11 by an insulation shell 2.Wherein, this insulation shell 2 is filled in non-conductive regional 21 between described a plurality of conductive feet 11.In addition, in this step S102, this insulation shell 2 can pass through injection molding or any forming mode, to coat the lower surface of described a plurality of conductive feet 11.
See also Fig. 7 and shown in Figure 8, its light-emitting diode chip for backlight unit that is respectively the utility model first embodiment is electrically connected at schematic perspective view, and the schematic side view of first kind of set-up mode of the light-emitting diode chip for backlight unit of the utility model first embodiment of conductive feet.By Fig. 7 and Fig. 8 as can be known, after this step S102, carry a plurality of light-emitting diode chip for backlight unit 3 in this ejaculation groove 20, and the positive and negative electrode end 30,31 of each light-emitting diode chip for backlight unit 3 is electrically connected at different conductive feet 11 (step S104) respectively.
That is, the positive and negative electrode end 30,31 of this light-emitting diode chip for backlight unit 3 is arranged at the lower surface and the upper surface of each light-emitting diode chip for backlight unit 3 respectively, and each light-emitting diode chip for backlight unit 3 optionally is arranged on the corresponding anodal conductive part 1100, so that the positive electricity end 30 of each light-emitting diode chip for backlight unit 3 directly is electrically connected at corresponding anodal conductive part 1100, and extreme 31 of the negative electricity of each light-emitting diode chip for backlight unit 3 is electrically connected at corresponding negative pole conductive part 1101 by a lead 4.
And then, see also shown in Figure 9ly, it penetrates the schematic perspective view in the groove for the packing colloid of the utility model first embodiment is filled in.As shown in Figure 9, after this step S104, a packing colloid 5 is filled in this ejaculation groove 20, to cover described a plurality of light-emitting diode chip for backlight unit 3 (step S106).Wherein, the material of this packing colloid 5 can be epoxy resin or silica gel (silicone) material.
At last, see also Figure 10 to shown in Figure 11, it is respectively schematic perspective view after cut of described a plurality of conductive feet of the utility model first embodiment, and described a plurality of conductive feet of the utility model first embodiment another angle schematic perspective view after cut.By Figure 10 and Figure 11 as can be known, after this step S106, cut described a plurality of conductive feet 11, to finish this making with LED encapsulation construction of thick guide feet (step S108).Wherein, the two ends of each conductive feet 11 expose to the both sides of this insulation shell 2, in order to follow-up scolding tin step.
See also shown in Figure 12ly, it is the schematic side view of second kind of set-up mode of the light-emitting diode chip for backlight unit of the utility model first embodiment.By among the figure as can be known, the positive and negative electrode end 30,31 of this light-emitting diode chip for backlight unit 3 is arranged at the lower surface and the upper surface of each light-emitting diode chip for backlight unit 3 respectively, and each light-emitting diode chip for backlight unit 3 be arranged in order corresponding anodal conductive part 1100 ' on, so that the positive electricity end 30 of each light-emitting diode chip for backlight unit 3 directly be electrically connected at corresponding anodal conductive part 1100 ', and the negative electricity of each light-emitting diode chip for backlight unit 3 extreme 31 by a lead 4 be electrically connected at corresponding negative pole conductive part 1101 '.
See also shown in Figure 13ly, it is the schematic side view of the third set-up mode of the light-emitting diode chip for backlight unit of the utility model first embodiment.By among the figure as can be known, this insulation shell 2 also further comprises: a plurality of be formed separately between per two conductive feet 11 non-conductive regional 21 '.Moreover, this light-emitting diode chip for backlight unit 3 ' positive and negative electrode end 30 ', 31 ' respectively be arranged at each light-emitting diode chip for backlight unit 3 ' upper surface, and each light-emitting diode chip for backlight unit 3 ' compartment of terrain be arranged at each non-conductive regional 21 ' on; By this, by the mode of routing (wire-bounding), make each light-emitting diode chip for backlight unit 3 ' positive and negative electrode end 30 ', 31 ' respectively by the adjacent anodal conductive part 1100 of two leads 4 ' be electrically connected at ' and negative pole conductive part 1101 '.
See also shown in Figure 14ly, it is the schematic side view of the 4th kind of set-up mode of the utility model light-emitting diode chip for backlight unit.By among the figure as can be known, the lower surface of this light-emitting diode chip for backlight unit 3 " positive and negative electrode end 30 ", 31 " being arranged at each light-emitting diode chip for backlight unit 3 respectively ", and each light-emitting diode chip for backlight unit 3 ' across corresponding non-conductive regional 21 "; By this, by the mode of flip-chip, make each light-emitting diode chip for backlight unit 3 " positive and negative electrode end 30 ", 31 " respectively by a plurality of corresponding tin balls 4 " be electrically connected at adjacent anodal conductive part 1100 " and negative pole conductive part 1101 ".
See also Figure 15 and shown in Figure 16, it is respectively flow chart, and the schematic perspective view that combines with insulation shell of the metal base of second embodiment of second embodiment of the manufacture method of the LED encapsulation construction that the utlity model has thick guide feet.By in the flow chart of Figure 15 as can be known, the manufacture method of the LED encapsulation construction that the utility model second embodiment is provided with thick guide feet, it comprises: at first, cooperate shown in Figure 16, provide a metal base 1 ', its have a plurality of extend and conductive feet 11 that two ends are fixing ', and each conductive feet 11 ' lower surface have groove 111 ' (step S200), this groove 111 ' wherein for half loses groove.Then, by the described a plurality of conductive feet 11 of an insulation shell 2 ' coating ' lower surface, with form one be used to expose each conductive feet 11 ' ejaculation groove 20 ' (the step S202) of upper surface.And, the described a plurality of conductive feet 11 of this insulation shell 2 ' be filled in ' between non-conductive regional 21 '.
Next, identical with step S104 and the S108 of first embodiment, carry a plurality of light-emitting diode chip for backlight unit (not shown) in this ejaculation groove, and the positive and negative electrode end of each light-emitting diode chip for backlight unit is electrically connected at different conductive feet 11 ' (step S204) respectively.Then, with a packing colloid (not shown) be filled in this ejaculation groove 20 ' in, to cover described a plurality of light-emitting diode chip for backlight unit (step S206).At last, cut described a plurality of conductive feet 11 ', to finish this making with LED encapsulation construction of thick guide feet (step S208).
See also Figure 17 and shown in Figure 180, it is respectively flow chart, and the schematic perspective view that combines with insulation shell of the metal base of the 3rd embodiment of the 3rd embodiment of the manufacture method of the LED encapsulation construction that the utlity model has thick guide feet.By in the flow chart of Figure 17 as can be known, the manufacture method of the LED encapsulation construction that the utility model the 3rd embodiment is provided with thick guide feet, it comprises: at first, cooperate shown in Figure 180, one metal base 1 is provided "; its have a plurality of extend and unsettled conductive feet 11 " and a plurality of extend and be linked to per two conductive feet 11 " between ribs 12 ", and each conductive feet 11 " lower surface have groove 111 " (step S300), wherein this groove 111 " are half erosion groove.Then, the lower surface that " coats described a plurality of conductive feet 11 " by an insulation shell 2 is used to expose each conductive feet 11 ejaculation groove 20 of upper surface " " (step S302) to form one.And, non-conductive regional 21 between this insulation shell 2 " is filled in described a plurality of conductive feet 11 " ".
Next, identical with step S204 and the S206 of second embodiment, carry a plurality of light-emitting diode chip for backlight unit (not shown) in this ejaculation groove 20 " in, and the positive and negative electrode end of each light-emitting diode chip for backlight unit is electrically connected at different conductive feet 11 respectively " (step S304); Then, a packing colloid (not shown) is filled in this ejaculation groove, to cover described a plurality of light-emitting diode chip for backlight unit (step S306).At last, cut described a plurality of conductive feet 11 " and described a plurality of ribs 12 ", to finish this making with LED encapsulation construction of thick guide feet (step S308).
See also Figure 19 to shown in Figure 21, the schematic perspective view that its metal base that is respectively first, second and third embodiment of the utility model combines with insulation shell.As shown in Figure 19, a plurality of first embodiment have metal base 1 and conductive feet 11, metal base 1 is connected into three rows with insulation shell 2 structure combining; In addition, as shown in Figure 20, a plurality of second embodiment have metal base 1 ' with conductive feet 11 ', metal base 1 ' be connected into three rows with insulation shell 2 ' structure combining; And, as shown in Figure 21, a plurality of the 3rd embodiment have metal base 1 " with conductive feet 11 ", metal base 1 " with insulation shell 2 " structure combining is connected into three rows.By this, the conductive feet 11,11 of above-mentioned three kinds of different embodiment ', 11 " with insulation shell 2,2 ', 2 " combination can full wafer (all-in-one) mode create.
In sum, the LED encapsulation construction with thick guide feet provided by the utility model has following advantage:
1, thick guide feet of the present utility model need not pass through bending, do not contact and can directly produce with circuit board, so the complexity of the utility model energy simplified manufacturing technique.
2, owing to adopt thick guide feet, so the utility model can increase area of dissipation, and reaches the advantage of high heat radiation.
3, owing to adopt thick guide feet, so the utility model can improve the supply of power supply, and makes light-emitting diode chip for backlight unit can produce higher luminous efficacy.
Note, the above, only be the detailed description and the accompanying drawing of the specific embodiment of one of the utility model the best, but feature of the present utility model is not limited thereto, be not in order to restriction the utility model, all scopes of the present utility model should be as the criterion with following claim, all accord with the embodiment of the spirit variation similar with it of the utility model claim, all should be contained in the category of the present utility model, any personnel that are familiar with this technology are in field of the present utility model, and the variation that can expect easily or modification all can be encompassed in following the application's the claim.
Claims (7)
1. the LED encapsulation construction with thick guide feet is characterized in that, comprising:
One metal base;
A plurality of conductive feet separated from one another, it extends from this metal base;
One insulation shell, it coats the lower surface of described a plurality of conductive feet, to form an ejaculation groove that is used to expose the upper surface of each conductive feet;
A plurality of light-emitting diode chip for backlight unit, it is electrically connected at described a plurality of conductive feet respectively; And
One packing colloid, it is filled in this ejaculation groove, to cover described a plurality of light-emitting diode chip for backlight unit.
2. the LED encapsulation construction with thick guide feet as claimed in claim 1 is characterized in that: electroplating surface one deck electro-cladding of this metal base and described a plurality of conductive feet.
3. the LED encapsulation construction with thick guide feet as claimed in claim 1 is characterized in that: the thickness of each conductive feet is between 0.4～3mm.
4. the LED encapsulation construction with thick guide feet as claimed in claim 1, it is characterized in that: this insulation shell is filled in the non-conductive zone between described a plurality of conductive feet, and the two ends of each conductive feet expose to the both sides of this insulation shell.
5. the LED encapsulation construction with thick guide feet as claimed in claim 1 is characterized in that: this packing colloid is the packing colloid of epoxy resin material or the packing colloid of silica gel material.
6. the LED encapsulation construction with thick guide feet as claimed in claim 1 is characterized in that: it is extreme that each light-emitting diode chip for backlight unit has the positive terminal and the negative electricity that are electrically connected at different conductive feet respectively.
7. the LED encapsulation construction with thick guide feet as claimed in claim 1 is characterized in that: described a plurality of light-emitting diode chip for backlight unit are arranged at respectively in this ejaculation groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201285579U CN201122597Y (en) | 2007-09-30 | 2007-09-30 | Light emitting diode chip packaging structure with thick guiding pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201285579U CN201122597Y (en) | 2007-09-30 | 2007-09-30 | Light emitting diode chip packaging structure with thick guiding pin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201122597Y true CN201122597Y (en) | 2008-09-24 |
Family
ID=40009837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201285579U Expired - Fee Related CN201122597Y (en) | 2007-09-30 | 2007-09-30 | Light emitting diode chip packaging structure with thick guiding pin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201122597Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101806439A (en) * | 2009-02-18 | 2010-08-18 | 黄嘉宾 | Heat dissipation structure of LED |
| CN102446909A (en) * | 2010-09-30 | 2012-05-09 | 展晶科技(深圳)有限公司 | Light-emitting diode combination |
-
2007
- 2007-09-30 CN CNU2007201285579U patent/CN201122597Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101806439A (en) * | 2009-02-18 | 2010-08-18 | 黄嘉宾 | Heat dissipation structure of LED |
| CN101806439B (en) * | 2009-02-18 | 2013-04-17 | 黄嘉宾 | Heat dissipation structure of LED |
| CN102446909A (en) * | 2010-09-30 | 2012-05-09 | 展晶科技(深圳)有限公司 | Light-emitting diode combination |
| CN102446909B (en) * | 2010-09-30 | 2015-03-11 | 赛恩倍吉科技顾问（深圳）有限公司 | Light-emitting diode combination |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201187696Y (en) | Flexible circuit board of LED illumination array | |
| TWI337409B (en) | Led chip package structure with thickness guiding pin | |
| CN103814450A (en) | LED module and LED lamp employing same | |
| CN208312001U (en) | LED lamp with heat dissipation effect | |
| CN101296564A (en) | Light source module group with excellent heat dispersion performance | |
| CN102176504A (en) | Ligth emitting device package and method of manufacturing the same | |
| CN103050602A (en) | Light-emitting device | |
| KR100735309B1 (en) | Surface mounting led package | |
| CN201122597Y (en) | Light emitting diode chip packaging structure with thick guiding pin | |
| CN100554773C (en) | A kind of LED light fixture that has heat-dissipating aluminium plate | |
| CN202013900U (en) | Light-emitting diode (LED) packing structure with base | |
| CN202018987U (en) | LED (light-emitting diode) packaging base | |
| CN100552907C (en) | LED encapsulation construction and manufacture method thereof with thick guide feet | |
| CN203038968U (en) | LED illumination module | |
| CN201133610Y (en) | LED illuminating device | |
| CN104103748A (en) | Light-emitting-diode packaging structure and manufacturing method thereof | |
| CN101246878B (en) | LED chip packaging structure with ceramic as substrate and its production method | |
| CN102637813B (en) | LED (light-emitting diode) packaging structure and LED lamp using same | |
| KR100592333B1 (en) | A led module | |
| CN100595916C (en) | LED chip packaging structure using ceramics as plaque and making method thereof | |
| CN113594334B (en) | Novel semiconductor support | |
| CN210956721U (en) | Novel LED packaging structure | |
| CN216288450U (en) | LED and IC high-density integrated packaging structure and LED lamp strip | |
| CN201087904Y (en) | Light emitting diode chip packaging structure with ceramic as substrate | |
| CN108447961A (en) | A kind of paster type light emitting type and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080924 Termination date: 20100930 |