CN201084710Y - A semiconductor-device chip surface spray-up magnetic-adsorption local protector - Google Patents
A semiconductor-device chip surface spray-up magnetic-adsorption local protector Download PDFInfo
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- CN201084710Y CN201084710Y CNU2007200645026U CN200720064502U CN201084710Y CN 201084710 Y CN201084710 Y CN 201084710Y CN U2007200645026 U CNU2007200645026 U CN U2007200645026U CN 200720064502 U CN200720064502 U CN 200720064502U CN 201084710 Y CN201084710 Y CN 201084710Y
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- chip
- protective cover
- rotten
- magnetic force
- magnetic
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Abstract
The utility model relates to a magnetic attraction local protective device used in the tabletop jet etching of semiconductor device chips, comprising a protective hood; during the tabletop jet etching treatment of chips, the protective hood just covers the part to be protected at the center of the chip, and forms a sealing surface together with the chip, so as to protect the surface part of the part requiring protection on the chip from the dipping and splashing of acid solution during the jet etching treatment. The protective hood is attached on the surface of the chip by means of magnetic attraction, and the main part is a disc-structured magnetizer made of magnetic permeable materials, a magnetic force generating device is arranged on a chip seat for holding the chip, during the treatment and processing of the tabletop jet etching, the protective hood is fixed on the chip under the action of the magnetic attraction of the magnetic force generating device, and covers the part to be protected at the center of the chip, in order to ensure that no acid solution dips or splashes on the part under protection during tabletop jet etching treatment. The magnetic attraction method can be either permanent magnetic attraction method or electromagnetic attraction method.
Description
Technical field
The utility model relates to a kind of processing method and device of semiconductor device, refer in particular to a kind of rotten local protection method and device handled of chip table spray of power electronics silicon-controlled device, the chip table that technology of the present utility model is mainly used in the high-power silicon controlled rectifier device sprays in the rotten treatment process, also can be used for rotten processing of chip table spray of other semiconductor element.
Background technology
On the chip surface of many semiconductor device, it is outer to have a circle table top, work in-process to carry out the table top jet etching to it to handle.In powerful thyristor of tradition and the diode chip for backlight unit processing,,, thereby do not need to carry out specific protection because traditional powerful thyristor and diode chip for backlight unit middle part do not have the structure of acid labile though used table top jet etching treatment technology.But has meticulous sliver in the at present new high-power semiconductor device chip; in corrosion treatment to chip table; meticulous sliver is not corroded impaired in the chip in order to protect effectively; must carry out necessary protection; in order to avoid the chip surface middle part is subjected to the acid damage; thereby ensure the integrality of device architecture, this point is very important to the GCT/GTO device with meticulous sliver structure.Therefore, in the table top jet etching processing of present novel high-power semiconductor device chip, need to consider the protector in centre is set, but never have good method.(patent No. is ZL95110389.X to Chinese patent; Name is called " glass passivating method of large mesa power semiconductor device ") a kind of method of making semiconductor device chip is disclosed, be to adopt dual shield, the mesa etch one-shot forming fuses glass dust repeatedly and prepares the glassivation film.But the processing method of this and new high-power semiconductor device chip table top has very big difference, and does not relate to spray corruption and guard technology.(number of patent application is 200610031477.1 to Chinese patent application; Name is called " a kind of chemical grooving process and device that rotates the rotten method of spray ") a kind of manufacture craft of high-power semiconductor device chip also disclosed, wherein mention and adopt the rotten treatment process of spray, but the problem of the protection in centre when also not relating to the semiconductor device chip jet etching and handling.Still find no pass patent documentation report by domestic patent retrieval.
The utility model content
The purpose of this utility model is the deficiency at the table top jet etching processing centre protection of new high-power semiconductor device chip, propose a kind ofly can effectively guarantee semiconductor part chip table jet etching processed the time, the spray that the chip center position is without prejudice is rotten handles local protector.
The purpose of this utility model is achieved through the following technical solutions: the local protector of a kind of table top jet etching processing of semiconductor element chip; at least comprise a protective cover; when chip carries out the rotten processing of table top spray; protective cover just in time covers the position that needs protection in chip center; protective cover forms a sealing surface with chip, can not be subjected to acid solution when handling and spatters and soak in that spray is rotten with the surface portion that guarantees to need protection on the chip.Described protective cover is adsorbed on the chip surface by the magnetic force suction type, and the main body of protective cover is the disk-shaped structure magnetic conductor that permeability magnetic material is made, and is provided with the magnetic force generating means on the chip carrier that chip is placed.When chip carries out table top jet etching processing; protective cover is clamped chip by the magnetic force absorption of magnetic force generating means; protective cover hides on the position that chip center needs protection; preventing when the chip table jet etching is handled, do not have acid solution and spatter and be dipped into the position that chip center needs protection.Described magnetic force suction type can be permanent magnetism suction type or electromagnetism suction type.Sealing effectiveness when guaranteeing that protective cover and chip are fitted can cover the overcoat that one deck has certain flexible acid-proof soft material making in protective cover and the contacted main part of chip.Acid-proof soft material on the protective cover is close to chip center and needs protection on the position in chip table jet etching processing, the sealing when guaranteeing chip with the chip applying.
According to the table top jet etching processing method of semiconductor element chip of the present utility model, when chip table being sprayed rotten the processing,, its acid and alkali liquid is spattered soak infringement at the chip part surface is taked effective protection, be highly effective.This covering formula protected mode is compared with conventional art, and characteristics are as follows:
1, hiding the formula protected mode can make silicon chip correctly locate and finish mesa etch.
2, not only acid-proof but also help applying of the acid-proof soft material layer of going up block with chip.
3, the overall dimension compact of whole frock is with the fine coupling of main equipment.
4, the quality of the rotten processing of spray is good, the work efficiency height, and middle protection is respond well.
5, the cost of frock is low, makes processing simply, and useful life is also very long.
Description of drawings
Fig. 1 is a three-dimensional decomposition principle schematic diagram of the present utility model;
Fig. 2 is the structural representation of an embodiment of the utility model;
Fig. 3 is the structural representation vertical view of an embodiment of the utility model.
Among the figure: 1, chip pad, 2, chip, 3, protective cover, 4, positioner, 5, locating ring, 6, the magnetic force generating means, 7, hide the formula protective cover.
Embodiment
The utility model will be further described below in conjunction with drawings and Examples.
The utility model relates to chip center in a kind of table top jet etching processing of high-power semiconductor device chip the need protection means of defence and the device at position as seen in Figure 1; described method is: the surface portion that needs protection on the chip is taked to hide the formula protected mode, and the surface portion that needs protection on the protection chip is without prejudice.Described covering formula protected mode is the surface portion that needs protection on chip; by a cover covering formula protection system; cover the surface portion that needs protection on the chip, do not have acid solution when handling and spatter and be dipped into the position that chip center needs protection in that spray is rotten with the surface portion that guarantees to need protection on the chip.Described covering formula protected mode can be by a kind of movably protective cover; in the table top jet etching processing of chip; when chip after placing on the chip carrier; by the strength that self produced; or by external force protective cover is moved down to cover the surface portion that needs protection on the chip, protect the surface portion that needs protection on the chip not have acid solution when handling and spatter and soak infringement in that spray is rotten.Acid-proof soft material layer on the protective cover and the chip center position that needs protection can seamlessly fit together, and forms the rotten acid solution of handling of spray and can't spatter in immersing airtight.
Covering formula protection system according to said method comprises a chip pad 1 at least, is useful on the positioner 4 of positioning chip 2 on the chip pad 1, and chip 2 is placed on the positioner 4, and by positioner 4 location; One protective cover 3 is arranged above chip 2; the main body of protective cover 3 is the magnetic conductor of the disk-shaped structure of permeability magnetic material making; on the chip carrier 1 that chip 2 is placed, be provided with the magnetic force generating means; protective cover 3 is when chip table jet etching processing; be absorbed and fixed on the chip 2 by the magnetic force of magnetic force generating means; and hide on the position that chip center needs protection, to prevent that the chip table jet etching from not having acid solution and spattering and be dipped into the position that chip center needs protection when handling.The size of protective cover 3 and the chip center position that needs protection adapts, and protective cover 3 can move up and down along the axis direction of chip 2, to guarantee when the table top jet etching of chip 2 is handled, protective cover 3 can effectively cover the chip center position that needs protection, and prevents from that acid solution from spattering to soak the infringement chip center position that needs protection; In order to make protective cover 3 can be close to the chip center position that needs protection when the table top jet etching processing; make the protective cover 3 and the contact-making surface of chip 2 become one airtight; in protective cover 3 and the contacted part of chip one deck acid-proof soft material layer is arranged; and when the jet etching processing; the acid-proof soft material layer of protective cover 3 and the chip center position that needs protection is seamless fitting together, and forms the rotten acid solution of handling of spray and can't spatter in immersing airtight.
Embodiment one
Fig. 2 has provided a specific embodiment of the present utility model; from accompanying drawing 2 as can be seen; the utility model is the need protection means of defence and the device at position of the chip center in a kind of table top jet etching processing of high-power semiconductor device chip; described method is: when the rotten processing of chip table spray; the surface portion that needs protection on the chip is taked the protected mode of magnetic force adsorption cover, and the surface portion that needs protection on the protection chip is without prejudice.
This magnetic force adsorption cover device comprises a chip pad 1, is with locating ring 5 on the chip pad 1, and chip 2 is placed on the locating ring 5; Above the center of chip 2, have one to hide formula protective cover 7, the size of covering formula protective cover 7 and the chip center position that needs protection adapts, and the protective cover 7 of the formula of covering can move up and down along the axis direction of chip 2, to guarantee when the table top jet etching of chip 2 is handled, the protective cover 7 of covering formula be for effectively covering the chip center position that needs protection, and prevents from that acid solution from spattering to soak the infringement chip center position that needs protection; The main body of covering formula protective cover 7 is the magnetic conductor of ferrous metal material, is inlaid with magnetic force generating means 6 on chip pad 4, and magnetic force generating means 6 is a permanent magnetic iron.Permanent magnetic iron can will hide formula protective cover 7 by magnetic force when formula protective cover 7 moves down into to a certain degree and hold when hiding after chip 2 is placed in chip pad 1, make covering formula protective cover 7 be adsorbed on the position that needs protection above the center of chip 2.In order to make covering formula protective cover 7 can be close to the chip center position that needs protection when the table top jet etching processing; make the covering formula protective cover 7 and the contact-making surface of chip 2 become one airtight, at whole the be coated with one deck acid-proof soft material layers of the formula of covering protective cover 7 with contacted part of chip or the formula of covering protective cover 7.When the jet etching processing, the acid-proof soft material layer that hides formula protective cover 7 and the chip center position that needs protection is seamless fitting together, and forms the rotten acid solution of handling of spray and can't spatter interior airtight of immersion.
Embodiment two
Embodiment two is consistent with the structure of embodiment one substantially; just the magnetic force generating means of installing in chip pad 16 is not the permanent magnetic iron of inlaying; but the electromagnetism adsorbent equipment of installing; after chip 2 is placed in chip pad 1; as long as energising starts the electromagnetism adsorbent equipment; just can absorb, and make it be close to top, chip 2 centers to need protection on the position hiding formula protective cover 7.
Claims (4)
1. semiconductor part chip table sprays rotten magnetic force and adsorbs local protector; it is characterized in that: described semiconductor part chip table sprays rotten protector and comprises a protective cover at least; protective cover is when the rotten processing of chip table spray; just in time cover the position that needs protection in chip center, protective cover forms a sealing surface with chip.
2. semiconductor part chip table as claimed in claim 1 sprays rotten local protector; it is characterized in that: described protective cover be by suction type be adsorbed on the chip surface or directly cover on chip surface by external force means; the main body of protective cover is the magnetic conductor that permeability magnetic material is made; on the chip carrier that chip is placed, be provided with the magnetic force generating means; when covering is carried out the jet etching processing at chip table; be subjected to the magnetic force absorption of magnetic force generating means and be fixed on the chip, and hide on the position that chip center needs protection.
3. semiconductor part chip table as claimed in claim 2 sprays rotten local protector, it is characterized in that: described magnetic force suction type is permanent magnetism suction type or electromagnetism suction type.
4. semiconductor part chip table as claimed in claim 1 or 2 sprays rotten local protector, it is characterized in that: be to have the acid-proof soft material layer that certain flexible acid-proof soft material makes or be provided with one deck acid-proof soft material layer on the whole protecting cover with the contacted part of chip on the protective cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200645026U CN201084710Y (en) | 2007-09-20 | 2007-09-20 | A semiconductor-device chip surface spray-up magnetic-adsorption local protector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200645026U CN201084710Y (en) | 2007-09-20 | 2007-09-20 | A semiconductor-device chip surface spray-up magnetic-adsorption local protector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201084710Y true CN201084710Y (en) | 2008-07-09 |
Family
ID=39627182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200645026U Expired - Fee Related CN201084710Y (en) | 2007-09-20 | 2007-09-20 | A semiconductor-device chip surface spray-up magnetic-adsorption local protector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201084710Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103572342A (en) * | 2012-07-23 | 2014-02-12 | 崇鼎科技有限公司 | Shielding method for local surface treatment |
-
2007
- 2007-09-20 CN CNU2007200645026U patent/CN201084710Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103572342A (en) * | 2012-07-23 | 2014-02-12 | 崇鼎科技有限公司 | Shielding method for local surface treatment |
| CN103572342B (en) * | 2012-07-23 | 2016-04-20 | 崇鼎科技有限公司 | The screen method of topical surface treatment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080709 Termination date: 20150920 |
|
| EXPY | Termination of patent right or utility model |