CN201062205Y - Copper-ball vanadium removing device - Google Patents

Copper-ball vanadium removing device Download PDF

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Publication number
CN201062205Y
CN201062205Y CNU2007200850779U CN200720085077U CN201062205Y CN 201062205 Y CN201062205 Y CN 201062205Y CN U2007200850779 U CNU2007200850779 U CN U2007200850779U CN 200720085077 U CN200720085077 U CN 200720085077U CN 201062205 Y CN201062205 Y CN 201062205Y
Authority
CN
China
Prior art keywords
copper ball
copper
vanadium
retort
vanadium removal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2007200850779U
Other languages
Chinese (zh)
Inventor
张建达
李学舒
赵中友
黄敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHONGXING ELECTRONIC MATERIAL CO Ltd XIANTAO
Original Assignee
ZHONGXING ELECTRONIC MATERIAL CO Ltd XIANTAO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZHONGXING ELECTRONIC MATERIAL CO Ltd XIANTAO filed Critical ZHONGXING ELECTRONIC MATERIAL CO Ltd XIANTAO
Priority to CNU2007200850779U priority Critical patent/CN201062205Y/en
Application granted granted Critical
Publication of CN201062205Y publication Critical patent/CN201062205Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a copper ball vanadium removal device, which comprises a fine titanium storage tank and a raw material conveying pump. The material inlet opening of the fine titanium storage tank is connected with the material outlet opening of the copper ball reaction tank, isotropic copper balls are filled into the copper ball reaction tank, and the material inlet opening of the copper ball reaction tank is connected with the raw material conveying pump. The utility model has the advantages that the cost is low, the pollution is little, the vanadium removal quality is good, and the efficiency is good. Not only the advantage of good vanadium removal effect of copper wires is kept, but also the disadvantages that are solved batch operation is needed for vanadium removal of copper wires, and the regeneration washing operation is bothersome are overcome, thereby, the vanadium removal efficiency is greatly improved, the labor intensity of workers is decreased, and the production cost is reduced.

Description

Copper ball removes the vanadium device
Technical field
The utility model relates to the vanadium equipment that removes of titanium tetrachloride, especially relates to a kind of copper ball and removes the vanadium device.
Background technology
From titanium tetrachloride, remove vanadium, mainly contain copper wire, mineral oil and aluminium powder at present and remove the vanadium method for three kinds.Wherein, it is low to adopt mineral oil to remove the vanadium cost, but easily produces bulky residue liquid.After scabbing on the heated wall of these residues at equipment, cause the obstruction of rectifying tower, still, condenser and pipeline easily, and be difficult to clean; And remove and to contain in the titanium tetrachloride behind the vanadium that a small amount of organism is not easily separated dispels.Though adopt aluminium powder to remove vanadium, it is few to have a level of residue, is difficult for scabbing, and reclaims advantages such as vanadium easily from residue, and it is general higher and have explosiveness to remove the price of the employed superfine active aluminium powder of vanadium, uses safety inadequately.
Adopting copper wire vanadium removal, is copper wire to be rolled into copper wire balls and layering is packed into except that in the vanadium tower, allows gas phase titanium tetrachloride (136 ℃-140 ℃) contact with copper wire balls by removing the vanadium tower continuously, and it is lip-deep a kind of except that the vanadium means to make foreign matter of vanadium be deposited in copper wire; After the copper wire surface failure, will from tower, take out copper wire balls and wash method with water the copper wire surface cleaning, after super-dry, return in the tower and just can reuse.Though adopt copper wire vanadium removal effective, high-quality titanium tetrachloride obtained, but copper wire vanadium removal is a batch operation, the regeneration washing operation trouble of inefficacy copper wire balls, and labour intensity is big, and operating environment is poor, and the copper loss height, and copper-containing wastewater is seriously polluted; Also be not easy to therefrom reclaim vanadium in addition, it is higher therefore to remove the vanadium cost.
Summary of the invention
The utility model purpose provides a kind of copper ball and removes the vanadium device.From titanium tetrachloride, remove the existing cost height of vanadium to solve prior art, seriously polluted, technical problem such as of poor quality.
The utility model has also solved the existing copper wire balls regeneration of copper wire vanadium removal washing operation trouble simultaneously, and labour intensity is big, technical problems such as operating environment difference.
The utility model mainly solves above-mentioned technical problem by following technical proposals: it comprises smart titanium storage tank, former material conveying pump, the opening for feed of described smart titanium storage tank is connected with the discharge port of copper ball retort, be filled with the homogeneous copper ball in this copper ball retort, the opening for feed of described copper ball retort is connected with former material conveying pump.
As preferably, described copper ball surface compact is in contact with one another between each copper ball, and being deposited in the copper ball retort from level to level.
Characteristics such as the utility model adopts copper ball to remove vanadium, utilizes its surface-area big, and surfacing is smooth, rolling characteristics is good make the foreign matter of vanadium that is deposited in the copper ball surface be very easy to cleaning, even can allow it come off voluntarily and to be deposited in the copper ball retort.
Therefore, it is low to the utlity model has cost, pollutes for a short time, removes characteristics such as the vanadium quality is good, efficient height.It had both kept the effective advantage of former copper wire vanadium removal, had overcome copper wire vanadium removal palpus batch operation again, shortcomings such as regeneration washing operation trouble, thereby improve greatly and remove vanadium efficient, alleviate labor strength and reduced production cost.
Description of drawings
Below by the drawings and specific embodiments, the technical solution of the utility model is described in further detail.
Fig. 1 is the structural representation of a kind of preferred implementation of the utility model;
Fig. 2 is the structural representation of the horizontal placement of copper ball retort shown in Figure 1.
Embodiment
Fig. 1 is the structural representation of preferred implementation of the present utility model.This device mainly is made of smart titanium storage tank 1, former material conveying pump 8, copper ball retort 5 etc.Wherein copper ball retort 5 can vertically be placed, and also can horizontally place (horizontal placement is referring to the structural representation of the horizontal placement of copper ball retort shown in Figure 2).
The two ends up and down of copper ball retort 5 (or two ends, the left and right sides) are respectively equipped with discharge port 4 and opening for feed 7, in copper ball retort 5, be filled with homogeneous copper ball 6, its copper ball 6 surface compacts are also smooth smooth, are in contact with one another between each copper ball, and one deck being deposited in the copper ball retort 5 near one deck.For above-mentioned copper ball 6, as long as apply certain external force (allowing copper ball roll or vibrations), copper ball 6 surperficial foreign matter of vanadium just can come off very well voluntarily, so have alleviated the workload of handling again after the copper surface failure greatly.
The opening for feed 2 of smart titanium storage tank 1 is connected (its mode of connection can adopt ring flange to connect, and also can adopt welding to wait other habitual mode of connection) by pipeline 3 with the discharge port 4 of copper ball retort 5.The opening for feed 7 of copper ball retort 5 is connected with former material conveying pump 8.The titanium tetrachloride that contains foreign matter of vanadium is advanced in the copper ball retort 5 by former material conveying pump 8 pumps, during by 6 surfaces of copper ball one by one, chemical reaction takes place, foreign matter of vanadium is deposited in copper ball 6 surface goes up and become smart titanium tetrachloride, then should the essence titanium tetrachloride continue to rely on the pressure of former material conveying pump 7 to flow into smart titanium storage tank 1 and store.
Certainly, the shape of above-mentioned copper ball is not limited only to typical spheroid, when copper ball be shaped as ellipse and wait other shape the time, belong to protection domain of the present utility model equally.

Claims (2)

1. a copper ball removes the vanadium device, comprise smart titanium storage tank, former material conveying pump, it is characterized in that being connected with the discharge port of copper ball retort at the opening for feed of described smart titanium storage tank, be filled with the homogeneous copper ball in this copper ball retort, the opening for feed of described copper ball retort is connected with former material conveying pump.
2. copper ball according to claim 1 removes the vanadium device, it is characterized in that being in contact with one another between each copper ball at described copper ball surface compact, and being deposited in the copper ball retort from level to level.
CNU2007200850779U 2007-06-04 2007-06-04 Copper-ball vanadium removing device Expired - Fee Related CN201062205Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2007200850779U CN201062205Y (en) 2007-06-04 2007-06-04 Copper-ball vanadium removing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2007200850779U CN201062205Y (en) 2007-06-04 2007-06-04 Copper-ball vanadium removing device

Publications (1)

Publication Number Publication Date
CN201062205Y true CN201062205Y (en) 2008-05-21

Family

ID=39450574

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2007200850779U Expired - Fee Related CN201062205Y (en) 2007-06-04 2007-06-04 Copper-ball vanadium removing device

Country Status (1)

Country Link
CN (1) CN201062205Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101444781B (en) * 2008-12-19 2011-07-13 仙桃市中星电子材料有限公司 Device for cleaning vanadium-removing copper wire balls
CN106946286A (en) * 2017-03-09 2017-07-14 金川集团股份有限公司 A kind of crude titanic chloride is except the chemical reaction equipment and method of vanadium

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101444781B (en) * 2008-12-19 2011-07-13 仙桃市中星电子材料有限公司 Device for cleaning vanadium-removing copper wire balls
CN106946286A (en) * 2017-03-09 2017-07-14 金川集团股份有限公司 A kind of crude titanic chloride is except the chemical reaction equipment and method of vanadium

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080521

Termination date: 20110604