CN201048157Y - 基片集成波导馈电的印刷天线 - Google Patents
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
- H01Q9/28—Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines
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- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced with unbalanced lines or devices
- H01P5/107—Hollow-waveguide/strip-line transitions
Abstract
基片集成波导馈电的印刷天线涉及一种应用于无线通信、电子侦察与对抗及雷达等领域的天线及馈电技术，特别适合于天馈线需要与系统实现平面集成和密封的应用场合。该天线的基片集成波导(2)由介质基片(1)上下两面的金属面(21)和贯穿于上下两层金属面(21)的金属化通孔阵列(22)围成的区域构成，该上下两面的金属面(21)轴对称设置；其中，在介质基片(1)的上下表面，在基片集成波导(2)中心线的一侧连接有双线传输线的渐变过渡段(3)，在渐变过渡段(3)的外端即渐变过渡线平衡端连接有振子天线(4)；在基片集成波导(2)上与渐变过渡段(3)相对称的另一侧连接有微带过渡转接器(6)，微带过渡转接器(6)的外侧连接微带传输线(7)。
Description
技术领域
本实用新型涉及一种应用于无线通信、电子侦察与对抗及雷达等领域的天线及馈电技术，该天馈线采用基片集成波导(Substrate Integrated Waveguide SIW)馈电及平面印刷电路技术，特别适合于天馈线需要与系统实现平面集成和密封的应用场合。
背景技术
电子设备中的天馈线常用的同轴线、矩形波导及与这些传输线相适应的天线结构大多是传统的三维结构。它们具有高功率容量、低损耗的优点，但加工成本高，不适合与现代平面电路集成。为适应系统集成和设备轻量化的要求，人们提出了多种适合平面印刷工艺的天馈线技术，其中包括微带线、槽线、共面波导等，以及与这些传输线相适应的各种天线，如各种微带天线和印刷形式的天线。这些技术虽然较好地解决了与电路集成的要求，但也存在着诸如功率容量小、损耗大、因结构开放而不便密封等问题。在许多需要电路与天线之间隔开的场合，通常的办法是将隔墙开孔让微带线等开放结构的传输线穿过，或通过同轴接头转接。前者不便密封，后者增加了复杂性和体积、成本。基片集成波导(SIW)技术克服了传统三维结构传输线和一般平面传输线缺点。SIW技术在保持传统波导高功率、低损耗优点的同时，还保留了一般平面印刷传输线易于集成、轻量化、易加工、便于密封等优点，但适合SIW馈电的天线种类还不是很多。因此需要研究一种新方法解决天馈线集成、天馈线与电路集成及密封问题。
发明内容
技术问题：本实用新型的目的是提出一种基片集成波导馈电的印刷天线，使其能很好地满足天馈线与电路集成和密封的要求，同时扩展SIW技术在天线领域的应用范围，使之适用于多种应用场合。该天馈线具有功率容量大、损耗小、体积小、成本低、便于批量生产等优点。
技术方案：本实用新型的天线及馈电技术基于SIW技术、SIW与渐变双线、微带线过渡及印刷振子天线技术。采用SIW传输，通过SIW-双线过渡给印刷振子天线馈电，电路与天线之间的隔板(或天线的反射板)上开缝隙，天线用SIW段穿过缝隙实现与隔板内侧电路密封连接。
本实用新型的基片集成波导馈电的印刷天线，包括一块介质基片，和在介质基片上的基片集成波导，其特征在于该天线的基片集成波导由介质基片上下两面的金属面和贯穿于上下两层金属面的金属化通孔阵列围成的区域构成，该上下两面的金属面轴对称设置；其中，在介质基片的上下表面，在基片集成波导中心线的一侧连接有双线传输线的渐变过渡段，在渐变过渡段的外端即渐变过渡线平衡端连接有振子天线；在基片集成波导上与渐变过渡段相对称的另一侧连接有微带过渡转接器，微带过渡转接器的外侧连接微带传输线。
在以上结构的基础上还可有以下的结构：在基片集成波导上的渐变过渡段的一旁设有寄生杆。在基片集成波导上的渐变过渡段的两旁分别设有寄生杆。在渐变过渡段两旁对称于介质基片两侧的寄生杆，由第五金属化通孔阵列连接。
在对称于介质基片上的振子天线的另一侧设有对称振子天线的第一矩形金属条带和第二矩形金属条带，并由第四金属化通孔阵列将振子天线与对称振子天线的第一矩形金属条带和第二矩形金属条带连接。
有益效果：本实用新型具有如下优点：
1.由于采用基片集成波导作为天线馈线，使天线与电路之间密封更简单方便和经济。电路盒隔板或天线反射板可直接压在基片集成波导的上下底面上(图1、图2中的21)，不需要在隔板上另外开孔或附加任何转接措施，便既能达到密封的目的也不会影响信号传输。
2.以渐变线的方式实现了波导到双线(TE波到TEM波)的直接变换，实现了SIW为振子天线馈电，扩展了SIW技术在天线领域里的应用范围。
3.采用基片集成波导作为天线馈线，与微带、共面波导等传输线相比功率容量大，损耗小。
4.用金属化通孔阵列将单面结构扩展为双面对称印刷结构，增加了结构对称性，改善了交叉极化和带宽性能。增加寄生元件实现对天线E面波束宽度的控制、降低阵列E面互耦。
5.整个天馈线的各部分集成为一体，结构简单，全部利用PCB工艺生产，成本低、精度高、重复性好，适合大批量生产。
附图说明
图1是基本型基片集成波导馈电的印刷天线结构示意图。
图2是双面对称印刷结构的基片集成波导馈电的印刷天线结构示意图。
以上的图中有：介质基片1，基片集成波导2，介质基片上下两面的金属层21，两行金属化通孔阵列22，基片集成波导的波导宽边23，基片集成波导与双线传输线的渐变过渡段3，渐变过渡段在基片集成波导宽边上的输入端31，渐变过渡段的平衡输出端32，振子第一臂41，振子第二臂42，振子第一臂41，振子第二臂42构成振子天线4，金属化通孔阵列4a，第一矩形金属条带41b，第二矩形金属条带42b，寄生杆5，金属化通孔阵列5a，寄生杆5对面形状与5相同的金属条带5b，基片集成波导-微带过渡转接器6，微带传输线7。
具体实施方式
基片集成波导馈电的印刷天线(如图1所示)包括一块介质基片1，在介质基片1上的基片集成波导2(基片集成波导2由介质基片上下两面的金属21和贯穿于上下两层金属面的金属化通孔阵列22围成的区域构成)，基片集成波导与双线传输线的渐变过渡段3，与渐变过渡线平衡端连接的振子天线的两个臂振子第一臂41，振子第二臂42，寄生杆5和基片集成波导-微带过渡转接器6与微带传输线7，渐变过渡段的输入端31与基片集成波导在基片上下两侧的波导宽边23中心处连接，渐变过渡段的平衡输出端32连接印刷振子的第一臂41和第二臂42，振子第一臂41，振子第二臂42构成振子天线4，在振子第一臂41和第二臂42下方的寄生杆5为可选元件，可用以展宽天线E面方向图波束宽度，在阵列中还用以减小天线单元间E面互耦，为与电路的微带线连接，基片集成波导的另一端通过基片集成波导-微带过渡转接器6与微带传输线7相连，在图1结构的基础上通过用金属化通孔阵列4a将振子第一臂41、振子第二臂42分别与其相对的第一矩形金属条带41b，第二矩形金属条带42b连接，用金属化通孔阵列5a把寄生杆5与基片对面形状与5相同的金属条带5b连接(如图2所示)，使工作带宽增加，交叉极化性能得到改善。
实施例1带有金属反射板的基片集成波导馈电的印刷天线。
天线结构如图2所示，尺寸单位均为mm。金属反射板尺寸为150×150×4(L×W×H)，在反射板上开有43×1的缝隙让带有基片集成波导和印刷天线的介质基片穿过。本实施例的基片尺寸为43×44×1。反射板一侧为向外辐射的天线，另一侧为SIW和与电路连接的过渡转接。使缝隙位于SIW处，这样即可达到密封、隔离的目的，又不会因为金属反射板上的缝隙与基片上下两面的金属连接而造成射频信号的短路。
实施例2与电路屏蔽盒实现密封连接的基片集成波导馈电的印刷天线阵。
由基片集成波导馈电的印刷天线通过反射板及屏蔽盒壁上的缝隙与电路屏蔽盒内部的电路实现密封连接的天线阵结构，实例为8×8的阵列，每块天线板上加工有按水平方向排列的8个如图1或图2所示结构的基片集成波导馈电的印刷天线单元(为画图方便示意图中用图1结构表示)，每个单元由SIW段通过反射板及电路盒壳体上的缝隙与电路盒内部对应的电路连接，共有8层这样的电路盒及天线板垂直排列构成8×8的阵列。由于每层电路盒的缝隙直接压接在SIW上而不会影响信号传输，缝隙处涂密封胶也不会对信号传输造成影响，所以这种结构的天线能很好地解决天线与电路之间的气密、水密连接问题。
本专利工作得到国家自然科学基金委创新群体基金60621002的资助。
Claims (5)
1.一种基片集成波导馈电的印刷天线，包括一块介质基片(1)，和在介质基片(1)上的基片集成波导(2)，其特征在于该天线的基片集成波导(2)由介质基片(1)上下两面的金属面(21)和贯穿于上下两层金属面(21)的金属化通孔阵列(22)围成的区域构成，该上下两面的金属面(21)轴对称设置；其中，在介质基片(1)的上下表面，在基片集成波导(2)中心线的一侧连接有双线传输线的渐变过渡段(3)，在渐变过渡段(3)的外端即渐变过渡线平衡端连接有振子天线(4)；在基片集成波导(2)上与渐变过渡段(3)相对称的另一侧连接有微带过渡转接器(6)，微带过渡转接器(6)的外侧连接微带传输线(7)。
2.根据权利要求1所述的基片集成波导馈电的印刷天线，其特征在于在基片集成波导(2)上的渐变过渡段(3)的一旁设有寄生杆(5)。
3.根据权利要求1或2所述的基片集成波导馈电的印刷天线，其特征在于在基片集成波导(2)上的渐变过渡段(3)的两旁分别设有寄生杆(5)。
4.根据权利要求3所述的基片集成波导馈电的印刷天线，其特征在于在渐变过渡段(3)两旁对称于介质基片(1)两侧的寄生杆(5)，由第五金属化通孔阵列(5a)连接。
5.根据权利要求1所述的基片集成波导馈电的印刷天线，其特征在于在对称于介质基片(1)上的振子天线(4)的另一侧设有对称振子天线的第一矩形金属条带(41b)和第二矩形金属条带(42b)，并由第四金属化通孔阵列(4a)将振子天线(4)与对称振子天线的第一矩形金属条带(41b)和第二矩形金属条带(42b)连接。
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| CN110112560B (zh) * | 2019-06-06 | 2020-10-23 | 电子科技大学 | 一种应用于波束扫描的毫米波宽带宽角圆极化天线 |
| CN110112560A (zh) * | 2019-06-06 | 2019-08-09 | 电子科技大学 | 一种应用于波束扫描的毫米波宽带宽角圆极化天线 |
| CN110492241A (zh) * | 2019-07-16 | 2019-11-22 | 清华大学 | 一种应用于5g毫米波移动终端的大角度扫描的天线阵列 |
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