CN201048127Y - Wafer temporary storing apparatus - Google Patents
Wafer temporary storing apparatus Download PDFInfo
- Publication number
- CN201048127Y CN201048127Y CNU2007200692084U CN200720069208U CN201048127Y CN 201048127 Y CN201048127 Y CN 201048127Y CN U2007200692084 U CNU2007200692084 U CN U2007200692084U CN 200720069208 U CN200720069208 U CN 200720069208U CN 201048127 Y CN201048127 Y CN 201048127Y
- Authority
- CN
- China
- Prior art keywords
- wafer
- drive bearing
- lift
- temporary storage
- bearing platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Abstract
The utility model provides a wafer temporary storage device which comprises a cavity body and an inlet/outlet chip port on the outer wall of the cavity body, an elevator positioned at the bottom outside the cavity body, a drive bearing platform positioned under the elevator and used for clamping drive bearings, a drive bearing which passes through the drive bearing platform to be connected with the elevator, a motor positioned under the drive bearing platform and connected with the drive bearing, and a position built-in fitting arranged on the drive bearing platform. The position built-in fitting is positioned at the bottom of the elevator and in the projection range of the drive bearing platform, and the distance between the position built-in fitting and the bottom of the elevator keeps in a setting deviation range. The wafer temporary storage device provided in the utility model avoids a wafer from impacting a mechanical arm for delivering the wafer or the outer wall of processing equipment when passing through the inlet/outlet chip port of the cavity body, thereby preventing the wafer from being damaged.
Description
Technical field
The utility model relates to a kind of wafer apparatus for temporary storage.
Background technology
In semi-conductive manufacturing process, comprise for example oxidation of various processing procedures, photoetching, doping, deposition etc.
After a certain processing procedure of having finished for wafer, just wafer need be transmitted to next processing procedure.Before wafer is transported to some processing procedures by conveyer, all can temporarily be stored in the wafer apparatus for temporary storage.The wafer apparatus for temporary storage is temporarily parking a little of a wafer in fact, and after wafer did not carry out processing procedure or finishes processing procedure, the wafer apparatus for temporary storage can temporarily be deposited wafer; And but when the silicon wafer process time spent, the wafer apparatus for temporary storage will be transported to wafer the receiving port place of process apparatus, and process apparatus receives wafer from receiving port and carries out making technology for wafer.
Existing wafer apparatus for temporary storage comprises advancing on the cavity 1 that is used to deposit wafer and cavity 1 outer wall/piece mouth 2, is fixed in the cavity outer bottom and is used for driving the lift 3 that cavity 1 rises and descend, the motor 4 that is positioned at the drive bearing platform 6 of lift 3 below clamping drive bearings 5 and is used for controlling lift 3 runnings as shown in Figure 1.Wherein motor 4 is controlled lift 3 runnings by drive bearing 5, and when motor 4 control drive bearings 5 forward rotation, lift 3 will drive cavity 1 and rise, and when motor 4 control drive bearings 5 backwards rotation, lift 3 will drive cavity 1 and descend.But when the silicon wafer process time spent, silicon wafer process equipment will send the signal that wafer is provided to the wafer apparatus for temporary storage, wafer apparatus for temporary storage system will notify motor 4 to make lift 3 that cavity 1 is risen to the receiving port place of process apparatus by control drive bearing 5 forward rotation, obtains wafer and carries out making technology by receiving port advancing from cavity 1 outer wall/piece mouth 2 for process apparatus.And after process apparatus obtained wafer, the wafer apparatus for temporary storage will be notified motor 4 by control drive bearing 5 backwards rotation lift 3 drive cavitys 1 to be lowered and receive the wafer that a last processing procedure transmits.
But because it is generally all heavier to deposit the cavity of wafer, after use after a while, because the effect of gravity inertial, the minimum correction position of the lift of wafer apparatus for temporary storage will be shifted downwards.
And since the position of the receiving port of each wafer all fix, displacement will cause wafer can not accurately be passed in and out by advancing on the cavity/piece mouth when the cavity of turnover wafer apparatus for temporary storage, and can collide the upper edge of the mechanical arm that transmits wafer or the outer wall of process apparatus, make wafer breakage, and damaged wafer can not satisfy customer requirement.
The utility model content
Problem to be solved in the utility model is that the cavity of existing wafer apparatus for temporary storage is shifted, and causes the problem of wafer breakage.
For addressing the above problem, the utility model provides a kind of wafer apparatus for temporary storage, comprise,
Advancing on cavity and the chamber outer wall/piece mouth;
Be positioned at the lift of cavity outer bottom;
Be positioned at the drive bearing platform of lift below clamping drive bearing;
Pass the drive bearing that the drive bearing platform is connected with lift;
Be positioned at drive bearing platform below, and the motor that is connected with drive bearing;
And being arranged at fixed-site part on the drive bearing platform, described fixed-site part is positioned at the drop shadow spread of lift bottom at the drive bearing platform, and remains in the deviation range of setting with the distance of lift bottom.
Compared with prior art, the utlity model has following advantage: wafer apparatus for temporary storage of the present utility model is fixed for the position of lift by installation site fixture on the drive bearing platform, prevent the lift displacement, thereby the mechanical arm of having avoided wafer to collide by the advancing of cavity/piece mouth turnover the time transmitting wafer or the outer wall of process apparatus have been avoided wafer breakage.
Description of drawings
Fig. 1 is existing wafer apparatus for temporary storage schematic diagram;
Fig. 2 is the wafer apparatus for temporary storage schematic diagram of the utility model embodiment.
Embodiment
Wafer apparatus for temporary storage of the present utility model is fixed for the position of lift by installation site fixture on the drive bearing platform, prevents the lift displacement.
The utility model wafer apparatus for temporary storage is that example makes that the structure of the utility model wafer apparatus for temporary storage is clearer with a preferred implementation, as shown in Figure 2, comprises,
Advancing/piece mouth 20 on cavity 10 and cavity 10 outer walls, wherein cavity 10 is used for depositing wafer, and by advance/piece mouth 20 receives and sends wafer;
Be positioned at the lift 30 of cavity 10 outer bottoms, be used for driving cavity 10 and rise or descend;
Be positioned at the drive bearing platform 70 of lift 30 below clamping drive bearings 50;
Pass the drive bearing 50 that drive bearing platform 70 is connected with lift 30;
Be positioned at drive bearing platform 70 belows, and the motor 40 that is connected with drive bearing 50, make lift 30 rise or descend in order to control drive bearing 50 forwards or backwards rotation;
And being arranged at fixed-site part 60 on the drive bearing platform 70, described fixed-site part 60 is positioned at the drop shadow spread of lift 30 bottoms at drive bearing platform 70, and remains in the deviation range of setting with the distance of lift 30 bottoms.Described fixed-site part 60 is in order to fix for the position of lift 30 to prevent lift 30 displacements.
Described drive bearing 50 is a threaded rod, with lift 30 riveted joints.
The motor of described motor 40 for having the self feed back function.
Described fixed-site part 60 is a screw, be riveted on the drive bearing platform 70, and the minimum correction position in the bottom of distance elevating machine remains in the deviation range of setting, and described deviation range is 1-2mm.
As previously mentioned because gravity inertial, the minimum correction position of lift 30 may owing to the wafer apparatus for temporary storage after use after a while and be subjected to displacement downwards.The described deviation range that has surpassed setting in other words with respect to the distance of normal place that is subjected to displacement.Can place 12 wafer in the cavity 10 of the wafer apparatus for temporary storage of the utility model embodiment, and per 2 wafer can be defined by a layer (slot), for being positioned at cavity 10 nethermost two wafer is exactly ground floor, and two wafer on this two wafer are exactly the second layer, by that analogy, 12 wafer just have been divided into ground floor, the second layer, the 3rd layer, the 4th layer, layer 5 and layer 6.For the position of each layer, all can define the position of each layer to the distance of this plane of reference with each layer with the horizontal plane of a standard as reference face.It is as shown in table 1,
Table 1
| The position project | Normal place |
| Ground floor | 299450 |
| The second layer | 297165 |
| The 3rd layer | 294880 |
| The 4th layer | 292595 |
| |
290310 |
| |
288025 |
For example, be the plane of reference with a horizontal plane of wafer apparatus for temporary storage top, measure at normal wafer apparatus for temporary storage, promptly in the wafer apparatus for temporary storage that is shifted of the minimum correction position of lift 30 each layer to the distance of the plane of reference.Because moving up and down of lift 30 leans on 50 rotations of motor 40 control drive bearings to realize, therefore each layer is unit with the distance of motor 40 motions just to the distance of the plane of reference, and the distance that motor 40 moves among the utility model embodiment is with the step-length unit of being used as.For example, as shown in table 1, motor 40 control drive bearings 50 make lift 30 control cavitys 10 rise, and make the position of the ground floor in the cavity 10 flush with the plane of reference, the move distance that reaches this degree motor 40 was 299450 steps, and the normal place of ground floor is exactly 299450 so.By that analogy, the normal place that can know the second layer, the 3rd layer, the 4th layer, layer 5 and layer 6 is respectively 297165,294880,292595,290310 and 288025.
As previously mentioned, the motor 40 of the wafer apparatus for temporary storage of the utility model embodiment is the motor with self feed back function, has the number of turns that the motor of self feed back function can be rotated during with motor operation and feed back to control wafer apparatus for temporary storage operated system in the process of running.System is according to the number of turns of motor feedback, and combination just can access the distance that makes lift 30 motions along with motor 40 control drive bearings, 50 rotations as the thread size of the threaded rod of drive bearing 50 again.Under normal circumstances, the position of each layer of obtaining of the rotation number of turns by motor 40 feedback should be exactly the physical location of each layer.And the position that obtains according to this feedback usually just can judge whether lift 30 displacement has taken place.But it is said just because of the front, reason owing to gravity inertial, displacement has taken place downwards in the minimum correction position of lift 30, thereby the position of each layer of obtaining of the rotation number of turns by motor 40 feedback may not be the physical location of each layer, is equipped with certain deviation with actual bit.Therefore, light can not judge whether really to have taken place displacement by the position of each layer that motor 40 feedbacks obtain, and may omit the phenomenon that has been shifted.
Thereby the wafer apparatus for temporary storage of the utility model embodiment is used as fixed-site part 60 by mounting screw on drive bearing platform 70 and fixes for the position of lift 30.As previously mentioned, the distance of the minimum correction position in bottom of screw distance elevating machine keeps 1-2mm, and this number range is exactly the normal deviate scope of setting.When displacement downwards takes place in lift 30, if translocation distance surpasses 2mm, the bottom of lift 30 will be withstood by screw so, thereby has prevented that lift 30 from continuing to be shifted, and guaranteed that the position of each layer in the cavity 10 remains in the acceptable normal deviate scope downwards.In addition, another benefit of using screw is if the normal deviate scope of setting need adjust the time, also can be screwed into the distance that the degree of depth of drive bearing platform 70 is come the minimum correction position of adjustment screw and lift 30 bottoms by adjustment screw, therefore more convenient.Certainly, fixed-site part 60 also can use the hard straight-bar, equally can be after lift 30 displacement downwards to be above the deviation range of setting, and the bottom of withstanding lift 30 prevents that lift 30 from continuing displacement.
And, optical detection device is installed on the wafer apparatus for temporary storage for the effect of check position fixture 60, be included on the sidewall of lift 30 light launcher is installed, and be provided with the light receiving system on the opposite of light launcher.When making that when motor 40 control drive bearings 50 lift 30 moves up and down, the position of ray cast on the light receiving system of being launched by light launcher also can move up and down, and so just can whether displacement take place for lift 30 and measure.Usually setting positive and negative 1-2mm is acceptable normal deviate scope, if and the position of lift 30 has differed more than the 2mm with respect to standard value, so just can think that this moment, displacement took place lift 30, control wafer apparatus for temporary storage operated system and will report to the police this moment.
Certainly, except the method that said light detects, we also can use linear range register (linear encoder) to come to obtain for the move distance measurement of lift 30 position of each layer in the cavity 10.The linear range register is used for representing that each layer position also is unit with the step-length.When represented step-length has surpassed set point, that is to say that the position of each layer has exceeded the deviation range of setting, the linear range register will be reported to the police to control wafer apparatus for temporary storage operated system.
The physical location of each layer is as shown in table 2 in the cavity 10 that the linear range register is measured,
Table 2
| The position project | Normal place | Physical location |
| Ground floor | 299450 | 299451 |
| The second layer | 297165 | 297166 |
| The 3rd layer | 294880 | 294880 |
| The 4th layer | 292595 | 292594 |
| |
290310 | 290310 |
| |
288025 | 288025 |
Can see that from table 2 the utility model embodiment wafer apparatus for temporary storage that has adopted fixed-site part 60 is after use after a while, the physical location of each layer still remains within the standard deviation scope.
Thereby the wafer apparatus for temporary storage of the utility model embodiment by the fixed-site part with lift owing to the distance that the reason of gravity inertial moves is limited within the deviation range, and by optical detection device or the displacement of linear range register detecting lift, and provide warning, thereby collide the mechanical arm of transmission wafer or the outer wall of process apparatus when having avoided wafer to pass in and out, avoided wafer breakage in import/export by cavity.
Claims (7)
1. a wafer apparatus for temporary storage comprises,
Advancing on cavity and the chamber outer wall/piece mouth;
Be positioned at the lift of cavity outer bottom;
Be positioned at the drive bearing platform of lift below clamping drive bearing;
Pass the drive bearing that the drive bearing platform is connected with lift;
Be positioned at drive bearing platform below, and the motor that is connected with drive bearing;
It is characterized in that, also comprise the fixed-site part that is arranged on the drive bearing platform, described fixed-site part is positioned at the drop shadow spread of lift bottom at the drive bearing platform, and the distance bottom lift remains in the deviation range of setting.
2. wafer apparatus for temporary storage as claimed in claim 1 is characterized in that described deviation range is 1-2mm.
3. wafer apparatus for temporary storage as claimed in claim 2 is characterized in that, described fixed-site part is the hard straight-bar.
4. wafer apparatus for temporary storage as claimed in claim 2 is characterized in that, described fixed-site part is a screw.
5. as each described wafer apparatus for temporary storage of claim 1 to 4, it is characterized in that described drive bearing is a threaded rod, and rivet with lift.
6. wafer apparatus for temporary storage as claimed in claim 5 is characterized in that, described motor is the motor with self feed back function.
7. wafer apparatus for temporary storage as claimed in claim 1 is characterized in that, also comprises optical detection device or the linear range register detected for the displacement of lift.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200692084U CN201048127Y (en) | 2007-04-20 | 2007-04-20 | Wafer temporary storing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200692084U CN201048127Y (en) | 2007-04-20 | 2007-04-20 | Wafer temporary storing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201048127Y true CN201048127Y (en) | 2008-04-16 |
Family
ID=39300719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200692084U Expired - Lifetime CN201048127Y (en) | 2007-04-20 | 2007-04-20 | Wafer temporary storing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201048127Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102376608A (en) * | 2010-08-25 | 2012-03-14 | 无锡华润上华半导体有限公司 | Wafer transfer method and device |
| CN111146117A (en) * | 2019-12-10 | 2020-05-12 | 华虹半导体(无锡)有限公司 | Wafer movement monitoring method and glue spreading developing machine |
-
2007
- 2007-04-20 CN CNU2007200692084U patent/CN201048127Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102376608A (en) * | 2010-08-25 | 2012-03-14 | 无锡华润上华半导体有限公司 | Wafer transfer method and device |
| CN111146117A (en) * | 2019-12-10 | 2020-05-12 | 华虹半导体(无锡)有限公司 | Wafer movement monitoring method and glue spreading developing machine |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20190148201A1 (en) | Wafer positioning and loading system | |
| CN1441294A (en) | Base board plying-up device and its method and base board detector | |
| CN101217127B (en) | Method and device for photoelectric switch dynamically regulating silicon slice deviation | |
| JP2010162686A (en) | Tool body detection system and tool body detection method of rotary cutting tool | |
| CN201048127Y (en) | Wafer temporary storing apparatus | |
| WO2023004883A1 (en) | Wafer alignment device, method and system | |
| CN104608420B (en) | A kind of blanking system of full-automatic mold pressing modular system | |
| CN108328264A (en) | A kind of axis class auto-delivery type feed bin | |
| CN205352324U (en) | Detection device is foreseen to three -dimensional size detection of part machine lower | |
| CN104681475A (en) | Wafer location calibrating device | |
| CN104589566B (en) | Blanking device of fully-automatic mold pressing sizing equipment | |
| CN109533962A (en) | A kind of automatic charging device of triangle foot prop | |
| CN108213733A (en) | Automatic laser cutting machine | |
| CN218836157U (en) | Multi-drill-bit punching equipment for punching pipeline | |
| CN207566469U (en) | The handling equipment of circuit board testing machine | |
| JP2018049963A (en) | Component mounting machine | |
| JP2010003844A (en) | Semiconductor manufacturing apparatus, wafer position control method, and wafer position control system | |
| CN101640166B (en) | Substrate transmission device and control system and control method thereof | |
| CN113206019B (en) | Device and method for detecting warping degree of wafer | |
| CN108466828A (en) | One kind dividing brush all-in-one machine automatical feeding system and method | |
| JP2006103908A (en) | Stacker crane | |
| JP6571360B2 (en) | Component mounter | |
| CN207932550U (en) | A kind of axis class auto-delivery type feed bin | |
| CN207963810U (en) | A kind of vertical bonding machine tooling detecting system | |
| KR20100062294A (en) | Apparatus for calibrating height of wafer cassette and method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20121116 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20121116 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
| CX01 | Expiry of patent term |
Granted publication date: 20080416 |
|
| CX01 | Expiry of patent term |