CN201041993Y - A semiconductor temperature difference power generation device - Google Patents

A semiconductor temperature difference power generation device Download PDF

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Publication number
CN201041993Y
CN201041993Y CNU2007200478911U CN200720047891U CN201041993Y CN 201041993 Y CN201041993 Y CN 201041993Y CN U2007200478911 U CNU2007200478911 U CN U2007200478911U CN 200720047891 U CN200720047891 U CN 200720047891U CN 201041993 Y CN201041993 Y CN 201041993Y
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China
Prior art keywords
semiconductor
generating element
heat pipe
semiconductor generating
generation apparatus
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Expired - Fee Related
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CNU2007200478911U
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Chinese (zh)
Inventor
李可礼
黄庆东
赖锦芳
李捷
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Individual
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Priority to CNU2007200478911U priority Critical patent/CN201041993Y/en
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Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to the power generation field, in particular to a semi-conductor thermoelectric generating device, which comprises radiation fins, a fixing plate, a thermal baffle and a semiconductor generating component, wherein, the semiconductor generating component and the thermal baffle are fixed on the fixing plate; the radiation fins are fixed on the semiconductor generating component. The utility model is characterized in that the fixing plate is also provided with a heat conduction pipe, which is positioned below the semiconductor generating component and connected to a pipeline for transmitting residual heat produced by a thermal power device, a diesel generating device or a nuclear power device, so that the semiconductor generating component can perform thermoelectric generation with the residual heat produced by the thermal power device, the diesel generating device or the nuclear power device. Without increase of resource consumption, the utility model generates power with residual heat and reduces damage to the environment, thereby not only increasing the economic benefit of an enterprise but also complying with human requirements on environment protection.

Description

A kind of semiconductor thermo-electric generation apparatus
Technical field
The utility model relates to power field, particularly a kind of semiconductor thermo-electric generation apparatus.
Background technology
Existing generation technology, no matter be traditional thermoelectricity, still more advanced nuclear power technology, all to consume a large amount of energy in order to generate electricity, while also produces a large amount of cooling waters, waste heat, and these cooling waters, waste heat are not used effectively more just directly to be entered in the atmosphere, has both wasted the energy, not environmental protection again.
The utility model content
The purpose of this utility model is in order to make full use of cooling water, the waste heat that equipment such as existing thermoelectricity, diesel power generation, nuclear power are discharged, under the prerequisite that need not increase energy resource consumption, utilize waste heat to generate electricity, reduce and give the destruction that environment brought, both increase economic benefit of enterprises, met human environmental requirement again.
The purpose of this utility model realizes by following proposal:
The utility model is a kind of semiconductor thermo-electric generation apparatus, comprise fin, fixed head, thermal insulation board and semiconductor generating element, semiconductor generating element and thermal insulation board are packed on the fixed head, fin is fixed on the semiconductor generating element, be characterized in also being provided with on the fixed head heat pipe, be positioned at semiconductor generating element below, described heat pipe is connected with the pipeline that is used to conduct thermoelectricity, diesel power generation, waste heat that nuclear power generating equipment produces.The semiconductor generating element utilizes the waste heats that equipment produced such as thermoelectricity, diesel power generation, nuclear power to carry out thermo-electric generation.
Described semiconductor generating element, thermal insulation board are fixed on the heat pipe by elastic lock.
Described heat pipe is provided with the connector that is connected with elastic lock, and connector and heat pipe are an integral body.
In the described heat pipe through hole is arranged, by getting final product, through hole is provided with the heat radiation netting twine in heat pipe for various liquid, steam, and the heat radiation netting twine is convenient to distributing of through hole interior heat amount.
Respectively there is an interface at described heat pipe two ends, so that various liquid, steam enter in the heat pipe.
Have on the described fin and be used for the square groove that is connected with elastic lock, elastic lock one end is fixed on the connector of heat pipe, and the other end is stuck in the square groove, and fin, semiconductor generating element, thermal insulation board, heat pipe are fixed together.
Be provided with water cooled pipeline between described semiconductor generating element and the fin, make the cooling effect of fin more obvious.
What the semiconductor generating element was produced is DC power supply, both can directly use according to actual needs, also can be connected to the grid by the power transmission and transformation technology.Its method is that a large amount of semiconductor generating elements is carried out series and parallel, produces utilization power transmission and transformation technology behind big electric current, the voltage, is connected to the grid.By being carried out various forms of series parallel circuits, the semiconductor generating element can form needed electric current and voltage.
This programme has simple in structure, and is easy to make, and system operation cost is low, the characteristics of remarkable in economical benefits.
Compared with prior art, the utility model has the advantages that:
1, use semiconductor thermo-electric generation apparatus, pollution-free, noiseless helps environmental protection, reduces the greenhouse effect that atmosphere is produced;
2, make full use of the cooling water that equipment produced, waste heats such as thermoelectricity, diesel power generation, nuclear power and generate electricity and both saved the energy, improved economic benefit of enterprises again.
3, generating element is simple in structure, is advanced semiconductor components and devices, need not carry out mechanical maintenance, and is easy to maintenance, no movement parts, and the life-span is long, is a kind of never wornout generating set.
Description of drawings
Fig. 1 is the structural representation of the semiconductor thermo-electric generation apparatus of embodiment 1;
Fig. 2 is the A-A cutaway view of Fig. 1;
Fig. 3 is the structural representation of the semiconductor thermo-electric generation apparatus of embodiment 2;
Fig. 4 is the B-B cutaway view of Fig. 3.
Among the figure: fin 1, heat pipe 2, fixed head 3, elastic lock 4, thermal insulation board 5, semiconductor generating element 6, square groove 7, water cooled pipeline 8, connector 9, through hole 10, heat radiation netting twine 11.
Embodiment
Embodiment 1
The utility model is a kind of semiconductor thermo-electric generation apparatus, as shown in Figure 1, 2, comprise fin 1, heat pipe 2, fixed head 3, elastic lock 4, thermal insulation board 5, semiconductor generating element 6, semiconductor generating element 6 is packed on the fixed head 3 with thermal insulation board 5, fin 1 is fixed on the semiconductor generating element 6, also be provided with heat pipe 2 on the fixed head 3, be positioned at semiconductor generating element 6 belows, heat pipe 2 is connected with the pipeline that is used to conduct thermoelectricity, diesel power generation, waste heat that nuclear power generating equipment produces.Semiconductor generating element 6 utilizes the waste heats that equipment produced such as thermoelectricity, diesel power generation, nuclear power to carry out thermo-electric generation.Semiconductor generating element 6, thermal insulation board 5 are fixed on the heat pipe 2 by elastic lock 4.Heat pipe 2 is provided with the connector 9 that is connected with elastic lock 4, and connector 9 is an integral body with heat pipe 2; Be provided with through hole 10 in the heat pipe 2, respectively there is an interface at two ends, so that various liquid, steam enter in it and passes through, through hole is provided with heat radiation netting twine 11.Have on the fin 1 and be used for the square groove 7 that is connected with elastic lock 4, elastic lock 4 one ends are fixed on the connector 9 of heat pipe 2, and the other end is stuck in the square groove 7, and fin 1, semiconductor generating element 6, thermal insulation board 5, heat pipe 2 are fixed together.
When the waste heat that equipment produced, steam such as thermoelectricity, diesel power generation, nuclear power enter heat pipe 2 by pipeline, the end face of semiconductor generating element 6 is heated; Dispelling the heat in 1 other end to the semiconductor generating element of fin, produces the temperature difference to impel between semiconductor generating element 6 both ends of the surface, determined that by the characteristic of semiconductor generating element 6 two outputs of semiconductor generating element 6 just produce DC power supply.By being carried out various forms of series parallel circuits, the semiconductor generating element can form needed electric current and voltage.
Embodiment 2
Embodiment 2 is identical with the structure of embodiment 1, its difference is to have increased water cooled pipeline 8 between the semiconductor generating element 6 of embodiment 2 and the fin 1, shown in Fig. 3,4, cold scattering face at semiconductor generating element 6 has increased water-cooled, air-cooled, make a large amount of semiconductor generating elements 6 when generating, can both maintain enough coolings, make semiconductor generating element two ends keep the bigger temperature difference.
Waste heat, steam that equipment such as thermoelectricity, nuclear power is produced enter heat pipe by pipeline, and an end of semiconductor generating element is heated; Cooling water enters water cooled pipeline through pipe special the other end of semiconductor generating element is carried out cold scattering, and keep at the two ends of guaranteeing the semiconductor generating element has the bigger temperature difference.Because of the two ends of semiconductor generating element have the bigger temperature difference, just produce DC power supply at the output of semiconductor generating element by the characteristic decision of semiconductor generating element.By the semiconductor generating element being carried out can produce bigger electric current and voltage behind the series and parallel, can directly use by the user, also can be by being connected to the grid after the power transmission and transformation technology.

Claims (7)

1. semiconductor thermo-electric generation apparatus, comprise fin (1), fixed head (3), thermal insulation board (5) and semiconductor generating element (6), described semiconductor generating element (6) is packed on the fixed head (3) with thermal insulation board (5), fin (1) is fixed on the semiconductor generating element (6), it is characterized in that also being provided with heat pipe (2) on the fixed head (3), be positioned at semiconductor generating element (6) below.
2. semiconductor thermo-electric generation apparatus according to claim 1 is characterized in that described semiconductor generating element (6), thermal insulation board (5) are fixed on the heat pipe (2) by elastic lock (4).
3. semiconductor thermo-electric generation apparatus according to claim 1 is characterized in that described heat pipe (2) is provided with the connector (9) that is connected with elastic lock (4), and connector (9) is an integral body with heat pipe (2).
4. semiconductor thermo-electric generation apparatus according to claim 3 is characterized in that through hole (10) is arranged in the described heat pipe (2), and through hole (10) is provided with heat radiation netting twine (11).
5. semiconductor thermo-electric generation apparatus according to claim 3 is characterized in that respectively there is an interface at described heat pipe (2) two ends.
6. semiconductor thermo-electric generation apparatus according to claim 1 is characterized in that having on the described fin (1) and is used for the square groove (7) that is connected with elastic lock.
7. semiconductor thermo-electric generation apparatus according to claim 1 is characterized in that being provided with between described semiconductor generating element and the fin water cooled pipeline (8).
CNU2007200478911U 2007-01-26 2007-01-26 A semiconductor temperature difference power generation device Expired - Fee Related CN201041993Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2007200478911U CN201041993Y (en) 2007-01-26 2007-01-26 A semiconductor temperature difference power generation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2007200478911U CN201041993Y (en) 2007-01-26 2007-01-26 A semiconductor temperature difference power generation device

Publications (1)

Publication Number Publication Date
CN201041993Y true CN201041993Y (en) 2008-03-26

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CNU2007200478911U Expired - Fee Related CN201041993Y (en) 2007-01-26 2007-01-26 A semiconductor temperature difference power generation device

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CN (1) CN201041993Y (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101499746A (en) * 2008-10-28 2009-08-05 无锡明惠通科技有限公司 Plate type semiconductor thermo-electric generation apparatus
WO2013060096A1 (en) * 2011-10-27 2013-05-02 宁波丽辰电器有限公司 Fireplace with power generation device
CN105276789A (en) * 2015-11-19 2016-01-27 江苏心日源建筑节能科技股份有限公司 Integrated system utilizing waste heat for power generating and water heating
CN110138276A (en) * 2019-04-30 2019-08-16 罗运山 Atmospheric temperature difference power generation device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101499746A (en) * 2008-10-28 2009-08-05 无锡明惠通科技有限公司 Plate type semiconductor thermo-electric generation apparatus
WO2013060096A1 (en) * 2011-10-27 2013-05-02 宁波丽辰电器有限公司 Fireplace with power generation device
CN105276789A (en) * 2015-11-19 2016-01-27 江苏心日源建筑节能科技股份有限公司 Integrated system utilizing waste heat for power generating and water heating
CN110138276A (en) * 2019-04-30 2019-08-16 罗运山 Atmospheric temperature difference power generation device

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GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080326