CN201017857Y - 可变更尺寸的晶舟盒 - Google Patents
可变更尺寸的晶舟盒 Download PDFInfo
- Publication number
- CN201017857Y CN201017857Y CNU2006200496050U CN200620049605U CN201017857Y CN 201017857 Y CN201017857 Y CN 201017857Y CN U2006200496050 U CNU2006200496050 U CN U2006200496050U CN 200620049605 U CN200620049605 U CN 200620049605U CN 201017857 Y CN201017857 Y CN 201017857Y
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2006200496050U CN201017857Y (zh) | 2006-12-27 | 2006-12-27 | 可变更尺寸的晶舟盒 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CNU2006200496050U CN201017857Y (zh) | 2006-12-27 | 2006-12-27 | 可变更尺寸的晶舟盒 |
Publications (1)
Publication Number | Publication Date |
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CN201017857Y true CN201017857Y (zh) | 2008-02-06 |
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Application Number | Title | Priority Date | Filing Date |
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CNU2006200496050U Expired - Lifetime CN201017857Y (zh) | 2006-12-27 | 2006-12-27 | 可变更尺寸的晶舟盒 |
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CN (1) | CN201017857Y (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101452983B (zh) * | 2008-12-12 | 2011-03-09 | 晶能光电(江西)有限公司 | 硅衬底外延片去边腐蚀方法以及腐蚀用装片篮 |
CN101750004B (zh) * | 2008-12-17 | 2011-12-28 | 中芯国际集成电路制造(上海)有限公司 | 测量工具 |
CN103606531A (zh) * | 2013-12-05 | 2014-02-26 | 山东科芯电子有限公司 | 一种晶片泡酸专用花篮 |
CN108555789A (zh) * | 2017-12-14 | 2018-09-21 | 中国航空工业集团公司洛阳电光设备研究所 | 一种半圆式难装夹零件镀膜均匀性校正装夹镀膜工装及方法 |
CN110838460A (zh) * | 2018-08-15 | 2020-02-25 | 致茂电子股份有限公司 | 晶片旋转暂置台 |
-
2006
- 2006-12-27 CN CNU2006200496050U patent/CN201017857Y/zh not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101452983B (zh) * | 2008-12-12 | 2011-03-09 | 晶能光电(江西)有限公司 | 硅衬底外延片去边腐蚀方法以及腐蚀用装片篮 |
CN101750004B (zh) * | 2008-12-17 | 2011-12-28 | 中芯国际集成电路制造(上海)有限公司 | 测量工具 |
CN103606531A (zh) * | 2013-12-05 | 2014-02-26 | 山东科芯电子有限公司 | 一种晶片泡酸专用花篮 |
CN108555789A (zh) * | 2017-12-14 | 2018-09-21 | 中国航空工业集团公司洛阳电光设备研究所 | 一种半圆式难装夹零件镀膜均匀性校正装夹镀膜工装及方法 |
CN110838460A (zh) * | 2018-08-15 | 2020-02-25 | 致茂电子股份有限公司 | 晶片旋转暂置台 |
CN110838460B (zh) * | 2018-08-15 | 2023-08-22 | 致茂电子股份有限公司 | 晶片旋转暂置台 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130318 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
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TR01 | Transfer of patent right |
Effective date of registration: 20130318 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 No. 18 Zhangjiang Road, Shanghai Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
CX01 | Expiry of patent term |
Granted publication date: 20080206 |
|
EXPY | Termination of patent right or utility model |