CN200987253Y - Novel power supply cooling support - Google Patents
Novel power supply cooling support Download PDFInfo
- Publication number
- CN200987253Y CN200987253Y CN 200620099459 CN200620099459U CN200987253Y CN 200987253 Y CN200987253 Y CN 200987253Y CN 200620099459 CN200620099459 CN 200620099459 CN 200620099459 U CN200620099459 U CN 200620099459U CN 200987253 Y CN200987253 Y CN 200987253Y
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- casing
- power device
- processed
- trunk
- device module
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Abstract
The utility model discloses a novel cooling framework for power supply, which comprises a trunk body, a front faceplate, and a back faceplate. The utility model is characterized in that; the trunk body consisted of a left upper trunk, a left lower trunk, a right upper trunk, a right lower trunk, which is removable. The left upper trunk is combined with the right upper trunk, forming an upper device trunk. The left lower trunk is combined with the right lower trunk, forming a lower device trunk and a cooling trunk. A loading shell for power device module is arranged in the splint of the upper or lower device trunk. Multiform power device modules or electrolytic capacitor modules can be arranged in the loading shell. The heat from the modules is absorbed and token away by a heat transfer medium with a low boiling point, achieving the effect of cooling and heat dissipation.The utility model is provided with an inner heat transfer medium with a low boiling point and an outer water tank, which are used for heat dissipation and cooling respectively. The utility model has advantages of good cooling effect, regular shape of the loading shell and module, convenient installation and disassembly, and insulating safety for power device that is a novel cooling framework for power supply.
Description
Technical field
The utility model relates to power-supply device, especially relates to a kind of novel power supply cooling structure.
Background technology
The power supply framework generally is made up of casing, front panel, rear board, circuit main board and coldplate at present, all electronic devices and components major parts all concentrate on the mainboard, coldplate is installed on the mainboard, the big power device that generates heat just is installed on the coldplate, the position of coldplate is by the determining positions of power device, this will cause the out-of-shape of coldplate, and stamping parts is many, and wiring is complicated.And the heat radiation of existing power supply framework is to adopt the air cooling mode basically, radiating rate is slower, in order to improve these bad types of cooling, the applicant has applied for utility model patent " power supply the cooling structure " (patent No.: 200420110792X) in 2004, this is device cooling support is arranged in a kind of, to have movable endothermic water tank, various module to be installed in power supply cooling structure on the device cooling support by guide rail outward, but also there is following shortcoming in it: 1, fixed screw is more in the functional module, and the insulation of power device is not very insurance; 2, device cooling support is maked somebody a mere figurehead, and is not that whole heating power modules can both contact by abundant and main cooling surface; 3, under the situation of high-power applications, be unable to do without running water; 4, the outer radiating surface of casing is little.
Summary of the invention
The purpose of this utility model is to provide the heat radiation of low boiling heat-conducting medium in a kind of, water tank heat absorption, good cooling results are arranged outward, carry shell and modular shape rule, the novel power supply cooling structure of easy installation and removal, power device insulation insurance.
The purpose of this utility model is achieved in that the utility model comprises casing, front panel and rear board, on the sidewall of casing, be processed with the fin that is covered with about casing and the heat radiation circular hole of inside and outside perforation, be processed with control knob installing hole and instrument installing hole in front on the plate, be processed with heat radiation square hole and entrance hole in the back on the plate, feature is that casing is by four upper left casings that can separate, the lower-left casing, upper right casing and bottom right casing are formed, upper left casing and upper right casing, lower-left casing and bottom right casing respectively by projection with groove amalgamation be in the same place, upper left casing and lower-left casing, upper right casing and bottom right casing are fixed together by screw, upper left casing and upper right casing amalgamation form the device case together, and lower-left casing and bottom right casing amalgamation form down device case and cooler bin together; On the base plate of last device case and following device case, supporting plate is housed, on supporting plate, be processed with two pairs or more the cloudy slide rail of supporting plate, two side bottoms that carry shell in the power device module are provided with a pair of year shell sun slide rail that is used with the cloudy slide rail of supporting plate, the bottom that carries in the shell in the power device module is equipped with the power device module, and the power device module is carried shell side wall and is provided with one or more layers of in order to place the circuit board shelf of circuit board; On supporting plate and central dividing plate, all be processed with the cable-through hole of device case and following device case in the connection; Cooler bin is made up of at left cooler bin on the casing of lower-left and the right cooler bin of processing on the casing of bottom right processing, in the low boiling heat-conducting medium is housed left cooler bin and right cooler bin be communicated with by circular hole, front end at left cooler bin and right cooler bin all is plugged with preceding sealing plug, and the rear end all is plugged with the back sealing plug of bringing low boiling heat-conducting medium pipe into and going out low boiling heat-conducting medium pipe; Be processed with the cloudy slide rail in a pair of casing top at the top of casing, two side bottoms at water tank are provided with a pair of water tank sun slide rail that is used with the cloudy slide rail in casing top, water and low boiling heat-conducting medium screwed pipe are housed in water tank, and two flexible pipes link together advancing low boiling heat-conducting medium pipe and going out low boiling heat-conducting medium pipe of the low boiling heat-conducting medium screwed pipe in the water tank and left cooler bin and right cooler bin.
Described power device module is hugging formula power device module or upright slot type power device module or imitative well slot formula power device module or electrochemical capacitor module.
The bottom of carrying shell at transformer module is provided with a pair of transformer sun slide rail that is used with the cloudy slide rail of supporting plate.
On the top board of last device case and following device case, all be processed with the cloudy slide rail of top board in order to electric fan to be installed.
The utility model be in specialized designs on the basis of conventional tank on device case, down device case, water tank, the left cooler bin that the low boiling heat-conducting medium is housed and right cooler bin, and at last device case, down be placed with the power device module in the supporting plate of device case and carry shell, various power devices, electrochemical capacitor module all can be placed on the power device module and carry in the shell, thereby can absorb heat fast by the low boiling heat-conducting medium, and take away heat fast, thereby reach the heat radiation cooling purpose.The utility model also can be installed transformer and electric fan by the negative and positive slide rail, and installing/dismounting is all very convenient.The shape of various years shells, module is all fairly regular, cuts out after can adopting aluminium alloy to draw to form, and also can cast or form with angle aluminium, middle short side aluminium, aluminium sheet body plan.The advantage that the heat radiation of low boiling heat-conducting medium is arranged in therefore the utlity model has, has water tank heat absorption, good cooling results, year shell and modular shape rule, easy installation and removal, power device insulation to insure outward, the utility model is a kind of novel power supply cooling structure.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
The transformer module that the power device module that Fig. 2 is supporting plate, be equipped with the power device module is carried shell and transformer is housed carries the structural representation of shell;
Fig. 3 carries the structural representation of shell for the power device module;
Fig. 4 is the structural representation of hugging formula power device module;
Fig. 5 is installed in structural representation in the hugging formula power device module for power device;
Fig. 6 is the structural representation of water tank;
Fig. 7 is the structural representation of electrochemical capacitor module;
Fig. 8 is installed in the structural representation of electrochemical capacitor module for electrochemical capacitor;
Fig. 9 is the structural representation of upright slot type power device module;
Figure 10 is the interior structural representation of upright slot type power device module for power device is installed in;
Figure 11 is the structural representation of imitative well slot formula power device module;
Figure 12 is the interior structural representation of imitative well slot formula power device module for power device is installed in.
Embodiment
Below in conjunction with embodiment and contrast accompanying drawing the utility model is described in further detail.
Embodiment 1:
The utility model comprises casing 7, front panel 1 and rear board 4, on the sidewall of casing 7, be processed with the fin 8 that is covered with about casing and the heat radiation circular hole 9 of inside and outside perforation, be processed with control knob installing hole 2 and instrument installing hole 3 in front on the plate 1, be processed with entrance hole 5 and heat radiation square hole 6 in the back on the plate 4, casing 7 is by four upper left casings 10 that can separate, lower-left casing 11, upper right casing 12 and bottom right casing 13 are formed, upper left casing 10 and upper right casing 12, lower-left casing 11 and bottom right casing 13 respectively by projection 14 with groove 15 amalgamations be in the same place, upper left casing 10 and lower-left casing 11, upper right casing 12 and bottom right casing 13 are fixed together by screw 16, upper left casing 10 and 12 amalgamations of upper right casing form device case 17 together, and lower- left casing 11 and 13 amalgamations of bottom right casing form down device case 18 and cooler bin 19 together; On the bottom of last device case 17 and following device case 18, supporting plate 33 is housed, on supporting plate 33, be processed with two pairs or more the cloudy slide rail 34 of supporting plate, two side bottoms that carry shell 40 in the power device module are provided with a pair of year shell sun slide rail 41 that is used with the cloudy slide rail 34 of supporting plate, bottom in the power device module is carried shell 40 is equipped with power device module 38, and the sidewall that the power device module is carried shell 40 is provided with one or more layers of in order to place the circuit board shelf 39 of circuit board 42; On central dividing plate 22, be processed with the cable-through hole 28 of device case in the connection 17 and play device case 18, at the cable-through hole 35 that all is processed with device case 17 and following device case 18 in the connection on the supporting plate; Cooler bin 19 is made up of at left cooler bin on the lower-left casing 11 21 and the right cooler bin 20 of processing on bottom right casing 13 processing, in the left cooler bin 21 of low boiling heat-conducting medium is housed and right cooler bin 20 is communicated with by circular hole 23, sealing plug 29 before the front end of left cooler bin 21 and right cooler bin 20 all is plugged with, rear end all are plugged with the back sealing plug 32 of bringing low boiling heat-conducting medium pipe 30 into and going out low boiling heat-conducting medium pipe 31; Be processed with the cloudy slide rail 26 in a pair of casing top at the top 25 of casing 7, two side bottoms at water tank 50 are provided with a pair of water tank sun slide rail 51 that is used with the cloudy slide rail 26 in casing top, water and 52, two flexible pipes of low boiling heat-conducting medium screwed pipe are housed in water tank 50 to be advanced the low boiling heat-conducting medium screwed pipe in the water tank 50 52 and left cooler bin 21 and right cooler bin 20 low boiling heat-conducting medium pipe 30 and goes out low boiling heat-conducting medium pipe 31 to link together.
In the bottom of casing 7, " Jiong " shape connecting plate 24 is connected and fixed lower-left casing 11 and bottom right casing 13.
Described power device module 38 is a hugging formula power device module 43, on the base plate 44 of hugging formula power device module 43, be processed with the hugging 45 parallel more than three or three at interval with base plate, decide according to the requirement of circuit and power device 46 at interval between the height of hugging 45, length, width and the hugging 45, power device 46 lies in the hugging 45 with 48 insulation of heat conductive insulating cloth, fixing with heat conduction chock 49, pin is welded on the circuit board 47 by drawing at interval between the hugging 42.
The bottom of carrying shell 37 at transformer module is provided with a pair of transformer sun slide rail 36 that is used with the cloudy slide rail 34 of supporting plate.
All be processed with in order to top board the moon slide rail 27 of electric fan to be installed at the top of last device case 17 and following device case 18.
Be processed with in the electrochemical capacitor module 53 in order to place the cylindrical vertical slot 54 of electrochemical capacitor, electrochemical capacitor 55 is placed upside down in the cylindrical vertical slot 54, and pin is welded on the circuit board 56.
Embodiment 2:
The structure of embodiment 2 is substantially the same manner as Example 1, difference is: described power device module 38 is upright slot type power device module 58, on the base plate 57 of upright slot type power device module 58, be processed with the upright groove 59 more than three or three at interval, decide according to the requirement of circuit and power device 62 at interval between the height of upright groove 59, length, width and the upright groove 59, power device 62 is placed upside down in the upright groove 49 with 61 insulation of heat conductive insulating cloth, fixing with heat conduction chock 60, pin is welded on the circuit board 63.
Embodiment 3:
Structure and the embodiment of embodiment 3 are basic identical, difference is: described power device module 38 is imitative well slot formula power device module 64, on imitative well slot formula power device module 64, be processed with in order to the imitative well slot 65 of the cuboid of placing power device 66, decide according to the requirement of circuit and power device 66 at interval between the imitative well slot 65 of the degree of depth, length, width and the cuboid of the imitative well slot 65 of cuboid, power device 66 is placed upside down in the imitative well slot 65 of cuboid with 68 insulation of heat conductive insulating cloth, fixing with heat conduction chock 67, pin is welded on the circuit board 69.
Claims (8)
1, a kind of novel power supply cooling structure, comprise casing (7), front panel (1) and rear board (4), on the sidewall of casing (7), be processed with the fin (8) that is covered with about casing and the heat radiation circular hole (9) of inside and outside perforation, be processed with control knob installing hole (2) and instrument installing hole (3) in front on the plate (1), be processed with entrance hole (5) and heat radiation square hole (6) in the back on the plate (4), it is characterized in that: casing (7) is by four upper left casings (10) that can separate, lower-left casing (11), upper right casing (12) and bottom right casing (13) are formed, upper left casing (10) and upper right casing (12), lower-left casing (11) and bottom right casing (13) pass through projection (14) and groove (15) amalgamation together respectively, upper left casing (10) and lower-left casing (11), upper right casing (12) and bottom right casing (13) are fixed together by screw (16), upper left casing (10) and upper right casing (12) amalgamation together formation device case (17), lower-left casing (11) and bottom right casing (13) amalgamation together formation down device case (18) and cooler bin (19); On the bottom of last device case (17) and following device case (18), supporting plate (33) is housed, on supporting plate (33), be processed with two pairs or more the cloudy slide rail (34) of supporting plate, two side bottoms that carry shell (40) in the power device module are provided with a pair of year shell sun slide rail (41) that is used with the cloudy slide rail of supporting plate (34), bottom in the power device module is carried shell (40) is equipped with power device module (38), and the sidewall that the power device module is carried shell (40) is provided with one or more layers of in order to place the circuit board shelf (39) of circuit board (42); On central dividing plate (22), be processed with cable-through hole (28) that be communicated with to go up device case (17) and following device case (18), at the cable-through hole (35) that all is processed with device case (17) and following device case (18) in the connection on the supporting plate; Cooler bin (19) is made up of at left cooler bin (21) on the lower-left casing (11) and the right cooler bin (20) processed on bottom right casing (13) processing, in the left cooler bin (21) of low boiling heat-conducting medium is housed and right cooler bin (20) is communicated with by circular hole (23), front end at left cooler bin (21) and right cooler bin (20) all is plugged with preceding sealing plug (29), and the rear end all is plugged with the back sealing plug (32) of bringing low boiling heat-conducting medium pipe (30) into and going out low boiling heat-conducting medium pipe (31); Be processed with the cloudy slide rail (26) in a pair of casing top at the top (25) of casing (7), two side bottoms at water tank (50) are provided with a pair of water tank sun slide rail (51) that is used with the cloudy slide rail in casing top (26), water and low boiling heat-conducting medium screwed pipe (52) are housed in water tank (50), and two flexible pipes advance low boiling heat-conducting medium pipe (30) and go out low boiling heat-conducting medium pipe (31) to link together with the low boiling heat-conducting medium screwed pipe (52) in the water tank (50) and left cooler bin (21) and right cooler bin (20).
2, novel power supply cooling structure as claimed in claim 1, it is characterized in that: described power device module (38) is a hugging formula power device module (43), go up the hugging (45) parallel that is processed with at interval more than three or three with base plate at the base plate (44) of hugging formula power device module (43), power device (46) lies in the hugging (45) with heat conductive insulating cloth (48) insulation, fixing with heat conduction chock (49), pin is welded on the circuit board (47) by drawing at interval between the hugging (42).
3, novel power supply cooling structure as claimed in claim 1, it is characterized in that: described power device module (38) is upright slot type power device module (58), go up the upright groove (59) that is processed with at interval more than three or three at the base plate (57) of upright slot type power device module (58), power device (62) is placed upside down in the upright groove (49) with heat conductive insulating cloth (61) insulation, fixing with heat conduction chock (60), pin is welded on the circuit board (63).
4, novel power supply cooling structure as claimed in claim 1, it is characterized in that: described power device module (38) is imitative well formula power device module (64), on imitative well formula power device module (64), be processed with in order to the imitative well slot (65) of the cuboid of placing power device (66), power device (66) is placed upside down in the imitative well slot (65) of cuboid with heat conductive insulating cloth (68) insulation, fixing with heat conduction chock (67), pin is welded on the circuit board (69).
5, as claim 2 or 3 or 4 described novel power supply cooling structures, it is characterized in that: the bottom of carrying shell (37) at transformer module is provided with a pair of transformer sun slide rail (36) that is used with the cloudy slide rail of supporting plate (34).
6, as claim 2 or 3 or 4 described novel power supply cooling structures, it is characterized in that: be processed with in the electrochemical capacitor module (53) in order to place the cylindrical vertical slot (54) of electrochemical capacitor, electrochemical capacitor (55) is placed upside down in the cylindrical vertical slot (54), and pin is welded on the circuit board (56).
7, novel power supply cooling structure as claimed in claim 1 is characterized in that: all be processed with the cloudy slide rail (27) of top board in order to electric fan to be installed at the top of last device case (17) and following device case (18).
8, novel power supply cooling structure as claimed in claim 1 is characterized in that: the bottom in casing (7), " Jiong " shape connecting plate (24) is connected and fixed lower-left casing (11) and bottom right casing (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620099459 CN200987253Y (en) | 2006-10-16 | 2006-10-16 | Novel power supply cooling support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620099459 CN200987253Y (en) | 2006-10-16 | 2006-10-16 | Novel power supply cooling support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN200987253Y true CN200987253Y (en) | 2007-12-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620099459 Expired - Fee Related CN200987253Y (en) | 2006-10-16 | 2006-10-16 | Novel power supply cooling support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN200987253Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009149640A1 (en) * | 2008-06-13 | 2009-12-17 | 华为技术有限公司 | Thermal transfer device |
| CN101478193B (en) * | 2009-01-15 | 2011-04-06 | 章祖文 | Electric power cooling structure with steam engine refrigerator |
| CN108513491A (en) * | 2018-02-05 | 2018-09-07 | 张广山 | A kind of optical fiber tester being used for optical fiber and manufacture |
-
2006
- 2006-10-16 CN CN 200620099459 patent/CN200987253Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009149640A1 (en) * | 2008-06-13 | 2009-12-17 | 华为技术有限公司 | Thermal transfer device |
| CN101478193B (en) * | 2009-01-15 | 2011-04-06 | 章祖文 | Electric power cooling structure with steam engine refrigerator |
| CN108513491A (en) * | 2018-02-05 | 2018-09-07 | 张广山 | A kind of optical fiber tester being used for optical fiber and manufacture |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071205 Termination date: 20151016 |
|
| EXPY | Termination of patent right or utility model |