CN200969357Y - 发光二极管组件 - Google Patents

发光二极管组件 Download PDF

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Publication number
CN200969357Y
CN200969357Y CNU2006201334509U CN200620133450U CN200969357Y CN 200969357 Y CN200969357 Y CN 200969357Y CN U2006201334509 U CNU2006201334509 U CN U2006201334509U CN 200620133450 U CN200620133450 U CN 200620133450U CN 200969357 Y CN200969357 Y CN 200969357Y
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China
Prior art keywords
groove
emitting diode
chip
light
pedestal
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Expired - Fee Related
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CNU2006201334509U
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English (en)
Inventor
蔡金松
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HONGKUN TECHNOLOGY Co Ltd
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HONGKUN TECHNOLOGY Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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Abstract

本实用新型为一种发光二极管组件,其包括至少一LED芯片、基座以及至少一插脚杆,该基座中央设有供芯片放置的凹槽,该凹槽底部设有至少一孔洞,该插脚杆穿设于孔洞,以与芯片或电路板形成电通路,该发光二极管组件的凹槽底部面积大,可放置多个LED芯片,以增加发光亮度,而且该插脚杆是从基座底部插入,因此该插脚不会延伸至基座侧边,因此不会占用到基座以外的空间。

Description

发光二极管组件
技术领域
本实用新型涉及一种发光二极管组件,尤其是一种避免插脚占据基板,并能放置多块芯片且加大反射槽壁面积以提升亮度的发光二极管组件。
背景技术
由于科技的日新月异,发光二极管(LED)因具有较大的发光强度,所以在许多产业中已渐渐取代了传统的钨丝灯,发光二极管(LED)可分为炮弹型(lamp type)及表面黏着型(SMD),由于炮弹型LED所使用的封装材料用量为表面黏着型的10-20倍,而且由于炮弹型LED的工作热阻较大,因此使用时温度会增加到200℃以上,因而破坏芯片或周围的封装材料,所以目前大部分的发光二极管皆采用表面黏着型。
请参考图3所示,已知的表面黏着型发光二极管组件是设置在一基板(图中未示)上,其包括一芯片10、基座60以及二插脚70,该基座60为一圆盘体,其周围设有可供该发光二极管散热的导热座61,该基座60中央设有可供一块芯片10放置的凹槽62,凹槽62的槽壁(符号未示)为反射面以反射芯片10所放出的光,该插脚70以引线的方式与芯片10两侧连接,并延伸出凹槽62外,以连接电源并形成回路,而为了保护芯片10,凹槽62内可灌入绝缘胶或是以罩盖80设置于基座60上将芯片10罩盖。
然而,已知发光二极管的凹槽仅可供一块芯片放置,因此发光功率无法提升,且该凹槽底部即为基座底部,因此无法增加反射槽壁的面积,而且一基板上往往会放置数个发光二极管组件,以增加发光亮度,但由于延伸出去的插脚占了部分基板,让目前所有零件都趋于微小化的时代,该基板上的发光二极管组件无法增加,因此使设有该发光二极管的基板所发出的亮度无法提升。
本发明人有鉴于已知发光二极管组件的插脚是从凹槽中延伸出来,因此会占据基板面积,使基板上可放置发光二极管的面积减少,而且已知基座仅能放置一芯片,反射槽壁面积小,故而无法提升发光二极管的亮度,因此经过不断的尝试与努力,终于创作出此发光二极管组件。
发明内容
本实用新型的目的在于提供一种避免插脚占据基板,并能放置多块芯片且加大反射槽壁面积以提升亮度的发光二极管组件。
为达上述目的,本实用新型的发光二极管组件包括:
至少一芯片;
基座,其设有供芯片放置的凹槽,该凹槽底部设有至少一孔洞;
至少一插脚杆,其包括穿设于该凹槽底部的孔洞,并至少一插脚杆与孔洞之间套设绝缘套环;
罩盖,其罩盖于基座上以保护芯片。
由上述基座凹槽底部的孔洞,可将插脚杆穿入,并与芯片做电性接触,以形成电通路,由于该插脚杆是从基座底部插入,因此不会占据除了该发光二极管以外的空间,故而达到本实用新型的目的。
附图说明
图1:本实用新型的立体分解图。
图2:本实用新型的立体图。
图3:已知发光二极管组件的侧面剖视图。
附图标号:
10芯片                      11电路板
20、60基座                  21、61导热座
22、62凹槽                  23槽壁
24孔洞                      25凹设部
26定位凸块                  27绝缘套环
31插脚杆                    32导电杆
41、80罩盖                  42勾设片
70插脚
具体实施方式
请参看图1及图2所示,本实用新型的发光二极管组件,其包括有:
至少一LED芯片10;
基座20,为一圆盘体,而该基座20中央设有供芯片10放置的凹槽22,该凹槽22底部的面积可供多片芯片10放置,其具有槽壁23及凹槽22底部,该槽壁23为反射面以反射芯片10所放出的光,该凹槽22底部向下突出于基座20的底部,以扩大槽壁23的反射面,其突出的程度对应于芯片10放置的数量,以增加发光二极管的发光亮度,该凹槽22底部设有至少一孔洞24,并于凹槽22底部及孔洞24上方可设有放置多块芯片10的电路板11,该电路板11是以电性连接的方式与芯片10接触,该基座20周围还可设有供凹槽22内部散热的导热座21,该导热座21周缘设有二凹设部25以及一方便装配人员配置此发光二极管的定位凸块26;
至少一插脚杆31,其穿设于该凹槽22底部的孔洞24,其与芯片10或电路板11之间形成电通路,另外,至少一插脚杆31与孔洞24之间套设绝缘套环27,以避免产生短路;
罩盖41,其罩盖于基座20上,本实施例该罩盖41两侧具有二勾设于基座20凹设部25的弹性勾设片42,利用该勾设片42卡入凹设部25,以使得罩盖41与基座20之间的连接更稳固,以保护基座20内部的芯片10,并且能有聚光的效果,使发光二极管的发射光型能符合要求,而且该罩盖41还可重复使用,只要将该具弹性的勾设片42往外扳开,则可让该罩盖41与基座20脱离,以使用于另一基座20上。
上述的发光二极管组件可增加芯片的数量,并增加槽壁的反射面积,以达到较佳的发光效率,并由上述基座凹槽底部可将插脚杆穿入的孔洞,使该插脚与芯片做电性接触,以形成电通路,由于该插脚杆是从基座底部插入,因此该发光二极管组件不会占据除了基座以外的空间,故而达到本实用新型的目的。

Claims (7)

1.一种发光二极管组件,其特征在于包括:
至少一芯片;
基座,其设有供芯片放置的凹槽,该凹槽底部设有至少一孔洞;
至少一插脚杆,其包括穿设于该凹槽底部的孔洞,且至少一插脚杆与孔洞之间套设绝缘套环。
2.如权利要求1所述的发光二极管组件,其特征在于:该基座周围设有导热座。
3.如权利要求2所述的发光二极管组件,其特征在于:该导热座周缘设有一定位凸块。
4.如权利要求1、2或3所述的发光二极管组件,其特征在于:一保护芯片的罩盖,其罩盖于基座上。
5.如权利要求4所述的发光二极管组件,其特征在于:导热座的周缘设有二凹设部,该罩盖周缘设有二勾设于该凹设部的勾设片。
6.如权利要求1、2或3所述的发光二极管组件,其特征在于:该凹槽底部向下突出于基座的底部。
7.如权利要求5所述的发光二极管组件,其特征在于:该凹槽底部向下突出于基座的底部。
CNU2006201334509U 2006-10-13 2006-10-13 发光二极管组件 Expired - Fee Related CN200969357Y (zh)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010142243A1 (zh) * 2009-06-10 2010-12-16 前源科技股份有限公司 传送和/或接收光讯号的光学模组、光电元件底座结构、光电元件
CN101713521B (zh) * 2008-10-07 2012-05-30 海立尔股份有限公司 交流发光二极管结构
CN103807643A (zh) * 2012-11-09 2014-05-21 勒格朗法国公司 用于电气设备的发光指示器及相关的电气设备

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101713521B (zh) * 2008-10-07 2012-05-30 海立尔股份有限公司 交流发光二极管结构
WO2010142243A1 (zh) * 2009-06-10 2010-12-16 前源科技股份有限公司 传送和/或接收光讯号的光学模组、光电元件底座结构、光电元件
CN101924143A (zh) * 2009-06-10 2010-12-22 前源科技股份有限公司 光电元件底座结构及光电元件
CN103807643A (zh) * 2012-11-09 2014-05-21 勒格朗法国公司 用于电气设备的发光指示器及相关的电气设备

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Granted publication date: 20071031

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