CN200962465Y

CN200962465Y - BGA chip test base connector

Info

Publication number: CN200962465Y
Application number: CN 200620064288
Authority: CN
Inventors: 瞿昌义; 梁巨龙
Original assignee: QU CHANGYI
Current assignee: QU CHANGYI
Priority date: 2006-09-18
Filing date: 2006-09-18
Publication date: 2007-10-17
Anticipated expiration: 2016-09-18

Abstract

The utility model relates to the technical field of testing tools which discloses BGA chip testing seat connector. The BGA chip testing seat connector of the utility model comprises an insulating fixed body which is buried and provided with matrix type ranged electric conductors, the top end cut noodles of the conductors are at the same horizontal surface with the surface of the insulating fixed body (10). The utility model can effectively connection test the BGA chip with very small point distance of IC, and has apparent effect of stability and reliability of connection comparing with current probe mode.

Description

Bga chip test bench connector

Technical field:

The utility model relates to the testing tool technical field, the connector of especially relate to the bga chip test, installing.

Background technology:

Bga chip test at present adopts the contact type probe and the finished product circuit that are convexly set on the pcb board to move under true environment, enables the repertoire of IC.But probe has certain diameter, and needs certain spacing, for the bga chip of some IC point apart from very little (the general limit is 0.25mm), obviously can't effectively finish test jobs with probe; In addition, contact type probe has partly requirement activity in test process, and its stability and reliability are reduced greatly, also will influence measuring accuracy and test effect.

The utility model content:

The purpose of this utility model is the weak point that exists at prior art and a kind of new bga chip test connector is provided, it can Validity Test IC point apart from very little bga chip, and the stability and the reliability of testing are all very good.

For achieving the above object, bga chip test connector of the present utility model comprises an insulation fixed body, is embedded with in the insulation fixed body to be the electric conductor that the matrix pattern is arranged, and the top tangent plane of electric conductor and insulation fixed body surface are at same horizontal plane.

The beneficial effects of the utility model are: (1), its test point are apart from can be as small as 0.15mm, reached the limiting value of bga chip fully, and there are a plurality of electric conductor tangent planes to contact with the sphere of the tin ball of same IC, strengthened the reliability of the stability of test greatly, and each electric conductor is solidificated in, and degree forms cube of arranged formation between the insulator, played the effect of typing, location, got rid of because of the connector swing and misplace/possibility of short circuit; (2), this test connector not only can test the IC of point distance, also can test the IC of a little bigger distance, versatility is better, greatly reduces the Products Development cost, has saved a large amount of energy; (3), the utility model employing electric conductor is fine wire or non-metallic conducting material.Can under the temperature about 100 ℃, move,, can after cooling, reset, can reuse as deformation taking place because of heating up because of being in the naked environment; (4), its insulation fixed body of bga chip test connector of the present utility model and electric conductor adopt the approaching material of elastic deformation coefficient, after applying certain pressure situations such as distortion, dislocation, short circuit can not appear because of reinforcing is excessive, the situation of damage more can not occur reporting, thereby further improve the stability and the reliability of test because of pressure is excessive.

Description of drawings:

Below in conjunction with accompanying drawing the utility model is described further:

Accompanying drawing 1 is a stereogram of the present utility model;

Accompanying drawing 2 is a vertical view of the present utility model;

Embodiment:

The following stated only is preferred embodiment of the present utility model, does not therefore limit protection range of the present utility model.

See shown in accompanying drawing 1 and the accompanying drawing 2: bga chip test connector of the present utility model comprises a cuboidal insulation fixed body 10, be embedded with in the insulation fixed body 10 and be the linear electric conductor 20 that the matrix pattern is arranged, do not contact mutually between each electric conductor 20, its top tangent plane and insulation fixed body 10 surfaces are at same horizontal plane.

Insulation fixed body 10 insulating material such as handy resistant to elevated temperatures organic resin is made, and 20 of electric conductors are preferably materials such as fine wire or electric silica gel, and the elastic deformation coefficient of insulate like this fixed body 10 and electric conductor 20 material therefors is close.Can improve the stability and the reliability of test.

During use, only need insulation fixed body 10 surfaces of test bench connector are attached on the bga chip, each electric conductor 20 tangent plane on insulation fixed body 10 surfaces can fully contact with IC chip tin sphere, thereby reach the purpose of intact conducting between IC spheroid and the circuit board.

Claims

1.BGA chip testing base connector, it is characterized in that: it comprises an insulation fixed body (10), be embedded with the electric conductor (20) that is the arrangement of matrix pattern in the insulation fixed body (10), the top tangent plane of electric conductor (20) is surperficial at same horizontal plane with insulation fixed body (10).

2. bga chip test bench connector according to claim 1 is characterized in that: described insulation fixed body (10) is an organic resin, and electric conductor (20) is fine wire or electric silica gel.