CN200946896Y - Water heater heated by using semi-conductor refrigerating elements - Google Patents
Water heater heated by using semi-conductor refrigerating elements Download PDFInfo
- Publication number
- CN200946896Y CN200946896Y CN 200620021340 CN200620021340U CN200946896Y CN 200946896 Y CN200946896 Y CN 200946896Y CN 200620021340 CN200620021340 CN 200620021340 CN 200620021340 U CN200620021340 U CN 200620021340U CN 200946896 Y CN200946896 Y CN 200946896Y
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- shell
- water heater
- semiconductor
- temperature difference
- inner bag
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- Expired - Fee Related
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Abstract
The utility model relates to a water heater which uses semiconductor refrigeration components to heat, belongs to the heating technical field, which is designed for reducing the energy consumption, reducing the costs and the operation safety. A semiconductor thermoelectric refrigeration component 1 is stickingly arranged between a liner 2 and a shell 3 which is also a refrigeration plate for the semiconductor thermoelectric refrigeration component 1, whereby forming a cooling- heating exchange part of the water heater; the liner 2 is positioned at the semiconductor thermoelectric refrigeration component 1 and processed to a trapezoid embossment towards the shell 3 thereby filling the middle between the liner 2 and the shell 3 with enough thick thermal insulation materials, enhancing the insulation effect of plus- minus temperatures, increasing the heating efficiency. The utility model adopts semiconductor thermoelectric refrigeration components to heat, heats up water, and emits the coldness which is produced during the heating process to the space by the water heater shell, which is applicable to hot water preparations.
Description
Technical field: the utility model relates to a kind of water heater that uses semiconductor cooling device to heat, and belongs to heating technical field.
Background technology: with the water heater of electric energy heating, generally all be that power consumption is big, the cost height, also there is certain Electrical Safety hidden danger in indivedual types.
Summary of the invention: for cutting down the consumption of energy, reduce cost, safe in utilization and the water heater that heats of use semiconductor cooling device of design, it is made up of semiconductor temperature difference cooling assembly 1, inner bag 2, shell 3, water inlet pipe 4, outlet pipe 5, thermal insulation material 6 and dc source and temperature control circuit 7: semiconductor temperature difference cooling assembly 1 is mounted between the trapezoidal high spot and shell 3 of inner bag 2, constitutes the cold and hot switching part of water heater; Fill thermal insulation material 6 between inner bag 2 and the shell 3; The mouth of pipe of water inlet pipe 4 is following, and the mouth of pipe of outlet pipe 5 is dipped in the water of water heater last; Dc source and temperature control circuit 7 are loaded on the top of water heater.Characteristics such as the utility model adopts the semiconductor temperature difference cooling assembly to heat, and the water of water heater is heated, and the cold shell by water heater that the process that will heat produces is dispersed into the space, has little power consumption, and cost is low, and is safe in utilization are applicable to the preparation of hot water.
Description of drawings:
Accompanying drawing is a structural representation of the present utility model.
Among the figure: 1, semiconductor temperature difference cooling assembly, 2, inner bag, 3, shell, 4, water inlet pipe, 5, outlet pipe, 6, the thermal insulation material, 7, dc source and temperature control circuit.
The specific embodiment:
Accompanying drawings structure of the present utility model and embodiment.Inner bag 2 is positioned at semiconductor temperature difference cooling assembly 1 place and is processed into trapezoidal projection towards shell 3, and semiconductor temperature difference cooling piece 1 is mounted between the trapezoidal projection and shell 3 of inner bag 2.The effect of trapezoidal projection: the one, make inner bag 2 and shell 3 can stick on the surface of semiconductor temperature difference cooling assembly 1 better, the 2nd, can set up enough cavitys at the periphery of semiconductor temperature difference cooling assembly 1, to fill the thermal insulation material, strengthen the isolated effect of positive negative temperature of two working faces of cooling assembly, reduce loss, improve heating efficiency.Shell 3 adopts metal material, and double row's cold drawing of doing semiconductor temperature difference cooling assembly 1 is to replace row's cooler spares such as fin and fan.
Dc source of the present utility model is identical with conventional relevant power supply and circuit with temperature control circuit 7.
Claims (3)
1, a kind of water heater that uses semiconductor cooling device to heat, form by semiconductor temperature difference cooling assembly (1), inner bag (2), shell (3), water inlet pipe (4), outlet pipe (5), thermal insulation material (6) and dc source and temperature control circuit (7), it is characterized in that: semiconductor temperature difference cooling assembly (1) is mounted between inner bag (2) and the shell (3), constitutes the cold and hot switching part of water heater; Be filled with thermal insulation material (6) between inner bag (2) and the shell (3); The mouth of pipe of water inlet pipe (4) is following, and the mouth of pipe of outlet pipe (5) is dipped in the water of water heater last; Dc source and temperature control circuit (7) are loaded on the top of water heater.
2, the water heater that heats of use semiconductor cooling device according to claim 1, it is characterized in that: inner bag (2) is positioned at semiconductor temperature difference cooling assembly (1) and locates to be processed into trapezoidal projection towards shell (3), and semiconductor temperature difference cooling assembly (1) is mounted between the trapezoidal high spot and shell (3) of inner bag (2).
3, the water heater that heats of use semiconductor cooling device according to claim 1, it is characterized in that: shell (3) is mounted on cold worker's face of semiconductor temperature difference cooling assembly (1), the double row of being cold drawing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620021340 CN200946896Y (en) | 2006-08-01 | 2006-08-01 | Water heater heated by using semi-conductor refrigerating elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620021340 CN200946896Y (en) | 2006-08-01 | 2006-08-01 | Water heater heated by using semi-conductor refrigerating elements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN200946896Y true CN200946896Y (en) | 2007-09-12 |
Family
ID=38733959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620021340 Expired - Fee Related CN200946896Y (en) | 2006-08-01 | 2006-08-01 | Water heater heated by using semi-conductor refrigerating elements |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN200946896Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106032632A (en) * | 2015-03-10 | 2016-10-19 | 青岛海尔洗衣机有限公司 | A heating device and a washing machine |
| CN107334440A (en) * | 2017-03-16 | 2017-11-10 | 宁波方太厨具有限公司 | Dry cleaning machine can be accelerated |
-
2006
- 2006-08-01 CN CN 200620021340 patent/CN200946896Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106032632A (en) * | 2015-03-10 | 2016-10-19 | 青岛海尔洗衣机有限公司 | A heating device and a washing machine |
| CN106032632B (en) * | 2015-03-10 | 2020-01-24 | 青岛海尔洗衣机有限公司 | Heating device and washing machine |
| CN107334440A (en) * | 2017-03-16 | 2017-11-10 | 宁波方太厨具有限公司 | Dry cleaning machine can be accelerated |
| CN107334440B (en) * | 2017-03-16 | 2023-08-18 | 宁波方太厨具有限公司 | Cleaning machine capable of accelerating drying |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| DD01 | Delivery of document by public notice |
Addressee: Chen Zunshan Document name: Notification of Termination of Patent Right |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070912 Termination date: 20100801 |