CN1982901A - 一种金属互连线电迁移的测试结构及方法 - Google Patents
一种金属互连线电迁移的测试结构及方法 Download PDFInfo
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- CN1982901A CN1982901A CN 200510111413 CN200510111413A CN1982901A CN 1982901 A CN1982901 A CN 1982901A CN 200510111413 CN200510111413 CN 200510111413 CN 200510111413 A CN200510111413 A CN 200510111413A CN 1982901 A CN1982901 A CN 1982901A
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102053219A (zh) * | 2010-11-08 | 2011-05-11 | 上海集成电路研发中心有限公司 | 金属电迁移测试设备及方法 |
CN102116828A (zh) * | 2010-12-24 | 2011-07-06 | 上海集成电路研发中心有限公司 | 互连线电迁移寿命的确定方法 |
CN102508953A (zh) * | 2011-10-19 | 2012-06-20 | 中国科学院微电子研究所 | 一种互连线平均失效时间计算方法及系统 |
CN102590629A (zh) * | 2012-02-10 | 2012-07-18 | 工业和信息化部电子第五研究所 | 一种高精度电迁移预警电路 |
CN102621468A (zh) * | 2012-03-27 | 2012-08-01 | 上海宏力半导体制造有限公司 | 电阻温度系数的检测结构及检测方法 |
CN103187397A (zh) * | 2011-12-27 | 2013-07-03 | 中芯国际集成电路制造(上海)有限公司 | 微加热装置 |
CN103884928A (zh) * | 2012-12-21 | 2014-06-25 | 中国科学院金属研究所 | 力电热多场耦合作用下微电子产品可靠性测试平台 |
CN106684008A (zh) * | 2015-11-05 | 2017-05-17 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件的可靠性测试结构及其测试方法 |
CN107887291A (zh) * | 2017-12-27 | 2018-04-06 | 中国电子产品可靠性与环境试验研究所 | 连接通孔的电迁移寿命时间测试装置及其测试方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102446901B (zh) * | 2010-10-14 | 2013-11-06 | 中芯国际集成电路制造(上海)有限公司 | 失效分析结构、其形成方法及其失效分析方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6603321B2 (en) * | 2001-10-26 | 2003-08-05 | International Business Machines Corporation | Method and apparatus for accelerated determination of electromigration characteristics of semiconductor wiring |
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2005
- 2005-12-13 CN CN 200510111413 patent/CN100575970C/zh active Active
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102053219A (zh) * | 2010-11-08 | 2011-05-11 | 上海集成电路研发中心有限公司 | 金属电迁移测试设备及方法 |
CN102116828A (zh) * | 2010-12-24 | 2011-07-06 | 上海集成电路研发中心有限公司 | 互连线电迁移寿命的确定方法 |
CN102116828B (zh) * | 2010-12-24 | 2015-10-28 | 上海集成电路研发中心有限公司 | 互连线电迁移寿命的确定方法 |
CN102508953A (zh) * | 2011-10-19 | 2012-06-20 | 中国科学院微电子研究所 | 一种互连线平均失效时间计算方法及系统 |
CN102508953B (zh) * | 2011-10-19 | 2013-12-04 | 中国科学院微电子研究所 | 一种互连线平均失效时间计算方法及系统 |
CN103187397B (zh) * | 2011-12-27 | 2015-09-02 | 中芯国际集成电路制造(上海)有限公司 | 微加热装置 |
CN103187397A (zh) * | 2011-12-27 | 2013-07-03 | 中芯国际集成电路制造(上海)有限公司 | 微加热装置 |
CN102590629B (zh) * | 2012-02-10 | 2017-06-06 | 工业和信息化部电子第五研究所 | 一种高精度电迁移预警电路 |
CN102590629A (zh) * | 2012-02-10 | 2012-07-18 | 工业和信息化部电子第五研究所 | 一种高精度电迁移预警电路 |
CN102621468A (zh) * | 2012-03-27 | 2012-08-01 | 上海宏力半导体制造有限公司 | 电阻温度系数的检测结构及检测方法 |
CN102621468B (zh) * | 2012-03-27 | 2016-12-14 | 上海华虹宏力半导体制造有限公司 | 电阻温度系数的检测结构及检测方法 |
CN103884928A (zh) * | 2012-12-21 | 2014-06-25 | 中国科学院金属研究所 | 力电热多场耦合作用下微电子产品可靠性测试平台 |
CN106684008A (zh) * | 2015-11-05 | 2017-05-17 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件的可靠性测试结构及其测试方法 |
CN106684008B (zh) * | 2015-11-05 | 2019-09-27 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件的可靠性测试结构及其测试方法 |
CN107887291A (zh) * | 2017-12-27 | 2018-04-06 | 中国电子产品可靠性与环境试验研究所 | 连接通孔的电迁移寿命时间测试装置及其测试方法 |
CN107887291B (zh) * | 2017-12-27 | 2020-07-10 | 中国电子产品可靠性与环境试验研究所 | 连接通孔的电迁移寿命时间测试装置及其测试方法 |
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CN100575970C (zh) | 2009-12-30 |
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