CN1979264A - Liquid crystal display apparatus - Google Patents

Liquid crystal display apparatus Download PDF

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Publication number
CN1979264A
CN1979264A CN 200510102016 CN200510102016A CN1979264A CN 1979264 A CN1979264 A CN 1979264A CN 200510102016 CN200510102016 CN 200510102016 CN 200510102016 A CN200510102016 A CN 200510102016A CN 1979264 A CN1979264 A CN 1979264A
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China
Prior art keywords
indicates
liquid crystal
horizontal
chip
crystal indicator
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Granted
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CN 200510102016
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Chinese (zh)
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CN100397165C (en
Inventor
王永明
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Innolux Shenzhen Co Ltd
Innolux Corp
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Innolux Shenzhen Co Ltd
Innolux Display Corp
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Priority to CNB2005101020164A priority Critical patent/CN100397165C/en
Publication of CN1979264A publication Critical patent/CN1979264A/en
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Publication of CN100397165C publication Critical patent/CN100397165C/en
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Abstract

The invention relates to a LCD device, comprising a LCD panel and a drive chip, interconnected, where the LCD panel comprises plural circuit pins, at least a horizontal location mark and at least a vertical location mark; and the drive chip comprises plural metal bumps corresponding to the circuit pins, at least a horizontal alignment mark and at least a vertical alignment mark; the horizontal and vertical alignment marks correspond to the horizontal and vertical location marks, respectively; the vertical spaces between the horizontal location mark and the circuit pins are equal to those between the horizontal alignment mark and the metal bumps; the horizontal spaces between the vertical location mark and the circuit pins are equal to those between the horizontal alignment and the metal bumps. Thus, it can improve the accuracy of aligning the drive chip with conducting wires on the LCD panel.

Description

Liquid crystal indicator
[technical field]
The present invention relates to a kind of liquid crystal indicator, particularly relate to a kind of liquid crystal indicator that chip for driving is set on display panels.
[background technology]
Flourish along with semiconductor technology and material science, (integrated circuit, application IC) also more and more widely for chip for driving.(Liquid Crystal Display needs in LCD) several chip for driving to control each picture element in the LCD in LCD.At present on the LCD panel according to the juncture of chip for driving and different being divided into of use mantle winding: chip is attached to (Chip On Glass on the glass plate, COG), ribbon crystal grain structure dress (Tape Carrier Package, TCP) be attached to pliability soft board (Chip On Flex, COF) three kinds of packaged types with chip for driving.
Wherein the liquid crystal indicator that a kind of prior art disclosed as shown in Figure 1, this liquid crystal indicator 1 comprises a display panels 10, a plurality of chip for driving 11 and a flexible printed wiring board 12.Be distributed with a plurality of conducting wires 101 on this display panels 10, marginal end is distributed with a plurality of welding regions (Bonding Area) 100.One tail end of this chip for driving 11 and this flexible printed wiring board 12 is arranged on this welding region 100, and is electrical connected with this display panels 10.
See also Fig. 2, be the welding region 100 local enlarged diagrams of the display panels 10 that this Fig. 1 disclosed.This conducting wire 101 is formed in the vertical bar shape metal conducting layer on this display panels 10.Welding region 100 at these display panels 10 edges is provided with a plurality of circuit pins (Circuit Pad) 102, this circuit pin 102 is the metallic contacts that are positioned at these conducting wire 101 ends, and this metallic contact is electrical connected with the conducting wire 101 that is arranged on this display panels 10.
See also Fig. 3, the partial cutaway schematic when being attached to display panels 10 for this chip for driving 11.These chip for driving 11 surfaces are provided with a plurality of metal couplings (Bump) 110, this metal coupling 110 is meant the derby of manufacturing gold or slicker solder on the welding pin (Bonding Pad) in chip for driving 11 (figure does not show), makes these metal coupling 110 meltings make the welding pin of chip for driving 11 and circuit pin 102 electric connections of this display panels 10 when assembling.
When chip for driving 11 is attached to the welding region 100 of this liquid crystal panel 10, use a kind of adhesion material of conduction simultaneously, as anisotropic conducting film (Anisotropic Conductive Film, ACF) 13, further this display panels 10 is bonded together with this chip for driving 11.
Along with the measure of precision increase of display panels 10 surface lines, the spacing of per two adjacent conductive circuits 101 is dwindled gradually, so when the welding region 100 that adopts display panels 10 attaches chip for driving 11, need accurate contraposition.When skew takes place these chip for driving 11 sticking positions, can cause the difference of short circuit or contact resistance, the electrical connection characteristic after influence engages.The accuracy of this contraposition depends on accurate operation and accurate equipment.Please consult Fig. 2 once more, this conducting wire 101 is width even metal layers, indicates without any contraposition, so in the attaching process, be difficult to accomplish the welding region 100 that accurately aligns, influences process rate simultaneously.
[summary of the invention]
For overcoming the inconvenient contraposition of above-mentioned chip for driving, the low and low problem of process rate of aligning accuracy is necessary to provide a kind of contraposition that makes things convenient for, and improves the liquid crystal indicator of aligning accuracy and process rate.
A kind of liquid crystal indicator, it comprises: a display panels and one and the chip for driving that electrically connects of this display panels, this display panels comprises that a plurality of circuit pins, at least one horizontal location indicate and at least one perpendicular positioning indicates; This chip for driving comprises and the corresponding a plurality of metal couplings of this circuit pin, at least one horizontal alignment indicates and at least one vertical contraposition indicates, this horizontal alignment indicates and this vertical contraposition indicates corresponding with this horizontal location sign and this perpendicular positioning sign respectively, this horizontal location indicates and the vertical interval of these a plurality of circuit pins equates with the vertical interval of this horizontal alignment sign and this metal coupling, and this perpendicular positioning indicates with the level interval of these a plurality of circuit pins and equates with the level interval of this metal coupling with this horizontal alignment sign.
Compared to prior art, contraposition process at above-mentioned liquid crystal indicator, because this horizontal location indicates and the vertical interval of this circuit pin indicates with this horizontal alignment and the vertical interval of this metal coupling equates, this perpendicular positioning indicates with the level interval of this circuit pin and equates with the level interval of this metal coupling with this horizontal alignment sign, so rely on the location sign of this display panels and the contraposition of this chip for driving to indicate, can be so that the corresponding accurately contraposition of the metal coupling of the circuit pin of this display panels and this chip for driving, the process rate of handled easily, and raising simultaneously.
[description of drawings]
Fig. 1 is a kind of liquid crystal indicator floor map of prior art.
Fig. 2 is that display panels welding region shown in Figure 1 amplifies floor map.
Fig. 3 is a welding region diagrammatic cross-section shown in Figure 2.
Fig. 4 is the liquid crystal indicator floor map shown in first kind of better embodiment of the present invention.
Fig. 5 is the local floor map of amplifying of the present invention's welding region shown in Figure 3.
Fig. 6 indicates floor map for the present invention location shown in Figure 5.
Fig. 7 and Fig. 8 were for indicating two kinds of distribution schematic diagrams in addition in the location in the welding region of the present invention.
Fig. 9 amplifies floor map for the welding region shown in second kind of better embodiment of the present invention is local.
Figure 10 is the welding region floor map shown in the third better embodiment of the present invention.
[embodiment]
Seeing also Fig. 4, is first kind of liquid crystal indicator schematic perspective view that better embodiment disclosed of the present invention.This liquid crystal indicator 2 comprises a display panels 20, three chip for driving 21 and flexible circuit boards 22.This display panels 20 is provided with a plurality of welding regions 200 and a plurality of conducting wire 201.One of this chip for driving 21 and this flexible printed wiring board 22 tail end is welded on the welding region 200 at these display panels 20 edges respectively, and is electrical connected with this conducting wire 201.
Seeing also Fig. 5, is the floor map that this chip for driving 21 is arranged on these display panels 20 welding regions 200.This conducting wire 201 is formed in the strip metal layer on this display panels 20, and this welding region 200 is positioned at this display panels 20 marginal ends, is used for attaching the zone of this chip for driving 21.This welding region 200 is provided with a plurality of circuit pins 202, and this circuit pin 202 is positioned at the metallic contact of these conducting wire 201 ends, and this metallic contact is electrical connected with the conducting wire 201 that is arranged on this display panels 20.
One conducting wire 201 that is positioned at perpendicular to horizontal direction is provided with horizontal location sign 2031, one is positioned at the conducting wire 201 that is parallel to horizontal direction is provided with perpendicular positioning sign 2032, and this horizontal location sign 2031 and this perpendicular positioning indicate 2032 near these welding region 200 marginal position settings.
See also Fig. 6, indicate 2031 floor map for this horizontal location.The shape of this horizontal location sign 2031 can be rectangle.Its width is between 1 μ m~2 μ m, and the center line 2011 of this rectangle coincides with the edge contour of this welding region 200, and promptly this horizontal location indicates 2031 and is symmetrically distributed in this welding region 200 edges.This horizontal location sign 2031 and this perpendicular positioning sign 2032 are to be extended and formed by the local conductive metal layer broad ways of the conducting wire 201 of this conducting wire 201.This perpendicular positioning sign 2032 is basic identical with the formation method of this horizontal location sign 2031.
Please consult Fig. 5 once more, these chip for driving 21 surfaces are provided with a plurality of metal couplings 210, a horizontal alignment indicates 2131 and one vertical contraposition and indicates 2132.To circuit pin 202 that should display panels 20, it be a horizontal side of this chip for driving 21 that this horizontal alignment indicates 2131 to these a plurality of metal couplings 210 respectively, and this vertical contraposition sign 2132 is one of this chip for driving 21 vertical side edge.This horizontal location indicate 2031 and the vertical interval of this circuit pin 202 and this horizontal alignment indicate 2131 and this metal coupling 210 between vertical interval equate, between this perpendicular positioning sign 2032 and this circuit pin 202 between level interval and this vertical contraposition sign 2132 and this metal coupling 210 level interval equate.
When this chip for driving 21 is arranged on this welding region 200, this horizontal alignment sign 2131 and vertical contraposition indicate 2132 and indicate 2032 corresponding alignment with the horizontal location sign 2031 and the perpendicular positioning of this display panels 20 respectively, and promptly the center line 2011 of this horizontal location sign 2031 coincides with this horizontal alignment sign 2131.Because this horizontal location indicate 2031 and the vertical interval of this circuit pin 202 and this horizontal alignment sign 2131 and this metal coupling 210 between vertical interval equate, the level interval of this perpendicular positioning sign 2032 and this circuit pin 202 equates with the level interval of this vertical contraposition sign 2132 and this metal coupling 210, indicate 2131,2132 so rely on the location of this display panels 20 to indicate 2031,2032 contrapositions of aliging this chip for driving 21 respectively, make corresponding respectively being electrical connected of circuit pin 202 of this metal coupling 210 and this display panels 20.
Generally, when this chip for driving 21 is arranged on this welding region 200,, during less than 2 μ m, can not cause the electrically bad of circuit in deviation range according to the requirement of aligning accuracy.Compared to prior art, on this conducting wire 201, be provided with horizontal alignment indicate 2031 and vertical contraposition indicate 2032, make the operating personnel when contraposition, indicate 2031,2032 as foundation according to these two contrapositions, make this accurately contraposition of chip for driving 21.Because this contraposition indicates 2031,2032 width range between 1~2 μ m, even under contraposition situation devious, indicate 2131 when this horizontal location indicates in the scope of 2031 upsides or downside 1 μ m as long as guarantee the horizontal alignment of this chip for driving 21, perhaps make this vertical contraposition indicate 2132 when this perpendicular positioning indicates in the scope of 2032 left sides or right side 1 μ m, all can realize the electric connection of this display panels 20 and this chip for driving 21, and can not influence chip for driving 21 and paste local derviations to cause welding region 200 electrically bad.Also improved simultaneously process rate.
In assembling process, utilize conduction adhesion material (figure does not show), this chip for driving 21 is pressed together on the welding region 200 of this display panels 20, further be adhesively fixed.This conduction adhesive can be anisotropic conductive film.
See also Fig. 7 and Fig. 8, be two kinds of different distributions form synoptic diagram in addition of this location sign.Wherein, in Fig. 7, this horizontal location sign 3031 and this perpendicular positioning indicate 3032 and are arranged on the same conducting wire 301.
In Fig. 8, this horizontal location sign 4031 and this perpendicular positioning indicate 4032 can also be distributed in a plurality of different conducting wires 401.
See also Fig. 9, for second kind of location that better embodiment disclosed of the present invention indicates floor map.Be with a last embodiment difference: this horizontal location indicate 5031 and perpendicular positioning indicate 5032 shape and be similarly rectangle, but its to be the etched part of local conductive layer by this conducting wire 501 form.
See also Figure 10, for this horizontal location of the third better embodiment of the present invention indicate 6031 and this perpendicular positioning indicate the shape of (figure does not show) and not only be confined to rectangle, can also be for cruciform etc., and be arranged in the gap between this conducting wire 601.

Claims (10)

1. liquid crystal indicator, it comprises a display panels and a chip for driving, and the two electric connection, this display panels comprises a plurality of circuit pins, this chip for driving comprises and the corresponding a plurality of metal couplings of this circuit pin, it is characterized in that: this display panels comprises that also at least one horizontal location indicates and at least one perpendicular positioning indicates, this chip for driving comprises that also at least one horizontal alignment indicates and at least one vertical contraposition indicates, this horizontal alignment indicates and this vertical contraposition indicates corresponding with this horizontal location sign and this perpendicular positioning sign respectively, this horizontal location indicates and the vertical interval of these a plurality of circuit pins equates with the vertical interval of this horizontal alignment sign and this metal coupling, and this perpendicular positioning indicates with the level interval of these a plurality of circuit pins and equates with the level interval of this metal coupling with this horizontal alignment sign.
2. liquid crystal indicator as claimed in claim 1 is characterized in that: this horizontal location indicates and is arranged on the Width of this circuit pin.
3. liquid crystal indicator as claimed in claim 2 is characterized in that: this horizontal location indicates and is arranged on this circuit pin.
4. liquid crystal indicator as claimed in claim 2 is characterized in that: this horizontal location indicates the rectangular or cruciform of shape.
5. liquid crystal indicator as claimed in claim 1 is characterized in that: this perpendicular positioning indicates on the Width that is arranged on perpendicular to this circuit pin.
6. liquid crystal indicator as claimed in claim 5 is characterized in that: this perpendicular positioning indicates and is arranged on this circuit pin.
7. liquid crystal indicator as claimed in claim 5 is characterized in that: this perpendicular positioning indicates the rectangular or cruciform of shape.
8. liquid crystal indicator as claimed in claim 1 is characterized in that: this perpendicular positioning indicates with this horizontal location sign and is arranged on the same circuit pin.
9. liquid crystal indicator as claimed in claim 1 is characterized in that: the width range that this horizontal location indicates and this perpendicular positioning indicates is 1 μ m to 2 μ m.
10. liquid crystal indicator as claimed in claim 1 is characterized in that: this chip for driving adopts a viscous electric material to be pasted on this display panels.
CNB2005101020164A 2005-12-02 2005-12-02 Liquid crystal display apparatus Active CN100397165C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB2005101020164A CN100397165C (en) 2005-12-02 2005-12-02 Liquid crystal display apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2005101020164A CN100397165C (en) 2005-12-02 2005-12-02 Liquid crystal display apparatus

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CN1979264A true CN1979264A (en) 2007-06-13
CN100397165C CN100397165C (en) 2008-06-25

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107464522A (en) * 2017-08-01 2017-12-12 武汉华星光电半导体显示技术有限公司 A kind of display module and display device
CN108666302A (en) * 2018-05-17 2018-10-16 武汉华星光电半导体显示技术有限公司 chip, display panel and display device
CN109473038A (en) * 2018-12-12 2019-03-15 武汉华星光电半导体显示技术有限公司 Display panel assembly and display device
CN109801563A (en) * 2019-03-04 2019-05-24 武汉华星光电技术有限公司 COG glass basal plate structure and display panel
CN113838843A (en) * 2020-06-24 2021-12-24 纮华电子科技(上海)有限公司 Wireless communication device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3633566B2 (en) * 2002-02-28 2005-03-30 セイコーエプソン株式会社 Electronic device, manufacturing method thereof, and electronic apparatus
JP2004087941A (en) * 2002-08-28 2004-03-18 Seiko Epson Corp Manufacturing method and apparatus for electro-optical device, and manufacturing method and apparatus for electronic apparatus
KR101022278B1 (en) * 2003-12-15 2011-03-21 삼성전자주식회사 Driving chip and display apparatus having the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107464522A (en) * 2017-08-01 2017-12-12 武汉华星光电半导体显示技术有限公司 A kind of display module and display device
CN107464522B (en) * 2017-08-01 2019-08-13 武汉华星光电半导体显示技术有限公司 A kind of display module and display device
CN108666302A (en) * 2018-05-17 2018-10-16 武汉华星光电半导体显示技术有限公司 chip, display panel and display device
CN109473038A (en) * 2018-12-12 2019-03-15 武汉华星光电半导体显示技术有限公司 Display panel assembly and display device
CN109801563A (en) * 2019-03-04 2019-05-24 武汉华星光电技术有限公司 COG glass basal plate structure and display panel
WO2020177184A1 (en) * 2019-03-04 2020-09-10 武汉华星光电技术有限公司 Cog glass substrate structure and display panel
CN113838843A (en) * 2020-06-24 2021-12-24 纮华电子科技(上海)有限公司 Wireless communication device

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