CN1968777A - 切削刀具刀头 - Google Patents

切削刀具刀头 Download PDF

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CN1968777A
CN1968777A CNA2005800195441A CN200580019544A CN1968777A CN 1968777 A CN1968777 A CN 1968777A CN A2005800195441 A CNA2005800195441 A CN A2005800195441A CN 200580019544 A CN200580019544 A CN 200580019544A CN 1968777 A CN1968777 A CN 1968777A
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polycrystalline diamond
grinding element
zone
working surface
layer
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CN1968777B (zh
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R·D·埃奇里斯
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Baker Hughes Holdings LLC
Element Six Production Pty Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
    • B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
    • B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
    • B23B27/148—Composition of the cutting inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • C23C30/005—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process on hard metal substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2226/00—Materials of tools or workpieces not comprising a metal
    • B23B2226/31—Diamond
    • B23B2226/315—Diamond polycrystalline [PCD]

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Abstract

多晶金刚石砂轮切割元件通常由结合到硬质合金基材上的高等级多晶金刚石层组成。多晶金刚石层具有工作表面和外围表面，且其特征在于具有与外围表面相邻的、贫催化材料的环形区域或其一部分。与工作表面相邻的区域也是贫催化材料的，以至于在使用时，随着磨痕扩大，其前端和后端二者将均位于贫催化材料的区域中。

Description

切削刀具刀头
发明背景
本发明涉及刀具刀头，且更特别地涉及用于在地下地层中钻孔和取芯的切削刀具刀头。
通常用于钻头的切削刀具刀头包括结合到硬质合金基材上的多晶金刚石(PCD)层。该金刚石层具有工作面和在一部分工作表面外缘周围的刀刃。
多晶金刚石(也公知为金刚石磨料坯块)包含大量的金刚石颗粒，该金刚石颗粒含有大量直接的金刚石-金刚石键合。多晶金刚石通常具有第二相，该第二相含有金刚石催化剂/溶剂如钴、镍、铁或者含有一种或多种这些金属的合金。
在钻孔操作时，将该切削刀具刀头在其寿命的不同阶段施加高载荷和高温。在钻孔早期，当锋利的刀头刀刃接触地下地层时，切削刀具受到巨大的接触压力。这样可能导致大量的断裂过程如引起的疲劳裂纹。
当刀头刀刃磨损时，接触压力降低且通常低到不会形成高能故障。但是，该压力仍然可以扩散在高接触压力下引起的裂纹；并且可以最终导致剥落型故障。
在钻孔工业中，PCD刀具性能取决于刀具能够同时实现在越来越苛刻的环境中的高穿孔速率和仍能在钻孔后保持良好的条件(因此能够再次使用)的能力。在任意的钻孔操作中，刀具可以通过光滑的、研磨型磨损和剥落/切屑型磨损的组合中磨损。虽然光滑的、研磨磨损模型是期望的，因为其放弃了高耐磨PCD材料中最大限度的益处，但是剥落或切屑型磨损是不利的。甚至相当小的该类断裂破坏可以不利地同时影响刀具寿命和性能。
具有剥落型磨损时，刀具效率可以快速降低，因为钻头穿透岩层的速率被降低。一旦切屑开始，对工作台的破坏程度继续增加。因为此时为了获得给定的切削深度需要增大法向力。因此，当出现刀具损坏且钻头穿孔速率降低时，在钻头上增加重量的反应可以迅速地导致碎裂的切削元件的退化和最终灾难性故障。
在优化PCD刀具性能时，增大耐磨性(为了获得更好的刀具寿命)通常通过操纵变量如平均金刚石粒径、催化剂/溶剂总含量、金刚石密度等来实现。通常，但是，当使PCD材料更耐磨时，其变得更脆或者倾向于出现故障。因此，为了改进磨损性能而设计的PCD元件倾向于具有较差的抗冲强度或降低的耐剥落性。抗冲性能和耐磨性之间的权衡使得设计出优化的PCD结构，尤其是用于本身有限的苛刻应用。
如果可以消除或控制更耐磨PCD的切屑行为，那么可以更彻底地实现这些类型PCD刀具潜在的性能改进。
以前，认识到通过斜切来改进刀刃几何形状是一种用于降低这种切屑行为的有希望的路径。已发现(US5,437,343和US5,016,718)，预先斜切或锉圆PCD工作台的刀刃，显著降低了金刚石切割台的剥落倾向。通过增大接触面积，这种锉圆行为降低了当刀头接触地下地层时加载期间生成的初始高应力的影响。但是，在使用该PCD刀具期间这样的削边会磨掉，且最终达其中不再留有斜切的点。在这点上。刀刃对剥落性磨损的抵抗力将被降低到无保护的/无斜切的PCD材料的程度。
US5,135,061建议，剥落性行为也可以通过用由PCD材料层形成的切割面制备刀具来控制，该PCD材料的耐磨性低于下面的PCD材料，由此降低了其剥落趋势。在钻探岩层时，刀刃区域中低耐磨层的更大磨损将磨圆的边缘提供了切割元件。因此，该发明实现的刀刃的磨圆具有类似于斜切的抗剥落效果。该方法的优点可以显著优于在合成过程期间原位获得令人满意的薄的、低耐磨性层的技术难度。(这种抗剥落层的一致性和可控行为显然高度依赖于所形成的几何形状)。另外，耐磨性降低的该上层可以导致损害刀具的整体耐磨性-导致刀刃更快速的钝化(bluntening)和次优的性能。
JP59119500要求保护一种在化学处理工作表面之后改进PCD烧结材料性能的方法。该处理将催化剂/溶剂基材溶解于紧靠工作表面的区域中并将其除去。该方法要求在除去基材的区域中增大PCD材料的耐热性，其不会损害烧结金刚石的强度。
最后推入市场销售的PCD切削元件据称具有改进的耐磨性，且未损失抗冲强度。美国专利US6,544,308和US6,562,462描述了这种刀具的制造方法和性能。该PCD切削元件的特征尤其是在于靠近于切削面存在基本上无催化材料的区域。这些刀具性能的改进归因于该区域中PCD耐磨性的增加；其中除去催化剂材料导致在应用时PCD热退化的降低。
虽然在该区域中除去催化剂/溶剂大大地降低了刀刃上高度有害的剥落故障的发生率，但是在末端上的剥落性故障(其产生于该区域中的特性薄层型裂纹)也可以显著影响性能。虽然末端区域中的应力不如前端上那么高，但是该区域中的列为可以导致大量的材料损耗且因此降低刀具性能。
发明概述
依据本发明，提供了一种多晶金刚石研磨元件、尤其是切削元件，其包括沿着界面结合到基材上、尤其是硬质合金基材上的多晶金刚石(优选高等级多晶金刚石)层，该多晶金刚石层具有与该界面相对的工作表面和在该工作表面和界面之间延伸的外围表面，该多晶金刚石研磨元件的特征在于，具有远离工作表面延伸的与外围表面相邻的环形区域，该环形区域或其一部分是贫催化材料的。
该多晶金刚石层优选包括与工作表面相邻的、也是贫催化材料的区域(通常为层)。
因此，优选的多晶金刚石层包含远离工作表面延伸的、定义为完整的或中断的环带的环形区域，和与工作表面相邻的贫催化材料的区域，以至于在使用时，随着磨痕扩大，其前端和后端二者将均位于贫催化材料的区域中。
多晶金刚石研磨元件优选如公开的国际专利申请WO 2004/106003和WO 2004/106004中所述，二者均在此引入作为参考。
多晶金刚石层具有与外围表面相邻的、贫催化材料的区域。该区域从外围表面横向延伸到多晶金刚石内的深度为约30μm-约500μm。该区域还从工作表面的外缘延伸向界面的深度为多晶金刚石层全部厚度的至少一半，但是在距离界面至少约500μm处终止。
多晶金刚石层也优选地包含与工作表面相邻的、贫催化材料的区域。通常，该区域基本上无催化材料。该区域从工作表面延伸到多晶金刚石内的深度为最小约30μm到不大于约500μm。
多晶金刚石层也具有富催化材料的区域。该催化材料作为多晶金刚石层制备中的烧结剂存在。可以使用本领域公知的任何金刚石催化材料。优选的催化材料为第VIII族过渡金属如钴和镍。富催化材料的区域通常与贫催化材料的区域具有界面，且延伸到与基材的界面。
富催化材料的区域本身可以包括一个以上的区域。这些区域的平均粒度以及化学组成可以不相同。这些区域(当存在时)通常位于平行于多晶金刚石层的工作表面的面上。
在本发明的优选结构中，贫催化材料的区域定义为覆盖在富催化材料的区域或其一部分之上的罩状(cap-like)结构。
依据本发明的另一方面，制备如上所述PCD研磨元件的方法包括步骤：通过提供基材来形成未结合的组件，其可以包括非平面的分界界面；将大量的金刚石颗粒置于基材上，优选地选择大量的金刚石颗粒以使得能够制得高等级的多晶金刚石；和提供用于金刚石颗粒的催化材料源；向未结合的组件施加适合于制得大量金刚石颗粒的多晶金刚石层的高温和高压条件，使这样的层结合到基材上；和分别从与其暴露的工作表面和外围表面相邻的多晶金刚石层的各个区域中除去催化材料。
优选地，除去催化材料的深度为多晶金刚石层全部厚度的至少一半。
基材通常为硬质合金基材。催化材料源通常为硬质合金基材。可以将一些额外的催化材料混入金刚石颗粒中。
从与其暴露表面相邻的多晶金刚石层的区域中除去催化材料。通常，这些表面位于与基材相对的多晶金刚石层一侧，其提供了多晶金刚石层的工作表面，和在该工作表面和基材之间延伸的外围表面。催化材料的除去可以采用本领域公知的方法来进行，如电解浸蚀、酸浸法和蒸发技术。
通常通过酸浸法来除去催化材料。为了实现贫催化材料的所谓中断型环带，可以使用对酸侵蚀不受影响的试剂，由此能实现掩模的浸出。
由大量金刚石颗粒制成多晶金刚石层所必须高温和高压条件是本领域众所周知的。通常，该条件为4-8GPa的压力和1300-1700℃的温度。
另外，依据本发明，提供了一种含有多个刀具元件的旋转钻头，基本上所有的这些元件都为如上所述的PCD研磨元件。
本发明扩展到一种降低、优选消除多晶金刚石研磨元件(其易受该磨损的影响)中剥落和/或切屑型磨损的方法，其包括步骤：从与其两个暴露表面相邻的多晶金刚石层的区域中除去催化材料。
已发现，由于控制了剥落与切屑磨损组份，本发明的PCD研磨元件相对于现有技术的PCD研磨元件具有显著改进的磨损行为。
附图说明
现在将参照附图，仅以示例性方式来更详细地描述本发明，其中：
图1为本发明多晶金刚石研磨元件的优选实施方式的透视图，和
图2为沿着图1多晶金刚石研磨元件的线2-2的横截面侧视图。
发明详述
本发明的多晶金刚石研磨元件特别适用于作为钻头的刀具元件。在该应用中，已发现具有极佳的耐磨性和抗冲强度，也不容易受典型磨痕嵌段或末端中剥落或切屑的影响。这些性能能使其有效地用于具有高抗压强度的地下地层的钻孔或打眼。
参照附图1和2，切削元件10具有结合到基材上14的多晶金刚石层12。多晶金刚石层具有顶部工作表面16，其周围为外围刀刃18和外围表面20。
多晶金刚石层12具有贫催化材料的各个区域22，24和富催化材料的区域26。贫催化材料的区域22，24分别从工作表面16和外围表面20向多晶金刚石层12延伸。每个区域的深度，当其远离各个表面16，20横向延伸时，通常不大于500微米，且优选为30-400微米、最优选60-350微米。另外，区域24从工作表面16向基材14延伸的深度为多晶金刚石层12全部厚度的至少一半，但是优选在距离界面区域28至少500μm处终止，以抑制界面区域28不应该(inadvertant)的浸出。
通常，如果PCD边缘被斜切时，贫催化材料的区域22，24通常将遵循该斜切的形状并且沿该斜切长度方向延伸。延伸到硬质合金基材14的多晶金刚石层12的其它部分为富催化材料的区域26。另外，可以机械抛光PCD元件的表面16，20，如此获得低摩擦表面或光面。
使用时，当PCD层12接触待钻孔的基材时，其形成具有前端32和末端34的磨痕30。通过提供贫催化材料的各个区域22，24，当磨痕30增大时，前端32和末端34二者均位于贫催化材料的区域中。这样，先前认识到的从PCD研磨元件工作表面中除去催化剂材料的优点，现在被扩展到末端34，进一步改进了其使用时的性能。在本实施方式中，区域24形状为贫催化材料的完整环形区域。实践中，通常在钻孔操作中仅使用几段金刚石层12。例如，当磨痕30变得过大时，可以将刀头旋转90°，由此形成新的磨痕。通过重复该操作，例如可以形成四个磨痕。因此，可以只是浸出对应于其中形成各个磨痕的那部分区域24，由此形成所谓的贫催化材料的中断的环形区域。
通常，通过本领域公知的方法来制备多晶金刚石层12并将其结合到硬质合金基材14上。然后，采用多种已知方法中的任一种将催化材料从特定实施方式的工作表面16和外围表面20中除去。一种该方法是使用热的矿物酸浸出，例如热的盐酸浸出。通常，酸的温度为约110℃且浸出时间为3-60小时。不希望被浸出的多晶金刚石层区域和碳化物基材将适宜地用耐酸材料遮盖起来。这点也可以用于提供中断的区域24。
在制备上述多晶金刚石研磨元件时，将任选地与一些催化材料混合的金刚石颗粒的层置于硬质合金基材上。随后将该未结合的组件置于高温和高压条件下，由此制得结合到硬质合金基材上的金刚石颗粒的多晶金刚石。实现这点所需的条件和步骤是本领域中众所周知的。
金刚石颗粒优选包含平均粒度不同的金刚石颗粒的混合物。在一种实施方式中，该混合物包含具有如下五种不同平均粒度的颗粒：
平均粒度(微米)质量百分数
20-25(优选22)      25-30(优选28)
10-15(优选12)      40-50(优选44)
5-8(优选6)         5-10(优选7)
3-5(优选4)         15-20(优选16)
小于4(优选2)       小于8(优选5)
另一实施方式中，多晶金刚石层包含它们的颗粒混合物不相同的两个层。与工作表面相邻的第一层具有上述类型的颗粒混合物。位于第一层和基材之间的第二层为这样一种层：其中(i)多数颗粒的平均粒度范围为10-100微米，且由至少三种不同的平均粒度组成；和(ii)至少4质量％的颗粒的平均粒度小于10微米。用于第一层和第二层的金刚石混合物也均可以含有混合型催化剂材料。

Claims (10)

1、一种多晶金刚石研磨元件，其包括沿着界面结合到基材上的多晶金刚石层，该金刚石层具有与该界面相对的工作表面和在该工作表面和界面之间延伸的外围表面，该多晶金刚石研磨元件的特征在于，具有远离工作表面延伸的与外围表面相邻的环形区域，该环形区域或其一部分是贫催化材料的。
2、根据权利要求1的多晶金刚石研磨元件，其中该金刚石层也具有与工作表面相邻的贫催化材料的区域。
3、根据权利要求1或2的多晶金刚石研磨元件，其中贫区从外围表面和/或工作表面延伸到多晶金刚石内的深度为约30μm-约500μm。
4、根据前述权利要求中任意一项的多晶金刚石研磨元件，其中环形区域从工作表面延伸向界面的深度为多晶金刚石层全部厚度的至少一半，但是在距离界面至少约500μm处终止。
5、根据前述权利要求中任意一项的多晶金刚石研磨元件，其中多晶金刚石层也具有富催化材料的区域。
6、根据权利要求5的多晶金刚石研磨元件，其中催化材料作为多晶金刚石层制备中的烧结剂存在。
7、根据权利要求5或6的多晶金刚石研磨元件，其中富催化材料的区域本身包括一个以上的区域，这些区域的平均粒度或化学组成不相同。
8、根据前述权利要求中任意一项的多晶金刚石研磨元件，其为切削元件。
9、根据前述权利要求中任意一项的多晶金刚石研磨元件，其中多晶金刚石为高等级的。
10、根据前述权利要求中任意一项的多晶金刚石研磨元件，其中基材为硬质合金基材。
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GB0423597D0 (en) * 2004-10-23 2004-11-24 Reedhycalog Uk Ltd Dual-edge working surfaces for polycrystalline diamond cutting elements

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US10132121B2 (en) 2007-03-21 2018-11-20 Smith International, Inc. Polycrystalline diamond constructions having improved thermal stability
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CN102596454A (zh) * 2009-09-11 2012-07-18 第六元素公司 多晶金刚石复合坯块
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US9175521B2 (en) 2010-08-24 2015-11-03 Varel Europe S.A.S. Functionally leached PCD cutter and method for fabricating the same
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CN110770410B (zh) * 2017-05-02 2021-06-01 通用电气(Ge)贝克休斯有限责任公司 被配置为减少冲击损坏的切削元件以及相关工具和方法
CN108277489A (zh) * 2018-03-30 2018-07-13 镇江东艺机械有限公司 一种交联pvd硬质涂层高速切削刀具及制造方法

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