CN1962929A - Method for vacuum sputtering of anti-EMI film on plastic rubber substrate - Google Patents
Method for vacuum sputtering of anti-EMI film on plastic rubber substrate Download PDFInfo
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- CN1962929A CN1962929A CN 200510100995 CN200510100995A CN1962929A CN 1962929 A CN1962929 A CN 1962929A CN 200510100995 CN200510100995 CN 200510100995 CN 200510100995 A CN200510100995 A CN 200510100995A CN 1962929 A CN1962929 A CN 1962929A
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- plating
- rubber substrate
- plastic rubber
- vacuum splashing
- emi
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Abstract
The invention discloses a preparing method of superposition anti-EMI film on the plastic base through vacuum spraying, which comprises the following steps: spraying sand on the base surface through alumina; washing the sand of base surface; spraying in the vacuum; coating a layer of Cu layer and SUS layer on the whole plastic base; reducing resistant value of film layer; reinforcing anti-EMI effect; saving spraying waste.
Description
Technical field
The present invention relates to a kind of surface treatment method of plastic cement, relate in particular to a kind of with on plastic rubber substrate, the be covered method of anti-EMI film of vacuum splashing and plating.
Background technology
The plastic cement EMI suppression generally all adopts on the plastic cement surface with the about 2.5UM of electroless plating technology plated with copper film, and its screening effect reaches more than the 70dB.Adopt chemical plating method environment to be had great pollution at plastic cement surface plating EMI suppression copper film.
Adopt vacuum splashing and plating method plating EMI suppression copper film, because of the temperature problem of sputter, so that once can only copper facing 0.56um, its screening effect only reaches 57Db, and can only sputter one side, so just need repeat to plate more than the secondary and can reach more than the 70dB by screening effect, reduction production efficiency.As shown in Figure 1, sputter Cu layer 2, attached outstanding SUS layer 3 on Cu layer 2 again on plastic rubber substrate 1 one side.Simultaneously, the position of spraying paint needs to cover with the aluminium alloy tool in the sputter process, and is very high in the expense of tool.
Above-mentioned prior art produces trouble and inconvenience in use, remains in fact to be improved.
Summary of the invention
The invention provides be covered a kind of resistance value that reduces the integral product thin film layer of method of anti-EMI film of vacuum splashing and plating on plastic rubber substrate, strengthen the EMI suppression effect of rete, the EMI suppression screening effect can reach more than the 70dB, the tool expense in the time of can saving sputter simultaneously.
For achieving the above object, the present invention adopts in the following method:
A kind of with on plastic rubber substrate, the be covered method of anti-EMI film of vacuum splashing and plating, wherein, comprise the steps: at least
The sandblasting step is sprayed on substrate surface with emergy;
Cleaning step cleans the grains of sand on the substrate surface of sandblasting;
The vacuum splashing and plating step after the plastic cement all surfaces plates one deck Cu layer, plates the SUS layer again.
Described be covered on the plastic rubber substrate method of anti-EMI film of vacuum splashing and plating, wherein, in the described sandblasting step, the emergy of employing is the white fused alumina sand grains.
Described be covered on the plastic rubber substrate method of anti-EMI film of vacuum splashing and plating, wherein, described cleaning step adopts ultrasonic cleaning.
Described be covered on the plastic rubber substrate method of anti-EMI film of vacuum splashing and plating, wherein, plastic basis material can be PC, ABS or PC/ABS.
Description of drawings
Fig. 1 handles plastic cement surface section synoptic diagram for this existing method;
Fig. 2 is for handling the synoptic diagram of plastic cement surface section through method of the present invention.
Embodiment
The present invention is further detailed explanation below in conjunction with accompanying drawing:
As shown in Figure 2, a kind of with on plastic rubber substrate, the be covered method of anti-EMI film of vacuum splashing and plating, wherein, comprise following three steps.
Step 1, the sandblasting step, with the white fused alumina sand blasting on plastic rubber substrate 1 surface;
Step 2, cleaning step utilizes the plastic rubber substrate 1 lip-deep grains of sand of ultrasonic cleaning sandblasting.Ultrasonic wave cleaning principle is the high-frequency oscillation signal that is sent by ultrasonic generator, convert the high frequency mechanical oscillation to by transverter and propagate into medium--in the cleaning solvent, ultrasonic wave in scavenging solution density interphase to previous irradiation, make liquid-flow and produce ten hundreds of micro-bubbles.These bubbles form at the negative pressuren zone of ultrasonic wave longitudinal propagation, growth, and at the zone of positive pressure rapid closing.In the process of this being referred to as " cavitation " effect, the bubble closure can form the instantaneous pressure that surpasses 1000 air pressure, continuously produce instantaneous pressure and resemble that a succession of little " blast " is constantly impacted article surface, the surface of object and the dirt in the slit are peeled off rapidly, thereby reach the purpose that article surface purifies.
Step 3, the vacuum splashing and plating step after the plastic cement surface plates one deck Cu layer 2, plates SUSS316 layer 3 again.Sputter (sputtering) is a kind of technology of physical vaporous deposition, and principle is to utilize glow discharge (glow discharge) with argon gas (Ar) ionic bombardment target (target) surface, and the atom of target is deposited in substrate surface and forms film by ejection.Novel sputtering equipment nearly all uses strong magnets that the electronics curl is moved to quicken target argon gas ionization on every side, causes the bump probability between target and argon gas ion to increase, and improves sputtering rate.The common metal plated film mostly adopts dc sputtering, and nonconducting ceramics material then uses RF to exchange sputter.
Described be covered on the plastic rubber substrate method of anti-EMI film of vacuum splashing and plating, wherein, plastic basis material can be PC, ABS or PC/ABS.
The invention provides on plastic rubber substrate, be covered a kind of resistance value that reduces the integral product thin film layer of method of anti-EMI film of vacuum splashing and plating, strengthen the EMI suppression effect of rete, the EMI suppression screening effect can reach more than the 70dB, since once just on all whole sputters in plastic cement surface, the tool expense when having saved sputter.
The above; only be one of preferable feasible embodiment of the present invention; can not therefore promptly limit to interest field of the present invention; concerning being familiar with those of ordinary skill in the art; such as use technical scheme of the present invention and technical conceive to make other various corresponding changes and distortion, and all these changes and distortion all should belong within the protection domain of claim of the present invention.
Claims (4)
1, a kind ofly it is characterized in that, comprise the steps: at least with on plastic rubber substrate, the be covered method of anti-EMI film of vacuum splashing and plating
The sandblasting step is sprayed on substrate surface with emergy;
Cleaning step cleans the grains of sand on the substrate surface of sandblasting;
The vacuum splashing and plating step after the plastic cement all surfaces plates one deck Cu layer, plates the SUS layer again.
2, according to claim 1 with on plastic rubber substrate, the be covered method of anti-EMI film of vacuum splashing and plating, it is characterized in that in the described sandblasting step, the emergy of employing is the white fused alumina sand grains.
3, described according to claim 1 with on plastic rubber substrate, the be covered method of anti-EMI film of vacuum splashing and plating, it is characterized in that described cleaning step adopts ultrasonic cleaning.
4, described according to claim 1 with on plastic rubber substrate, the be covered method of anti-EMI film of vacuum splashing and plating, it is characterized in that plastic basis material can be PC, ABS or PC/ABS.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510100995 CN1962929A (en) | 2005-11-08 | 2005-11-08 | Method for vacuum sputtering of anti-EMI film on plastic rubber substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510100995 CN1962929A (en) | 2005-11-08 | 2005-11-08 | Method for vacuum sputtering of anti-EMI film on plastic rubber substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1962929A true CN1962929A (en) | 2007-05-16 |
Family
ID=38082155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510100995 Pending CN1962929A (en) | 2005-11-08 | 2005-11-08 | Method for vacuum sputtering of anti-EMI film on plastic rubber substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1962929A (en) |
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2005
- 2005-11-08 CN CN 200510100995 patent/CN1962929A/en active Pending
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| PB01 | Publication | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |