CN1955222B - Flame-resistant polybutylene terephthalate resin composition for lead-free solder - Google Patents
Flame-resistant polybutylene terephthalate resin composition for lead-free solder Download PDFInfo
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- CN1955222B CN1955222B CN200610142475XA CN200610142475A CN1955222B CN 1955222 B CN1955222 B CN 1955222B CN 200610142475X A CN200610142475X A CN 200610142475XA CN 200610142475 A CN200610142475 A CN 200610142475A CN 1955222 B CN1955222 B CN 1955222B
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- acid
- phenenyl
- resin combination
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- -1 polybutylene terephthalate Polymers 0.000 title claims abstract description 75
- 229920001707 polybutylene terephthalate Polymers 0.000 title claims description 24
- 229910000679 solder Inorganic materials 0.000 title claims description 12
- 239000011342 resin composition Substances 0.000 title 1
- 229920005989 resin Polymers 0.000 claims abstract description 59
- 239000011347 resin Substances 0.000 claims abstract description 59
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 11
- 239000011574 phosphorus Substances 0.000 claims abstract description 11
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 claims abstract description 7
- 150000001463 antimony compounds Chemical class 0.000 claims abstract description 7
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 19
- 239000002253 acid Substances 0.000 claims description 18
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 12
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 10
- 239000003365 glass fiber Substances 0.000 claims description 9
- 230000026030 halogenation Effects 0.000 claims description 9
- 238000005658 halogenation reaction Methods 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 150000003949 imides Chemical class 0.000 claims description 8
- 238000001746 injection moulding Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 6
- 125000000962 organic group Chemical group 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 150000003839 salts Chemical class 0.000 claims description 6
- 229910052728 basic metal Inorganic materials 0.000 claims description 3
- 150000003818 basic metals Chemical class 0.000 claims description 3
- 150000008301 phosphite esters Chemical group 0.000 claims description 3
- 125000005843 halogen group Chemical group 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 19
- 239000000203 mixture Substances 0.000 abstract description 19
- 229920000139 polyethylene terephthalate Polymers 0.000 abstract description 6
- 239000005020 polyethylene terephthalate Substances 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 abstract description 6
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 abstract 2
- 239000011152 fibreglass Substances 0.000 abstract 1
- 239000003381 stabilizer Substances 0.000 abstract 1
- 229910052757 nitrogen Inorganic materials 0.000 description 28
- 239000003063 flame retardant Substances 0.000 description 17
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 13
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 13
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- 150000002148 esters Chemical class 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 239000000835 fiber Substances 0.000 description 8
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 229910052736 halogen Inorganic materials 0.000 description 6
- 150000002367 halogens Chemical class 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 6
- 150000003009 phosphonic acids Chemical class 0.000 description 6
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 6
- 125000006839 xylylene group Chemical group 0.000 description 6
- 125000003118 aryl group Chemical group 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 229920000728 polyester Polymers 0.000 description 5
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- 229910019142 PO4 Inorganic materials 0.000 description 4
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 4
- 239000001506 calcium phosphate Substances 0.000 description 4
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 4
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 4
- 235000021317 phosphate Nutrition 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 3
- 125000005907 alkyl ester group Chemical group 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 125000001118 alkylidene group Chemical group 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- FUFJGUQYACFECW-UHFFFAOYSA-L calcium hydrogenphosphate Chemical compound [Ca+2].OP([O-])([O-])=O FUFJGUQYACFECW-UHFFFAOYSA-L 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical class [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 229940059574 pentaerithrityl Drugs 0.000 description 3
- 125000005543 phthalimide group Chemical class 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 description 3
- 239000001488 sodium phosphate Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- MNAHQWDCXOHBHK-UHFFFAOYSA-N 1-phenylpropane-1,1-diol Chemical compound CCC(O)(O)C1=CC=CC=C1 MNAHQWDCXOHBHK-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 2
- KLSLBUSXWBJMEC-UHFFFAOYSA-N 4-Propylphenol Chemical compound CCCC1=CC=C(O)C=C1 KLSLBUSXWBJMEC-UHFFFAOYSA-N 0.000 description 2
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 2
- 229940122361 Bisphosphonate Drugs 0.000 description 2
- 125000000041 C6-C10 aryl group Chemical group 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- QMKYBPDZANOJGF-UHFFFAOYSA-N benzene-1,3,5-tricarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CC(C(O)=O)=C1 QMKYBPDZANOJGF-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 125000005340 bisphosphate group Chemical group 0.000 description 2
- YYRMJZQKEFZXMX-UHFFFAOYSA-L calcium bis(dihydrogenphosphate) Chemical compound [Ca+2].OP(O)([O-])=O.OP(O)([O-])=O YYRMJZQKEFZXMX-UHFFFAOYSA-L 0.000 description 2
- 229910000389 calcium phosphate Inorganic materials 0.000 description 2
- 235000011010 calcium phosphates Nutrition 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- SEGLCEQVOFDUPX-UHFFFAOYSA-N di-(2-ethylhexyl)phosphoric acid Chemical compound CCCCC(CC)COP(O)(=O)OCC(CC)CCCC SEGLCEQVOFDUPX-UHFFFAOYSA-N 0.000 description 2
- 229910000397 disodium phosphate Inorganic materials 0.000 description 2
- 235000019800 disodium phosphate Nutrition 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 125000004185 ester group Chemical group 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- GVALZJMUIHGIMD-UHFFFAOYSA-H magnesium phosphate Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O GVALZJMUIHGIMD-UHFFFAOYSA-H 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 235000019691 monocalcium phosphate Nutrition 0.000 description 2
- 229910000150 monocalcium phosphate Inorganic materials 0.000 description 2
- 229910000403 monosodium phosphate Inorganic materials 0.000 description 2
- 235000019799 monosodium phosphate Nutrition 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- RZJRJXONCZWCBN-UHFFFAOYSA-N octadecane Chemical compound CCCCCCCCCCCCCCCCCC RZJRJXONCZWCBN-UHFFFAOYSA-N 0.000 description 2
- 239000012766 organic filler Substances 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000012756 surface treatment agent Substances 0.000 description 2
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 2
- GAJQCIFYLSXSEZ-UHFFFAOYSA-N tridecyl dihydrogen phosphate Chemical compound CCCCCCCCCCCCCOP(O)(O)=O GAJQCIFYLSXSEZ-UHFFFAOYSA-N 0.000 description 2
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 2
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- 125000006719 (C6-C10) aryl (C1-C6) alkyl group Chemical group 0.000 description 1
- VQOXUMQBYILCKR-UHFFFAOYSA-N 1-Tridecene Chemical group CCCCCCCCCCCC=C VQOXUMQBYILCKR-UHFFFAOYSA-N 0.000 description 1
- KMBSSXSNDSJXCG-UHFFFAOYSA-N 1-[2-(2-hydroxyundecylamino)ethylamino]undecan-2-ol Chemical compound CCCCCCCCCC(O)CNCCNCC(O)CCCCCCCCC KMBSSXSNDSJXCG-UHFFFAOYSA-N 0.000 description 1
- ZUHPIMDQNAGSOV-UHFFFAOYSA-N 2-benzyl-2-phenylpropanedioic acid Chemical compound C=1C=CC=CC=1C(C(=O)O)(C(O)=O)CC1=CC=CC=C1 ZUHPIMDQNAGSOV-UHFFFAOYSA-N 0.000 description 1
- QPBGNSFASPVGTP-UHFFFAOYSA-N 2-bromoterephthalic acid Chemical class OC(=O)C1=CC=C(C(O)=O)C(Br)=C1 QPBGNSFASPVGTP-UHFFFAOYSA-N 0.000 description 1
- UPHOPMSGKZNELG-UHFFFAOYSA-N 2-hydroxynaphthalene-1-carboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=C(O)C=CC2=C1 UPHOPMSGKZNELG-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- SSADPHQCUURWSW-UHFFFAOYSA-N 3,9-bis(2,6-ditert-butyl-4-methylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C)=CC(C(C)(C)C)=C1OP1OCC2(COP(OC=3C(=CC(C)=CC=3C(C)(C)C)C(C)(C)C)OC2)CO1 SSADPHQCUURWSW-UHFFFAOYSA-N 0.000 description 1
- AFPHTEQTJZKQAQ-UHFFFAOYSA-N 3-nitrobenzoic acid Chemical class OC(=O)C1=CC=CC([N+]([O-])=O)=C1 AFPHTEQTJZKQAQ-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- QRFTXHFUNIFHST-UHFFFAOYSA-N 4,5,6,7-tetrabromoisoindole-1,3-dione Chemical compound BrC1=C(Br)C(Br)=C2C(=O)NC(=O)C2=C1Br QRFTXHFUNIFHST-UHFFFAOYSA-N 0.000 description 1
- WVDRSXGPQWNUBN-UHFFFAOYSA-N 4-(4-carboxyphenoxy)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C=C1 WVDRSXGPQWNUBN-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- RISQCUQJUHIVTO-UHFFFAOYSA-N C(C)OC(C(C1=CC=CC=C1)(O)O)(C)OCC Chemical compound C(C)OC(C(C1=CC=CC=C1)(O)O)(C)OCC RISQCUQJUHIVTO-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
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- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
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- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- QORUGOXNWQUALA-UHFFFAOYSA-N N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 Chemical compound N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 QORUGOXNWQUALA-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- VWZUADMLRZGWQB-UHFFFAOYSA-N P(O)(O)=O.P(O)(O)=O.C1=CC=CC=2C3=CC=CC=C3C12 Chemical class P(O)(O)=O.P(O)(O)=O.C1=CC=CC=2C3=CC=CC=C3C12 VWZUADMLRZGWQB-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-L Phosphate ion(2-) Chemical compound OP([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-L 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 239000004902 Softening Agent Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229920004935 Trevira® Polymers 0.000 description 1
- 241000863032 Trieres Species 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- DIJZCMNVRFTVBB-UHFFFAOYSA-N [2,3,5,6-tetrabromo-4-(hydroxymethyl)phenyl]methanol Chemical compound OCC1=C(Br)C(Br)=C(CO)C(Br)=C1Br DIJZCMNVRFTVBB-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- PZZYQPZGQPZBDN-UHFFFAOYSA-N aluminium silicate Chemical compound O=[Al]O[Si](=O)O[Al]=O PZZYQPZGQPZBDN-UHFFFAOYSA-N 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003968 arylidene group Chemical group [H]C(c)=* 0.000 description 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N benzene Substances C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- IFVTZJHWGZSXFD-UHFFFAOYSA-N biphenylene Chemical group C1=CC=C2C3=CC=CC=C3C2=C1 IFVTZJHWGZSXFD-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- ZQNPDAVSHFGLIQ-UHFFFAOYSA-N calcium;hydrate Chemical compound O.[Ca] ZQNPDAVSHFGLIQ-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical class OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- PDXRQENMIVHKPI-UHFFFAOYSA-N cyclohexane-1,1-diol Chemical compound OC1(O)CCCCC1 PDXRQENMIVHKPI-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- MHDVGSVTJDSBDK-UHFFFAOYSA-N dibenzyl ether Chemical compound C=1C=CC=CC=1COCC1=CC=CC=C1 MHDVGSVTJDSBDK-UHFFFAOYSA-N 0.000 description 1
- RBLGLDWTCZMLRW-UHFFFAOYSA-K dicalcium phosphate dihydrate Substances O.O.[Ca+2].[Ca+2].[O-]P([O-])([O-])=O RBLGLDWTCZMLRW-UHFFFAOYSA-K 0.000 description 1
- 125000003963 dichloro group Chemical group Cl* 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- MHJAJDCZWVHCPF-UHFFFAOYSA-L dimagnesium phosphate Chemical compound [Mg+2].OP([O-])([O-])=O MHJAJDCZWVHCPF-UHFFFAOYSA-L 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 125000000219 ethylidene group Chemical group [H]C(=[*])C([H])([H])[H] 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000009950 felting Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 230000002650 habitual effect Effects 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000005865 ionizing radiation Effects 0.000 description 1
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000004137 magnesium phosphate Substances 0.000 description 1
- 229910000400 magnesium phosphate tribasic Inorganic materials 0.000 description 1
- 235000010994 magnesium phosphates Nutrition 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- HZVOZRGWRWCICA-UHFFFAOYSA-N methanediyl Chemical compound [CH2] HZVOZRGWRWCICA-UHFFFAOYSA-N 0.000 description 1
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 1
- 229940045641 monobasic sodium phosphate Drugs 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical class C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 229940038384 octadecane Drugs 0.000 description 1
- 125000005968 oxazolinyl group Chemical group 0.000 description 1
- CDXVUROVRIFQMV-UHFFFAOYSA-N oxo(diphenoxy)phosphanium Chemical compound C=1C=CC=CC=1O[P+](=O)OC1=CC=CC=C1 CDXVUROVRIFQMV-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- NFIYTPYOYDDLGO-UHFFFAOYSA-N phosphoric acid;sodium Chemical compound [Na].OP(O)(O)=O NFIYTPYOYDDLGO-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N phthalic anhydride Chemical compound C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000412 polyarylene Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229910000160 potassium phosphate Inorganic materials 0.000 description 1
- 229940093916 potassium phosphate Drugs 0.000 description 1
- 235000011009 potassium phosphates Nutrition 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 235000011008 sodium phosphates Nutrition 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- YTZKOQUCBOVLHL-UHFFFAOYSA-N tert-butylbenzene Chemical compound CC(C)(C)C1=CC=CC=C1 YTZKOQUCBOVLHL-UHFFFAOYSA-N 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- NSBGJRFJIJFMGW-UHFFFAOYSA-N trisodium;stiborate Chemical compound [Na+].[Na+].[Na+].[O-][Sb]([O-])([O-])=O NSBGJRFJIJFMGW-UHFFFAOYSA-N 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
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- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention provides a polybutanediol terephthalate resin compositon for lead-free soldering tin. The composition has excellent soldering tin thermal endurance of 260 DEG C, above ten seconds as well as flame retardancy. More specifically, relative to the polybutanediol terephthalate resin (A), following components are compounded with specified amounts as: polyethylene terephthalate resin (B), specific imide halides (C), antimony compounds (D), phosphorus stabilizer (E) and fiberglass (F).
Description
Technical field
The present invention relates to a kind of flame retardance poly mutual-phenenyl two acid bromide two alcohol ester resin combination and molding thereof, wherein, described polybutylene terephthalate resin combination has the thermotolerance that can carry out soldering under the hot conditions more than the fusing point of resin.In more detail, relate to a kind of flame retardance poly mutual-phenenyl two acid bromide two alcohol ester resin combination and molding thereof, wherein, described flame retardance poly mutual-phenenyl two acid bromide two alcohol ester resin combination has superior thermotolerance, flame retardant resistance, is suitable for junctor, switch, electrical condenser, unicircuit (IC), rly., resistor, photodiode (LED), coil of wire skeleton and electric electronic unit such as peripheral equipment, shell thereof.
Background technology
Along with the miniaturization and the high performance of electronics, the densification that parts are installed also in development, is not only electronic units such as semi-conductor, electrical condenser, and the peripheral components such as junctor of undertaking data I/O also can be installed on the printed circuit board (PCB).At present, electronic unit carries out soldering by through-holes of printed circuit boards, but the situation of recently these electronic units being carried out surface mounting on substrate increases, in this case, molding such as pyritous scolding tin, substrate melt or distortion is perplexed near to or in contact with being heated to owing to being subjected to, and rise year by year so improve the stable on heating requirement of so-called scolding tin of molding such as substrate.
And, as backflow scolding tin, using the plumbous class alloy of tin scolding tin at present, but because to the raising of the understanding of environmental problem so far, so do not use plumbous so-called Research of Lead-free Tin Alloy in vogue day by day, its practicability is also in stable development always.Pb-free solder is compared the fusing point height with the scolding tin of the plumbous class alloy of present tin, that is the fusing point of the plumbous class alloy of present relatively tin is about 180 ℃, and the fusing point of Pb-free solder surpasses 200 ℃ usually, and the fusing point about at least 20 ℃ rises inevitable.And, utilize in the soldering that the dip soldering method carries out, under the temperature that is higher than 30～60 ℃ of fusing points, carry out.By this situation, the polybutylene terephthalate material for using in the shell of junctor etc. also begins requirement and has 260 ℃ * 10 seconds scolding tin thermotolerance at least.
And, in these electric electronic units, also there are a lot of situations requiring on the stable on heating basis of above-mentioned scolding tin viewpoint to consider that flame retardant resistance must be arranged from security.As the index of flame retardant resistance, generally be to carry out combustion test according to サ Block ジ エ Network ト 94 (UL-94) method of ア Application ダ one ラ イ タ one ラ ボ ラ ト リ one ズ.In UL-94, in most cases require V-0.
The polybutylene terephthalate resin, owing to its superior mechanical characteristics, electrical characteristic, also have it to give flame retardant resistance easily, so in junctor, switch, electrical condenser, unicircuit (IC), rly., resistor, photodiode (LED), coil of wire skeleton and electric electronic unit such as peripheral equipment, shell thereof, use sometimes, but 240 ℃ * 10～60 seconds scolding tin thermotolerance is the limit.Therefore, in the stable on heating situation of scolding tin that requires more than 260 ℃, generally use senior engineering plastics such as liquid crystalline polymers or poly-inferior aralkyl sulfide.But it is expensive that these senior engineering plastics are compared with polybutylene terephthalate, and in addition, also there are the following problems in the processing that is shaped: injection molding forming temperature height, the durable time of metal pattern shortens, the welding strength step-down.
Therefore, the motion of JP-A 2001-40096 is: polymkeric substance by will having maleic anhydride Ji Huo oxazolinyl etc. and polybutylene terephthalate or polyamide resin carry out the fusion shaping of mixing, and the irradiation ionizing radiation improves the scolding tin thermotolerance.
In addition, the composition of motion is to be added with the metatitanic acid metal-salt in thermoplastic resin in JP-A2003-213139, even also have thermotolerance under the hot conditions of said composition in the backflow solder furnace.
But, about with the equilibrium of flame retardant resistance, all documents all do not have record.
In addition, record in JP-B 7-21103: with the halogenation double imide is the polybutylene terephthalate resin combination that fire retardant uses.The halogenation double imide is the fire retardant of superior for heat resistance, but in order to use in the Pb-free solder purposes, needs further to improve stable on heating technology.
Summary of the invention
The objective of the invention is to, a kind of polybutylene terephthalate resin combination and molding thereof are provided, wherein, superior, 260 ℃ of scolding tin thermotolerances more than 10 seconds that described polybutylene terephthalate resin combination has in the Pb-free solder purposes also have flame retardant resistance simultaneously.
The present inventor is in order to finish above-mentioned purpose, study without single devotion, found that, with respect to polybutylene terephthalate, with polyethylene terephthalate, halogenation double imide, antimony compounds, Phosphorus stablizer and glass fibre is the composition that neccessary composition cooperates, have high scolding tin thermotolerance, also have flame retardant resistance simultaneously, so finished the present invention.
That is, the invention provides a kind of Pb-free solder flame retardance poly mutual-phenenyl two acid bromide two alcohol ester resin combination, it constitutes: with respect to (A) polybutylene terephthalate resin 100 weight parts, cooperates,
(B) pet resin 50～100 weight parts
(C) halogenation double imide 10～50 weight parts of following general formula (1) expression
(D) antimony compounds 3～50 weight parts
(E) Phosphorus stablizer 0.01～5 weight part
(F) glass fibre 30～200 weight parts,
(in the formula, R
1The organic group of expression divalent, R
2And R
3Represent that one of them is the organic group with divalent of the halogen atom more than 1.)。
Polybutylene terephthalate resin combination of the present invention, thermotolerance, flame retardant resistance in the Pb-free solder purposes are superior, are specially adapted to junctor, switch, electrical condenser, unicircuit (IC), rly., resistor, photodiode (LED), coil of wire skeleton and electric electronic unit such as peripheral equipment, shell thereof.
Description of drawings
Fig. 1 is illustrated in the injection molded product that use in the scolding tin thermal test of embodiment and the figure of Test condition.
Embodiment
Below, the constituent to resin combination of the present invention at length describes successively.(A) the polybutylene terephthalate resin is a kind of polycondensate, and this polycondensate uses terephthalic acid or dimethyl terephthalate (DMT) by the dicarboxylic acid as main component, and dihydroxy compound uses 1, and the 4-butyleneglycol forms.Except that main component, as dicarboxylic acid also can comprise the known dicarboxylic acid of m-phthalic acid, naphthalene dicarboxylic acids, diphenyldicarboxylic acid, diphenyl ether dicarboxylic acid, diphenylethane dicarboxylic acid, cyclohexyl dicarboxylic acid, hexanodioic acid, sebacic acid and so on and these alkyl, alkoxy or halogen replaces body etc.In addition, in dihydroxy compound, can comprise ethylene glycol, propylene glycol, neopentyl glycol, Resorcinol, Resorcinol, dihydroxy-benzene, naphthalene glycol, dihydroxy diphenyl ether, cyclohexanediol, 2, the dihydroxy compound of 2-two (4-hydroxyphenyl) propane, diethoxy dihydroxyphenyl propane and so on, also have polyether polyols and these alkyl, alkoxy or halogen to replace body etc., wherein, can be used alone, or mixing two or more.
In addition, in addition, also can use hydroxycarboxylic acids such as Para Hydroxy Benzoic Acid, hydroxynaphthoic acid, diphenylene hydroxycarboxylic acid and can form the derivative of these ester.And, in addition, also can be to be the polyester with branch or crosslinking structure of a small amount of and usefulness such as trihemellitic acid, trimesic acid, pyromellitic acid, tetramethylolmethane, TriMethylolPropane(TMP) with the trifunctional monomer.In addition, also comprise and used such as two bromo terephthalic acids, tetrabromo for terephthalic acid, tetrachloro for terephthalic acid, 1,4-dihydroxymethyl tetrabromo-benzene, tetrabromo for dihydroxyphenyl propane, tetrabromo for the ethene of dihydroxyphenyl propane or propylene oxide adduct and so on aromatic series nuclear, have halogenide as substituting group, and have the polyester copolymer that ester forms the compound of group with halogen.And, also can use hard section part of formation high-melting-point and the low melting point polyester elastomer glue of the segmented copolymer of section part firmly.The polybutylene terephthalate resin that uses among the present invention, preferred uses ortho chloro phenol as solvent, be the material more than the 0.55dl/g 30 ℃ of intrinsic viscosities of measuring down, the material of further preferred 0.55～1.2dl/g, particularly 0.55～1.0dl/g.
(B) of the present invention pet resin is the polymkeric substance that following operation obtains, for example, making at least 90 moles of % is that the dicarboxylic acid compound that constitutes of terephthalic acid or its ester glycol that to form property derivative composition and at least 90 moles of % be ethylene glycol carries out esterification or ester group and moves and change reaction, makes it carry out polycondensation then.The dialkyl of the ester of dicarboxylic acid formation property derivative preference such as terephthalic acid units, diaryl ester etc.In the scope that is lower than 10 moles of %, can for example have: phthalandione, m-phthalic acid, hexanodioic acid, sebacic acid, naphthalene-1,4-or 2,6-dicarboxylic acid, diphenyl ether-4,4 '-dicarboxylic acid etc. with the dicarboxylic acid of terephthalic acid and usefulness.In the scope that is lower than 10 moles of %, can for example have: propylene glycol, butyleneglycol, neopentyl glycol, cyclohexanedimethanol, 2,2-two (4-hydroxyphenyl) propane etc. with the diol component of ethylene glycol and usefulness.In addition, operable other composition when obtaining pet resin can be enumerated to Para Hydroxy Benzoic Acid, to alcohol acids such as hydroxyl-oxethyl M-nitro benzoic acids.The pet resin that uses among the present invention is not particularly limited its polymerization degree, is the material of 0.4～1.0dl/d but preferably use o-Chlorophenic acid as solvent, 30 ℃ of intrinsic viscosities of measuring down.
(A) polybutylene terephthalate resin 100 weight parts use (B) pet resin 50～100 weight parts relatively.When its usage quantity is lower than 50 weight parts,, on the other hand, when it surpasses 100 weight parts, may produces and be difficult to the bad of plasticities such as the demoulding sometimes because of the insufficient fusing in tape welding molten tin bath test of its thermotolerance.
Secondly, (C) halogenation double imide of Shi Yonging is the compound of following general formula (1) expression in the present invention.
At this, R
1Be the organic group of divalence, be generally alkylidene group, arylidene, be preferably low-grade alkylidene especially.For example have: methylene radical, ethylidene, 1,4-butylidene, hexamethylene, phenylene, 4,4 '-methylene radical diphenylene, 4,4 '-hydroxyl diphenylene, xylylene, tetrachloro xylylene, tetrabromo xylylene etc., wherein preferred ethylidene, butylidene, hexylidene.In addition, R
2And R
3At least one side, preferred both sides be organic group with divalent of the halogen more than 1, the group of the divalent of preferred halogenated aromatic is generally the phenylene of the divalent with 1～4 halogen.In addition, the preferred bromine of halogen, preferred especially tetrabromo phenylene.
Exemplify the example of the double imide that following material represents as (1) formula of (C) composition.N, N '-(to and between-phenylene)-two (3456-tetrachloro phthalimides), N, N '-(to and between-phenylene)-two (3456-tetrabromo phthalimides), N, N '-(methylene radical-two pair phenylene)-two (3456-tetrachloro phthalimide), N, N '-(methylene radical-two pair phenylene)-two (3456-tetrabromo phthalimide), N, N '-(hydroxyl-two pair phenylene)-two (3456-tetrachloro phthalimide), N, N '-(hydroxyl-two pair phenylene)-two (3456-tetrabromo phthalimide), N, N '-(to and between-phenylene)-the dichloro lactim,
*N, N '-(to and between-the tetrachloro xylylene)-two-(3456-tetrachloro phthalimide),
*N, N '-(to and between-the tetrachloro xylylene)-two (3456-tetrabromo phthalimides),
*N, N '-(to and between-the tetrachloro xylylene)-dichloro lactim, N, N '-(12-ethylidene)-dichloro lactim, N, N '-(12-ethylidene)-two (3456-tetrabromo phthalimide), N, N '-two (12345-pentabromobenzyl)-diimides, N, N '-two (246-tribromo phenyl)-diimides.
*In these materials, four halo xylylenes are 1245-tetrahalogeno-benzene dimethyl and 1345-four halo xylylenes.Wherein, suitable compounds for example has: low-grade alkylidene two tetrabromo phthalimide, particularly N, N '-ethylenebis tetrabromo phthalimide.These halogenation double imides are fire retardants of superior for heat resistance, are suitable for the present invention.
With respect to (A) polybutylene terephthalate resin 100 weight parts, (C) use level of composition is 10～50 weight parts.Owing to when it is excessive, influence mechanical properties, physical properties, thermostability etc., hinder the outward appearance of resin, so not preferred.In addition, when it was very few, its flame retardant resistance was insufficient.
(D) antimony compounds that uses among the present invention for example has: the double salt of ANTIMONY TRIOXIDE SB 203 99.8 PCT, four weisspiessglanzs, antimony pentaoxide, antimony halides, sodium antimonate, alkalimetal oxide and antimony pentaoxide etc.Though can use, but, the ester group that suppresses polybutylene terephthalate and polyethylene terephthalate changes reaction for moving, the wherein suitable double salt that uses antimony pentaoxide or sodium oxide and antimony pentaoxide is for example with the commercially available materials of trade(brand)name such as NA-1030, NA-1070 by daily output chemistry (strain).
With respect to (A) polybutylene terephthalate 100 weight parts, (D) antimony compounds adds 3～50 weight parts.When it is lower than 3 weight parts, can not manifest sufficient flame retardant resistance, on the other hand, when it surpasses 50 weight parts, may bring detrimentally affect to other characteristics such as mechanical properties, plasticities.
In addition, (E) the Phosphorus stablizer that uses among the present invention for example has: be selected from least a in inorganic Phosphorus stablizer (basic metal or alkali earth metal phosphate etc.) and the organic phosphates stablizer (organophosphite, organophosphate, Organophosphonate, organic phosphinate).Phosphorus stablizer can be liquid or solid-state any.
The basic metal of phosphoric acid or alkaline earth salt can illustrations: phosphoric acid or corresponding hydrophosphate (for example potassiumphosphate, sodium phosphate an alkali metal salts such as [(monosodium phosphate (SODIUM PHOSPHATE, MONOBASIC), Di-Sodium Phosphates (sodium hydrogen phosphate, disodium-hydrogen, Sodium phosphate dibasic) etc.)]; Calcium phosphate [monocalcium phosphate (monocalcium phosphate, two (biphosphate) calcium monohydrate etc.), secondary calcium phosphate (secondary calcium phosphate, dicalcium phosphate dihydrate etc.) etc.], trimagnesium phosphate alkaline earth salts such as (secondary magnesium phosphate, primary magnesium phosphates etc.).Aforementioned bases metal or alkaline earth salt can be any of anhydride or hydrate.Special preferably phosphoric acid sodium, calcium phosphate.
Organophosphite for example has: di(2-ethylhexyl)phosphate (2-ethylhexyl), phosphoric acid tridecyl ester, tricresyl phosphate isodecyl ester, di(2-ethylhexyl)phosphate-alkyl phosphates such as Octadecane base ester (phosphoric acid one～three C6-24 alkyl ester etc.); Di(2-ethylhexyl)phosphate phenyl isodecyl ester, triphenylphosphate, tricresyl phosphate (2-hexamethylene phenyl ester), di(2-ethylhexyl)phosphate or three (tertiary butyl phenyl ester), tricresyl phosphate (nonyl phenyl ester) etc. can have the aryl phosphate (phosphoric acid one～three C6-10 aryl ester etc.) of substituting group (alkyl, cycloalkyl etc.) on aryl; Phosphoric acid aralkyl esters such as tricresyl phosphate benzyl ester (phosphoric acid one～three (C6-10 aryl-C1-6 alkyl ester) etc.), in addition, bisphosphate diaryl pentaerythritol ester [bisphosphate two (2,6-di-t-butyl-4-tolyl) pentaerythritol ester etc.], bisphosphate two aralkyl pentaerythritol esters etc.Special preferably phosphoric acid tridecyl ester, Triphenyl phosphate, bisphosphate diaryl pentaerythritol ester.
Organophosphate for example has: one～triaryl ester (phosphoric acid one or diphenyl etc. one or two C6-10 aryl esters etc.) of one～trialkyl ester of phosphoric acid (for example, one～two C6-24 alkyl ester such as single-stearic acid phosphoric acid ester, two hard ester acid phosphoric acid esters etc.), phosphoric acid etc.
Organophosphonate for example has: phosphonic acids one or dialkyls (phosphonic acids C6-24 alkyl ester etc.) such as phosphonic acids two hard esters; Can have substituent phosphonic acids aryl ester (phosphonic acids C6-10 aryl ester etc.) on phosphonic acid diphenyl ester, phosphonic acids two aryl such as (nonyl phenyl esters); Phosphonic acids such as phosphonic acids dibenzyl ester one or two aralkyl esters (phosphonic acids C6-10 aryl-C1-6 alkyl ester etc.) etc.
Organic phosphinate for example has: four (2, the 4-di-t-butyl)-4,4 '-biphenylene bisphosphonates, (2,4-two trimethylphenylmethane bases)-4, biphenylene bisphosphonates such as 4 '-biphenylene bisphosphonates etc.
With respect to polybutylene terephthalate resin 100 weight parts, (E) use level of Phosphorus stablizer is 0.01～5 weight part.When it is lower than 0.01 weight part, can not suppress the transesterification reaction of polybutylene terephthalate and polyethylene terephthalate sometimes, the tackify during because of fusing is shaped bad.When it surpasses 5 weight parts, may produce bleeding unfavorable conditions such as (bleed) on the molding surface.
(F) glass fibre that uses among the present invention is not particularly limited its kind, character (fiber footpath, fiber length), and any material can use, but the preferred material of handling with surface treatment agent or coupler that uses.
The surface treatment agent of glass fibre or coupler use the known functionality compound that uses because of this purpose at present, for example epoxy compounds, isocyanate compound, silane compound and titanate ester compound.Concrete material for example has: γ-glycidoxy propyl-triethoxysilicane, γ-glycidoxypropyltrime,hoxysilane, β-(3,4-epoxy group(ing) cyclohexyl) epoxy silane such as ethyl trimethoxy silane, bisphenol A type epoxy resin, bisphenol f type epoxy resin, Resorcinol type Resins, epoxy, four hydroxyphenyl methane Resins, epoxy, phenolic resin varnish type epoxy resin, the vinyl cyclohexene dioxide, the Dicyclopentadiene (DCPD) dioxide, 3,4-epoxy group(ing)-6-methyl cyclohexane ylmethyl-3,4-epoxy group(ing)-polyepoxidess such as 6-methylcyclohexane carbonic ether, 2, the 4-tolylene diisocyanate, 4,4 '-diphenylmethanediisocyanate, dimethoxyanilino-diisocyanate, tridecylene vulcabond (ト リ デ Application ジ イ ソ シ ア ネ one ト), hexamethylene diisocyanate, between eylylene diisocyanate, 1, the 3-naphthalene diisocyanate, triphenylmethane triisocyanate, the derivative of polyphenylene isocyanic ester and above-mentioned vulcabond (polymkeric substance urethanum, oligopolymer than urethane diketone (ウ レ タ ジ オ Application) dimer high order, the tricyanic acid ester polymer) isocyanate ester compound such as, γ-An Bingjisanyiyangjiguiwan, the known aminosilane of beta-amino oxyethyl group-γ-An Bingjisanjiayangjiguiwan and so on, vinyl trichloro silane, vinyltriethoxysilane, vinyl three-'beta '-methoxy Ethoxysilane, γ-methacryloyl propyl trimethoxy silicane, (dimethoxy-methyl silyl propyl group) quadrol just, (trimethoxy-silylpropyl) quadrol etc. just.
With respect to (A) polybutylene terephthalate resin 100 weight parts, (F) glass fibre adds in the scope of 30～200 weight parts.When it is lower than 30 weight parts, keep the inflexible effect insufficient during high temperature, when it surpasses 200 weight parts, the mobile possibility that reduces, is shaped difficulty is arranged.
Need to prove, flame retardance poly mutual-phenenyl two acid bromide two alcohol ester resin combination of the present invention, in the scope that does not influence thermotolerance, flame retardant resistance, also can use more than a kind or 2 kinds of other thermoplastic resins, additive, organic filler, inorganic filler etc. as required, as the auxiliary composition that cooperates that adds in polymerization or after the polymerization.
At this, thermoplastic resin for example has: the vibrin beyond polyester elastomer, the present invention, polyolefin resin, polystyrene resins, polyamide-based resin, polycarbonate, polyacetal, polyarylene oxides, poly-arylene sulfide, fluoro-resin etc.
In addition, additive can the present known UV light absorber of illustration and (E) composition such as antioxidant beyond stablizer, static inhibitor, (C), (D) composition beyond tinting material, lubricant, softening agent, lubricant, releasing agent, nucleating agents etc. such as fire retardant, flame retardant, dye well pigment.
In addition, inorganic filler is except that (F) glass fibre, and illustration has: silicate such as felting glass fibre, granulated glass sphere, glass flake, silica, sapphire whisker, Zirconium oxide fibre, potassium titanate fiber, carbon fiber, carbon black, graphite, Calucium Silicate powder, pure aluminium silicate, potter's clay, talcum, clay; The metal oxide of ferric oxide, titanium oxide, zinc oxide, aluminum oxide and so on; The carbonate and the vitriol of metals such as calcium, magnesium, zinc, also have silicon carbide, silicon nitride, boron nitride etc., the organic filler illustration has: dystectic aromatic polyester fiber, liquid crystal type trevira, aromatic polyamide fibre, fluororesin fiber, polyimide fiber etc.In addition, in resin combination of the present invention, preferably use tetrafluoroethylene to drop down agent as when burning anti-.
The preparation of flame retardance poly mutual-phenenyl two acid bromide two alcohol ester resin combination of the present invention utilizes and can easily prepare as present normally used equipment of resin combination compound method and method.For example: 1) mix each composition after, utilize 1 or 2 concise methods of extruding the preparation particle, meanwhile preparing of extrusion machine, 2) different particles is once formed in preparation, this particle is mixed with specified amount, supply with and be shaped, after shaping, obtain the method for the molding that purpose forms, 3) in forming mill with 1 or the method for directly packing into more than 2 kind etc. of each composition, can use.In addition, being thin powder with the part of resinous principle mixes interpolation with composition beyond it, aspect the even cooperation of carrying out these compositions, is preferable methods.In addition, above-mentioned weighting agent etc. can obtain the desired combined thing adding period arbitrarily.
The shaping processability of resin combination of the present invention is good.Therefore, in the present invention, this resin combination fusion is mixed, utilize habitual manufacturing process such as extrusion molding and injection molding forming easily to be shaped, can effectively obtain molding.Preferred especially injection molding forming.
Resin combination of the present invention, when the plate molding of making metal-resin and injection molded product, even 260 ℃ in heating of metal portion 10 seconds only, the resin part does not melt yet.Particularly in the thermotolerance for solder bath that use has embodiment to put down in writing was estimated, the injection molded product did not melt.That is, resin combination of the present invention, because its flame retardant resistance is superior and the superior for heat resistance of Pb-free solder purposes, so be applicable to electric electronic unit, particularly junctor, switch, electrical condenser, unicircuit (IC), rly., resistor, photodiode (LED), coil of wire skeleton and peripheral equipment, shell etc.
Embodiment
Below, specifically describe the present invention by embodiment, but the present invention is not subjected to the restriction of the following examples in wanting point range.
Embodiment 1～8, comparative example 1～5
With the mixture ratio shown in the table 1 that each resin combination is dried mixed, 2 extrusion machines that use has the screw rod of 30mm Φ carry out granulating after 265 ℃ of following fusions are mixed, make each sample and estimate, and show the result in table 1.
Need to prove that the details of the composition of use is as follows.
(A) polybutylene terephthalate (PBT) resin
ウ イ Application テ Star Network Port リ マ one system, 500FP
(B) polyethylene terephthalate (PET) resin
カ ネ ボ ウ system, ベ Le ペ Star ト EFG10
(C) halogenation double imide compound
ア Le ベ マ one Le system, SAYTEX BT93
(D) antimony compounds
Daily output chemistry system, サ Application エ Port Star Network NA-1030
(E) Phosphorus stablizer
(E-1) rising sun electrification system, ア デ カ ス タ Block PEP-36
(E-2) rice mountain chemical industry system, monosodium phosphate
(F) glass fibre
NEC ガ ラ ス system, ECS03T187
Teflon resin
Mitsui デ ユ Port Application Off ロ ロ ケ ミ カ Le system, 800J
Low molecular weight polyethylene
Sanyo changes into industry system, サ Application ワ ッ Network ス 165P
Antioxidant
Japan チ バ ガ イ ギ one system, イ Le ガ ノ ッ Network ス 1010
In addition, in comparative example, use has
(C ') the halogenation polycarbonate
Supreme Being people changes into system Off ア イ ア one ガ one De FG7500.
In addition, evaluation method is as follows.
[thermotolerance]
The particle that obtains at 140 ℃ down after dry 3 hours, is made the injection molded product of steel plate by injection molding forming under 80 ℃ of 265 ℃ of forming temperatures, metal pattern temperature.This sample is a molding as shown in Figure 1, at the central part that forms the copper coin of lead frame with 20mm * 30mm * 0.2mm, the subsidiary molding that the form of resin 10mm * 10mm * 7mm is arranged.Use the trier of band solderability, as shown in Figure 1, the metal part (copper coin) of sample was flooded to the resin portion about 2mm dipping 10 seconds, behind the heating certain hour with the resin around the microscopic examination injection moulding metal (2mmt is one-sided: a melted state part), if if do not melt just be set at zero just melted be set at *.The temperature of tape welding molten tin bath is set at 250 ℃, 260 ℃, 270 ℃.
Need to prove, in comparative example 2,4,, can't estimate because of illiquidity and the not enough injection molded product that can not be shaped of release property.
[incendivity]
According to the method for the サ Block ジ エ Network ト 94 (UL94) of ア Application ダ one ラ イ タ one ズ ラ ボ ラ ト リ one ズ, use 5 samples (thick 1/32 inch) that incendivity is estimated.
[tensile strength, unit elongation]
The particle that obtains, at 265 ℃ of forming temperatures, 80 ℃ of following injection molding forming ISO3167 stretching samples of metal pattern temperature, is estimated according to the judgement criterias of ISO527-1,2 regulations after 3 hours in drying under 140 ℃.
Table 1
Claims (6)
1. a Pb-free solder is with flame retardance poly mutual-phenenyl two acid bromide two alcohol ester resin combination, wherein,
It constitutes: with respect to (A) polybutylene terephthalate resin 100 weight parts, cooperates,
(B) pet resin 50～100 weight parts,
(C) halogenation double imide 10～50 weight parts of representing with following general formula (1),
(D) antimony compounds 3～50 weight parts,
(E) Phosphorus stablizer 0.01～5 weight part,
(F) glass fibre 30～200 weight parts,
In the formula, R
1Expression divalent organic group, R
2Expression has the divalent organic group of the halogen atom more than 1.
2. flame retardance poly mutual-phenenyl two acid bromide two alcohol ester resin combination as claimed in claim 1, wherein,
When it makes the plate molding of metal-resin and injection molded product, though only to metal partly heat 260 ℃ 10 seconds, the resin part does not melt yet.
3. flame retardance poly mutual-phenenyl two acid bromide two alcohol ester resin combination as claimed in claim 1, wherein,
Its (E) Phosphorus stablizer is the basic metal or the alkaline earth salt of phosphoric acid.
4. flame retardance poly mutual-phenenyl two acid bromide two alcohol ester resin combination as claimed in claim 1, wherein,
Its (E) Phosphorus stablizer is an organophosphite.
5. electric electronic unit, wherein,
It forms by the described flame retardance poly mutual-phenenyl two acid bromide two alcohol ester of claim 1 resin combination is carried out injection molding forming.
6. electric electronic unit as claimed in claim 5, wherein,
It is in junctor, switch, electrical condenser, unicircuit (IC), rly., resistor, photodiode (LED), coil of wire skeleton and peripheral equipment thereof, the shell any.
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| CN103374210B (en) * | 2012-04-23 | 2016-06-15 | 合肥杰事杰新材料股份有限公司 | A kind of polybutylene terephthalate composition and method of making the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1051037A (en) * | 1989-10-18 | 1991-05-01 | 三井石油化学工业株式会社 | Acid imide prepolymer and cured article thereof |
| CN1153522A (en) * | 1995-03-10 | 1997-07-02 | 钟渊化学工业株式会社 | Flame-retardant polyethylene terephthalate resin compositions |
| CN1175267A (en) * | 1995-02-16 | 1998-03-04 | 智索公司 | Crystalline polyolefin resin composition and electrical insulation parts made from said composition |
| CN1519591A (en) * | 2003-02-07 | 2004-08-11 | 胜技高分子株式会社 | Light reflector made of terephthialic acid butanediol ester, and its mfg. method |
-
2006
- 2006-10-26 CN CN200610142475XA patent/CN1955222B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1051037A (en) * | 1989-10-18 | 1991-05-01 | 三井石油化学工业株式会社 | Acid imide prepolymer and cured article thereof |
| CN1175267A (en) * | 1995-02-16 | 1998-03-04 | 智索公司 | Crystalline polyolefin resin composition and electrical insulation parts made from said composition |
| CN1153522A (en) * | 1995-03-10 | 1997-07-02 | 钟渊化学工业株式会社 | Flame-retardant polyethylene terephthalate resin compositions |
| CN1519591A (en) * | 2003-02-07 | 2004-08-11 | 胜技高分子株式会社 | Light reflector made of terephthialic acid butanediol ester, and its mfg. method |
Non-Patent Citations (2)
| Title |
|---|
| JP特开2004-131580A 2004.04.30 |
| JP特开2005-281465A 2005.10.13 |
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