CN1925106A

CN1925106A - Method and device for regulating IC component pin

Info

Publication number: CN1925106A
Application number: CN 200510098536
Authority: CN
Inventors: 倪文明; 王永泉; 卓振勇
Original assignee: Yihua Science & Technology Co Ltd
Current assignee: Yihua Science & Technology Co Ltd
Priority date: 2005-09-02
Filing date: 2005-09-02
Publication date: 2007-03-07
Anticipated expiration: 2025-09-02
Also published as: CN100409405C

Abstract

This invention relates to one device to adjust integration circuit element, which comprises single rectification tool with one IC element leg, one supportive IC element and the fix part exposing multiple legs onto single rectification tool on the edge of IC element, wherein, the device is to impact IC element and single rectification tool to adjust each leg of IC element.

Description

Regulate the apparatus and method of IC component pin

Technical field

In general, the present invention relates to a kind of device that is used to regulate the pin of integrated circuit (IC) element, and relate to a kind of method of pin of the IC of adjusting element.

Background technology

Existing people has advised various devices and has been used to regulate the electric pin that stretches out from the molded packages of IC chip or element.Adjusting generally includes stretching pin and evens up the pin termination.

A kind of such device has been described in licensing to Singapore's patent 69299 of the applicant.This patent discussed pin reformation, readjust the pin that mistake that device and the method for utilizing bilateral programmable pin adjustment means rearrange the IC piece contacts.It is made of the both side assemblies that is mirror image mutually.Each side assembly comprises controls x respectively, three motors of the motion on y and the z axle.The linear guide that each side assembly also comprises comb formula assembly (toothed adjustment means) and allows to move along x and y axle.A kind of accurate piece of fixedly IC piece is between the center and both side assemblies of structure.In reforming process, comb formula assembly is regulated pin along the identical both sides of IC element.

This device of both side assemblies that utilizes used many years.

The applicant admits that the limitation of this device is, owing to there not being two motors identical, so the possibility of result that IC one stresses to put in order is different from the result of IC opposite side significantly.

Another shortcoming is that the cost of making this device is very high.In addition, this device also will occupy bigger space.

In addition, need a large amount of reformation parameters, and thereby make the discovery of fault and repairing become difficult.

Therefore, now possessed the above-mentioned knowledge relevant with the present invention and be put to the practice.

Summary of the invention

According to first aspect of the present invention, the device of the pin of a kind of adjusting integrated circuit (IC) element is provided, and this device comprises a whole instrument of substance of regulating the IC component pin, supporting IC element and many pins on the limit of the correspondence of IC element is revealed in the keeper of the whole instrument of substance; Wherein the setting of this device is the relative motion that is used to influence between IC element and the whole instrument of substance, so that be adjusted in the pin on each limit of IC element.

This keeper can comprise the rotatable seat element of a supporting IC element, is used to influence the relative motion between IC element and the whole instrument of substance.

This device also can comprise one be used to pick up and place the IC element and rotate the IC element, to influence the control arm of the relative motion between the whole instrument of IC element and substance.

The whole instrument of substance can be around the keeper rotation that is used to influence the relative motion between IC element and the whole instrument of substance.

The whole instrument of substance can comprise a housing that is used for receiving releasedly reformation comb formula element.

Reformation comb formula element can carry out oscillating motion, with stretching pin.

Housing can comprise the first and second half housings, is used to receive the reformation comb formula element between them.

The first half housings can comprise that first regulates the surface, and it engages with the termination of pin, is used for evening up the termination along a direction; The second half housings can comprise that second regulates the surface, and it engages with the termination of pin, is used for evening up the termination along another direction.

First and second regulate the surface can be substantially perpendicular to the tip that inserts the reformation comb formula element in the housing.

Keeper can be used for the supporting of vacuum mode reinforcement to the IC element.

Keeper can comprise a mobilizable keeping arm, and it helps the IC element is fixed in the keeper.

This device also can comprise a pneumatic unit, is used to influence the linear movement of keeping arm.

This device also can comprise an offset component, and when fixing IC element, the motion of the compression stress direction of keeper reversed migration element.

This device also can comprise a graphic user interface (GUI) applying unit, is used to control the reformation parameter of this device.

The reformation parameter can comprise the single numerical value of some parameter at least on all limits of a plurality of IC of can be applicable to elements.

The reformation parameter can comprise the numerical value of some parameter at least on each limit of a plurality of IC of can be applicable to elements.

The IC element can be installed on the keeper, places in the mode of " pin upwards " (" live bug ").

According to second aspect of the present invention, a kind of method of pin of the IC of adjusting element is provided, this device comprises the step of using the whole instrument of substance to regulate the pin of IC element; And influence relative motion between the whole instrument of IC element and substance, to regulate the pin on the IC element different edge.

The whole instrument of substance can comprise that is used to discharge a housing that receives reformation comb formula element, and this method can comprise: for the different limit of different IC element and/or identical IC element, change the reformation comb formula element in the housing.

This method can comprise with the comb of reforming carries out oscillating motion, with stretching pin.

This method also can comprise along both direction at least evens up the pin termination.

This method also can comprise with the supporting of vacuum mode reinforcement to the IC element.

This method also can comprise the arm of mobile keeper, so that when fixing IC element, the compression stress of contrary biasing element is the IC element fixedly.

This method also can comprise utilizes a GUI applying unit to control the reformation parameter.

Description of drawings

Embodiments of the invention will only be described by example and with reference to accompanying drawing, wherein:

Fig. 1 is the end view of device of pin that is used to regulate integrated circuit (IC) element according to one embodiment of the invention;

Fig. 2 is the enlarged detail view of this embodiment;

Fig. 3 is the end view of IC piece;

Fig. 4 is the enlarged detail view of this embodiment;

Fig. 5 is the side front view of the details of this embodiment;

Fig. 6 is the screen shot (screenshot) that the computer graphic user interface (GUI) of an embodiment is used;

Fig. 7 is the screen shot that the GUI of an embodiment uses;

Fig. 8 is the formula tabulation that is used to calculate the reformation parameter in one embodiment;

Fig. 9-the 18th, the schematic diagram of each operating procedure of an embodiment of expression.

Embodiment

Fig. 1 at length expresses the schematic diagram of an IC piece pin adjusting device (10) in the exemplary embodiments.Device (10) comprises that a top keeps assembly (200), a bottom to keep an assembly (210) and a reformation adjusting part (100).It should be noted that device (10) includes only a whole adjusting part (100) of substance that keeps assembly (200,210) near the upper and lower.In an exemplary embodiments, it is rotatable that the bottom keeps assembly (210), thereby in pin (112) operating process afterwards on regulating IC piece (110) one side, the bottom keeps assembly (210) rotation, and manifest pin, so that regulate at the another side of IC piece (110).Therefore, owing to used identical reformation adjusting part (100) and relevant driving mechanism/motor (not shown) thereof, so the reformation of the pin on the different edge of IC piece (110) can be not different owing to the driving feature of different tolerance/skew/sizes or different reformation adjusting parts.

Top keeps assembly (200) to comprise a top keeping arm (201).The top keeping arm of at one end going up (201) comprises a contact mat (208), and when IC piece (110) when being held, this contact mat directly contacts with upper half-shell (114 shown in Fig. 3).Contact mat (208) can be made into a soft contact component, and when carrying out clamping, the upper half-shell (114) in IC piece (110) goes up and produces cushioning effect.The sort buffer effect helps to prevent that IC piece (110) from breaking internally.

Utilize bolt (for example 203) that top keeping arm (201) is bearing on the hold-down arm (205).From Fig. 4, can be clear that, rotation clamping air cylinder device (500) comprises the hold-down arm (205) that links to each other with piston (502), this hold-down arm is received in again in the pneumatic cylinder (504), and the direction according to arrow (506) and (508) indication moves up and down and rotatablely moves respectively.

Therefore, those skilled in the art are understood that, utilize assembly (500), and the top keeper (201, Fig. 1) can be with respect to IC piece (110, Fig. 1) move up and down, and rotation leave top keep assembly (200, Fig. 1) so that take off IC piece (110 easily, Fig. 1), changing to new IC piece reforms.

Now get back to Fig. 1, device (10) also comprises a spring assembly (206), and this spring assembly comprises a spring (204) and a firm banking (202).Under static state, the top (207) of this spring (204) is positioned on the position of IC piece (101) upper surface top.Therefore, during hold-down arm (205) moves downward and then also makes top keeping arm (201) to move downward, contact mat (208) also owing to the compression of spring (204) is cushioned, thereby helps to prevent that IC piece (110) from breaking internally to the impact of IC piece (110).

The bottom keeps assembly (210) to comprise an accurate device in bottom (216) and a vacuum pad (214).As shown in Figure 5, the accurate device in bottom (216) comprises an IC base (215).The feature of the IC base (215) in this exemplary embodiments is that it has ability placed in the middle and firmly fix the ability of IC piece (110) under the assistance of vacuum mounting arrangement.

IC base (215) has the wall of a plurality of qualification base areas, and this base area is between these walls.The quantity of wall (218) equals the quantity on the limit of IC piece (110).Wall (218) is design like this, and promptly they have the slope that contacts with the housing lower half (116) of IC piece (110) in the side.This slope is with respect to angle of inclination A ° of vertical axis (012) (011).Utilize this slope, IC piece (110) is directed on the IC base (215), and the while does not have the space in the center of the housing lower half (116) of IC piece (110).

In this exemplary embodiments, wall (218) is designed on the top (for example 219) minimum thickness of locating can not damage the mechanical integrity of wall (218).In addition, gap (220) are positioned between the top (219) and basic horizontal part (222) of electric pin (212).Be understood that it is in order to help IC piece (110) can be received in reliably in the base (215) that gap (220) is provided, though when the part (222) of some pin (212) also be so when departing from horizontal direction fully, the IC piece needs to reform in this case.

Get back to Fig. 1, vacuum pad (214) is communicated with vacuum shaft (217) fluid that extend at the center of the accurate device in bottom (216).Axle (217) ends at not shown vacuum outlet.Vacuum forms the device (not shown) and is fixed to the outlet of bleeding from axle (213), so that utilize vacuum that IC piece (110) is securely fixed on the IC base (215).

With reference to Fig. 3, the IC piece (110) in this exemplary embodiments is mounted to " pin upwards " (" live-bug "), and promptly electric pin (112) outwards and downwards stretches out from the limit of the IC piece (110) between upper half-shell (114) and the housing lower half (116).The electric pin (112) of IC piece (110) can comprise some defectives, as coplane defective and pin bending defect.

With reference to Fig. 2, reformation adjusting part (100) comprises that a comb formula assembly (102), a top adjustable plate (106), a bottom adjustable plate (104) and a comb formula discharge recipient (108).

Comb formula assembly (102) the band tooth adjustment means that is otherwise known as is included in row's tip on one side of comb formula assembly (102) (for example 105), and in this exemplary embodiments, comb formula assembly (102) is clipped between top adjustable plate (106) and the bottom adjustable plate (104).The leading edge of tip tilts.

Top adjustable plate (106) comprises a release recipient (108).It also comprises some holes (103), is used for the construction bolt (not shown), is fixed together with the element with reformation adjusting part (100).The hole of some alignment pin (not shown)s also is set, and top adjustable plate (106), comb formula assembly (102) and bottom adjustable plate (104) are passed in the hole.

The comb formula discharges recipient (108) is easy to from reformation adjusting part (100) dismounting comb formula assembly (102), so that the different limit of different IC elements and/or identical IC element changes over the comb formula assembly of different spacing.It is that pin (109) deflection and that center on by top adjustable plate (106) rotates that the comb formula discharges recipient (108).In addition, reformation adjusting part (100) comprises that some are connected to the connector (not shown) of the motion of one or more driving reformation adjusting parts (100).

Device in this exemplary embodiments is used by computer graphic user interface (GUI) and is controlled.The screen shot used of the GUI shown in Figure 10 and 7 is for example thought user's regulating and controlling reformation parameter (being designated as 1 to 12 in Fig. 6 and 7) of this device.The reformation parameter will be determined the motion of the element of this device.As an example, regulating reformation parameter (1 to 9 among Fig. 6 and 7) can be based on the formula (Fig. 8,1 to 9) from IC piece size.GUI uses the database that comprises file, and each database all comprises the adjusting reformation parameter of one group of precalculated known IC piece.

Describe the element of the device in this exemplary embodiments above, described the adjusting operating sequence of this device now.It should be noted that the quadrangle IC piece that in this exemplary embodiments two limits is had an electric pin is regulated.

With reference to Fig. 9, utilize industrial IC piece to pick up and the placement program, pick up IC piece (110) and place it on the IC base (215) of the accurate device in bottom (216).It should be noted that, when allow upper half-shell (referring to Fig. 4 114) when picking up IC piece (110) and not being hindered by pin, because IC piece (110) is placed to " pin makes progress " (" live-bug "), this structure is highly suitable for picking up and the placement program.

In the time of on being placed on IC base (215), since the inclined wall (218) of IC keeper (215), the automatic centering of IC piece (110) own.Next step is to connect vacuum generating device, so that utilize vacuum to strengthen fixing IC piece (110).

Top keeping arm (201) is moved downward.Move downward top keeping arm (101) is clamped on the IC piece (110).

With reference to Figure 10, next step comprise make reformation adjusting part assembly (100) flatly (shown in arrow (301)) and move to comb part in-position (300) to the accurate device in bottom (216) motion.

Comb part in-position (300) is such position, and the bottom adjustable plate (104) of the adjusting part (100) of promptly reforming contacts or approach position contacting with the accurate device in bottom (216).This position also is that the pin (112) of IC piece (110) is positioned to comb near the position, middle part in formula assembly (102) and bottom adjustable plate (104) space.

With reference to Figure 11, next step comprises makes reformation adjusting part (100) (shown in arrow (303)) motion downwards.The comb formula assembly (102) of reformation adjusting part (100) engages with the leads ends of IC piece (110).It should be noted that in this motion process, leading edge (for example 305) as appearing between the pin (112), will be cut one and stop up frame (dambar) (not shown).

With reference to Figure 12, after reformation adjusting part (100) moved downward, reformation adjusting part (100) began to carry out oscillating motion from " original " (" home ") position of comb part along the y axle.On the y axle, the home position of comb part is defined as position ' 0 '.

During oscillating motion, reformation adjusting part (100) moves to the point ' a ' (this is " before the comb " (" comb forward ") distance) on the positive y axle from position ' 0 ', then backwards to point ' a ' motion (this is " comb back " (" comb backward ") distance).Then, reformation adjusting part (100) surmounts from point ' a ' and moves to point ' b ' (this be " comb surmounts motion " (" comb over travel ") distance), gets back to point ' 0 ' then.Because the elastic memory of metal pins, surmounting moves is applied to pin (112) thereby counteracting resilience (spring-back) effect.

Above-mentioned this oscillating motion repeats several times, makes pin (112) finally get back to last vertical parallel position.In this stage, form the parallel of distance from the pin to the pin between the needed adjacent leads (112) and pin (112) again.

Comb home position parameter (10 among Fig. 6) control that the comb home position is used by GUI.The control bit of this point on each limit of IC piece (110) is equipped with a numerical value.

The comb front distance comprises a numerical value, and this value is used for the both sides of IC piece (110).

Comb back distance comprises a numerical value, and this value is used for the both sides of IC piece (110).

In this exemplary embodiments, before the comb and comb back distance is defined by the formula among Fig. 8 (2) respectively.

Comb surmounts the comb that move distance used by GUI and surmounts move distance parameter (3 among Fig. 7) control.Two numerical value are arranged, each Numerical Control IC piece position on one side.The formula of decision numerical value is the formula (3) among Fig. 8 in this exemplary embodiments.These numerical value can be defined as on the occasion of or negative value.

With reference to Figure 13, next step is the defective of correcting coplane.It comprises makes reformation adjusting part (100) flatly towards the direction motion of leaving the accurate device in bottom (216).

Then, reformation adjusting part (100) begins to move upward, and makes bottom adjustable plate (104) apply the power of a leads ends towards IC piece (110) (122), thereby evens up defective leads ends in the upward direction.

Halt is used for promoting pin downwards as inlet point, to correct the defective of coplane.This is controlled by " upwards coplane " (coplan up) inlet point parameter (4 among Fig. 6) that GUI uses.Always have two numerical value, a limit of each Numerical Control IC piece.In this exemplary embodiments, the formula that determines this numerical value is the formula (4) among Fig. 8.

With reference to Figure 14, by after pin (112) has been applied the power that makes progress correcting uneven leads ends (122), reformation adjusting part (100) flatly moves to " coplane downwards " (coplandown) inlet point to accurate device (216) direction.It moves to downward co-planar locations then, and on this position, top adjustable plate (106) applies a downward power to leads ends (122), to even up defective pin along downward direction.

The coplane inlet point is by the downward coplane inlet point parameter (5 among Fig. 6) of GUI application downwards.Always have two numerical value, the position of the point on each each limit of Numerical Control IC piece.In this exemplary embodiments, the formula that determines this numerical value is the formula among Fig. 8.

Co-planar locations is by the downward coplane in-position parameter (12 among Fig. 6) of GUI application downwards.Always have two numerical value, the position of the point on each each limit of Numerical Control IC piece.

After " upwards coplane " and " coplane downwards " process, pin will be in identical height, but all leads ends (122) all are in higher location (standoff) now.Reformation adjusting part (100) will move upward to coplane final position (as shown in Figure 18), so that the positive predetermined bits of all leads ends (122), as shown in figure 15.

The final inlet point parameter of coplane (6 among Fig. 6) control that the coplane final position is used by GUI.Always have two numerical value, and the position of the point on each each limit of Numerical Control IC piece.In this exemplary embodiments, determine that the formula of this numerical value is the formula among Fig. 8.

After this step, as shown in figure 16, one side device be subjected to reform completely, and move downward, as shown in figure 17, leave the accurate device in bottom and move to comb exterior point (comb out point), thereby provide enough revolution spaces for the accurate device in bottom.

Comb exterior point parameter (7 among Fig. 6) control that the comb exterior point is used by GUI.The position that this point of each limit of numerical value control IC piece is arranged.In this exemplary embodiments, determine that the formula of this numerical value is the formula (6) among Fig. 8.

When reformation adjusting part (100) no longer hinders the accurate device in bottom (216), top keeping arm (201) will move upward, and make the accurate device in bottom (216) rotation, as shown in figure 18.When top keeping arm (201) left IC piece (110), the accurate device in bottom (216) rotation was till the another side of the unconditional pin of having of IC piece (112) is during in the face of reformation adjusting part (100).

After rotation, for the another side of IC piece, the reformation order of describing with reference to Fig. 9 to 18 above repeating.

When all reformed in the both sides of IC piece, the IC piece that will pick up and place after the arm (not shown) will be reformed is sent on the output ware from the accurate device in bottom.

Embodiments of the invention have following advantage:

Equipment comprises that a substance puts in order adjusting part.

Owing to, reform and only adopt a driving mechanism in monolateral adjusting.Therefore, all limits of IC piece can both obtain consistent result.

The size of device feature reduces to have reduced with quantity.So just reduced the demand in cost and space, the maintenance that is used for monolateral adjusting is easier to simple.

Also reduced the reformation parameter.Utilization is applied to the formula in the reformation parameter, and the discovery of fault and maintenance have also been simplified.

Therefore, when utilizing the whole instrument of substance to regulate pin on the IC element different edge, this exemplary embodiments can solve simultaneously office in the prior-art devices that the applicant admits many sex-limited/defective.

In addition, " pin upwards " (" live bug ") notion is used for the IC piece.This can simplify picking up and placement mechanism as the IC piece of device feature or self-contained unit.

It should be noted that for example, Fig. 6 and 7 described reformation parameters can manually enter GUI and use, or automatically obtain again by opening a parameter value that presets that comprises the IC piece of particular type.

In aforesaid way, a kind of apparatus and method of regulating the pin of integrated circuit component are disclosed.Only several embodiment are described.Without departing from the scope of the invention, those skilled in the art can carry out many conversion and improvement according to the disclosure content but obviously.

For example, though in an embodiment, reformation is that the IC piece to two limits with pin carries out, and it will be appreciated that the present invention can be used for the IC piece on the limit of the varying number with pin is reformed equally.

In addition, in this exemplary embodiments, the accurate device in bottom rotates, so that regulate the different edge of identical IC element.But be understood that in different embodiment, the relative motion between IC element and the reformation instrument can be worked in a different manner, comprise that for example accurate device rotates around the bottom by making the reformation instrument, or make the IC element by picking up and the rotation of placement program.

Claims

1. device of regulating the pin of integrated circuit (IC) element, this device comprises:

The whole instrument of substance of regulating the IC component pin;

Supporting IC element and with the both sides of IC element or polygon on many pins be revealed in the keeper of the whole instrument of substance;

Wherein the setting of this device is the relative motion that is used to influence between IC element and the whole instrument of substance, so that be adjusted in the pin on each limit of IC element.

2. device as claimed in claim 1, wherein this keeper comprises the rotatable seat element of a supporting IC element, is used to influence the relative motion between IC element and the whole instrument of substance.

3. device as claimed in claim 1, also comprise one be used to pick up and place the IC element and rotate the IC element, to influence the control arm of the relative motion between the whole instrument of IC element and substance.

4. device as claimed in claim 1, wherein the whole instrument of substance is around the keeper rotation that is used to influence the relative motion between IC element and the whole instrument of substance.

5. as the described device of above-mentioned any one claim, wherein the whole instrument of substance comprises a housing that is used for receiving releasedly reformation comb formula element.

6. device as claimed in claim 5, the comb formula of wherein reforming element carries out oscillating motion, with stretching pin.

7. as claim 5 or 6 described devices, its middle shell comprises the first and second half housings, is used to receive the reformation comb formula element between them.

8. device as claimed in claim 7, wherein the first half housings comprise that first regulates the surface, it engages with the termination of pin, is used for evening up the termination along a direction; The second half housings can comprise that second regulates the surface, and it engages with the termination of pin, is used for evening up the termination along another direction.

9. device as claimed in claim 8 wherein first and second is regulated the surface substantially perpendicular to the tip that inserts the reformation comb formula element in the housing.

10. as the described device of above-mentioned any one claim, wherein keeper is used for the supporting of vacuum mode reinforcement to the IC element.

11. as the described device of above-mentioned any one claim, wherein keeper comprises a mobilizable keeping arm, it helps the IC element is fixed in the keeper.

12. device as claimed in claim 11 also comprises a pneumatic unit, is used to influence the linear movement of keeping arm.

13. as claim 11 or 12 described devices, also comprise an offset component, and when fixing IC element, the motion of the compression stress direction of keeper reversed migration element.

14. as the described device of above-mentioned any one claim, also comprise a graphic user interface (GUI) applying unit, be used to control the reformation parameter of this device.

15. device as claimed in claim 14, the parameter of wherein reforming comprise the single numerical value of some parameter at least on all limits of a plurality of IC of being applied to elements.

16. as claim 14 or 15 described devices, the parameter of wherein reforming comprises the numerical value of some parameter at least on each limit of a plurality of IC of being applied to elements.

17. as the described device of above-mentioned any one claim, wherein the IC element is installed on the keeper, places in the mode of " pin upwards " (" live bug ").

18. a method of regulating the pin of IC element, this device comprises the steps:

Use the whole instrument of substance to regulate the pin of IC element;

Influence the relative motion between the whole instrument of IC element and substance, to regulate the pin on the IC element different edge.

19. according to the method for claim 18, wherein the whole instrument of substance can comprise that is used to discharge a housing that receives reformation comb formula element, this method comprises: for the different limit of different IC element and/or identical IC element, change the reformation comb formula element in the housing.

20., comprise with the comb of reforming and carry out oscillating motion, with stretching pin according to the method for claim 19.

21. according to the method for claim 19 or 20, this method also comprises along both direction at least evens up the pin termination.

22., also comprise with the supporting of vacuum mode reinforcement to the IC element according to any one described method in the claim 18 to 21.

23. according to any one the method in claim 18 or 22, also comprise the arm of mobile keeper, so that when fixing IC element, the compression stress of contrary biasing element is the IC element fixedly.

24. according to any one described method in the claim 18 to 23, this method also comprises utilizes a GUI applying unit to control the reformation parameter.

25. according to the method for claim 24, the parameter of wherein reforming comprises the single numerical value of some parameter at least on all limits of a plurality of IC of being applied to elements.

26. according to the method for claim 24 or 25, the parameter of wherein reforming comprises the numerical value of some parameter at least on each limit of a plurality of IC of being applied to elements.

27. according to any one described method in the claim 18 to 26, wherein the IC element is installed on the keeper, places in the mode of " pin upwards " (" live bug ").